CN111352515B - Touch display device with embedded fingerprint identification function and preparation and use methods thereof - Google Patents

Touch display device with embedded fingerprint identification function and preparation and use methods thereof Download PDF

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Publication number
CN111352515B
CN111352515B CN201811572271.9A CN201811572271A CN111352515B CN 111352515 B CN111352515 B CN 111352515B CN 201811572271 A CN201811572271 A CN 201811572271A CN 111352515 B CN111352515 B CN 111352515B
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layer
fingerprint sensing
imaging array
dielectric
active
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CN111352515A (en
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王晓川
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Xinzhiwei Shanghai Electronic Technology Co ltd
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Xinzhiwei Shanghai Electronic Technology Co ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification

Abstract

The invention relates to a touch display device with embedded fingerprint identification function and a preparation and use method thereof, wherein the touch display device sequentially comprises the following components along the incidence direction of human eyes vision: a transparent dielectric cover layer, at least one transparent touch location sensing layer and at least one electro-optical display layer; the active fingerprint sensing imaging array sheet body is embedded in the groove area of the transparent medium cover layer, and the active fingerprint sensing imaging array in the active fingerprint sensing imaging array sheet body comprises a plurality of active fingerprint sensing imaging pixels. According to the invention, the active fingerprint sensing imaging array sheet body is integrated into the transparent medium covering layer of the top layer, so that the active fingerprint sensing imaging array sheet body is close to the fingerprint contacting the transparent medium covering layer in the nearest mode, thereby effectively improving the sensitivity of fingerprint sensing and the definition of fingerprint imaging, and completing more accurate identity recognition function.

Description

Touch display device with embedded fingerprint identification function and preparation and use methods thereof
Technical Field
The present invention relates to a display device of a portable electronic system, and more particularly, to a touch display device with embedded fingerprint recognition function, and a method for manufacturing and using the same.
Background
Fingerprint sensing imaging and identification have become a reliable and widely used identity authentication method nowadays, which generally performs fingerprint identification and identity authentication by scanning fingerprint images and storing digitized information of the fingerprint images, and comparing the digitized information with certain pre-stored reference fingerprint data.
The fingerprint imaging device is integrated into one intelligent electronic device (such as a smart phone or other intelligent handheld equipment), so that not only can fingerprint identification and identity authentication be effectively completed, but also other different application functions can be simultaneously completed in the process of completing fingerprint imaging and identity authentication. Currently, a fingerprint sensing imaging device and functions thereof are integrated in a touch interaction display device, and become an important point for development of a smart phone or other intelligent handheld devices, so that man-machine touch interaction is further enhanced, and the area and the duty ratio of a display screen are increased.
However, the sensitivity of fingerprint sensing and the definition of fingerprint imaging devices integrated into intelligent electronic devices have not yet been able to meet the needs of users, and still further improvements are needed.
Disclosure of Invention
One of the technical problems to be solved by the invention is to provide a touch display device with embedded fingerprint identification function and a use method thereof, which can improve the sensitivity of fingerprint sensing of an active fingerprint sensing imaging array and the definition of fingerprint imaging.
The second technical problem to be solved by the invention is to provide a preparation method of the touch display device with embedded fingerprint identification function, which can reduce the difficulty of the integration process and improve the sensitivity of fingerprint induction of an active fingerprint induction imaging array and the definition of fingerprint imaging.
In order to solve the above technical problems, the present invention provides a touch display device with embedded fingerprint recognition function, which comprises, along a human eye visual incident direction:
the device comprises a transparent medium covering layer, wherein a groove area is formed in the transparent medium covering layer, an active fingerprint sensing imaging array sheet body is embedded in the groove area, an active fingerprint sensing imaging array is formed in the active fingerprint sensing imaging array sheet body, the active fingerprint sensing imaging array comprises a plurality of active fingerprint sensing imaging pixels, and each active fingerprint sensing imaging pixel at least comprises a sensing pixel semiconductor transistor;
at least one transparent touch location sensing layer configured to sense and locate external contacts on the transparent dielectric cover layer; the method comprises the steps of,
At least one electro-optical display layer having a display cell array formed therein, the display cell array including a plurality of display pixel cells.
Optionally, along the human eye vision incident direction, the active fingerprint sensing imaging array sheet comprises, in layers: a semiconductor dielectric composite sub-layer; and a first dielectric sublayer; the inductive pixel semiconductor transistor is arranged between the semiconductor medium composite sub-layer and the first medium sub-layer.
Optionally, the semiconductor dielectric composite sub-layer includes a plurality of insulating dielectric sheets therein.
Optionally, the active fingerprint sensing imaging array sheet further comprises: the second dielectric sub-layer is arranged on one side of the semiconductor dielectric composite sub-layer facing the human eye vision incidence direction and is opposite to the dielectric sub-layer.
Optionally, the active fingerprint sensing imaging pixel comprises: and the fingerprint sensing end head unit is arranged in the second medium sub-layer and is electrically connected with the sensing pixel semiconductor transistor.
Optionally, the fingerprint sensing terminal unit is a capacitance sensing unit for generating a sensing capacitance for external contact on the transparent medium cover layer; or alternatively; the fingerprint sensing end head unit is an acoustic wave sensing unit for generating acoustic wave sensing for external contact on the transparent medium cover layer; or the fingerprint sensing end head unit is an electromagnetic wave sensing unit for generating electromagnetic wave sensing for external contact on the transparent medium cover layer; or the fingerprint sensing end head unit is a micro-pressure sensing unit for generating micro-pressure sensing on external contact on the transparent medium cover layer.
Optionally, the sensing pixel semiconductor transistor is disposed between the semiconductor dielectric composite sublayer and the second dielectric sublayer.
Optionally, the active fingerprint sensing imaging array sheet further comprises: a plurality of sets of row interconnect wires; and, sets of column interconnect conductors; wherein each of said sensing pixel semiconductor transistors is connected to a corresponding set of said row interconnect conductors and a corresponding set of said column interconnect conductors.
Optionally, a plurality of display illumination blocking sheets are formed in the first dielectric sub-layer, and each display illumination blocking sheet is optically aligned vertically to the corresponding sensing pixel semiconductor transistor along the human eye visual incidence direction.
Optionally, the display pixel unit and the active fingerprint sensing imaging pixel have the same planar size.
Optionally, the thickness of the transparent medium cover layer is 0.01-1 mm, the thickness of the active fingerprint sensing imaging array sheet body is 0.1-850 microns, and the thickness of the sensing pixel semiconductor transistor is 0.001-5 microns.
Optionally, the transparent dielectric cap layer is composed primarily of silicon oxide and the sensing pixel semiconductor transistor is composed primarily of silicon.
The invention also provides a man-machine interaction device which comprises the touch display device with the embedded fingerprint identification function.
The invention also provides a preparation method of the touch display device with the embedded fingerprint identification function, which comprises the following steps:
providing an active fingerprint sensing imaging array sheet body, wherein an active fingerprint sensing imaging array is formed in the active fingerprint sensing imaging array sheet body, and comprises a plurality of active fingerprint sensing imaging pixels, and each active fingerprint sensing imaging pixel at least comprises a sensing pixel semiconductor transistor;
providing a transparent medium cover layer sheet body, wherein the transparent medium cover layer sheet body is provided with a transparent medium cover layer, and a groove area is formed in the transparent medium cover layer;
attaching the active fingerprint induction imaging array sheet body to the groove area of the transparent medium cover layer sheet body;
providing an optoelectronic display layer sheet body, wherein the optoelectronic display layer sheet body is provided with at least one optoelectronic display layer, a display unit array is formed in the optoelectronic display layer, the display unit array comprises a plurality of display pixel units, at least one transparent touch positioning sensing layer is formed on the optoelectronic display layer sheet body, and the transparent touch positioning sensing layer is configured to sense and position external contact on the transparent medium covering layer;
And attaching a transparent medium cover sheet body attached with the active fingerprint induction imaging array sheet body onto the transparent touch positioning induction layer.
Optionally, the step of providing the active fingerprint sensing imaging array sheet comprises:
providing a semiconductor substrate;
forming a plurality of active fingerprint sensing imaging array sheets on the semiconductor substrate;
and cutting the semiconductor substrate to separate each active fingerprint induction imaging array sheet body.
Optionally, the step of forming a plurality of active fingerprint sensing imaging array patches on the semiconductor substrate comprises:
forming a semiconductor medium composite sub-layer on a first substrate surface of the semiconductor substrate;
forming a first dielectric sub-layer on the semiconductor dielectric composite sub-layer; the method comprises the steps of,
and forming the plurality of sensing pixel semiconductor transistors between the semiconductor dielectric composite sub-layer and the first dielectric sub-layer.
Optionally, the step of forming a plurality of active fingerprint sensing imaging array tiles on the semiconductor substrate further comprises: forming a plurality of sets of row interconnect wires and a plurality of sets of column interconnect wires in the first dielectric sublayer; each of the sensing pixel semiconductor transistors is electrically connected to a corresponding set of the row interconnect conductors and a corresponding set of the column interconnect conductors.
Optionally, the step of forming a plurality of active fingerprint sensing imaging array tiles on the semiconductor substrate further comprises: a plurality of display-illumination-blocking sheets are formed in the first dielectric sublayer, each of the display-illumination-blocking sheets being optically vertically aligned with a corresponding one of the sensing pixel semiconductor transistors.
Optionally, the step of forming a plurality of active fingerprint sensing imaging array tiles on the semiconductor substrate further comprises:
forming a second dielectric sub-layer on a second substrate surface of the semiconductor substrate opposite to the first substrate surface;
and forming a plurality of regularly arranged fingerprint sensing end units in the second medium sublayer, wherein the fingerprint sensing end units are connected with the sensing pixel semiconductor transistors to form an active fingerprint sensing imaging array comprising a plurality of active fingerprint sensing imaging pixels which are arranged in an array.
Optionally, the step of forming a plurality of active fingerprint sensing imaging array tiles on the semiconductor substrate further comprises:
before forming the second dielectric sub-layer on a second substrate surface of the semiconductor substrate opposite to the first substrate surface, thinning the semiconductor substrate from the second substrate surface to a remaining part of the thickness of the semiconductor substrate, or removing the semiconductor substrate.
Optionally, a temporary carrier substrate is provided and the first substrate surface with the first dielectric sub-layer is attached to the temporary carrier substrate before thinning the semiconductor substrate from the second substrate surface.
Optionally, the semiconductor substrate is cut along with the temporary carrier substrate to separate each of the active fingerprint sensing imaging array sheets.
Optionally, the step of attaching the active fingerprint sensing imaging array sheet to the transparent dielectric cover sheet within the recessed area further comprises:
attaching one side of the second dielectric sub-layer of the active fingerprint sensing imaging array sheet body with the temporary bearing substrate to a groove area of the transparent medium cover layer sheet body;
removing the temporary bearing substrate on the active fingerprint induction imaging array sheet body;
filling transparent adhesive into the groove area; the method comprises the steps of,
and flattening the surface of the transparent medium cover layer sheet body with the active fingerprint induction imaging array sheet body.
Optionally, after attaching the transparent medium cover sheet attached to the active fingerprint sensing imaging array sheet onto the transparent touch positioning sensing layer, the preparation method further comprises: and welding a first flexible connecting sheet on the active fingerprint sensing imaging array sheet body, and welding a second flexible connecting sheet on the transparent touch positioning sensing layer.
The invention also provides a method for using the touch display device with the embedded fingerprint identification function, which comprises the following steps: and locally enhancing the display brightness of the display pixel units in the display unit array in the photoelectric display layer, wherein the display brightness corresponds to the display pixel units in the sheet body area or the finger contact area of the active fingerprint sensing imaging array.
Compared with the prior art, the technical scheme of the invention has at least the following beneficial effects:
1. according to the touch display device with the embedded fingerprint identification function, the active fingerprint induction imaging array sheet body is integrated into the transparent medium covering layer of the top layer, so that the active fingerprint induction imaging array sheet body is close to the fingerprint contacting the transparent medium covering layer in the nearest mode, and further the active fingerprint induction imaging array in the active fingerprint induction imaging array sheet body actively inducts and images the fingerprint through the induction pixel semiconductor transistor with the pixel in-situ amplification function, and therefore sensitivity of fingerprint induction and definition of fingerprint imaging can be effectively improved, and more accurate identity identification function can be achieved. Further, the touch display device with the embedded fingerprint recognition function is preferably manufactured by adopting the manufacturing method of the touch display device with the embedded fingerprint recognition function, so that manufacturing difficulty and process cost are reduced.
2. The preparation method of the touch display device with the embedded fingerprint identification function comprises the steps of attaching an active fingerprint sensing imaging array sheet body with an active fingerprint sensing imaging array with high transparency and high sensitivity to a groove area of a transparent medium cover layer sheet body, and attaching the transparent medium cover layer sheet body to a photoelectric display layer sheet body with a transparent touch positioning sensing layer.
3. According to the application method of the touch display device with the embedded fingerprint identification function, the display brightness of the display pixel units corresponding to the groove area of the display unit array in the photoelectric display layer is locally enhanced, so that the definition of fingerprint imaging can be improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a touch display device with embedded fingerprint recognition function according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of an active fingerprint sensing imaging array sheet according to an embodiment of the invention
FIG. 3 is a schematic cross-sectional view of a user's finger contacting the touch display device according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view illustrating a method for using a touch display device with embedded fingerprint recognition function according to an embodiment of the present invention;
FIG. 5 is a flowchart of a method for manufacturing a touch display device with embedded fingerprint recognition function according to an embodiment of the present invention;
fig. 6A to 6I are schematic cross-sectional views of a device in a method for manufacturing a touch display device with embedded fingerprint recognition function according to an embodiment of the invention;
FIG. 7 is a schematic cross-sectional view of a device in a method for manufacturing a touch display device with embedded fingerprint recognition function according to another embodiment of the present invention;
wherein, the reference numerals are as follows:
10-touch display device; 11-human eye vision incident direction; 12-a fingerprint identification module;
100-a transparent dielectric cover layer; a 100' -transparent dielectric cover sheet; 101-a groove region; 110-a transparent adhesive;
200-an active fingerprint induction imaging array sheet body; 201-an active fingerprint induction imaging array; 202-peripheral and input-output circuits; 210-a semiconductor dielectric composite sub-layer; 211-an active region; 212-insulating dielectric sheet body; 220-a first dielectric sublayer; 230-a second dielectric sublayer; 240-a semiconductor substrate; 250-active fingerprint sensing imaging pixels; 251-sense pixel semiconductor transistor; 252-fingerprint sensing tip unit; 259-show illumination barrier sheet; 261. 262-interconnect lines connected to the source or drain and gate, respectively, of the sensing pixel semiconductor transistor (i.e., 261 and 262 may be row interconnect lines and/or column interconnect lines, herein for convenience of description, 261 is defined as a row interconnect line, 262 is defined as a column interconnect line); 270-a first flexible connection pad; 281-a second adhesive layer;
300-a transparent touch positioning sensing layer; 310-a second flexible connection pad;
400-an optoelectronic display layer; 400' -photoelectric display layer sheet body; 401 an array of display cells; 450-displaying pixel units;
500-insulating dielectric layers;
600-temporary carrier substrate;
700-a first adhesive layer;
800-a third adhesive layer;
900-outer support.
Detailed Description
The technical scheme provided by the invention is further described in detail below with reference to the attached drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention. Furthermore, it should be readily understood that the meanings of "on …" and "on …" and the like herein should be interpreted in the broadest sense such that the meaning of "on …" and "on …" and the like is not only "directly on something" without an intermediate feature or layer, but also includes the meaning of "on something" with an intermediate feature or layer.
Referring to fig. 1 and 2, an embodiment of the present invention provides a touch display device 10 with embedded fingerprint recognition function, wherein the touch display device 10 with embedded fingerprint recognition function includes, in layers: a transparent dielectric cover layer 100, at least one transparent touch location sensing layer 300, and at least one optoelectronic display layer 400.
With continued reference to fig. 1 and 2, the transparent dielectric cover layer 100 may be any suitable transparent material known to those skilled in the art, such as silicon oxide, plexiglas, sapphire, transparent plastic, etc. A groove area 101 is formed in the transparent medium cover layer 100, and an active fingerprint sensing imaging array sheet 200 is embedded in the groove area 101. The active fingerprint sensing imaging array sheet 200 may be attached to the bottom wall of the groove area 101 by a second adhesive layer 281, and the side wall of the active fingerprint sensing imaging array sheet 200 may be fixed to the side wall of the groove area 101 by a transparent adhesive 110.
Referring to fig. 1, 2 and 4, the active fingerprint sensing imaging array sheet 200 has an active fingerprint sensing imaging array 201, a peripheral and input/output circuit 202. The active fingerprint sensing imaging array 201 comprises m×n regularly arranged active fingerprint sensing imaging pixels 250, each of the active fingerprint sensing imaging pixels 250 comprises at least one sensing pixel semiconductor transistor 251, wherein M is greater than or equal to 1, N is greater than or equal to 1, and M and N are integers. The sensing pixel semiconductor transistor 251 has a pixel in-situ amplification function, and can actively sense and image the fingerprint of a finger contacting the transparent dielectric cover layer 100. The peripheral and input/output circuit 202 is used for providing various signals to the active fingerprint sensing imaging array 201 and outputting various signals generated by the active fingerprint sensing imaging array 201, and the peripheral and input/output circuit 202 may include a clock circuit, an analog-to-digital conversion circuit, a sequential logic circuit, an input/output circuit, and the like.
Referring to fig. 1 and 2, along the human visual incident direction 11, the active fingerprint sensing imaging array sheet 200 comprises, in layers: a second dielectric sublayer 230, a semiconductor dielectric composite sublayer 210 and a first dielectric sublayer 220. That is, in the active fingerprint sensing imaging array sheet 200, the second dielectric sub-layer 230 is disposed on a side of the semiconductor dielectric composite sub-layer 210 facing the human eye visual incident direction 11 and opposite to the first dielectric sub-layer 220. The semiconductor dielectric composite sub-layer 210 includes an active region 211 and a transparent insulating dielectric body 212, where the number of the active region 211 and the transparent insulating dielectric body 212 is generally plural, the transparent insulating dielectric body 212 is mainly formed of silicon oxide, and plays a role in isolating adjacent transistors in the active region 211 or isolating adjacent active regions (usually, shallow trench isolation structures, abbreviated as STI), the active region 211 is used for manufacturing the sensing pixel semiconductor transistor 251, and may include a well region, a Lightly Doped Drain (LDD) region, a source drain region, and the like, the active region 211 may be formed on the semiconductor substrate 205 through an epitaxial growth process, and when the semiconductor substrate 205 is a silicon on insulator, the active region 211 may also be a top silicon of the semiconductor substrate 205. The second dielectric sub-layer 230 and the first dielectric sub-layer 220 are both made of transparent dielectric materials, and the materials of the two may or may not be identical. In this embodiment, the transparent dielectric material is, for example, one or more of barium titanate, ferric oxide, strontium titanate, or silicon nitride.
Referring to fig. 2, the sensing pixel semiconductor transistor 251 may be formed between the semiconductor medium composite sub-layer 210 and the first dielectric sub-layer 220 (e.g., including a portion extending in the semiconductor medium composite sub-layer 210 and a portion extending in the first dielectric sub-layer 220), or between the semiconductor medium composite sub-layer 210 and the second dielectric sub-layer 230 (e.g., including a portion extending in the semiconductor medium composite sub-layer 210, a portion extending in the first dielectric sub-layer 220, and a portion extending in the second dielectric sub-layer 230). The main material of the sensing pixel semiconductor transistor 251 is a semiconductor such as silicon, and the structure thereof may include a channel region, a gate insulating layer, a gate, a source and a drain (source and drain are also referred to as source and drain), and the like, which are not described herein.
Referring to fig. 1 to 4, the active fingerprint sensing imaging pixel 250 further includes at least one fingerprint sensing tip unit 252, and each fingerprint sensing tip unit 252 is formed in the second dielectric sublayer 230 and is electrically connected to the corresponding sensing pixel semiconductor transistor 251. The fingerprint sensing terminal unit 252 may be a capacitance sensing unit that generates a sensing capacitance for an external contact on the transparent medium cover layer 100, may be an acoustic wave sensing unit that generates an acoustic wave sensing for an external contact on the transparent medium cover layer 100, may be an electromagnetic wave sensing unit that generates an electromagnetic wave sensing for an external contact on the transparent medium cover layer 100, and may be a micro pressure sensing unit that generates a micro pressure sensing for an external contact on the transparent medium cover layer 100. In particular, the fingerprint sensing head units 252 of all the fingerprint sensing imaging pixels 250 of the active fingerprint sensing imaging array 201 may adopt the same sensing mode, such as a capacitance sensing unit, an acoustic wave sensing unit, an electromagnetic wave sensing unit or a pressure sensing unit; alternatively, the fingerprint sensing head units 252 in the active fingerprint sensing imaging array 201 may employ different sensing modes, for example, a portion of the fingerprint sensing head units 252 may be capacitive sensing units, and another portion of the fingerprint sensing head units 252 may be acoustic sensing units.
With continued reference to fig. 2, the active fingerprint sensing imaging array sheet 200 may further include M x N regularly arranged display illumination blocking plates 259 and M sets of row interconnect wires 261 and N sets of column interconnect wires 262. Each display illumination blocking plate 259 is, for example, formed in the first dielectric sublayer 220 and is disposed in one-to-one correspondence with the corresponding sensing pixel semiconductor transistor 251, and each display illumination blocking plate 259 is optically aligned vertically with the corresponding sensing pixel semiconductor transistor 251 along the human visual incidence direction 11. The M sets of row interconnect wires 261 and N sets of column interconnect wires 262 are formed, for example, in the first dielectric sublayer 220 and between the array of display illumination blocking plates 259 and the array of sensing pixel semiconductor transistors 251, each of the sensing pixel semiconductor transistors 251 being electrically connected to a corresponding set of row interconnect wires 261 and set of column interconnect wires 262.
With continued reference to fig. 2, in this embodiment, the peripheral and i/o circuit 202 and the active fingerprint sensing imaging array 201 are formed by a co-process, and the peripheral and i/o circuit 202 is located at the periphery of the active fingerprint sensing imaging array 201 and is spaced apart from the active fingerprint sensing imaging array 201 by an insulating dielectric sheet 212 in a semiconductor dielectric composite sub-layer 210.
Preferably, the thickness of the transparent medium cover layer 100 is 0.01 mm-1 mm, the thickness of the active fingerprint sensing imaging array sheet body 200 is 0.1 μm-850 μm, and the thickness of the sensing pixel semiconductor transistor 251 is 0.001 μm-5 μm, so that the thickness of the fingerprint identification module formed by the transparent medium cover layer 100 and the active fingerprint sensing imaging array sheet body 200 is thinner, and the definition of fingerprint imaging is improved to the greatest extent.
Referring to fig. 1, most of the area of the transparent touch-positioning sensing layer 300 may be configured to sense and position external contacts (such as fingers, styli, etc. contacting the transparent dielectric cover 100) on the transparent dielectric cover 100, and the areas of the transparent touch-positioning sensing layer 300 include the area of the transparent touch-positioning sensing layer 300 corresponding to the active fingerprint sensing imaging array sheet 200. The transparent touch positioning sensing layer 300 may include a structure (not shown) such as a touch electrode formed by a grid-shaped metal wire. The transparent touch positioning sensing layer 300 may be formed on the optoelectronic display layer 400 by film deposition, etching, or may be an independent film body to be attached to the optoelectronic display layer 400 by an encapsulation process such as attaching. It should be appreciated that regardless of the process by which the transparent touch positioning sensing layer 300 is formed on the optoelectronic display layer 400, the transparent touch positioning sensing layer 300 and the optoelectronic display layer 400 need to be isolated from each other by an insulating dielectric layer 500. The insulating medium layer 500 is made of a transparent material, and the material may be silicon oxide, organic glass frit, transparent adhesive, or the like.
Referring to fig. 4, a display unit array 401 is formed in the electro-optical display layer 400, where the display unit array 401 includes a plurality of display pixel units 450 arranged regularly, each display pixel unit 450 may include a pixel electrode and a thin film transistor (not shown) for driving the pixel electrode to emit light, the material of the pixel electrode may include a material such as Indium Tin Oxide (ITO), and the material of the thin film transistor mainly includes a semiconductor such as silicon. Preferably, each display pixel unit 450 has the same plane size (including shape and area) as the active fingerprint sensing imaging pixel 250, so that when a finger touches the transparent medium cover layer 100, the effect of locally enhancing the display brightness of the display pixel unit 450 under the finger can be achieved, thereby enhancing the contrast between the fingerprint in the obtained fingerprint image and the background, and improving the definition of the fingerprint.
Further, referring to fig. 1 and 2, the touch display device 10 with embedded fingerprint recognition function further includes a first flexible connection pad 270 and a second flexible connection pad 310. The first flexible connection pad 270 and the second flexible connection pad 310 are disposed at one side of the electro-optical display layer 400, and the first flexible connection pad 270 is connected to a bonding pad (not shown) of the peripheral and input-output circuit 202 to input signals to the peripheral and input-output circuit 202 and to transfer signals output from the peripheral and input-output circuit 202 outward. The second flexible connection piece 310 is electrically connected to the transparent touch positioning sensing layer 300, and inputs a signal required by the transparent touch positioning sensing layer 300 and outputs a signal generated by the transparent touch positioning sensing layer 300.
It should be appreciated that the touch display device 10 with embedded fingerprint recognition function according to the present invention has a structure such as a PCB circuit board where components such as a microprocessor and a memory are located, in addition to the above-mentioned layers and modules, where the microprocessor can receive the finger fingerprint information acquired by the active fingerprint sensing imaging array sheet 200 through the first flexible connection sheet 270, and receive the finger position information acquired by the transparent touch positioning sensing layer 300 through the second connection sheet 500, and compare the acquired finger fingerprint information with the preset fingerprint stored in the memory, so as to recognize whether the acquired finger fingerprint is the preset fingerprint, and output a corresponding control command when the acquired finger fingerprint is the preset fingerprint.
According to the touch display device with the embedded fingerprint identification function, the active fingerprint induction imaging array sheet body is integrated into the transparent medium covering layer of the top layer, so that the active fingerprint induction imaging array sheet body is close to the fingerprint contacting the transparent medium covering layer in the nearest mode, and further the active fingerprint induction imaging array in the active fingerprint induction imaging array sheet body actively inducts and images the fingerprint through the induction pixel semiconductor transistor with the pixel in-situ amplification function, thereby effectively improving the sensitivity of fingerprint induction and the definition of fingerprint imaging, and completing more accurate identity identification function.
The touch display device with the embedded fingerprint identification function can be a functional module, can be further packaged together with other functional modules to form the man-machine interaction device with the fingerprint identification function, the touch display function and the functions thereof, and can also be an independent device with the fingerprint identification function and the touch display function. The touch display device with the embedded fingerprint identification function can be suitable for mobile wireless communication equipment, tablet computers, notebook computers, intelligent televisions, intelligent wearing equipment, sports equipment, medical equipment, banking equipment and other various electronic equipment.
Referring to fig. 3 and fig. 4 in combination with fig. 1 and fig. 2, when the above-mentioned touch display device 10 with embedded fingerprint recognition function is used, when a user's finger contacts a portion of the transparent medium cover layer 100 corresponding to the portion on the active fingerprint sensing imaging array sheet 200, the active fingerprint sensing imaging array sheet 200 can sense and position the finger, and the transparent touch positioning sensing layer 300 can sense and position the finger, at this time, the display brightness of the display pixel unit 450 of the display pixel array 401 in the optoelectronic display layer 400 in the finger contact area is locally enhanced, as in fig. 4, only the display brightness of the display pixel unit 450 on the left side of the vertical dotted line L is enhanced, so that the contrast between the finally obtained fingerprint image and the background thereof can be enhanced, and the definition of the fingerprint image is further enhanced. In other embodiments of the present invention, when the above-mentioned touch display device 10 with embedded fingerprint recognition function is used, when a user's finger contacts a portion of the transparent medium cover layer 100 corresponding to the portion of the active fingerprint sensing imaging array sheet 200, the display brightness of the display pixel units 450 of the display unit array 401 in the optoelectronic display layer 400 corresponding to the groove area 101 (i.e. the entire active fingerprint sensing imaging array sheet 200) can be further enhanced, so as to enhance the definition of the finally obtained fingerprint image.
Referring to fig. 5, an embodiment of the present invention further provides a method for manufacturing a touch display device with embedded fingerprint recognition function according to the above embodiment, including the following steps:
s1, providing an active fingerprint sensing imaging array sheet body, wherein an active fingerprint sensing imaging array is formed in the active fingerprint sensing imaging array sheet body, the active fingerprint sensing imaging array comprises a plurality of active fingerprint sensing imaging pixels, and each active fingerprint sensing imaging pixel at least comprises a sensing pixel semiconductor transistor;
s2, providing a transparent medium cover layer sheet body, wherein the transparent medium cover layer sheet body is provided with a transparent medium cover layer, and a groove area is formed in the transparent medium cover layer;
s3, attaching the active fingerprint induction imaging array sheet body to the groove area of the transparent medium cover layer sheet body;
s4, providing a photoelectric display layer sheet body, wherein the photoelectric display layer sheet body is provided with at least one photoelectric display layer, a display unit array is formed in the photoelectric display layer, and the display unit array comprises a plurality of display pixel units;
s5, forming at least one transparent touch positioning sensing layer on the photoelectric display layer sheet body, wherein the transparent touch positioning sensing layer is configured to sense and position external contact on the transparent medium cover layer sheet body;
And S6, attaching the transparent medium cover sheet body attached with the active fingerprint sensing imaging array sheet body onto the transparent touch positioning sensing layer.
In step S1, the process of providing an active fingerprint sensing imaging array sheet 200 is as follows:
s1.1 referring to fig. 6A, a semiconductor substrate 205 is provided, and the semiconductor substrate 205 may be any suitable semiconductor material known to those skilled in the art, such as Si, ge, siGe, siC, siGeC, inAs, gaAs, inP, inGaAs or one of other III/V compound semiconductors, or a multi-layer structure formed by these semiconductor materials, or the like, or silicon-on-insulator (SOI), silicon-on-insulator (SSOI), silicon-on-insulator (S-SiGeOI), silicon-on-insulator (SiGeOI), germanium-on-insulator (GeOI), and the like.
S1.2, please continue to refer to fig. 6A, a semiconductor dielectric composite sub-layer 210 is formed on the first substrate surface (the surface facing away from the human visual incidence direction 11) of the semiconductor substrate 205 by a series of suitable processes such as deposition, photolithography, etching, etc., and the semiconductor dielectric composite sub-layer 210 includes, for example, an active region 211 and a transparent insulating dielectric body 212 for isolating the active regions 211, and the transparent insulating dielectric body 212 is mainly composed of silicon oxide. The active region 211 is used to fabricate the sensing pixel semiconductor transistor 251, which may include a well region, a Lightly Doped Drain (LDD) region, a source drain region, etc., the active region 211 may be formed on the semiconductor substrate 205 by an epitaxial growth process, and when the semiconductor substrate 205 is a silicon-on-insulator substrate, the active region 211 may also be a top silicon layer of the semiconductor substrate 205.
S1.3, please continue to refer to fig. 6A, a first dielectric sub-layer 220 is formed on the semiconductor dielectric composite sub-layer 210, wherein the first dielectric sub-layer 220 is made of a transparent dielectric material, such as barium titanate, ferric oxide, strontium titanate, or silicon nitride. In the process of forming the semiconductor dielectric composite sub-layer 210 or the process of forming the first dielectric sub-layer 220, a series of suitable processes such as ion implantation, deposition, photolithography, etching, etc. may be used to manufacture m×n regularly arranged sensing pixel semiconductor transistors 251 between the semiconductor dielectric composite sub-layer 210 and the first dielectric sub-layer 220, where each sensing pixel semiconductor transistor 251 has a pixel in-situ amplifying function, and may be capable of actively sensing and imaging a fingerprint of a finger contacting the transparent dielectric cover layer 100, and the structure may include a channel region, a gate insulating layer, a gate, a source, a drain (source and drain and referred to as a source drain), and the like. Each of the sensing pixel semiconductor transistors 251 may include at least one of a portion extending in the semiconductor substrate 205 (e.g., an active layer including a channel region, a source and a drain), a portion extending in the semiconductor dielectric composite sub-layer 210 (e.g., a gate and a gate insulating layer), and a portion extending in the first dielectric sub-layer 220 (e.g., a metal silicide and an insulating medium covering the gate and the source and the drain, etc.). In addition, the first dielectric sub-layer 220 is a stacked structure, and before a certain layer (not shown) in the first dielectric sub-layer 220 is formed, a series of suitable processes such as photolithography, etching, deposition, etc. are performed to form M sets of row interconnect wires 261 and N sets of column interconnect wires 262 in a stacked layer before the certain layer in the first dielectric sub-layer 220, and each of the sensing pixel semiconductor transistors 251 is connected to a corresponding set of row interconnect wires 261 and a corresponding set of column interconnect wires 262. Then, m×n display radiation blocking plates 259 are formed in the certain layer of the first dielectric sub-layer 220 by a series of suitable processes such as photolithography, etching, and deposition, where each display radiation blocking plate 259 is disposed in a one-to-one correspondence with a corresponding sensor pixel semiconductor transistor 251, and each display radiation blocking plate 259 is optically aligned vertically with the corresponding sensor pixel semiconductor transistor 251 along a human eye visual incidence direction (as shown in 11 in fig. 1 and 2). It should be appreciated that while the active fingerprint sensing imaging array 201 is being formed, a peripheral and input output circuit 202 is formed at the periphery of the active fingerprint sensing imaging array 201, the peripheral and input output circuit 202 being configured to provide the various signals required to the active fingerprint sensing imaging array 201 and to output the various signals generated by the active fingerprint sensing imaging array 201 outwardly.
S1.4, please continue to refer to fig. 6A, a temporary carrier substrate 600 is provided, wherein the temporary carrier substrate 600 may be a semiconductor die, a glass substrate, a plastic substrate, a ceramic substrate, etc. for supporting the subsequent process. The first substrate surface with the first dielectric sub-layer 220 is attached to the temporary carrier substrate 600, that is, the exposed upper surface (i.e., the surface facing away from the incidence direction of human vision) of the first dielectric sub-layer 220 is attached to the temporary carrier substrate 600 by a second adhesive layer 700, where the second adhesive layer 700 may be selected from adhesive tape, organic polymer material or organic material capable of ultraviolet denaturation, and various organic films manufactured by combining spin coating process and photolithography process, such as chip attach film (DAF), dry film (dry film) or photoresist. The thickness of the second adhesive layer 700 is set as needed, and the number of layers of the second adhesive layer 700 is not limited to one, but may be two or more.
S1.5, please refer to fig. 6B, the semiconductor substrate 205 is inverted to thin the semiconductor substrate 205 from the second substrate surface of the semiconductor substrate 205 (i.e., the surface of the semiconductor substrate 205 opposite to the first substrate surface) by a Chemical Mechanical Polishing (CMP) process until the semiconductor substrate 205 of the desired thickness remains, during which the temporary carrier substrate 600 supports the structure above it. In this embodiment, since the sensing pixel semiconductor transistor 251 does not have a portion extending in the semiconductor substrate 205, the required thickness of the semiconductor substrate 205 to be left is 0, i.e., the semiconductor substrate 205 is removed entirely. It should be appreciated that in other embodiments of the present invention, the S1.5 step, i.e., the step of thinning the semiconductor substrate 205, may also be omitted when the thickness of the semiconductor substrate 205 is thin and the sensing pixel semiconductor transistor 251 has a portion that extends into the semiconductor substrate 205.
S1.6, please refer to fig. 6C, a second dielectric sub-layer 230 is formed on the surface of the first dielectric sub-layer 210 facing the incident direction of human vision (i.e. the surface facing away from the temporary carrier substrate 600), and a plurality of regularly arranged fingerprint sensing end units 252 are formed in the second dielectric sub-layer 230 through a series of suitable processes such as photolithography, etching, deposition, etc., where the fingerprint sensing end units 252 are disposed in a one-to-one correspondence with the sensing pixel semiconductor transistors 251, i.e. one of the fingerprint sensing end units 252 is connected with a corresponding one of the sensing pixel semiconductor transistors 251 to form a corresponding one of the active fingerprint sensing imaging pixels 250, and all of the formed active fingerprint sensing imaging pixels 250 (i.e. m×n) are arranged in an array to form an active fingerprint sensing imaging array 201. The second dielectric sublayer 230 is made of a transparent dielectric material, such as barium titanate, ferric oxide, strontium titanate, or silicon nitride. The second dielectric sub-layer 230 has a laminated structure, and each of the fingerprint sensing terminal units 252 is located in a corresponding layer of the second dielectric sub-layer 230 and is buried by the remaining layers. In other embodiments of the present invention, when the semiconductor substrate 205 is still remaining in step S1.5, the second dielectric sublayer 230 is formed on a second substrate surface of the semiconductor substrate 205 opposite to the first substrate surface. Thus, based on the semiconductor dielectric composite sub-layer 210, the first dielectric sub-layer 220 and the second dielectric sub-layer 230, a plurality of active fingerprint sensing imaging array sheets 200 are formed, each of the active fingerprint sensing imaging array sheets 200 includes an active fingerprint sensing imaging array 201 and its peripheral periphery and input/output circuits 202 and m×n regularly arranged display illumination blocking sheets 259, an insulating dielectric sheet 212 is disposed between the active fingerprint sensing imaging array 201 and its peripheral periphery and input/output circuits 202, the active fingerprint sensing imaging array 201 includes m×n regularly arranged active fingerprint sensing imaging pixels 250, each of the active fingerprint sensing imaging pixels includes at least one sensing pixel semiconductor transistor 251 and its connecting fingerprint sensing end unit 252, a set of row interconnection wires 261 and a set of column interconnection wires 262. A scribe line (not shown) is provided between adjacent ones of the active fingerprint sensing imaging array plates 200.
S1.7 please refer toFig. 6D and 6E, first, a first adhesive layer 281 may be formed on the surface of the second dielectric sub-layer 230, the first adhesive layer 281 protecting the second dielectric sub-layer 230 from damage during a subsequent dicing process on one hand, and further being used to attach the active fingerprint sensing imaging array sheet 200 obtained after dicing into the groove region 101 of the transparent dielectric cover sheet 100 on the other hand, the material of the first adhesive layer 281 may include at least one of a passivation protection layer material and an adhesive material commonly used in the art, the passivation protection layer material including but not limited to silicon dioxide (SiO 2 ) Silicon nitride (SiN), silicon oxynitride (SiON), fluorocarbon (CF), carbon doped silicon oxide (SiOC), silicon carbonitride (SiCN), or the like, binder materials including, but not limited to, tape, various organic films made using organic polymeric materials or organic materials that can be uv denatured in combination with spin-on processes and photolithographic processes. Then, a V-shaped cutting blade or a laser inclined cutting mode is adopted to cut grains along a cutting path between adjacent active fingerprint sensing imaging array sheet bodies 200 from one side of the temporary carrier substrate 600 or from one side of the first adhesive layer 281, and each active fingerprint sensing imaging array sheet body 200 is completely separated, so that the active fingerprint sensing imaging array sheet body 200 still provided with the temporary carrier substrate 600 is obtained. The thickness of the active fingerprint sensing imaging array sheet 200 is 0.1-850 microns, and the thickness of the sensing pixel semiconductor transistor 251 is 0.001-5 microns.
Referring to fig. 6E, in step S2, a transparent dielectric cover sheet body 100 'is provided, the transparent dielectric cover sheet body 100' has a transparent dielectric cover 100, and a groove region 101 is formed in the transparent dielectric cover 100. The transparent dielectric cover layer 100 may be any suitable transparent material known to those skilled in the art, such as silicon oxide, plexiglas, sapphire, transparent plastic, etc., and the thickness of the transparent dielectric cover layer 100 is 0.01 mm to 1.00 mm. The groove area 101 is used for accommodating the required active fingerprint sensing imaging array sheet 200, and the groove depth of the groove area 101 is adapted to the thickness of the active fingerprint sensing imaging array sheet 200, for example, 0.1 to 850 micrometers.
Referring to fig. 6E and 6F, in step S3, the active fingerprint sensing imaging array sheet 200 is attached to the transparent dielectric cover sheet 100' in the groove area 101 by the first adhesive layer 281 of the active fingerprint sensing imaging array sheet 200; then, a proper process is selected according to the properties of the second adhesive layer 700 to remove the temporary carrier substrate 600 and the second adhesive layer 700; then, filling transparent adhesive 110 into the groove area 101, and curing to fix and embed the active fingerprint sensing imaging array sheet 200 in the groove area 101; thereafter, the excessive transparent adhesive on the surface of the transparent dielectric cover sheet body 100 'is removed and the surface of the transparent dielectric cover sheet body 100' is planarized by a Chemical Mechanical Polishing (CMP) or the like process to provide a planar process surface for a subsequent process. Thereby obtaining a fingerprint recognition module 12.
Referring to fig. 6G, in step S4, an electro-optical display layer body 400 'is provided, the electro-optical display layer body 400' has at least one electro-optical display layer 400, the electro-optical display layer 400 has a display unit array 401 formed therein, the display unit array 401 includes a plurality of regularly arranged display pixel units 450, each display pixel unit 450 may include a pixel electrode and a thin film transistor (not shown) for driving the pixel electrode to emit light, the material of the pixel electrode may include a material such as Indium Tin Oxide (ITO), and the material of the thin film transistor mainly includes a semiconductor such as silicon. Preferably, each of the display pixel units 450 has the same planar size (including shape and area) as the active fingerprint sensing imaging pixel 250, so that when a finger touches the transparent medium cover layer 100, the display brightness of the display pixel unit 450 under the finger can be locally enhanced to obtain a clear fingerprint pattern on the finger.
With continued reference to fig. 6G, in step S5, a series of suitable semiconductor device manufacturing processes such as material deposition, photolithography, etching, etc. may be used to form at least one transparent touch positioning sensing layer 300 on the optoelectronic display layer sheet 400', and most of the area of the transparent touch positioning sensing layer 300 may be configured to sense and position external contacts (such as fingers, styli, etc. contacting the transparent dielectric cover layer 100) on the transparent dielectric cover layer 100, where the areas of the transparent touch positioning sensing layer 300 include the area of the transparent touch positioning sensing layer 300 corresponding to the active fingerprint sensing imaging array sheet 200. The transparent touch positioning sensing layer 300 may include a structure such as a touch electrode formed by a latticed metal wire. The transparent touch positioning sensing layer 300 and the optoelectronic display layer 400 are insulated and isolated by an insulating medium layer 500, wherein the insulating medium layer 500 is made of a transparent material, and the material of the insulating medium layer 500 can be silicon oxide or the like. In other embodiments of the present invention, at least one transparent touch positioning sensing layer 300 may be bonded to the electro-optical display layer body 400' by a packaging process such as glue, and the transparent touch positioning sensing layer 300 and the electro-optical display layer 400 are insulated and isolated by an insulating medium layer 500 such as an organic glass frit or a transparent adhesive. At this time, edges of the transparent touch positioning sensing layer 300 and the electro-optical display layer sheet body 400' are aligned. Further, a third adhesive layer 800 is formed on the transparent touch positioning sensing layer 300, where the third adhesive layer 800 may be selected from a tape, various organic films made of an organic polymer material or an organic material that can be denatured by ultraviolet, and a spin coating process and a photolithography process, for example, a Die Attach Film (DAF), a dry film (dry film), or a photoresist.
Referring to fig. 6H, in step S6, the transparent dielectric cover sheet 100' attached to the active fingerprint sensing imaging array sheet 200 is attached to the transparent touch positioning sensing layer 300 by a third adhesive layer 800.
Referring to fig. 6I, after that, wire bonding and plastic packaging are performed as follows:
first, the edge of the electro-optical display sheet body 400 'is cut twice from the back surface of the electro-optical display sheet body 400'. The two side edges of the optoelectronic display layer sheet 400' are cut at the same time, and the depth of the cut reaches the surface of the active fingerprint sensing imaging array sheet 200 to expose the periphery of the active fingerprint sensing imaging array sheet 200 and the surface of the bonding pad of the input/output circuit 202; the other cut is performed only on the edge of the photo display layer body 400' near the side of the active fingerprint sensing imaging array body 200, and the depth of the cut reaches the surface of the transparent touch positioning sensing layer 300, so as to expose the bonding pad surface of the transparent touch positioning sensing layer 300. The two cutting steps are not sequential, and finally the edge of the photoelectric display layer sheet 400 'near one side of the active fingerprint sensing imaging array sheet 200 is shorter than the edge of the transparent touch positioning sensing layer 300, so as to form a step, and the other edge of the photoelectric display layer sheet 400' is aligned with the edge of the other side of the transparent touch positioning sensing layer 300.
Then, the first flexible connection sheet 270 is welded to the periphery of the active fingerprint sensing imaging array sheet 200 and the bonding pad of the input/output circuit 202, and the second flexible connection sheet 310 is welded to the bonding pad of the transparent touch positioning sensing layer 300, the first flexible connection sheet 270 has the signal leads required by the active fingerprint sensing imaging array sheet 200, and the second flexible connection sheet 310 has the signal leads required by the transparent touch positioning sensing layer 300.
Next, the outer support 900 is covered on the surface of the electro-optical display layer sheet body 400' including the first and second flexible connection pieces 270 and 310 (i.e., the surface facing away from the human visual incidence direction 11) by an injection molding process. As an example, the outer support 900 includes a thermosetting resin, which is softened or flowed during molding, has plasticity, can be formed into a certain shape, and is cross-linked and cured by a chemical reaction, and the outer support 900 may include at least one of a phenolic resin, a urea resin, a melamine-formaldehyde resin, an epoxy resin, an unsaturated resin, polyurethane, polyimide, and other thermosetting resins, wherein an epoxy resin is preferably used as the outer support 900, wherein the epoxy resin may be an epoxy resin with or without a filler material, and various additives (e.g., a curing agent, a modifying agent, a mold release agent, a thermochromatic agent, a flame retardant, and the like), such as a phenolic resin as a curing agent, and solid particles (e.g., silica micropowder) and the like as a filler. The encapsulation layer 900 may embed the surface of the electro-optical display layer sheet body 400' facing away from the human visual incidence direction 11, provide a flat surface, and may expose the ends of the first and second flexible connection sheets 270 and 310 that are led outward. In other embodiments of the present invention, the outer support 900 may also be formed by a coating process, a chemical vapor deposition process, or the like.
It should be appreciated that the steps of the above embodiments, including deletion, addition, and sequence exchange, are adaptable to achieve the same manner as the touch display device with embedded fingerprint recognition function of the present invention. For example, referring to fig. 6A to 6F, 6I and 7, in another embodiment of the present invention, after performing steps S1 to S3, a transparent touch positioning sensing layer sheet (not shown) may be provided, in which at least one transparent touch positioning sensing layer 300 is formed, and most of the area of the transparent touch positioning sensing layer 300 may be configured to sense and position external contact on the transparent dielectric cover layer 100; then, a photo display layer sheet 400 may be adhered to the transparent touch positioning sensing layer sheet by a transparent adhesive (i.e. an insulating medium layer 500), where the photo display layer sheet 400 'has at least one photo display layer 400, where a display unit array 401 is formed in the photo display layer 400, where the display unit array 401 includes a plurality of regularly arranged display pixel units 450, each display pixel unit 450 may include a structure (not shown) such as a pixel electrode and a thin film transistor for driving the pixel electrode to emit light, or the manufacturing process of the pixel array directly forms the insulating medium layer 500 on the transparent touch positioning sensing layer sheet and forms at least one photo display layer 400 on the insulating medium layer 500, so as to obtain the photo display layer sheet 400', at this time, the edge of the photo display layer sheet 400 'opposite to the transparent touch positioning sensing layer sheet having the transparent touch positioning sensing layer 300 is retracted, that is shorter than the edge of the transparent touch positioning sensing layer, so as to form a step, so that the edge of the transparent touch positioning sensing layer sheet 300 is exposed to the other side of the transparent touch positioning sensing layer sheet, and the fingerprint sensing layer 400' is stacked, and the size of the transparent touch sensing layer is aligned with the edge 12; next, a third adhesive layer 800 is formed on a surface of the fingerprint recognition module 12 facing away from the human eye vision incident direction 11, and a surface of the transparent touch positioning sensing layer 300 facing away from the optoelectronic display layer sheet body 400 'is attached to the fingerprint recognition module 12 through the third adhesive layer 800 (i.e. the transparent dielectric cover layer sheet body 100' is attached to a surface of the active fingerprint sensing imaging array sheet body 200), and the stacked structure of the optoelectronic display layer sheet body 400 'and the transparent touch positioning sensing layer sheet body is retracted relative to the transparent dielectric cover layer sheet body 100', so as to expose the periphery of the active fingerprint sensing imaging array sheet body 200 and the surface of the bonding pad of the input/output circuit 202; then, the first flexible connection sheet 270 is welded to the periphery of the active fingerprint sensing imaging array sheet 200 and the bonding pad of the input/output circuit 202, and the second flexible connection sheet 310 is welded to the bonding pad of the transparent touch positioning sensing layer 300, wherein the first flexible connection sheet 270 has the signal leads required by the active fingerprint sensing imaging array sheet 200, and the second flexible connection sheet 310 has the signal leads required by the transparent touch positioning sensing layer 300. Next, the outer support 900 is covered on the surface of the electro-optical display layer sheet body 400' including the first and second flexible connection pieces 270 and 310 (i.e., the surface facing away from the human visual incidence direction 11) by an injection molding process.
In summary, in the method for manufacturing the touch display device with embedded fingerprint identification function of the present invention, an active fingerprint sensing imaging array sheet body with high transparency and high sensitivity of the active fingerprint sensing imaging array is attached to a groove area of a transparent medium cover sheet body, and then the transparent medium cover sheet body is attached to a photoelectric display layer sheet body with a transparent touch positioning sensing layer.
While the invention has been described in terms of preferred embodiments, the invention is not so limited. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims (24)

1. The touch display device (10) with the embedded fingerprint identification function is characterized in that the touch display device (10) with the embedded fingerprint identification function comprises the following components in layers along the human eye vision incidence direction (11):
A transparent medium cover layer (100), wherein a groove area (101) is formed in the transparent medium cover layer (100), an active fingerprint sensing imaging array sheet body (200) is embedded in the groove area (101), an active fingerprint sensing imaging array (201) is formed in the active fingerprint sensing imaging array sheet body (200), the active fingerprint sensing imaging array (201) comprises a plurality of active fingerprint sensing imaging pixels (250), and each active fingerprint sensing imaging pixel at least comprises a sensing pixel semiconductor transistor (251);
at least one transparent touch location sensing layer (300), the transparent touch location sensing layer (300) configured to sense and locate external contacts on the transparent dielectric overlay; the method comprises the steps of,
at least one electro-optical display layer (400), wherein a display unit array (401) is formed in the electro-optical display layer (400), and the display unit array (401) comprises a plurality of display pixel units (450).
2. The touch display device with embedded fingerprint recognition function according to claim 1, wherein the active fingerprint sensing imaging array sheet body (200) comprises, in layers, along the human eye visual incidence direction:
A semiconductor dielectric composite sub-layer (210); the method comprises the steps of,
a first dielectric sublayer (220);
wherein the sensing pixel semiconductor transistor (251) is disposed between the semiconductor dielectric composite sublayer (210) and the first dielectric sublayer (220).
3. The touch display device with embedded fingerprint recognition function according to claim 2, wherein the semiconductor dielectric composite sub-layer (210) comprises a plurality of insulating dielectric sheets (212).
4. The touch display device with embedded fingerprint recognition function according to claim 2, wherein the active fingerprint sensing imaging array sheet body (200) further comprises:
a second dielectric sub-layer (230) disposed on a side of the semiconductor dielectric composite sub-layer (210) facing the human eye visual incidence direction and opposite to the first dielectric sub-layer (220).
5. The touch display device with embedded fingerprint recognition function of claim 4, wherein the active fingerprint sensing imaging pixel (250) further comprises:
at least one fingerprint sensing tip unit (252) disposed in the second dielectric sublayer (230) and electrically connected to the sensing pixel semiconductor transistor (251).
6. The touch display device with embedded fingerprint recognition function according to claim 5, wherein the fingerprint sensing tip unit (252) is a capacitance sensing unit that generates a sensing capacitance for an external contact on the transparent medium cover layer; or alternatively; the fingerprint sensing end head unit (252) is an acoustic wave sensing unit for generating acoustic wave sensing for external contact on the transparent medium cover layer; or, the fingerprint sensing end head unit (252) is an electromagnetic wave sensing unit for generating electromagnetic wave induction on external contact on the transparent medium cover layer; alternatively, the fingerprint sensing tip unit (252) is a micro pressure sensing unit that generates micro pressure sensing for external contacts on the transparent medium cover.
7. The touch display device with embedded fingerprint recognition function of claim 4, wherein the sensing pixel semiconductor transistor (251) is disposed between the semiconductor dielectric composite sub-layer (210) and the second dielectric sub-layer (230).
8. The touch display device with embedded fingerprint recognition function according to claim 1, wherein the active fingerprint sensing imaging array sheet body (200) further comprises:
a plurality of sets of row interconnect wires (261); the method comprises the steps of,
a plurality of sets of column interconnect wires (262);
wherein each of said sensing pixel semiconductor transistors (251) is electrically connected to a corresponding set of said row interconnect conductors (261) and a corresponding set of said column interconnect conductors (262).
9. The touch display device with embedded fingerprint recognition function according to claim 4, wherein a plurality of display illumination blocking sheets (259) are formed in the first dielectric sub-layer (220), and each display illumination blocking sheet (259) is optically vertically aligned with the corresponding sensing pixel semiconductor transistor (251) along the human eye visual incidence direction (11).
10. The touch display device with embedded fingerprint recognition function according to claim 1, wherein the display pixel unit (450) has the same planar size as the active fingerprint sensing imaging pixel (250).
11. The touch display device with embedded fingerprint recognition function according to claim 1, wherein the thickness of the transparent dielectric cover layer (100) is 0.01-1 mm, the thickness of the active fingerprint sensing imaging array sheet body (200) is 0.1-850 microns, and the thickness of the sensing pixel semiconductor transistor (251) is 0.001-5 microns.
12. The touch display device with embedded fingerprint recognition function according to claim 1, wherein the material of the transparent dielectric cover layer (100) comprises at least one of silicon oxide, glass, and transparent plastic, and the sensing pixel semiconductor transistor (251) is mainly composed of a semiconductor material.
13. The preparation method of the touch display device with the embedded fingerprint identification function is characterized by comprising the following steps of:
providing an active fingerprint sensing imaging array sheet body (200), wherein an active fingerprint sensing imaging array (201) is formed in the active fingerprint sensing imaging array sheet body (200), the active fingerprint sensing imaging array (201) comprises a plurality of active fingerprint sensing imaging pixels (250), and each active fingerprint sensing imaging pixel at least comprises a sensing pixel semiconductor transistor (251);
Providing a transparent dielectric cover sheet body (100 '), the transparent dielectric cover sheet body (100') having a transparent dielectric cover layer (100), the transparent dielectric cover layer (100) having a recessed area (101) formed therein;
attaching the active fingerprint sensing imaging array sheet body (200) to the transparent medium cover layer sheet body (100') in a groove area (101);
providing an electro-optical display layer sheet body (400 '), the electro-optical display layer sheet body (400') having at least one electro-optical display layer (400), the electro-optical display layer (400) having an array of display cells (401) formed therein, the array of display cells (401) comprising a plurality of display pixel cells (450), at least one transparent touch location sensing layer (300) formed on the electro-optical display layer sheet body (400 '), the transparent touch location sensing layer (300) configured to sense and locate external contacts on the transparent dielectric cover layer sheet body (100'); the method comprises the steps of,
and attaching a transparent medium cover layer sheet body (100') attached to the active fingerprint sensing imaging array sheet body (200) to the transparent touch positioning sensing layer (300).
14. The method of manufacturing of claim 13, wherein the step of providing the active fingerprint sensing imaging array sheet (200) comprises:
Providing a semiconductor substrate (205);
-forming a plurality of active fingerprint sensing imaging array patches (200) on the semiconductor substrate (205);
the semiconductor substrate (205) is diced to separate each of the active fingerprint sensing imaging array tiles (200).
15. The method of manufacturing of claim 14, wherein forming a plurality of the active fingerprint sensing imaging array tiles (200) on the semiconductor substrate (205) comprises:
forming a semiconductor dielectric composite sub-layer (210) on a first substrate surface of the semiconductor substrate (205);
forming a first dielectric sub-layer (220) on the semiconductor dielectric composite sub-layer (210); the method comprises the steps of,
the plurality of sensing pixel semiconductor transistors (251) are formed between the semiconductor dielectric composite sub-layer (210) and the first dielectric sub-layer (220).
16. The method of manufacturing of claim 15, wherein the step of forming a plurality of the active fingerprint sensing imaging array tiles (200) on the semiconductor substrate (205) further comprises:
forming sets of row interconnect wires (261) and sets of column interconnect wires (262) in the first dielectric sublayer (220);
wherein each of said sensing pixel semiconductor transistors (251) is electrically connected to a corresponding set of said row interconnect conductors (261) and a corresponding set of said column interconnect conductors (262).
17. The method of manufacturing of claim 15, wherein the step of forming a plurality of the active fingerprint sensing imaging array tiles (200) on the semiconductor substrate (205) further comprises:
a plurality of display illumination barrier plates (259) are formed in the first dielectric sublayer (220), each display illumination barrier plate (259) being optically vertically aligned with a corresponding one of the sensing pixel semiconductor transistors (251).
18. The method of manufacturing of claim 15, wherein the step of forming a plurality of the active fingerprint sensing imaging array tiles (200) on the semiconductor substrate further comprises:
forming a second dielectric sub-layer (230) on a second substrate surface of the semiconductor substrate (205) opposite the first substrate surface; the method comprises the steps of,
a plurality of fingerprint sensing tip units (252) are formed in the second dielectric sublayer (230), each fingerprint sensing tip unit (252) being connected to a corresponding sensing pixel semiconductor transistor (251) to form an active fingerprint sensing imaging array (201) comprising a plurality of active fingerprint sensing imaging pixels (250) arranged in an array.
19. The method of manufacturing of claim 18, wherein the step of forming a plurality of the active fingerprint sensing imaging array tiles (200) on the semiconductor substrate further comprises:
-thinning the semiconductor substrate (205) from a second substrate face of the semiconductor substrate (205) before forming the second dielectric sub-layer (230) on the second substrate face opposite to the first substrate face, to leave a part of the thickness of the semiconductor substrate (205), or-removing the semiconductor substrate (205).
20. The method of manufacturing according to claim 19, characterized in that a temporary carrier substrate (600) is provided and the first substrate surface with the first dielectric sub-layer (220) is attached to the temporary carrier substrate (600) before thinning the semiconductor substrate (205) from the second substrate surface.
21. The method of manufacturing according to claim 20, wherein the semiconductor substrate (205) is cut together with the temporary carrier substrate (600) to separate the individual active fingerprint sensing imaging array sheets (200) when cutting.
22. The method of manufacturing of claim 21, wherein the step of affixing the active fingerprint sensing imaging array sheet (200) within the recessed area (101) of the transparent dielectric overlay sheet (100') further comprises:
attaching one side of the second dielectric sub-layer (203) of the active fingerprint sensing imaging array sheet body (200) with the temporary bearing substrate (600) to the groove area (101) of the transparent medium cover layer sheet body (100');
Removing the temporary carrier substrate (600) on the active fingerprint sensing imaging array sheet body (200);
filling a transparent adhesive (110) into the recessed area; the method comprises the steps of,
-planarizing the surface of the transparent dielectric cover sheet (100') with the active fingerprint sensing imaging array sheet (200).
23. The method of manufacturing according to claim 13, wherein after attaching the transparent dielectric overlay sheet (100') attached to the active fingerprint sensing imaging array sheet (200) over the transparent touch positioning sensing layer (300), the method of manufacturing further comprises:
welding a first flexible connection sheet (270) to the active fingerprint sensing imaging array sheet (200), and,
and welding a second flexible connecting sheet (310) on the transparent touch positioning induction layer (300).
24. A method of using the embedded fingerprint recognition function of any one of claims 1 to 12 for a touch display device, comprising:
display brightness of a display pixel unit (450) in a display unit array (401) in the photoelectric display layer (400) corresponding to the region of the active fingerprint sensing imaging array sheet body (200) or the finger contact region is locally enhanced.
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