CN111356307A - Processing method of laminated structure, laminated structure and rigid-flex printed circuit board - Google Patents
Processing method of laminated structure, laminated structure and rigid-flex printed circuit board Download PDFInfo
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- CN111356307A CN111356307A CN202010185712.0A CN202010185712A CN111356307A CN 111356307 A CN111356307 A CN 111356307A CN 202010185712 A CN202010185712 A CN 202010185712A CN 111356307 A CN111356307 A CN 111356307A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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Abstract
The invention discloses a processing method of a laminated structure, the laminated structure and a rigid-flex printed circuit board, wherein the processing method of the laminated structure comprises the following steps: obtaining a first semi-cured sheet according to a first preset requirement; obtaining a copper foil according to a second preset requirement, and arranging the copper foil on at least one side of the first semi-cured sheet; and carrying out lamination processing on the copper foil and the first semi-cured sheet according to a third preset requirement to obtain a first lamination structure. The laminated structure is processed by the processing method of the laminated structure, and the rigid-flex printed circuit board comprises the laminated structure. The processing method of the laminated structure can be applied to the processing of the rigid-flex printed circuit board, the first prepreg is a common prepreg such as an FR-4 prepreg, in the laminating process, the quality is easy to control, and compared with the prepreg which does not flow, the laminated structure is low in cost, and the cost burden caused by inferior products can be greatly reduced, so that the production cost of enterprises is reduced.
Description
Technical Field
The invention relates to the technical field of lamination processing of a rigid-flex printed circuit board, in particular to a processing method of a lamination structure, the lamination structure and the rigid-flex printed circuit board.
Background
With the continuous development of the electronic industry, the number of Circuit layers of a Circuit Board (PCB, also called a Printed Circuit Board or a Printed Circuit Board) is increasing, and the Circuit structure is also more and more complex (for example, a rigid-flex Printed Circuit Board, also called a rigid-flex Printed Circuit Board, which is designed to coexist with structures such as blind holes, buried copper, through holes, and the like, and the wiring on the Circuit Board is also tighter). The development of products gradually moves towards individuation, customization and miniaturization, so that the light, thin, short and small circuit boards become the mainstream development trend, and therefore, the manufacturing process of the circuit boards is also different day by day, wherein the lamination technology is taken as an important process and plays a vital role in the processing process of the circuit boards.
In the process of processing the rigid-flex printed circuit board, a no-flow prepreg is generally needed to be used as a dielectric plate between two copper layers of a copper-clad plate or a dielectric plate between different circuit layers. However, such a no-flow prepreg is expensive, which makes the manufacturing cost of the copper-clad plate or the flex-rigid plate high. For a general manufacturer, such high material cost may bring a huge burden to the manufacturer.
Disclosure of Invention
In view of the above, it is necessary to provide a method of processing a laminated structure, and a rigid-flex printed board; the processing method of the laminated structure has lower cost, and reduces the cost burden of enterprises; the laminated structure is processed by adopting the processing method of the laminated structure; the rigid-flex bonded panel includes the aforementioned laminate structure.
The technical scheme is as follows:
in one aspect, a method of fabricating a laminated structure is provided, comprising the steps of:
obtaining a first semi-cured sheet according to a first preset requirement;
obtaining a copper foil according to a second preset requirement, and arranging the copper foil on at least one side of the first semi-cured sheet;
and carrying out lamination processing on the copper foil and the first semi-cured sheet according to a third preset requirement to obtain a first lamination structure.
The processing method of the laminated structure can be applied to the processing of the rigid-flex printed circuit board, the first prepreg is a common prepreg such as an FR-4 prepreg, the quality is easy to control in the laminating processing process, and compared with the prepreg which does not flow, the cost is low, the cost burden caused by inferior products can be greatly reduced, and the production cost of an enterprise is reduced.
The technical solution is further explained below:
in one embodiment, in the step of taking the first semi-cured sheets according to the first preset requirement, the first semi-cured sheets take at least two.
In one embodiment, in the step of obtaining the first semi-cured sheet according to the first preset requirement, the thickness of the first semi-cured sheet is determined according to a fourth preset requirement.
In one embodiment, the step of laminating the copper foil and the first prepreg sheet according to a third preset requirement includes:
obtaining the copper-clad plate according to a fifth preset requirement;
obtaining a second prepreg according to a sixth preset requirement, and arranging the second prepreg between the other side of the copper foil and the copper-clad plate;
and carrying out lamination processing on the first prepreg, the copper foil, the second prepreg and the copper-clad plate according to a third preset requirement.
In one embodiment, after the step of laminating the copper foil and the first semi-cured sheet according to a third preset requirement to obtain a first laminated structure, the method further includes:
windowing is carried out on the first laminated structure according to a seventh preset requirement to obtain a rigid plate;
obtaining a flexible plate according to an eighth preset requirement;
obtaining a third prepreg according to a ninth preset requirement, and arranging the third prepreg between the rigid plate and the flexible plate;
and laminating the rigid plate, the third prepreg and the flexible plate according to a tenth preset requirement to obtain a second laminated structure.
In one embodiment, the step of obtaining a third prepreg according to a ninth preset requirement and disposing the third prepreg between the rigid board and the flexible board further includes:
and paving a covering film on the flexible plate corresponding to the windowing position of the rigid plate.
In one embodiment, the step of obtaining a third prepreg according to a ninth preset requirement and disposing the third prepreg between the rigid board and the flexible board further includes:
and spreading glue between the covering film and the flexible board.
In one embodiment, after the step of laminating the rigid board, the third prepreg, and the flexible board according to a tenth preset requirement to obtain a second laminated structure, the method further includes:
and processing a green oil layer on the plate surface of the second laminated structure according to an eleventh preset requirement.
On the other hand, a laminated structure is also provided, and the laminated structure is processed by adopting the processing method of the laminated structure according to any one of the technical schemes.
The laminated structure is obtained by adopting the processing method of the laminated structure, and the cost is low.
In addition, a rigid-flex printed circuit board is also provided, which comprises the laminated structure of the technical scheme.
The rigid-flex printed circuit board comprises the laminated structure, and is low in cost.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a processing method of a laminated structure in a first embodiment;
FIG. 2 is a flowchart of a method of processing a laminated structure in a second embodiment;
FIG. 3 is a flowchart of a method of processing a laminated structure in a third embodiment;
fig. 4 is a flowchart of a processing method of a laminated structure in a fourth embodiment.
Detailed Description
Embodiments of the present invention are described in detail below with reference to the accompanying drawings:
it will be understood that when an element is referred to herein as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, a method for processing a laminated structure includes the following steps:
obtaining a first semi-cured sheet according to a first preset requirement;
obtaining a copper foil according to a second preset requirement, and arranging the copper foil on at least one side of the first semi-cured sheet;
and carrying out lamination processing on the copper foil and the first semi-cured sheet according to a third preset requirement to obtain a first lamination structure.
The processing method of the laminated structure can be applied to the processing of the rigid-flex printed circuit board, the first prepreg is a common prepreg such as an FR-4 prepreg, in the laminating process, the quality is easy to control, and compared with the prepreg which does not flow, the laminated structure is low in cost, and the cost burden caused by inferior products can be greatly reduced, so that the production cost of enterprises is reduced.
The rigid-flex printed circuit board is a circuit board formed by combining a soft board, namely a flexible board, and a hard board, namely a rigid board, and therefore is also called a rigid-flex printed circuit board, wherein during production, a thin-layer flexible layer and a thin-layer rigid layer are combined and then laminated into a single component, so that a required circuit board (or a circuit board) is formed.
The prepreg, also called as "PP sheet", is one of the main materials in the production of multilayer boards, and mainly comprises resin and reinforcing materials, the reinforcing materials are classified into several types such as glass fiber cloth, paper base, composite materials, etc., and most prepregs (bonding sheets) used in the production of multilayer circuit boards adopt glass fiber cloth as the reinforcing material.
No Flow Prepreg (No Flow Prepreg) is a relatively expensive Prepreg, which is used as an adhesive material for connecting a rigid wiring board and a flexible wiring board in the manufacturing process of a flex-rigid board. In the industry, a non-flowing prepreg generally refers to a semi-solid film that is made by impregnating a resin glue with a glass cloth and then baking the impregnated film.
The non-flowing prepreg and the common prepreg (such as an FR-4 prepreg) both meet the required performance requirement through glass fiber cloth gumming and prepreg treatment, and both have the characteristics of prepreg structures, so that to a certain extent, the non-flowing prepreg is a special prepreg and has a great performance difference with the common prepreg. The prepreg is classified into a conventional prepreg, a low-fluidity prepreg and a no-flow prepreg according to the fluidity of the resin during hot pressing. Under the same hot pressing condition, the conventional prepreg can flow to the edge by about 10mm, the low-fluidity prepreg flows to the edge by 1-2 mm, and the resin fluidity of the non-flowing prepreg is generally only 0.1-0.5 mm. It should be noted that the no-flow prepreg is not no-flow, and the melt viscosity of the no-flow prepreg is generally much higher than that of a common prepreg (such as an FR-4 prepreg) or even 10 times to 100 times higher than that of the common FR-4 prepreg under certain conditions, such as a laminating process, along with the increase in the temperature rise rate.
At present, the production of the non-flowing prepreg and other technologies are mainly controlled by the countries of the United states, Japan and Korean, and the like, the price is high, the delivery period is long, and even some PC B manufacturers cannot buy the material. Meanwhile, when a manufacturer produces the non-flowing prepreg, once the control is not good, more defective products are generated, and high production cost is difficult to bear.
In the processing method of the laminated structure provided in this embodiment, the first prepreg is a common prepreg, which may be a conventional prepreg (e.g., FR-4 prepreg, the FR-4 prepreg is a plate material formed by laminating epoxy resin and fiberglass cloth), and of course, when the requirement is met, the first prepreg may also be a low-fluidity prepreg, and the method of using the no-flow prepreg in the conventional production of rigid-flex printed boards is changed to the method of using the common prepreg (i.e., the first prepreg) for production, which may also meet the production requirement, and the price of the common prepreg (i.e., the common prepreg or the common flowing prepreg) is much lower than that of the no-flow prepreg, so as to reduce the cost burden of manufacturers, and simultaneously, because the production processes of laminating the no-flow prepreg and other members are complicated, The control is difficult, so after the prepreg is replaced by the ordinary prepreg, the technical difficulty can be greatly reduced, and even a small amount of defective products appear, an enterprise can still bear the defective products because the cost is much lower than that of the immobile prepreg, so that an ordinary manufacturer can also produce the prepreg, and the manufacturing threshold is reduced.
It should be noted that:
the first preset requirement refers to obtaining parameters such as material, specification and thickness of the first semi-cured sheet to be selected through design and calculation according to the product requirements of the rigid-flex printed circuit board or the circuit board, so as to obtain the corresponding first semi-cured sheet according to the parameters, and cutting the first semi-cured sheet to form the usable first semi-cured sheet;
the second preset requirement is that according to the product requirements of the rigid-flex printed circuit board or the circuit board, parameters such as material, specification and thickness of copper foil are obtained through design and calculation, corresponding copper foil is obtained according to the parameters, and the copper foil is pasted or placed on one side or two sides of the first semi-cured sheet in a positioning mode to prepare for subsequent lamination processing;
the third preset requirement is that according to the product requirements of the rigid-flex printed circuit board or the circuit board, the current owned production equipment is combined, and processing parameters during production, such as lamination acting force, temperature control and the like, are obtained through design and calculation, so that the copper foil and the first semi-cured sheet are subjected to lamination processing, and the first lamination structure is obtained.
In addition, it should be noted that the laminated structure may be a single-layer board or a double-layer board, in one case, both sides of the first semi-cured sheet are provided with copper foils, the laminated first laminated structure is equivalent to a copper-clad board, after subsequent processing, a double-layer circuit board may be formed, or the laminated structure may be further processed by matching with other copper-clad boards or structures such as a flexible board to form a multi-layer board or a flex-rigid board, which is not described herein again.
In one embodiment, in the step of taking the first semi-cured sheets according to the first preset requirement, the first semi-cured sheets take at least two.
According to a first preset requirement, the thickness of the first semi-curing sheet is controlled based on product requirements and a designed structure, and the first semi-curing sheet with the thickness suitable for specification is selected, for example, two layers of the first semi-curing sheets can be selected to be used as a medium layer. It should be noted that, during the design, a thinner first semi-cured sheet may be selected to reduce the overall thickness of the dielectric layer formed by the first semi-cured sheet, which is equivalent to reducing the height of the dielectric layer, i.e. the height of the first semi-cured sheet, from the cross-sectional view of the multilayer board or the rigid-flex printed circuit board. Meanwhile, the characteristics of the first semi-solidified sheet (common semi-solidified sheet) are combined to play roles of preventing glue overflow and the like, the flatness of the plate surface of the laminated structure can be improved, the plate surface is smoother, the processing difficulty is reduced, the process quality is easy to control, in addition, windowing treatment can be omitted on part of the first semi-solidified sheet according to needs, and details are omitted here.
In one embodiment, in the step of obtaining the first semi-cured sheet according to the first preset requirement, the thickness of the first semi-cured sheet is determined according to a fourth preset requirement.
The fourth preset requirement may refer to that the thickness of the first semi-cured sheet is further determined by combining the first preset requirement (such as a product requirement, a design result, and the like) and the laminating equipment, the laminating temperature control, and the like, so that the thickness of the laminated first semi-cured sheet and the finally obtained first laminating structure are both related requirements and specifications of an expected product, and the thickness of the first semi-cured sheet is set according to the fourth preset requirement, whether one first semi-cured sheet or two or more first semi-cured sheets are determined according to actual product requirements, design requirements, laminating temperature, and the like, which is not described herein again.
Referring to fig. 4, in an embodiment, the step of laminating the copper foil and the first prepreg according to a third predetermined requirement includes:
obtaining the copper-clad plate according to a fifth preset requirement;
obtaining a second prepreg according to a sixth preset requirement, and arranging the second prepreg between the other side of the copper foil and the copper-clad plate;
and carrying out lamination processing on the first prepreg, the copper foil, the second prepreg and the copper-clad plate according to a third preset requirement.
When the first laminated structure is obtained by processing, if a multi-layer board is finally processed, a new copper-clad board (or a new copper foil) can be further laminated, a second prepreg is placed between the copper-clad board (or the new copper foil) and the copper foil on one side of the first prepreg to be used as a dielectric layer, the copper-clad board is used as a rigid board, so that the multi-layer board is obtained, and the multi-layer board structure is obtained by subsequent procedures of etching, exposure, development and the like, and is further processed to obtain a finished product.
It should be noted that the second prepreg may be a common prepreg or other prepregs, and if the second prepreg is a common prepreg, the cost is further reduced, and the thickness, material, and the like of the second prepreg can be selected according to the selection mode of the first prepreg, and for example, according to the product requirements, design requirements, and the like, details are not repeated here.
In addition, although the rigid board is obtained, the embodiment can still be applied to the processing of the rigid-flex board, because the rigid-flex board can also be obtained by laminating a multilayer board (rigid board) and a flexible board and then processing the multilayer board, and the description is omitted here.
It should be noted that:
the fifth preset requirement refers to that a proper copper-clad plate is taken according to the product requirement, the design requirement and the like of the multilayer plate in combination with actual needs, and the copper-clad plate is also formed by a prepreg and copper foils arranged on two sides of the prepreg, so that the copper-clad plate can also be of another first lamination structure, and certainly, the copper-clad plate can also be understood as a layer of copper foil and is not described again;
the sixth preset requirement refers to that parameters such as material, specification and thickness of the second prepreg which can be selected are obtained through design and calculation according to the product requirements of the rigid-flex printed circuit board or the circuit board, so that the corresponding second prepreg is obtained according to the parameters and is cut to form the second prepreg which can be used.
Referring to fig. 1 and 2, in an embodiment, after the step of performing a lamination process on the copper foil and the first prepreg according to a third predetermined requirement to obtain the first laminated structure, the method further includes:
windowing is carried out on the first laminated structure according to a seventh preset requirement to obtain a rigid plate;
obtaining a flexible plate according to an eighth preset requirement;
obtaining a third prepreg according to a ninth preset requirement, and arranging the third prepreg between the rigid plate and the flexible plate;
and laminating the rigid plate, the third prepreg and the flexible plate according to a tenth preset requirement to obtain a second laminated structure.
When the method is applied to the production of the rigid-flex printed circuit board, the rigid-flex printed circuit board is required to be matched with a flexible board for lamination, and then the actual rigid-flex printed circuit board finished product is obtained through further subsequent processing. Of course, during processing, the rigid board needs to be windowed according to the position of the flexible region, and the first semi-cured sheet may not be windowed, so as to be processed according to other existing means, which should be known by those skilled in the art and will not be described herein again.
It should be noted that:
the seventh preset requirement is that the position and corresponding parameters of the flexible zone are obtained according to the product requirement and design requirement of the rigid-flexible combined plate, so as to perform windowing processing on the obtained first laminated structure to obtain a corresponding rigid plate, wherein the rigid plate is a name of an intermediate product obtained after the first laminated structure is processed;
the eighth preset requirement is that the corresponding specification, thickness and the like of the flexible board are obtained according to the product requirement and design requirement of the rigid-flex printed circuit board for selection and can correspond to the rigid board;
the ninth preset requirement refers to that parameters such as material, thickness and specification of the third prepreg are obtained after design and calculation according to the product requirement and the design requirement of the rigid-flex printed circuit board, the third prepreg capable of meeting the requirements is selected according to the parameters, and the third prepreg is arranged between the rigid board and the flexible board to prepare for subsequent lamination processing;
the tenth preset requirement is that the rigid plate, the third prepreg and the flexible plate are positioned according to the actual situation of the existing laminating equipment in combination with the situations of the rigid plate, the flexible plate and the third prepreg, requirements are made on laminating pressure, laminating temperature control and the like during laminating, and actual laminating operation is performed according to the requirements to obtain a second laminated structure, wherein the second laminated structure is equivalent to a preform, and after the preform is further processed, for example, further laminating or subsequent procedures such as film pasting, developing, exposing, etching and the like can be performed to obtain a required product, which is not described herein again.
In addition, the third prepreg may be a common prepreg or other prepregs, and in the actual processing process, the third prepreg is not limited to one, and the specific selected number is determined according to the thickness, the lamination requirement, the product requirement, and the like of the third prepreg, for example, the third prepreg may be two third prepregs, that is, the two third prepregs together form a dielectric layer between the rigid board and the flexible board, which is not described herein again.
In one embodiment, the step of obtaining a third prepreg according to a ninth preset requirement, and disposing the third prepreg between the rigid board and the flexible board, further includes:
and laying a covering film on the flexible board corresponding to the windowing position of the rigid board.
The cover film is used for protecting the part of the flexible plate in the flexible area, the cover film can be a PI cover film, the PI cover film is a mold mainly composed of a polyimide film and glue, the polyimide film is a PI film (polyimide film), the PI film is a film type insulating material with the best performance in the world, and the PI film is formed by performing polycondensation and film casting on pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent and then performing imidization. Of course, those skilled in the art can select other cover films meeting the requirements according to actual needs, and details are not described here.
In one embodiment, the step of obtaining a third prepreg according to a ninth preset requirement, and disposing the third prepreg between the rigid board and the flexible board, further includes:
and spreading glue between the covering film and the flexible board.
The glue is arranged between the covering film and the flexible board, so that the covering film can be conveniently pasted and fixed on the flexible board, and the glue can be covering film glue specially used for pasting the covering film on the flexible board in the field, and is not described in detail here.
In one embodiment, after the step of laminating the rigid board, the third prepreg, and the flexible board according to a tenth preset requirement to obtain the second laminated structure, the method further includes:
and processing a green oil layer on the plate surface of the second laminated structure according to an eleventh preset requirement.
The green oil layer is a solder mask layer on a multilayer board or a rigid-flex printed board, and can be processed according to actual needs by a person skilled in the art, and is not described in detail herein.
It should be noted that the eleventh preset requirement refers to that a suitable green oil processing material and a thickness of a green oil layer are selected according to product requirements, design requirements and the like and in combination with various requirements such as cost control and the like, and processing of the green oil layer is performed according to the requirements, and details are not repeated here.
It should be noted that, in any of the above embodiments, other manners that still need to be processed, such as processing of a circuit layer, drilling processing, and the like, may all adopt the existing technical means, and those skilled in the art can perform routine implementation by referring to the existing technical means, and further description is not repeated here.
This embodiment also provides a laminated structure processed by the processing method of the laminated structure according to any of the above embodiments.
The laminated structure is obtained by adopting the processing method of the laminated structure, and the cost is low.
This embodiment also provides a rigid-flex printed circuit board including a laminate structure as described in the previous embodiments.
The rigid-flex printed circuit board comprises the laminated structure, and is low in cost.
In one embodiment, the rigid-flex board is a multilayer board, and the circuit layer has ten layers, wherein the first layer, the second layer, the third layer, the eighth layer, the ninth layer and the tenth layer are all circuit layers on a rigid board, and the fourth layer, the fifth layer, the sixth layer and the seventh layer are all circuit boards on a flexible board.
In specific implementation, the following may be specifically mentioned:
the dielectric layer between the first layer of circuit and the second layer of circuit can adopt a first prepreg (can be two, the specification can be 1080P common prepregs, windowing can not be carried out, the total thickness can be 145 microns, compared with the condition that no-flow prepregs are adopted under the same condition, the thickness is 5 microns less, and viewed from the section, the height of the prepregs at the position is equivalently reduced);
the dielectric layer between the third circuit layer and the fourth circuit layer can adopt a first prepreg (two prepregs can be adopted, the specification can be 1080P common prepregs, one prepreg can be subjected to windowing treatment, the other prepreg is not subjected to windowing treatment, the total thickness can be 145 microns, and compared with the condition that a non-flow prepreg is adopted under the same condition, the thickness is 5 microns less, and the height of the prepreg at the position is reduced equivalently in section view);
the dielectric layer between the fifth circuit layer and the sixth circuit layer may be a first prepreg (two prepregs may be used, the specification may be 1080P common prepregs, both prepregs may be windowed, and the total thickness may be 145 μm, which is 5 μm smaller than that in the case of using a no-flow prepreg under the same condition, and is equivalent to reducing the height of the prepreg at the position in a cross section view).
It should be noted that 1080 of the aforementioned 1080 ordinary prepregs (or ordinary flow prepregs) refers to the fortuitous condition of the prepregs, which represents that the glass fiber fabrics in the prepregs are different, such as 7628, 2116, 2113, 2112, and 1506, which represent prepregs of different types, respectively, and the smaller the value, the smaller the thickness of the glass fiber fabric, which is known by those skilled in the art and will not be described herein again.
Through accounting, by adopting the processing method of the laminated structure provided by the embodiment, the production and manufacturing cost can be reduced by 53%, so that the manufacturing threshold is greatly reduced, and the cost burden of manufacturers is also reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method of fabricating a laminated structure, comprising the steps of:
obtaining a first semi-cured sheet according to a first preset requirement;
obtaining a copper foil according to a second preset requirement, and arranging the copper foil on at least one side of the first semi-cured sheet;
and carrying out lamination processing on the copper foil and the first semi-cured sheet according to a third preset requirement to obtain a first lamination structure.
2. The method of processing a laminated structure according to claim 1, wherein in the step of obtaining a first semi-cured sheet according to a first preset requirement, at least two first semi-cured sheets are obtained.
3. The method of processing a laminated structure according to claim 1, wherein in the step of obtaining a first semi-cured sheet according to a first preset requirement, a thickness of the first semi-cured sheet is determined according to a fourth preset requirement.
4. The method of processing a laminated structure according to claim 1, wherein the step of subjecting the copper foil and the first semi-cured sheet to a lamination process according to a third preset requirement comprises:
obtaining the copper-clad plate according to a fifth preset requirement;
obtaining a second prepreg according to a sixth preset requirement, and arranging the second prepreg between the other side of the copper foil and the copper-clad plate;
and carrying out lamination processing on the first prepreg, the copper foil, the second prepreg and the copper-clad plate according to a third preset requirement.
5. The method of processing a laminated structure according to claim 1, wherein the step of laminating the copper foil and the first prepreg sheet according to a third predetermined requirement to obtain a first laminated structure further comprises:
windowing is carried out on the first laminated structure according to a seventh preset requirement to obtain a rigid plate;
obtaining a flexible plate according to an eighth preset requirement;
obtaining a third prepreg according to a ninth preset requirement, and arranging the third prepreg between the rigid plate and the flexible plate;
and laminating the rigid plate, the third prepreg and the flexible plate according to a tenth preset requirement to obtain a second laminated structure.
6. The method according to claim 5, wherein in the step of obtaining a third prepreg according to a ninth preset requirement and providing the third prepreg between the rigid board and the flexible board, the method further comprises:
and paving a covering film on the flexible plate corresponding to the windowing position of the rigid plate.
7. The method according to claim 6, wherein in the step of obtaining a third prepreg according to a ninth preset requirement and providing the third prepreg between the rigid board and the flexible board, the method further comprises:
and spreading glue between the covering film and the flexible board.
8. The method according to claim 5, further comprising, after the step of laminating the rigid board, the third prepreg and the flexible board according to a tenth predetermined requirement to obtain a second laminated structure:
and processing a green oil layer on the plate surface of the second laminated structure according to an eleventh preset requirement.
9. A laminated structure, characterized in that it is obtained by processing the laminated structure according to any one of claims 1 to 8.
10. A rigid-flex board comprising the laminate structure of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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|---|---|---|---|---|
| CN105472874A (en) * | 2015-12-25 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Rigid-flex board and preparation method thereof |
| US9743511B1 (en) * | 2016-09-20 | 2017-08-22 | Qun Hong Technology Inc | Rigid flex circuit board |
| CN107770963A (en) * | 2017-10-11 | 2018-03-06 | 广州兴森快捷电路科技有限公司 | The preparation method of rigid-flexible combined circuit board |
| CN108012467A (en) * | 2017-12-18 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The processing method and wiring board of rigid-flex combined board |
| CN207939830U (en) * | 2018-02-12 | 2018-10-02 | 浙江华正新材料股份有限公司 | A kind of multilayer composite sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472874A (en) * | 2015-12-25 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Rigid-flex board and preparation method thereof |
| US9743511B1 (en) * | 2016-09-20 | 2017-08-22 | Qun Hong Technology Inc | Rigid flex circuit board |
| CN107770963A (en) * | 2017-10-11 | 2018-03-06 | 广州兴森快捷电路科技有限公司 | The preparation method of rigid-flexible combined circuit board |
| CN108012467A (en) * | 2017-12-18 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The processing method and wiring board of rigid-flex combined board |
| CN207939830U (en) * | 2018-02-12 | 2018-10-02 | 浙江华正新材料股份有限公司 | A kind of multilayer composite sheet |
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