CN111356308A - Circuit board assembly, preparation method thereof and electronic equipment - Google Patents
Circuit board assembly, preparation method thereof and electronic equipment Download PDFInfo
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- CN111356308A CN111356308A CN202010190133.5A CN202010190133A CN111356308A CN 111356308 A CN111356308 A CN 111356308A CN 202010190133 A CN202010190133 A CN 202010190133A CN 111356308 A CN111356308 A CN 111356308A
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- Prior art keywords
- dispensing
- circuit board
- hole
- electromagnetic shielding
- glue
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The application relates to a circuit board assembly, a preparation method thereof and electronic equipment, wherein the preparation method of the circuit board assembly comprises the following steps: providing a circuit board and an electromagnetic shielding part, wherein the circuit board is provided with a heating element, the electromagnetic shielding part is connected with the circuit board and forms an accommodating space for accommodating the heating element with the circuit board, the electromagnetic shielding part is provided with a dispensing hole and an exhaust hole which are communicated with the accommodating space, the heating element is provided with a dispensing surface which is arranged opposite to the dispensing hole, and the dispensing surface part is exposed out of the dispensing hole; providing a dispensing device with a flow channel, and aligning the dispensing device at the dispensing hole and connecting the dispensing device with the electromagnetic shielding piece so as to seal the dispensing hole and enable the dispensing hole to be communicated with the flow channel; and under the action of the pressure difference between the pressure in the flow channel and the pressure at the exhaust hole, the heat-conducting glue is pressed into the glue dispensing surface from the flow channel by using the glue dispensing device, so that the heat-conducting glue pressed into the glue dispensing surface is spread on the glue dispensing surface to form a heat-conducting glue layer connected with the inner surface of the electromagnetic shielding part. This application can make the trompil size of point gluey hole do littleer.
Description
Technical Field
The application relates to the field of dispensing, in particular to a circuit board assembly, a preparation method thereof and electronic equipment.
Background
In the related art, in order to reduce the influence of electromagnetic interference on electronic components included in electronic devices such as smartwatches and smartphones, a shielding case covering the electronic components is generally disposed on a circuit board in the electronic device to absorb or reflect electromagnetic interference energy and prevent adjacent electronic components from generating electromagnetic interference. Because electronic components are isolated in the accommodation space provided by the shielding case, the air circulation near the electronic components is blocked, and the heat dissipation effect of the electronic components is influenced. Therefore, the shielding cover is generally provided with a through hole for exposing the electronic component, so that the surface of the electronic component is coated with a layer of heat-conducting glue, the heat-conducting glue can be contacted with the middle frame, and the heat-conducting glue can further transfer the heat of the electronic component out through the middle frame. However, the area of the opening of the through hole in the shield case is too large, which results in a reduction in the area of the region of the shield case where no through hole is formed, and the number of devices that can be carried by the region of the shield case where no through hole is formed is limited, thereby reducing the space utilization rate of the shield case.
Disclosure of Invention
The application discloses a circuit board assembly, a preparation method thereof and electronic equipment, and aims to solve the technical problems that the number of devices which can be borne by an area where no through hole is formed on a shielding cover is limited due to the fact that the opening area of the through hole for dispensing on the shielding cover is too large, and the space utilization rate of the shielding cover is reduced.
A method for preparing a circuit board assembly comprises the following steps:
providing a circuit board and an electromagnetic shielding part, wherein the circuit board is provided with a heating element, the electromagnetic shielding part is connected with the circuit board and forms an accommodating space for accommodating the heating element with the circuit board, the electromagnetic shielding part is provided with a dispensing hole and an exhaust hole which are communicated with the accommodating space, the heating element is provided with a dispensing surface which is arranged opposite to the dispensing hole, and the dispensing surface part is exposed out of the dispensing hole;
providing a dispensing device with a flow channel, and oppositely positioning the dispensing device in the dispensing hole and connecting the dispensing device with the electromagnetic shielding piece so as to seal the dispensing hole and enable the dispensing hole to be communicated with the flow channel; and
and under the action of the pressure difference between the pressure in the flow channel and the pressure at the exhaust hole, pressing the heat-conducting glue into the glue dispensing surface from the flow channel by using the glue dispensing device, and flatly spreading the heat-conducting glue pressed into the glue dispensing surface on the glue dispensing surface to form a heat-conducting glue layer connected with the inner surface of the electromagnetic shielding part.
According to the preparation method of the circuit board assembly, under the action of the pressure difference between the pressure in the flow channel and the pressure at the exhaust hole, the heat-conducting glue can be pressed into the dispensing surface from the flow channel, and the heat-conducting glue pressed into the dispensing surface can be spread on the dispensing surface to form the heat-conducting glue layer connected with the inner surface of the electromagnetic shielding part. The preparation method utilizes the pressure difference effect of the pressure in the flow channel and the pressure at the exhaust hole, so that the opening size of the dispensing hole is smaller, and the heat-conducting glue layer formed after dispensing can be spread in the accommodating space to dissipate heat of the heating element on the premise of small opening size. In addition, the size of the opening hole based on the dispensing hole can be smaller, so that the area of the region of the electromagnetic shielding part without the dispensing hole is increased, and the region of the electromagnetic shielding part without the dispensing hole can bear more devices, so that the space utilization rate of the electromagnetic shielding part is improved. For example, when the region of the electromagnetic shield not provided with the dispensing hole is coated with the heat-conducting glue for transferring the heat of the electromagnetic shield to the middle frame, the coating area of the heat-conducting glue is increased, and the heat dissipation efficiency is improved.
In one embodiment, in the step of providing the circuit board and the electromagnetic shielding element, the electromagnetic shielding element includes a main body portion and a bent portion, the bent portion is bent and extended from an edge of the main body portion, the main body portion is connected with the circuit board through the bent portion to form the accommodating space, and the dispensing hole and the exhaust hole are opened in the main body portion.
In one embodiment, the step of providing the circuit board and the electromagnetic shielding member specifically includes: a shield case is provided as the electromagnetic shield.
In one embodiment, the step of providing the circuit board and the electromagnetic shielding member specifically includes: and providing a circuit board as the electromagnetic shielding part, wherein the circuit board and the circuit board form a laminated PCB, and one side of the circuit board, which is back to the circuit board, is used for attaching electronic elements.
In one embodiment, the dispensing device includes a needle and a sealing sleeve, the flow channel is formed in the needle and forms a glue outlet at one end of the needle, the sealing sleeve is sleeved on an outer wall of the needle and protrudes out of one end of the needle where the glue outlet is formed, and the step of aligning the dispensing device in the dispensing hole and connecting the dispensing device with the electromagnetic shielding member specifically includes:
and positioning the needle head pair in the dispensing hole, so that the sealing sleeve surrounds the dispensing hole and is pressed on the electromagnetic shielding part to seal the dispensing hole and communicate the dispensing hole with the flow channel.
In one embodiment, in the step of providing the dispensing device, the distance from the sealing sleeve to the end of the needle provided with the glue outlet is 0.15mm-0.5 mm.
In one embodiment, the electromagnetic shielding element is provided with a sealing groove surrounding the dispensing hole, and the step of making the sealing sleeve surround the dispensing hole and press-fit the sealing sleeve to the electromagnetic shielding element specifically comprises: and the sealing sleeve is embedded in the sealing groove.
In one embodiment, the center pair of the dispensing holes is located at the center of the dispensing surface, and in the step of locating the pair of dispensing devices in the dispensing holes, the center pair of the dispensing outlets is located at the center of the dispensing holes.
In one embodiment, the edge of the dispensing surface is exposed to the exhaust hole, and in the step of forming the heat conductive adhesive layer, whether the formed heat conductive adhesive layer spreads to the edge of the dispensing surface is observed through the exhaust hole, and when the formed heat conductive adhesive layer spreads to the edge of the dispensing surface, the dispensing device is stopped to continue dispensing to the dispensing surface.
A circuit board assembly comprising
The circuit board is provided with a heating element, and the heating element is provided with a dispensing surface;
the circuit board is connected with the circuit board and forms an accommodating space for accommodating the heating element, the circuit board is provided with a dispensing hole and an exhaust hole which are communicated with the accommodating space, the dispensing hole is arranged opposite to the dispensing surface, and part of the dispensing surface is exposed out of the dispensing hole; the circuit board and the circuit board form a laminated PCB, and one side of the circuit board, which is back to the circuit board, is used for attaching electronic elements; and
the heat conduction adhesive layer is arranged between the dispensing surface and the circuit board, the heat conduction adhesive layer and the dispensing hole are arranged oppositely, and part of the structure of the heat conduction adhesive layer is exposed out of the dispensing hole.
In the circuit board assembly, the circuit board and the circuit board can form a laminated PCB, and the circuit board can be connected to form a containing space for containing the heating element, so that the circuit board can be used as an electromagnetic shielding part to absorb or reflect electromagnetic interference energy generated by the heating element. In addition, on the premise that the size of the dispensing hole can be small, more electronic elements can be attached to the side, back to the circuit board, of the circuit board.
In one embodiment, the circuit board includes a main body portion and a bending portion, the bending portion is bent and extended from an edge of the main body portion, the main body portion is connected with the circuit board through the bending portion to form the accommodating space, the dispensing hole and the exhaust hole are formed in the main body portion, and one side of the main body portion, which faces away from the circuit board, is used for attaching an electronic component.
In one embodiment, the center pair of dispensing holes is located at the center of the dispensing face.
An electronic device, comprising:
a terminal body; and
the circuit board assembly prepared by the preparation method or the circuit board assembly is arranged in the terminal body.
In the electronic device, the space utilization rate of the electromagnetic shielding member is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of the circuit board assembly shown in FIG. 1 according to an embodiment;
FIG. 3 is a schematic partial cross-sectional view taken along line II-II of FIG. 2;
FIG. 4 is a schematic structural diagram of the circuit board assembly shown in FIG. 1 according to an embodiment;
FIG. 5 is a schematic partial cross-sectional view taken along section line III-III in FIG. 4;
fig. 6 is a schematic flow chart illustrating a method for manufacturing a circuit board assembly according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a circuit board and an electromagnetic shield according to an embodiment;
FIG. 8 is a schematic view of the structure of the dispensing device after aligning and connecting with the dispensing hole;
fig. 9 is a schematic structural view illustrating a thermal conductive adhesive layer formed on a dispensing surface by a dispensing device.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1, the electronic device 10 will be described with reference to a smart phone as an example. Those skilled in the art will readily understand that the electronic device 10 of the present application may be any device having communication and storage functions, such as a smart terminal, for example, a smart phone, a tablet computer, a notebook computer, a mobile phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, etc., and the representation of the electronic device 10 is not limited herein. Of course, wearable devices such as smartwatches are also applicable to the electronic device 10 according to the embodiments of the present application.
The electronic device 10 includes a terminal body 11 and a circuit board assembly 12 provided in the terminal body 11. In an embodiment, the terminal body 11 includes a middle frame 13, a rear cover 14 and a display screen 15, the rear cover 14 and the display screen 15 are respectively connected to two opposite sides of the middle frame 13 and enclose to form an accommodating cavity, the accommodating cavity may be used for installing devices such as a main board and a power supply of the electronic device 10, and the middle frame 13 and the rear cover 14 may be integrally formed or detachably connected. The side of the display screen 15 facing away from the rear cover 14 includes a displayable region 151, and the displayable region 151 may constitute all or part of the side of the display screen 15 facing away from the rear cover 14, and the displayable region 151 is used for image information display.
In an embodiment, a side of the display screen 15 facing away from the rear cover 14 may be provided with a protective cover plate for protecting the display screen 15 from external interference, and the protective cover plate may be, for example, a glass cover plate or a plastic cover plate. In this case, the displayable region 151 may be formed on all or a portion of the side of the protective cover plate facing away from the rear cover 14, and of course, the protective cover plate may be omitted regardless of the structural strength of the display screen 15.
In one embodiment, the Display screen 15 may be a Liquid Crystal Display (LCD) screen for displaying information, and the LCD screen may be a Thin Film Transistor (TFT) screen or an In-plane switching (IPS) screen or a Liquid Crystal Display (SLCD) screen. In another embodiment, the display screen 15 may adopt an OLED (Organic Light-Emitting display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen, which will not be described herein again.
In one embodiment, referring to fig. 2 and 3, the circuit board assembly 12 includes a circuit board 100, an electromagnetic shield 200, and a thermal adhesive layer 300. The circuit board 100 is provided with a heating element 110, the heating element 110 is electrically connected to the circuit board 100, and the heating element 110 may be, for example, but is not limited to, a chip or a radio frequency module. The Circuit Board 100 may be a PCB (printed Circuit Board), a rigid-flex Board, or a reinforced FPC (flexible printed Circuit). Wherein, the rigid-flex board is including range upon range of PCB and the FPC that sets up, and the flexible circuit board after the reinforcement is including range upon range of FPC and the reinforcement piece that sets up, and the reinforcement piece can be for having the steel sheet of good heat dispersion.
The electromagnetic shield 200 is connected to the circuit board 100 and forms a receiving space 201 for receiving the heat generating element 110 with the circuit board 100. In an embodiment, the electromagnetic shield 200 includes a main body portion 210 and a bending portion 220, the bending portion 220 is bent and extended from an edge of the main body portion 210, and the main body portion 210 is connected to the circuit board 100 through the bending portion 220 and forms the receiving space 201. In this case, it can be understood that the electromagnetic shield 200 is disposed to cover the heating element 110, so that the electromagnetic shield 200 can absorb or reflect electromagnetic interference energy of the covered heating element 110, and reduce electromagnetic interference between components inside the electronic device 10.
The electromagnetic shield 200 is provided with a dispensing hole 202 and an exhaust hole 203 communicated with the accommodating space 201, the heating element 110 has a dispensing surface 111 opposite to the dispensing hole 202, and the dispensing surface 111 is partially exposed out of the dispensing hole 202. In an embodiment, the dispensing hole 202 and the exhaust hole 203 are opened in the main body portion 210, and the dispensing surface 111 can be understood as an end surface of the heat generating element 110 facing away from the circuit board 100. It is understood that in other embodiments, at least one of the dispensing hole 202 and the air vent 203 may also be opened at the bending portion 220. If the dispensing hole 202 is formed in the bending portion 220, the dispensing surface 111 of the heating element 110 can be understood as a side surface of the heating element 110 connected to the circuit board 100. In an embodiment, the electromagnetic shielding element 200 is a shielding case made of copper foil or aluminum foil, so that the electromagnetic shielding element 200 has a better electromagnetic shielding performance. Of course, the material of the shield case is not limited to this, and may be stainless steel, copper-nickel alloy, or the like.
In an embodiment, the electromagnetic shielding element 200 may also be a circuit board, the circuit board may be connected to the circuit board 100 by soldering to form the receiving space 201, and at this time, the bent portion 220 of the electromagnetic shielding element 200 may be understood as solder, or the bent portion 220 may be soldered to the circuit board 100 by using solder. After the circuit board is connected to the circuit board 100, the circuit board and the circuit board 100 form a laminated PCB board, and at this time, a side of the circuit board facing away from the circuit board 100 is used for attaching electronic components (such as chips, rf modules, resistors, capacitors, etc.). The wiring Board may be a PCB (Printed Circuit Board), a rigid-flex Board, or a reinforced FPC (Flexible Printed Circuit). Wherein, the rigid-flex board is including range upon range of PCB and the FPC that sets up, and the flexible circuit board after the reinforcement is including range upon range of FPC and the reinforcement piece that sets up, and the reinforcement piece can be for having the steel sheet of good heat dispersion.
The thermal conductive adhesive layer 300 is disposed between the dispensing surface 111 and the electromagnetic shield 200 in a flat-laid and unfolded state and is disposed opposite to the dispensing hole 202, and a part of the thermal conductive adhesive layer 300 is exposed to the dispensing hole 202. Thus, the heat conductive adhesive layer 300 is laid on the dispensing surface 111 in a large area, and heat generated by the operation of the heating element 110 can be transferred to the electromagnetic shield 200 through the heat conductive adhesive layer 300, so as to dissipate heat through the electromagnetic shield 200. The thermal conductive adhesive layer 300 may be, for example, a thermal conductive gel or a thermal conductive silica gel. In the process of specifically forming the thermal conductive adhesive layer 300, referring to fig. 8 and 9, the dispensing device 20 may be used to dispense the adhesive from the dispensing hole 202 to the dispensing surface 111, and at this time, the dispensing device 20 is connected to the electromagnetic shield 200 to seal the dispensing hole 202, that is, the opening of the dispensing hole 202 is isolated from the outside and the dispensing hole 202 is communicated with the flow channel 21 of the dispensing device 20, so that under the pressure difference between the pressure in the flow channel 21 and the pressure at the exhaust hole 203, the dispensing device 20 can press the thermal conductive adhesive 300a from the flow channel 21 to the dispensing surface 111, and the thermal conductive adhesive 300a pressed into the dispensing surface 111 is spread on the dispensing surface 111 to form the thermal conductive adhesive layer 300 connected to the inner surface of the electromagnetic shield 200. For example, in an embodiment, the center of the dispensing surface 111 is aligned with the center of the dispensing hole 202, for example, the dispensing surface 111 is rectangular, and the dispensing hole 202 is a circular hole, so that the center of the dispensing hole 202 can coincide with the center of the dispensing surface 111, so that the thermal conductive adhesive 300a can uniformly extend from the center of the dispensing surface 111 to other positions of the dispensing surface 111 from inside to outside during dispensing through the dispensing hole 202, thereby facilitating uniform heat conduction to the heating element 110 and improving the heat conduction effect.
To sum up, the trompil size that this application point glued hole 202 can be done is littleer, has realized under the prerequisite of little trompil size, also can make the heat-conducting glue layer 300 that the back formed of gluing spread in accommodating space 201 flatly in order to dispel the heat to heating element 110. In addition, the size of the opening hole based on the dispensing hole 202 can be made smaller, so that the area of the region of the electromagnetic shielding member 300 not provided with the dispensing hole 202 is increased, and thus the region of the electromagnetic shielding member 300 not provided with the dispensing hole 202 can bear more devices, so as to improve the space utilization rate of the electromagnetic shielding member 300. For example, when the region of the electromagnetic shield 300 not provided with the dispensing hole 202 is coated with the heat conductive paste for transferring the heat of the electromagnetic shield 300 to the middle frame 13 or the rear cover 14, the coating area of the heat conductive paste is increased, and the heat dissipation efficiency is improved. Alternatively, when a bracket for carrying a device such as a radio frequency module is mounted in a region of the electromagnetic shield 300 not provided with the dispensing hole 202, the mounting space of the bracket is increased. Alternatively, when the electromagnetic shield 200 is a circuit board, more electronic components can be attached to the circuit board.
In an embodiment, fig. 4 and 5 illustrate that the dispensing hole 202 and the exhaust hole 203 are disposed on the main body portion 210, the edge of the dispensing surface 111 is exposed to the exhaust hole 203, and in the step of forming the thermal conductive adhesive layer 300, whether the formed thermal conductive adhesive layer 300 extends to the edge of the dispensing surface 111 can be observed through the exhaust hole 203. When the formed thermal conductive adhesive layer 300 extends to the edge of the dispensing surface 111, the dispensing device 20 stops dispensing the adhesive toward the dispensing surface 111. Thus, the dispensing device 20 can be prevented from dispensing excessively during dispensing, and visual control can be realized.
Referring to fig. 6, the present application also provides a method of making a circuit board assembly 12, comprising the steps of:
step S810, providing the circuit board 100 and the electromagnetic shield 200, and referring to fig. 7, the circuit board 100 is provided with a heating element 110, and the heating element 110 may be, for example, a chip or a radio frequency module. The electromagnetic shield 200 is connected to the circuit board 100 and forms an accommodating space 201 for accommodating the heating element 110 with the circuit board 100, the electromagnetic shield 200 is provided with a dispensing hole 202 and an exhaust hole 203 which are communicated with the accommodating space 201, the heating element 110 is provided with a dispensing surface 111 which is arranged opposite to the dispensing hole 202, and the dispensing surface 111 is partially exposed out of the dispensing hole 202.
In an embodiment, the provided electromagnetic shield 200 includes a main body portion 210 and a bending portion 220, the bending portion 220 is bent and extended from an edge of the main body portion 210, the main body portion 210 is connected to the circuit board 100 through the bending portion 220 to form an accommodating space 201, and the dispensing hole 202 and the air vent 203 are disposed in the main body portion 210. The timing adhesive surface 111 can be understood as the end surface of the heat generating element 110 facing away from the circuit board 100. In other embodiments, at least one of the dispensing hole 202 and the exhaust hole 203 may also be opened at the bending portion 220. If the dispensing hole 202 is formed in the bending portion 220, the dispensing surface 111 of the heating element 110 can be understood as a side surface of the heating element 110 connected to the circuit board 100. The present application will be described by taking as an example that the dispensing hole 202 is provided in the main body portion 210.
In an embodiment, the electromagnetic shielding element 200 is a shielding cover made of copper foil or aluminum foil, so that the electromagnetic shielding element 200 has better electromagnetic shielding performance. Of course, the material of the shield case provided in the embodiments of the present application is not limited to this, and may be stainless steel, copper-nickel alloy, or the like.
In an embodiment, the provided electromagnetic shielding element 200 may also be a circuit board, the circuit board may be connected to the circuit board 100 by soldering to form the receiving space 201, and at this time, the bending portion 220 may be understood as solder, or the bending portion 220 may be soldered to the circuit board 100 by using solder. After the circuit board is connected to the circuit board 100, the circuit board and the circuit board 100 form a laminated PCB board, and at this time, a side of the circuit board facing away from the circuit board 100 is used for attaching electronic components (such as chips, rf modules, resistors, capacitors, etc.).
Step S820, providing the dispensing device 20 having the flow channel 21, and referring to fig. 8, positioning the dispensing device 20 in the dispensing hole 202 and connecting the dispensing hole 202 with the electromagnetic shield 200 to seal the dispensing hole 202 and make the dispensing hole 202 communicate with the flow channel 21. In an embodiment, the dispensing device 20 includes a needle 22 and a sealing sleeve 23, the flow channel 21 is formed in the needle 22, and a glue outlet 21a is formed at one end of the needle 22, the sealing sleeve 23 is sleeved on an outer wall of the needle 22 and protrudes from one end of the needle 22 where the glue outlet 21a is formed, the sealing sleeve 23 may be an elastic member such as a silicone sleeve or a rubber sleeve, and a distance between the sealing sleeve 23 protruding from the end of the needle 22 where the glue outlet 21a is formed may be 0.15mm to 0.5 mm. The needle 22 is aligned to the dispensing hole 202, and the sealing sleeve 23 surrounds the dispensing hole 202 and is pressed on the electromagnetic shielding member 200 to seal the dispensing hole 202 and connect the dispensing hole 202 with the flow channel 21.
In an embodiment, the electromagnetic shield 200 is provided with a sealing groove 204 disposed around the dispensing hole 202, and in the step of surrounding the dispensing hole 202 and pressing the sealing sleeve 23 on the electromagnetic shield 200, the sealing sleeve 23 may be embedded in the sealing groove 204. By such arrangement, the sealing performance at the dispensing hole 202 can be further optimized, and the pressure in the flow channel 21 and the pressure at the exhaust hole 203 can form a pressure difference for pushing the conductive adhesive 300 a.
In an embodiment, the center of the dispensing hole 202 is aligned with the center of the dispensing surface 111, for example, the dispensing surface 111 is rectangular, the dispensing hole 202 is a circular hole, and the center of the dispensing hole 202 can coincide with the center of the rectangular dispensing surface 111, so that the thermal conductive adhesive 300a can uniformly extend from the center of the dispensing surface 111 to other positions of the dispensing surface 111 from inside to outside during dispensing through the dispensing hole 202, thereby facilitating uniform heat conduction to the heating element 110. Therefore, in the step of aligning the dispensing device 20 to the dispensing hole 202, the center of the dispensing opening 21a is aligned to the center of the dispensing hole 202.
In step S830, referring to fig. 9, under the pressure difference between the pressure in the flow channel 21 and the pressure at the exhaust hole 202, the glue dispensing device 20 is used to press the heat conductive glue 300a from the flow channel 21 to the glue dispensing surface 111, and the heat conductive glue 300a pressed to the glue dispensing surface 111 is spread on the glue dispensing surface 111 to form the heat conductive glue layer 300 connected to the inner surface of the electromagnetic shield 200.
In an embodiment, the edge of the dispensing surface 111 is exposed to the exhaust hole 203, and fig. 9 illustrates that the dispensing hole 202 and the exhaust hole 203 are disposed on the main body portion 210, and in the step of forming the thermal conductive adhesive layer 300, whether the formed thermal conductive adhesive layer 300 extends to the edge of the dispensing surface 111 can be observed through the exhaust hole 203. When the formed thermal conductive adhesive layer 300 extends to the edge of the dispensing surface 111, the dispensing device 20 stops dispensing the adhesive toward the dispensing surface 111. Thus, the dispensing device 20 can be prevented from dispensing excessively during dispensing, and visual control can be realized.
In the above-mentioned manufacturing method of the circuit board assembly 12, under the pressure difference between the pressure in the flow channel 201 and the pressure at the exhaust hole 202, the heat-conducting glue 300a can enter the dispensing surface 111 from the flow channel 201, and the heat-conducting glue 300a pressed into the dispensing surface 111 can be spread on the dispensing surface 111 to form the heat-conducting glue layer 300 connected to the inner surface of the electromagnetic shielding member 200. The preparation method of the application utilizes the pressure difference between the pressure in the flow channel 21 and the pressure at the exhaust hole 203, so that the opening size of the dispensing hole 202 can be made smaller, and the heat-conducting glue layer 300 formed after dispensing can be spread in the accommodating space 201 to dissipate heat of the heating element 110 on the premise of small opening size. In addition, the size of the opening hole based on the dispensing hole 202 can be made smaller, so that the area of the region of the electromagnetic shielding member 200 where the dispensing hole 202 is not formed is increased, and thus the region of the electromagnetic shielding member 200 where the dispensing hole 202 is not formed can bear more devices, so as to improve the space utilization rate of the electromagnetic shielding member 200. For example, when the region of the electromagnetic shield 200 where the dispensing hole 202 is not formed is coated with the heat conductive paste for transferring the heat of the electromagnetic shield 200 to the middle frame 13 or the rear cover 14, the coating area of the heat conductive paste is increased, and the heat dissipation efficiency is improved. Alternatively, when a bracket for carrying a device such as a radio frequency module is mounted in a region of the electromagnetic shield 300 not provided with the dispensing hole 202, the mounting space of the bracket is increased. Or, when the electromagnetic shielding member 200 is a circuit board, more electronic components can be attached to the circuit board in the area where the dispensing hole 202 is not formed.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A method for manufacturing a circuit board assembly is characterized by comprising the following steps:
providing a circuit board and an electromagnetic shielding part, wherein the circuit board is provided with a heating element, the electromagnetic shielding part is connected with the circuit board and forms an accommodating space for accommodating the heating element with the circuit board, the electromagnetic shielding part is provided with a dispensing hole and an exhaust hole which are communicated with the accommodating space, the heating element is provided with a dispensing surface which is arranged opposite to the dispensing hole, and the dispensing surface part is exposed out of the dispensing hole;
providing a dispensing device with a flow channel, and oppositely positioning the dispensing device in the dispensing hole and connecting the dispensing device with the electromagnetic shielding piece so as to seal the dispensing hole and enable the dispensing hole to be communicated with the flow channel; and
and under the action of the pressure difference between the pressure in the flow channel and the pressure at the exhaust hole, pressing the heat-conducting glue into the glue dispensing surface from the flow channel by using the glue dispensing device, and flatly spreading the heat-conducting glue pressed into the glue dispensing surface on the glue dispensing surface to form a heat-conducting glue layer connected with the inner surface of the electromagnetic shielding part.
2. The method according to claim 1, wherein in the step of providing the circuit board and the electromagnetic shielding member, the electromagnetic shielding member includes a main body portion and a bending portion, the bending portion is bent and extended from an edge of the main body portion, the main body portion is connected to the circuit board through the bending portion to form the receiving space, and the dispensing hole and the vent hole are opened in the main body portion.
3. The method for preparing according to claim 2, wherein the step of providing the circuit board and the electromagnetic shielding member specifically comprises: a shield case is provided as the electromagnetic shield.
4. The method for preparing according to claim 2, wherein the step of providing the circuit board and the electromagnetic shielding member specifically comprises: providing a circuit board as an electromagnetic shielding part, wherein the circuit board and the circuit board form a laminated PCB, and one side of the circuit board, which is back to the circuit board, is used for attaching electronic elements.
5. The preparation method of claim 1, wherein the dispensing device comprises a needle and a sealing sleeve, the flow channel is formed in the needle and forms a glue outlet at one end of the needle, the sealing sleeve is sleeved on the outer wall of the needle and protrudes out of one end of the needle where the glue outlet is formed, and the step of aligning the dispensing device in the dispensing hole and connecting the dispensing device with the electromagnetic shielding member comprises the specific steps of:
and positioning the needle head pair in the dispensing hole, so that the sealing sleeve surrounds the dispensing hole and is pressed on the electromagnetic shielding part to seal the dispensing hole and communicate the dispensing hole with the flow channel.
6. The preparation method according to claim 5, wherein in the step of providing the glue dispensing device, the distance between the sealing sleeve and the end of the needle provided with the glue outlet is 0.15mm-0.5 mm.
7. The manufacturing method according to claim 5, wherein the electromagnetic shielding element is provided with a sealing groove arranged around the dispensing hole, and the step of causing the sealing sleeve to surround the dispensing hole and press-fit the electromagnetic shielding element specifically comprises: and the sealing sleeve is embedded in the sealing groove.
8. The manufacturing method according to claim 5, wherein a center pair of the dispensing holes is located at a center of the dispensing surface, and in the step of positioning the dispensing device pair at the dispensing holes, the center pair of the dispensing outlets is located at the center of the dispensing holes.
9. The method according to claim 1, wherein the edge of the dispensing surface is exposed to the exhaust hole, and in the step of forming the thermal conductive adhesive layer, whether the formed thermal conductive adhesive layer spreads to the edge of the dispensing surface is observed through the exhaust hole, and when the formed thermal conductive adhesive layer spreads to the edge of the dispensing surface, the dispensing device is stopped to continue dispensing to the dispensing surface.
10. A circuit board assembly, comprising:
the circuit board is provided with a heating element, and the heating element is provided with a dispensing surface;
the circuit board is connected with the circuit board and forms an accommodating space for accommodating the heating element, the circuit board is provided with a dispensing hole and an exhaust hole which are communicated with the accommodating space, the dispensing hole is arranged opposite to the dispensing surface, and part of the dispensing surface is exposed out of the dispensing hole; the circuit board and the circuit board form a laminated PCB, and one side of the circuit board, which is back to the circuit board, is used for attaching electronic elements; and
the heat conduction adhesive layer is arranged between the dispensing surface and the circuit board, the heat conduction adhesive layer and the dispensing hole are arranged oppositely, and part of the structure of the heat conduction adhesive layer is exposed out of the dispensing hole.
11. The circuit board assembly according to claim 10, wherein the circuit board includes a main body portion and a bending portion, the bending portion is bent and extended from an edge of the main body portion, the main body portion is connected to the circuit board through the bending portion to form the receiving space, the dispensing hole and the exhaust hole are disposed in the main body portion, and a side of the main body portion opposite to the circuit board is used for attaching an electronic component.
12. The circuit board assembly of claim 10, wherein the center pair of dispensing holes is located at the center of the dispensing face.
13. An electronic device, comprising:
a terminal body; and
a circuit board assembly prepared by the preparation method according to any one of claims 1 to 9, or a circuit board assembly according to any one of claims 10 to 12, provided in the terminal body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010190133.5A CN111356308B (en) | 2020-03-18 | 2020-03-18 | Circuit board assembly, preparation method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010190133.5A CN111356308B (en) | 2020-03-18 | 2020-03-18 | Circuit board assembly, preparation method thereof and electronic equipment |
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| CN111356308A true CN111356308A (en) | 2020-06-30 |
| CN111356308B CN111356308B (en) | 2021-11-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036705A1 (en) * | 2020-08-21 | 2022-02-24 | 京东方科技集团股份有限公司 | Control module and fabrication method therefor, and electronic device |
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| US20030155380A1 (en) * | 2002-02-20 | 2003-08-21 | Lg.Philips Lcd Co., Ltd. | Liquid crystal dispensing apparatus |
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN108124411A (en) * | 2016-11-30 | 2018-06-05 | 北京小米移动软件有限公司 | Electronic equipment |
| CN209897342U (en) * | 2019-04-04 | 2020-01-03 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030155380A1 (en) * | 2002-02-20 | 2003-08-21 | Lg.Philips Lcd Co., Ltd. | Liquid crystal dispensing apparatus |
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN108124411A (en) * | 2016-11-30 | 2018-06-05 | 北京小米移动软件有限公司 | Electronic equipment |
| CN209897342U (en) * | 2019-04-04 | 2020-01-03 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036705A1 (en) * | 2020-08-21 | 2022-02-24 | 京东方科技集团股份有限公司 | Control module and fabrication method therefor, and electronic device |
| US11848277B2 (en) | 2020-08-21 | 2023-12-19 | Boe Technology Group Co., Ltd. | Control module, method for manufacturing same, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111356308B (en) | 2021-11-05 |
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