CN111354834A - Metal tile laying and laminating device and method - Google Patents
Metal tile laying and laminating device and method Download PDFInfo
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- CN111354834A CN111354834A CN201811566551.9A CN201811566551A CN111354834A CN 111354834 A CN111354834 A CN 111354834A CN 201811566551 A CN201811566551 A CN 201811566551A CN 111354834 A CN111354834 A CN 111354834A
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- 239000002184 metal Substances 0.000 title claims abstract description 135
- 238000010030 laminating Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000010438 heat treatment Methods 0.000 claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000003475 lamination Methods 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims 1
- 230000037303 wrinkles Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920006124 polyolefin elastomer Polymers 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/20—Supporting structures directly fixed to an immovable object
- H02S20/22—Supporting structures directly fixed to an immovable object specially adapted for buildings
- H02S20/23—Supporting structures directly fixed to an immovable object specially adapted for buildings specially adapted for roof structures
- H02S20/25—Roof tile elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Architecture (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention provides a metal tile laying and laminating device and a method, which are arranged in a vacuum chamber and comprise the following steps: a carrier on which a corrugated metal plate substrate is placed; the heating device is arranged on the carrying platform and can directly heat the metal plate substrate; the mould pressing device is arranged above the carrying platform and is provided with an elastic non-stick pressure head and a first driving device connected with the elastic non-stick pressure head; the elastic non-stick pressure head is arranged corresponding to the metal plate substrate, and the first driving device drives the elastic non-stick pressure head to move close to the metal plate substrate so as to press the packaging piece on the metal plate substrate. The invention effectively solves the problem of wrinkles generated when the metal tiles are laid and laminated by the arrangement of the elastic non-stick pressure head.
Description
Technical Field
The invention relates to the technical field of photovoltaic building materials, in particular to a metal tile laying and laminating device.
Background
With the popularization of solar photoelectric building integration, photoelectric integration projects such as solar roofs and the like are actively applied to large and medium-sized cities. The solar roof project is to lay the solar cell on the metal tile, and then lay the metal tile to form the roof capable of generating power, thereby improving the utilization rate of the solar energy of the building.
At present, in the manufacturing process of the solar metal tile, a wavy metal plate is mostly used as a substrate, an EVA (ethylene vinyl acetate) adhesive film, an insulating layer back plate, a POE (polyolefin elastomer) adhesive film, a chip, a POE (polyolefin elastomer) adhesive film and a front plate are gradually laid on the surface of the substrate, the laid metal tile is placed into a silica gel bag, and a laminating machine is used for packaging. However, the metal plate has a large bending radian and a large number of bending positions, so that the packaging materials of all layers have different amounts of deformation due to extension at the same heating temperature, and the metal plate is in rigid contact with the packaging materials of all layers, so that a large number of folds can be formed on the packaging material of the final solar metal tile product at the trough position, and the winding on the chip layer is difficult to compact, thereby affecting the overall performance and the aesthetic property of the solar metal tile.
Disclosure of Invention
Therefore, the invention mainly aims to provide a metal tile laying and laminating device, and aims to solve the problem that the performance and the aesthetic property of a metal tile are affected because the conventional metal tile is easy to generate wrinkles at wave troughs during laying and laminating.
In order to solve the above problems, the present invention provides a metal tile laying and laminating apparatus, provided in a vacuum chamber, comprising: a carrier on which a corrugated metal plate substrate is placed; the heating device is arranged on the carrying platform and can directly heat the metal plate substrate; the mould pressing device is arranged above the carrying platform and is provided with an elastic non-stick pressure head and a first driving device connected with the elastic non-stick pressure head; the elastic non-stick pressure head is arranged corresponding to the metal plate substrate, and the first driving device drives the elastic non-stick pressure head to move close to the metal plate substrate so as to press the packaging piece on the metal plate substrate.
Further, the first driving device comprises a hydraulic cylinder body fixed on the wall of the vacuum chamber, and a hydraulic cylinder telescopic shaft connected with the elastic non-stick pressure head.
Further, the elastic non-stick pressure head comprises a rigid pressure head body and an elastic protection layer coated on the rigid pressure head body.
Further, the shape of the elastic non-stick indenter is the same as the shape of the metal plate substrate.
Further, when the elastic non-stick pressure head is close to the metal plate substrate, the wave crest of the elastic non-stick pressure head is matched with the wave trough of the metal plate substrate.
The carrier of the invention comprises: a second driving device; and the roller belt is sleeved on the second driving device, and is used for conveying the metal plate substrate under the action of the driving device.
Further, the carrier further comprises: and the positioning sensor is used for positioning the boundary area of the elastic non-stick pressure head, and the roller belt stops moving when driving the metal plate substrate to move to the position of the positioning sensor.
Further, the heating device is arranged on the roller belt and connected with a temperature control system.
The invention also comprises: and the grabbing device is arranged on one side of the carrying platform and is used for placing the packaging piece on the metal plate substrate.
Further, the grasping apparatus includes: the machine platform is fixedly connected with the ground; the telescopic arm is connected to the machine table; the electric sucker is connected to the telescopic arm and used for sucking the packaging piece; and the packaging piece adsorbed on the electric sucker is placed on the metal plate substrate under the action of the telescopic arm.
The invention also provides a method for laying and laminating the metal tiles, which adopts the metal tile laying and laminating device and comprises the following steps:
s1: arranging the packaging piece corresponding to the metal plate substrate;
s2: and starting the metal tile laying and laminating device, and pressing an elastic non-sticking pressure head of the metal tile laying and laminating device on the packaging piece at a first pressure value so as to enable the packaging piece to be tightly attached to the metal plate substrate.
Further, before the step of S2, the method further includes: and starting a heating device, setting a first heating temperature, and heating the metal plate substrate.
Further, after the step of S2, the method further includes the following steps: and starting the heating device, and setting a second heating temperature, wherein the numerical value of the second heating temperature is greater than that of the first heating temperature.
Further, after the step of "starting the heating device and setting a second heating temperature, wherein the value of the second heating temperature is greater than the value of the first heating temperature", the method further comprises the following steps: the elastic non-stick pressure head is pressed on the packaging piece at a second pressure value, wherein the value of the second pressure value is larger than that of the first pressure value.
The technical scheme of the invention has the following advantages:
1. the metal tile laying and laminating device provided by the invention is provided with the elastic non-stick pressure head which is arranged corresponding to the metal plate substrate, under the driving action of the first driving device, the elastic non-stick pressure head moves close to the metal plate substrate to press the packaging part on the metal plate substrate, in particular, because the traditional pressure head is a rigid part and the metal plate substrate is wavy, when the pressure head acts on the wave trough position in the pressing process, the force applied when the packaging part at the wave trough is contacted with the wave trough is not uniform due to the curved surface characteristic of the wave trough or the matching error of the pressure head and the metal plate substrate, and further wrinkles are generated, in the application, the elastic non-stick pressure head and the metal plate substrate are abutted together at a certain pressure, and because the surface of the elastic non-stick pressure head can generate elastic deformation when being stressed, the packaging part between the elastic non-stick pressure head and the metal plate substrate can be laid on the wave trough position in an expanded state, the trend of fold generation when the packaging part is stressed unevenly can be overcome due to the expansion effect of the elastic non-stick pressure head, and the problem that the metal tile generates fold at the wave trough position is further solved.
2. The first driving device in the metal tile laying and laminating device comprises a hydraulic cylinder body fixed on the wall of the vacuum chamber and a hydraulic cylinder telescopic shaft connected with the elastic non-stick pressure head, wherein the hydraulic cylinder can control the stroke of the telescopic shaft to control the pressure at the abutting part of the elastic non-stick pressure head and the metal plate substrate, so that the quality of metal tile laying and laminating can be finely adjusted by changing the pressure.
3. The shape of the elastic non-stick pressure head in the metal tile laying laminating device provided by the invention is the same as that of the metal plate substrate, so that the elastic non-stick pressure head and the metal plate substrate can be better matched, and a packaging part between the elastic non-stick pressure head and the metal plate substrate is better attached to the metal plate substrate.
4. The carrier in the metal tile laying and laminating device provided by the invention comprises: a second driving device; the roller belt is sleeved on the second driving device, the positioning sensor is used for positioning the boundary area of the elastic non-stick pressure head, and the roller belt drives the metal plate substrate to move to the position of the positioning sensor, and the roller belt stops moving. According to the invention, the metal plate substrate is conveyed and positioned by using the automatic conveying structure, so that compared with manual operation, the processing precision is improved, and the labor cost is saved.
5. The heating device in the metal tile laying and laminating device provided by the invention is arranged on the roller belt, can directly heat the metal plate substrate, and has higher heating efficiency on the metal plate substrate, shorter processing time and higher production efficiency compared with the traditional mode of heating the vacuum bag by using hot air.
6. According to the metal tile laying and laminating device, the packaging piece is automatically grabbed and placed on the metal plate substrate by the mechanical arm grabbing device and is matched with the carrying platform for use, so that automatic production is realized, and the production efficiency is further improved.
7. In the metal tile laying and laminating method, the packaging parts are pressed on the metal plate substrate at a lower first temperature and a lower first pressure in the manufacturing process of the metal tile, in the process, the difference of the expansion deformation of each packaging part is smaller at a lower temperature, the packaging parts and the metal plate substrate can be better formed together, the damage of the packaging parts and the falling off of the packaging parts and the metal plate substrate caused by acute deformation caused by sudden high temperature and high pressure can be prevented, and then the packaging parts are completely pressed on the metal plate substrate at a higher second temperature and a higher second pressure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of an apparatus for laying down and laminating metal tiles provided in embodiment 1 of the present invention.
Description of reference numerals:
1-carrying platform; 11-a second drive; 12-a roller belt;
2-a metal plate substrate;
3-a heating device;
4-a molding device; 41-elastic non-stick pressure head; 42-a first drive;
5-packaging;
6-a gripping device; 61-a machine platform; 62-a telescopic arm; 63-electric suction cup.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1, the metal tile laying and laminating apparatus provided for this embodiment is provided in a vacuum chamber, a vacuum valve is installed on the vacuum chamber, and the vacuum chamber is first pumped into a vacuum state through the vacuum valve before the metal tile laying and laminating apparatus works, wherein the metal tile laying and laminating apparatus includes:
In other embodiments, the carrier 1 may be a platform with a certain height, and the metal plate substrate is directly placed on the platform by an external robot for subsequent processing.
The carrying platform 1 in the embodiment further comprises a heating device 3, the heating device 3 is a bent resistance wire laid in the roller belt, the resistance wire is electrified to generate heat to directly heat the metal plate substrate 2 placed on the roller belt, the heating efficiency is high, and the heating device 3 is further connected with a temperature control device, so that the heating temperature of the heating device 3 in the embodiment is adjustable.
Further, a molding device 4 is mounted above the stage 1, and the molding device 4 has an elastic non-stick pressure head 41 and a first driving device 42 connected to the elastic non-stick pressure head 41. The elastic non-stick pressure head 41 comprises a rigid pressure head body and an elastic protection layer coated on the rigid pressure head body, and the shape of the elastic non-stick pressure head is the same as that of the metal plate substrate 2; the first driving means 42 comprise a hydraulic cylinder block fixed to the upper chamber wall of the vacuum chamber and a hydraulic cylinder telescopic shaft connected to the elastic non-stick ram 41. The hydraulic cylinder drives the telescopic shaft to extend to drive the elastic non-stick pressure head 41 to abut against the metal plate substrate 2, wherein when the elastic non-stick pressure head 41 is close to the metal plate substrate 2, the wave crest of the elastic non-stick pressure head 41 is matched with the wave trough of the metal plate substrate 2.
In order to realize the accurate positioning of the metal plate substrate 2 and the elastic non-stick pressure head 41, a positioning sensor is further arranged on the carrier 1 in this embodiment to position the boundary area of the elastic non-stick pressure head 41, and when the roller belt 12 drives the metal plate substrate 2 to move to the position of the positioning sensor, the roller belt 12 stops moving.
In the metal tile laying and laminating apparatus of the present embodiment, the package 5 needs to be placed between the elastic non-stick press 41 and the metal plate substrate 2, and for this purpose, a gripping device 6 is provided on one side of the stage 1 to place the package 5 on the metal plate substrate 2. Specifically, the grasping apparatus 6 includes: the machine table 61 is fixedly connected with the ground; a telescopic arm 62 connected to the machine base 61; an electric suction cup 63 connected to the telescopic arm 62, the electric suction cup 63 being capable of sucking the package 5 when energized; packaging part 5 in this embodiment includes transparent front bezel, the rete, insulating layer and chip, metal tile in this embodiment is at the manufacturing process, grabbing device 6 is according to the EVA rete, the insulating layer, the POE rete, the Miasole chip, the order of POE rete and transparent front bezel is placed in proper order on the metal sheet substrate 2, wherein adsorbed packaging part 5 on the electric suction cup 63 extends under the extension of the horizontal segment of flexible arm 62, stretch into between elasticity non-stick pressure head 41 and the metal sheet substrate 2, reach and predetermine after the distance position, flexible arm descends at vertical section, descend after predetermineeing the position, the outage of electric suction cup 63, place packaging part 5 on the metal sheet substrate 2.
In another embodiment, the above-mentioned packages are packaged together in other steps according to the sequence of implementation to form an integrated package, and the grasping device 6 directly grasps the integrated package.
Example 2
This example provides a method of metal tile laying lamination using the metal tile laying lamination apparatus described in example 1, comprising the steps of:
before the metal tile laying and laminating device is started, a vacuum chamber is subjected to vacuum treatment by using a vacuum valve,
starting the metal tile laying and laminating device, and presetting elastic non-stick pressure heads 41 in one-to-one correspondence with the positions of the metal plate substrate 2 under the action of a positioning device and a roller belt on the carrying platform 1;
the packages 5 are then placed in sequence on the sheet metal substrate 2 by means of the gripping device 6.
And starting the heating device 3, heating the metal plate substrate 2 and the packaging piece 5 placed on the metal plate substrate 2 by the heating device 3 at a first temperature of 85 ℃ under the action of the temperature control device, and pressing the elastic non-stick pressure head 41 on the packaging piece 5 at a first pressure value of 0.07MPa after a certain time so as to enable the packaging piece 5 to be tightly attached to the metal plate substrate 2.
After a certain time, the temperature control device controls the heating device 3 to heat the metal plate substrate 2 and the package 5 placed on the metal plate substrate 2 at a second temperature of 155 ℃, and meanwhile, the elastic non-stick pressure head 41 presses the package 5 at a second pressure value of 0.1MPa, and finally, the package 5 is pressed on the metal plate substrate 2.
In this embodiment, the first temperature is within a range of 70-100 ℃, the second temperature is within a range of 130-180 ℃, the first pressure is within a range of 0.02-0.08 MPa, and the second pressure is within a range of 0.09-0.13 MPa.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (14)
1. A metal tile laying and laminating device is arranged in a vacuum chamber and is characterized by comprising:
a carrier (1) on which a waved metal plate substrate (2) is placed;
the heating device (3) is arranged on the carrying platform (1), and the heating device (3) can directly heat the metal plate substrate (2);
the mould pressing device (4) is arranged above the carrying platform (1) and is provided with an elastic non-stick pressure head (41) and a first driving device (42) connected with the elastic non-stick pressure head (41);
the elastic non-stick pressure head (41) is arranged corresponding to the metal plate substrate (2), and the first driving device (42) drives the elastic non-stick pressure head (41) to move close to the metal plate substrate (2) so as to press the packaging piece (5) on the metal plate substrate (2).
2. Metal tile laying and laminating device according to claim 1, characterized in that said first actuating means (42) comprise a hydraulic cylinder fixed to the wall of said vacuum chamber and a hydraulic cylinder telescopic shaft connected to said elastic non-stick head (41).
3. Metal tile laying and laminating device according to claim 1, characterized in that said elastic non-stick indenter (41) comprises a rigid indenter body and an elastic protection layer covering said rigid indenter body.
4. Metal tile laying and laminating device according to claim 3, characterized in that said elastic non-stick indenter has the same shape as said metal sheet substrate (2).
5. Tile laying and laminating device according to claim 4, characterized in that when said elastic non-stick indenter (41) is brought close to said sheet metal substrate (2), the peaks of said elastic non-stick indenter (41) coincide with the valleys of said sheet metal substrate (2).
6. Metal tile laying and laminating device according to claim 5, characterized in that said carrier (1) comprises:
a second drive device (11);
a roller belt (12) sleeved on the second driving device (11), wherein the roller belt (12) is used for conveying the metal plate substrate (2) under the action of the driving device (11).
7. A metal tile laying and laminating device according to claim 6, further comprising: the positioning sensor is used for positioning the boundary area of the elastic non-stick pressure head (41), and when the roller belt (12) drives the metal plate substrate (2) to move to the position of the positioning sensor, the roller belt (12) stops moving.
8. Lay-up and lamination device according to claim 7, characterized in that said heating means (3) are provided on said roller belt (12), said heating means (3) being connected to a temperature control system.
9. A metal tile laying and laminating device according to claim 1, further comprising: and the grabbing device (6) is arranged on one side of the carrier (1) and is used for placing the packaging piece (5) on the metal plate substrate (2).
10. Metal tile laying and laminating device according to claim 9, characterized in that said gripping means (6) comprise:
the machine table (61) is fixedly connected with the ground;
a telescopic arm (62) connected to the machine base (61);
an electric sucker (63) connected to the telescopic arm (62) and used for sucking the packaging piece (5);
wherein the packaging piece (5) adsorbed on the electric sucker (63) is placed on the metal plate substrate (2) under the action of the telescopic arm (62).
11. A method of metal tile laying lamination, using a metal tile laying lamination apparatus as claimed in any one of claims 1 to 10, comprising the steps of:
s1: arranging the packaging piece (5) corresponding to the metal plate substrate (2);
s2: and starting the metal tile laying and laminating device, and pressing an elastic non-sticking pressure head (41) of the metal tile laying and laminating device on the packaging piece (5) at a first pressure value so as to enable the packaging piece (5) to be attached to the metal plate substrate (2).
12. The method according to claim 11, further comprising, before the step of S2: and starting a heating device, setting a first heating temperature, and heating the metal plate substrate (2).
13. The method according to claim 12, further comprising, after the step of S2, the steps of: and starting the heating device, and setting a second heating temperature, wherein the numerical value of the second heating temperature is greater than that of the first heating temperature.
14. The method of claim 13, wherein after the step of activating the heating device to set the second heating temperature, wherein the second heating temperature has a value greater than the first heating temperature, the method further comprises the step of: the elastic non-stick pressure head (41) is pressed on the packaging part (5) at a second pressure value, wherein the value of the second pressure value is larger than that of the first pressure value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811566551.9A CN111354834A (en) | 2018-12-20 | 2018-12-20 | Metal tile laying and laminating device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811566551.9A CN111354834A (en) | 2018-12-20 | 2018-12-20 | Metal tile laying and laminating device and method |
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| CN111354834A true CN111354834A (en) | 2020-06-30 |
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| CN201811566551.9A Pending CN111354834A (en) | 2018-12-20 | 2018-12-20 | Metal tile laying and laminating device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113165369A (en) * | 2018-12-13 | 2021-07-23 | 安赛乐米塔尔公司 | Laminating apparatus and method thereof |
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| CN113165369B (en) * | 2018-12-13 | 2023-11-03 | 安赛乐米塔尔公司 | Lamination device and method thereof |
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