CN111356283A

CN111356283A - Circuit board and electronic equipment

Info

Publication number: CN111356283A
Application number: CN202010273252.7A
Authority: CN
Inventors: 樊华
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2020-06-30

Abstract

The application relates to a circuit board and an electronic device. The circuit board includes a substrate and an electrical conductor. The substrate comprises a dielectric layer, a first conducting layer and a second conducting layer, wherein the first conducting layer and the second conducting layer are arranged on two opposite sides of the dielectric layer, the first conducting layer forms a first surface on one side departing from the dielectric layer, and the second conducting layer forms a second surface on one side departing from the dielectric layer. The substrate is provided with a containing groove, and the containing groove extends into the medium layer from the first surface. The conductor is filled in the accommodating groove and is arranged in an insulating way with the first conducting layer. The circuit board, the electric conductor can be used for transmitting current. Under the condition of transmitting the electric current of the same size, the thickness of the electric conductor is increased by the depth of the accommodating groove of the circuit board, so that the width of the electric conductor can be reduced, the width of the current transmission line can be reduced, the saved area can be used for arranging other signal transmission lines, the wiring compactness of the circuit board is improved, and the circuit board is favorable for the light, thin and small design of electronic equipment when applied to the electronic equipment.

Description

Circuit board and electronic equipment

Technical Field

The present application relates to the field of circuit board technology, and in particular, to a circuit board and an electronic device.

Background

With the increasing enhancement of the performance of mobile terminals (smart phones, smart watches, etc.), and the trend of pursuing light, thin and miniaturized designs, the wiring area of the circuit board of the mobile terminal is increasingly limited, and the wiring area of the circuit board restricts the light, thin and miniaturized designs of the mobile terminal.

Disclosure of Invention

The embodiment of the application provides a circuit board and an electronic device, so that the light, thin and small design of the electronic device is facilitated.

A circuit board, comprising:

the substrate comprises a dielectric layer, a first conducting layer and a second conducting layer, wherein the first conducting layer and the second conducting layer are arranged on two opposite sides of the dielectric layer; the substrate is provided with a containing groove, and the containing groove extends from the first surface to the medium layer; and

and the electric conductor is filled in the accommodating groove and is arranged in an insulating way with the first conducting layer.

In the circuit board, the accommodating groove extends into the dielectric layer from the first surface, the conductor is filled in the accommodating groove and is arranged in an insulating way with the first conducting layer, and the conductor can be used for transmitting current. Under the condition of transmitting the electric current of the same size, the thickness of the electric conductor is increased by the depth of the accommodating groove of the circuit board, so that the width of the electric conductor can be reduced, the width of the current transmission line can be reduced, the saved area can be used for arranging other signal transmission lines, the wiring compactness of the circuit board is improved, and the circuit board is favorable for the light, thin and small design of electronic equipment when applied to the electronic equipment.

In one embodiment, the accommodating groove extends to the second surface, and the conductive body is exposed to the side of the second surface and is insulated from the second conductive layer.

In one embodiment, the side of the electrical conductor exposed to the first surface is flush with the first surface, and the side of the electrical conductor exposed to the second surface is flush with the second surface.

In one embodiment, the material of the conductive body is the same as the material of the first conductive layer, or the material of the conductive body is the same as the material of the second conductive layer.

In one embodiment, the first conductive layer is made of copper or silver, and the second conductive layer is made of copper or silver.

In one embodiment, the thickness direction of the conductive body is perpendicular to the first surface, or the thickness direction of the conductive body is inclined to the first surface.

In one embodiment, the conductor extends to form a straight line shape or a curve shape on the side of the first surface, and the conductor can be used for transmitting current.

In one embodiment, the first conductive layer comprises a signal transmission line disposed in insulation from the electrical conductor, the signal transmission line being capable of being used for communication.

In one embodiment, the thickness of the first conductive layer is 0.015 mm to 0.020 mm, the thickness of the second conductive layer is 0.015 mm to 0.020 mm, the thickness of the dielectric layer is 0.04 mm to 0.05mm, and the width of the side of the conductive body exposed to the first surface is less than 1 mm.

In one embodiment, the dielectric layers are arranged in more than two layers, another conductive layer is arranged between two adjacent dielectric layers, and the conductor is arranged in an insulated manner with the another conductive layer.

An electronic device comprises a shell and the circuit board, wherein the circuit board is connected to the shell.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment;

FIG. 2 is a partial schematic view of a circuit board according to an embodiment;

FIG. 3 is a partial schematic view of a circuit board according to another embodiment;

FIG. 4 is a cross-sectional view of a circuit board of an embodiment;

FIG. 5 is a cross-sectional view of a circuit board of another embodiment;

FIG. 6 is a partial schematic view of a circuit board according to yet another embodiment;

fig. 7 is a schematic block structure diagram of a terminal device according to an embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "terminal device" refers to a device capable of receiving and/or transmitting communication signals including, but not limited to, devices connected via any one or more of the following connections:

(1) via wireline connections, such as via Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital cable, direct cable connections;

(2) via a Wireless interface means such as a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

A terminal device arranged to communicate over a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite or cellular telephones;

(2) personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data Communications capabilities;

(3) radiotelephones, pagers, internet/intranet access, Web browsers, notebooks, calendars, Personal Digital Assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

(4) conventional laptop and/or palmtop receivers;

(5) conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, in some embodiments, the electronic device 10 is a smartphone. The electronic device 10 includes a housing 100 and a circuit board 200, the circuit board 200 being connected to the housing 100. The circuit board 200 may integrate a processor, memory, baseband chip, power management unit, etc. of the electronic device 10. The circuit board 200 includes a current transmission line for transmitting current, for example, electrically connecting a battery of the electronic device 10 with other electronic components and supplying power to the other electronic components, and a signal transmission line 2131 a. The signal transmission line 2131a can be used for communication, for example, to transmit detection signals of electronic components such as an optical sensor and a distance sensor of the electronic device 10 to a processor for further processing. When the electronic device 10 is a smart phone, the electronic device 10 may further include a display screen module 300, the display screen module 300 is electrically connected to the circuit board 200, and the display screen module 300 may be used to display information and provide an interactive interface for a user. Of course, in some embodiments, the signal transmission line 2131a on the circuit board 200 is not required. In other embodiments, the electronic device 10 may be a tablet or the like type of terminal device.

Referring to fig. 2, a circuit board 200 includes a substrate 210 and a conductor 220, the conductor 220 constituting all or part of a current transmission line. The substrate 210 includes a dielectric layer 211, and a first conductive layer 2131 and a second conductive layer 2133 disposed on opposite sides of the dielectric layer 211, where the first conductive layer 2131 forms a first surface 210a on a side away from the dielectric layer 211, and the second conductive layer 2133 forms a second surface 210b on a side away from the dielectric layer 211. The substrate 210 has a receiving cavity 210c, and the receiving cavity 210c extends from the first surface 210a to the dielectric layer 211. The conductor 220 is filled in the receiving groove 210c and spaced apart from the first conductive layer 2131, so that the conductor 220 and the first conductive layer 2131 are insulated from each other. Specifically, the thickness of the dielectric layer 211 is greater than the thicknesses of the first conductive layer 2131 and the second conductive layer 2133, and the first conductive layer 2131 and the second conductive layer 2133 are respectively located on two sides of the dielectric layer 211 in the thickness direction. Of course, in other embodiments, the first conductive layers 2131 on both sides of the receiving groove 210c in the width direction may be coated with an insulating material to insulate the conductor 220 from the first conductive layers 2131.

Further, in some embodiments, the first conductive layer 2131 and the second conductive layer 2133 are made of the same material and are both copper. The thickness of the first conductive layer 2131 is 0.015 mm to 0.020 mm, for example, the thickness of the first conductive layer 2131 may be 0.016 mm, or 0.017 mm, or 0.018mm, or 0.019 mm, etc. The thickness of the second conductive layer 2133 is 0.015 mm to 0.020 mm, for example, the thickness of the second conductive layer 2133 may be 0.016 mm, or 0.017 mm, or 0.018mm, or 0.019 mm, etc. The dielectric layer 211 is made of epoxy resin or the like, and the thickness of the dielectric layer 211 is 0.04 mm to 0.05mm, for example, the thickness of the dielectric layer 211 may be 0.042 mm, or 0.043mm, or 0.045 mm, or 0.047 mm, or 0.049 mm. In this embodiment mode, the thickness of the first conductive layer 2131 is 0.018mm, the thickness of the second conductive layer 2133 is 0.018mm, and the thickness of the dielectric layer 211 is 0.043 mm. In another embodiment, the first conductive layer 2131 and the second conductive layer 2133 can be made of different materials, for example, the first conductive layer 2131 can be made of copper, and the second conductive layer 2133 can be made of silver. In other embodiments, the thickness of the first conductive layer 2131 may be different from the thickness of the second conductive layer 2133.

In some embodiments, the material of the conductor 220 is the same as that of the first conductive layer 2131, or the material of the conductor 220 is the same as that of the second conductive layer 2133. For example, the material of the conductor 220 and the material of the first conductive layer 2131 may be both copper or both silver. For another example, the material of the conductor 220 and the material of the second conductive layer 2133 may both be copper or both be silver.

Referring to fig. 2, in some embodiments, the receiving groove 210c is a sinking groove structure, that is, the receiving groove 210c does not penetrate through the second surface 210 b. Referring to fig. 3, in other embodiments, the receiving groove 210c extends to the second surface 210b, and the conductive body 220 is exposed at the side of the second surface 210b and spaced apart from the second conductive layer 2133 to insulate the conductive body 220 and the second conductive layer 2133 from each other. Of course, in other embodiments, the second conductive layers 2133 on both sides of the width direction of the receiving groove 210c may be coated with an insulating material to insulate the conductive body 220 from the second conductive layers 2133.

Further, referring to fig. 4, the side of the conductive body 220 exposed to the first surface 210a is flush with the first surface 210a, and the side of the conductive body 220 exposed to the second surface 210b is flush with the second surface 210 b. The circuit board 200 with such a structure has a flat appearance and is easy to machine and mold. For example, after the substrate 210 is processed by removing material by laser etching, the accommodating groove 210c may be formed, and the conductive metal is deposited in the accommodating groove 210c to obtain the conductive body 220. Further, in some embodiments, the width of the side of the conductive body 220 exposed to the first surface 210a is less than 1 millimeter. The conductive body 220 has a relatively small width, and the first surface 210a of the substrate 210 can save a relatively large wiring area for arranging the signal transmission line 2131a or other lines, so as to improve the compactness of wiring of the circuit board 200, thereby facilitating the light weight, thin and miniaturized design of the electronic device 10. It can be understood that when the conductive body 220 is exposed on the second surface 210b, the second surface 210b of the substrate 210 can also save a relatively large wiring area for arranging the signal transmission lines 2131a or other lines, so as to improve the compactness of wiring of the circuit board 200, thereby facilitating the light, thin and miniaturized design of the electronic device 10.

According to the calculation formula of the resistance: where R is resistance (unit: Ω) and ρ is resistivity (unit: Ω · mm)²Mm), L is the length of the conductor (unit: mm), S is the cross-sectional area of the conductor (unit: mm is²) When ρ and L are constant, S, i.e., R, can be kept constant. Therefore, in the circuit board 200 having the above-described structure, when the thickness of the conductor 220 is increased, the width of the conductor 220 is reduced in proportion to the thickness of the conductor 220, so that the resistance of the conductor 220 can be maintained. For example, in some embodiments, a power transmission line having a thickness of 0.018mm would need to have a width of 2mm when carrying a current of 2A. The two opposite sides of the conductor 220 are respectively flush with the first surface 210a and the second surface 210b, the thickness of the first conductive layer 2131 is 0.018mm, and the second conductive layerThe thickness of the conductive layer 2133 is 0.018mm, and the thickness of the dielectric layer 211 is 0.043mm, the thickness of the conductor 220 can reach (0.018mm +0.043mm +0.018mm) ═ 0.079mm, which is approximately 4.39 times of the thickness of the original power transmission line (0.079mm/0.018mm), and the width of the power transmission line can be reduced to (2mm/4.39) ≈ 0.456 mm.

In the circuit board 200, the receiving groove 210c extends from the first surface 210a to the dielectric layer 211 or to the second surface 210b, the conductor 220 is filled in the receiving groove 210c and insulated from the first conductive layer 2131, and the conductor 220 can be used for transmitting current. Under the condition of transmitting the same magnitude of current, the thickness of the conductor 220 is increased by the depth of the accommodating groove 210c of the circuit board 200, so that the width of the conductor 220 can be reduced, that is, the width of the current transmission line is reduced, the saved area can be used for arranging other signal transmission lines 2131a, the wiring compactness of the circuit board 200 is improved, and the circuit board 200 is beneficial to the light, thin and small design of the electronic device 10 when being applied to the electronic device 10.

Further, referring to fig. 4, in some embodiments, the thickness direction of the conductive body 220 is perpendicular to the first surface 210 a. Referring to fig. 5, in other embodiments, the thickness extending direction of the conductive body 220 is inclined to the first surface 210 a. For the conductor 220 disposed obliquely, in the case that the two opposite sides of the conductor 220 are flush with the first surface 210a and the second surface 210b, respectively, the cross section of the conductor 220 can be regarded as a parallelogram, and since the height of the parallelogram, i.e. the thickness of the substrate 210, remains unchanged, the width of the parallelogram exposed to the first surface 210a also remains unchanged, so that the cross section area of the conductor 220 remains unchanged. Because the conductive body 220 can be disposed obliquely, the difficulty of processing the conductive body 220 can be reduced, and the requirement of perpendicularity between the conductive body 220 and the first surface 210a or the second surface 210b can be reduced.

Referring to fig. 2 and 3, in some embodiments, the conductor 220 extends in a straight line shape on the side where the first surface 210a is located. In other embodiments, the conductive body 220 may extend to form a curve on the first surface 210 a. In other words, the width of the receiving groove 210c does not need to be uniformly set, and can be flexibly adjusted according to the wiring requirement. Therefore, the shape and width of the receiving groove 210c and the current transmission line can be flexibly set according to the actual wiring requirement. Further, referring to fig. 6, in some embodiments, the dielectric layers 211 of the substrate 210 may be disposed in two or more layers, and another conductive layer 2135 is disposed between two adjacent dielectric layers 211, and the conductive body 220 is spaced apart from the another conductive layer 2135 so that the conductive body 220 and the another conductive layer 2135 can be insulated from each other. Of course, in other embodiments, the other conductive layer 2135 on both sides of the receiving groove 210c in the width direction may be coated with an insulating material to insulate the conductor 220 from the other conductive layer 2135. In other words, for the substrate 210 with multiple dielectric layers 211 and multiple conductive layers, the depth of the receiving groove 210c can be further increased, so as to further increase the thickness of the conductive body 220, and further reduce the width of the conductive body 220. For example, in the case where the dielectric layers 211 are provided in two layers, and the other conductive layer 2135 is provided between the two dielectric layers 211, the thickness of each dielectric layer 211 is 0.043mm, and the thickness of the other conductive layer 2135 is 0.018mm, the thickness of the conductive body 220 may reach (0.018mm +0.043mm +0.018mm +0.043mm +0.018mm) ═ 0.14 mm. When the current of 2A needs to be transmitted, the width of the original current transmission line is 2mm, the thickness is 0.018mm, after the accommodating groove 210c and the conductor 220 are arranged, the thickness of the conductor 220 is (0.14mm/0.018mm) ≈ 7.78 times of the thickness of the original current transmission line, and the width of the conductor 220 can be reduced to (2mm/7.78) ≈ 0.257 mm.

In some embodiments, a signal transmission line 2131a is formed from the first conductive layer 2131, and the signal transmission line 2131a is spaced apart from the electrical conductors 220, the signal transmission line 2131a being capable of communication. The signal transmission line 2131a may be provided in a plurality, and the plurality of signal transmission lines 2131a are provided at intervals. For example, the signal transmission line 2131a may be provided in two or more than two. Further, in some embodiments, the width of the signal transmission line 2131a is 0.05mm, and the spacing between adjacent signal transmission lines 2131a is greater than or equal to 0.05 mm.

Fig. 7 shows a module structure of the electronic device 10 of the terminal device type. The terminal device may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer-readable storage media, input unit 503, display unit 504, sensor 505, audio circuitry 506, wireless fidelity (WiFi) module 507, processor 508 including one or more processing cores, and power supply 509. Those skilled in the art will appreciate that the terminal device configuration shown in fig. 7 does not constitute a limitation of the terminal device and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.

The rf circuit 501 may be used for receiving and transmitting information, or receiving and transmitting signals during a call, and in particular, receives downlink information of a base station and then sends the received downlink information to one or more processors 508 for processing; in addition, data relating to uplink is transmitted to the base station. In general, radio frequency circuit 501 includes, but is not limited to, an antenna, at least one Amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like. In addition, the radio frequency circuit 501 may also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

The memory 502 may be used to store applications and data. Memory 502 stores applications containing executable code. The application programs may constitute various functional modules. The processor 508 executes various functional applications and data processing by executing application programs stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the terminal device, and the like. Further, the memory 502 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 502 may also include a memory controller to provide the processor 508 and the input unit 503 access to the memory 502.

The input unit 503 may be used to receive input numbers, character information, or user characteristic information (such as a fingerprint), and generate a keyboard, mouse, joystick, optical, or trackball signal input related to user setting and function control. In particular, in one particular embodiment, the input unit 503 may include a touch-sensitive surface as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations by a user (e.g., operations by a user on or near the touch-sensitive surface using a finger, a stylus, or any other suitable object or attachment) thereon or nearby, and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 508, and can receive and execute commands sent by the processor 508.

The display unit 504 may be used to display information input by or provided to the user and various graphical user interfaces of the terminal device, which may be made up of graphics, text, icons, video, and any combination thereof. The display unit 504 may include a display panel. Alternatively, the display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch-sensitive surface may overlay the display panel, and when a touch operation is detected on or near the touch-sensitive surface, the touch operation is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in FIG. 7 the touch-sensitive surface and the display panel are two separate components to implement input and output functions, in some embodiments the touch-sensitive surface may be integrated with the display panel to implement input and output functions. It is understood that the display screen 110 may include an input unit 503 and a display unit 504.

The terminal device may also include at least one sensor 505, such as light sensors, motion sensors, and other sensors. Specifically, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and/or the backlight when the terminal device is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which can be configured in the terminal device, detailed description is omitted here.

The audio circuit 506 may provide an audio interface between the user and the terminal device through a speaker, microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit the electrical signal to a speaker, and convert the electrical signal into a sound signal to output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and the audio data is processed by the audio data output processor 508, and then sent to another terminal device through the rf circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuitry 506 may also include an earphone jack to provide communication of a peripheral earphone with the terminal device.

Wireless fidelity (WiFi) belongs to short-distance wireless transmission technology, and the terminal device can help the user to receive and send e-mail, browse web pages, access streaming media and the like through the wireless fidelity module 507, and provides wireless broadband internet access for the user. Although fig. 7 shows the wireless fidelity module 507, it is understood that it does not belong to the essential constitution of the terminal device, and may be omitted entirely as needed within the scope not changing the essence of the invention.

The processor 508 is a control center of the terminal device, connects various parts of the entire terminal device by using various interfaces and lines, and performs various functions of the terminal device and processes data by running or executing an application program stored in the memory 502 and calling data stored in the memory 502, thereby integrally monitoring the terminal device. Optionally, processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor, which primarily handles operating systems, user interfaces, application programs, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 508.

The terminal device also includes a power supply 509 to supply power to the various components. Preferably, the power supply 509 may be logically connected to the processor 508 through a power management system, so that the power management system may manage charging, discharging, and power consumption. The power supply 509 may also include any component such as one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.

Although not shown in fig. 7, the terminal device may further include a bluetooth module or the like, which is not described herein again. In specific implementation, the above modules may be implemented as independent entities, or may be combined arbitrarily to be implemented as the same or several entities, and specific implementation of the above modules may refer to the foregoing method embodiments, which are not described herein again.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A circuit board, comprising:

2. The circuit board of claim 1, wherein the receiving groove extends to the second surface, and the conductive body is exposed to the second surface and insulated from the second conductive layer.

3. The circuit board of claim 2, wherein the side of the electrical conductor exposed to the first surface is flush with the first surface and the side of the electrical conductor exposed to the second surface is flush with the second surface.

4. The circuit board according to claim 3, wherein the conductor is made of the same material as the first conductive layer, or the conductor is made of the same material as the second conductive layer.

5. The circuit board of claim 4, wherein the first conductive layer is made of copper or silver, and the second conductive layer is made of copper or silver.

6. The circuit board according to any one of claims 1 to 5, wherein a thickness direction of the conductor is perpendicular to the first surface, or the thickness direction of the conductor is inclined to the first surface.

7. The circuit board of claim 6, wherein the conductor extends in a straight or curved shape on the side of the first surface, and the conductor is capable of transmitting current.

8. The circuit board of claim 7, wherein the first conductive layer comprises a signal transmission line disposed in insulation from the electrical conductor, the signal transmission line being usable for communication.

9. The circuit board of claim 8, wherein the first conductive layer has a thickness of 0.015 mm to 0.020 mm, the second conductive layer has a thickness of 0.015 mm to 0.020 mm, the dielectric layer has a thickness of 0.04 mm to 0.05mm, and the width of the conductor exposed on the first surface is less than 1 mm.

10. The circuit board according to any one of claims 1 to 5, wherein the dielectric layers are provided in two or more layers, and another conductive layer is provided between two adjacent dielectric layers, and the conductive body is provided to be insulated from the another conductive layer.

11. An electronic device comprising a housing and the circuit board of any one of claims 1-10, the circuit board being attached to the housing.