CN111342179B - 2.5D miniaturized electromagnetic band gap structure for microwave circuit module package - Google Patents
2.5D miniaturized electromagnetic band gap structure for microwave circuit module package Download PDFInfo
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- CN111342179B CN111342179B CN202010290170.3A CN202010290170A CN111342179B CN 111342179 B CN111342179 B CN 111342179B CN 202010290170 A CN202010290170 A CN 202010290170A CN 111342179 B CN111342179 B CN 111342179B
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- band gap
- electromagnetic band
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Abstract
The invention relates to a 2.5-dimensional miniaturized electromagnetic band gap structure for packaging a microwave circuit module. The 2.5-dimensional electromagnetic band gap structure is processed by a multilayer printed circuit board technology, and the periodic unit of the 2.5-dimensional electromagnetic band gap structure comprises a horizontal metal patch with a metallized hole loaded in the center, a plurality of metallized hole arrays, four layers of circuit board substrates, an air layer, a metal cover plate and a metal base. The metallized hole arrays are loaded on the periphery of the horizontal metal patch, the equivalent capacitance among the periodic units of the electromagnetic band gap structure is enhanced through the electric coupling among the metallized hole arrays among the adjacent units, meanwhile, the metallized hole arrays can also effectively increase the equivalent inductance of the periodic units, finally, the working frequency of an electromagnetic band gap stop band is reduced, and the suppression of the resonance noise of the cavity of the parallel flat plate in the package of the microwave circuit module is realized. The periodic unit of the 2.5-dimensional electromagnetic band gap structure is small in size, low in section and lower in cut-off frequency of parallel plate cavity resonance noise suppression.
Description
Technical Field
The invention belongs to the technical field of electromagnetic field and microwave. In particular to a 2.5-dimensional miniaturized electromagnetic band gap structure for packaging a microwave circuit module.
Background
During the design and manufacture of microwave circuit modules, it is often necessary to use a metal housing to protect and support the internal functional circuitry so that these circuits can function properly in outdoor severe weather conditions or in complex electromagnetic environments. However, the metal-enclosed package of the microwave circuit module also raises some electromagnetic compatibility problems, especially that the cavity resonance mode in the metal package is easily excited by the electromagnetic leakage of the internal circuit, thereby causing problems such as self-excitation of the amplifier, increased interconnection loss, and failure of the circuit function. In order to solve these electromagnetic compatibility problems, it is common practice to design a metal wall in the microwave circuit module, implement a waveguide cavity effect, and implement electromagnetic isolation and circuit protection at the low frequency end by the high-pass characteristic of the waveguide, but this increases the weight, assembly cost, and complexity of the circuit module.
In the past decade, a magnetic package shielding technology derived based on the gap waveguide concept is used in the package of the microwave millimeter wave circuit module to suppress cavity resonance mode noise, thereby solving the corresponding electromagnetic compatibility problem. The magnetic packaging shielding technology is essentially an application of an electromagnetic band gap structure in circuit module packaging, the position and range of a stop band are closely related to the design of a periodic unit and the specific geometric structure size of the periodic unit, the main research of the electromagnetic band gap structure for circuit module packaging is focused on a frequency band above 10GHz, and the periodic unit form is mainly a cylindrical structure processed by metal machinery or printed in three dimensions or an inverted mushroom-shaped structure designed based on a double-layer circuit board. Other periodic unit structures similar to springs or Z-shaped wires are also proposed by researchers, such that the stop band can work within 10GHz, the section of the periodic unit is high, the processing is complex or the assembly reliability is poor, and therefore, a novel periodic unit with a low section and a light weight, which is used for packaging a microwave circuit module within 10GHz (especially Sub 6 GHz), and suppressing the cavity resonance mode noise of the novel periodic unit needs to be researched.
Disclosure of Invention
In view of the above problems, it is an object of the present invention to provide a 2.5 d miniaturized electromagnetic bandgap structure for packaging a microwave circuit module, which realizes the packaging of a Sub 6GHz microwave circuit module and suppresses the cavity resonance mode noise thereof; and meanwhile, the characteristics of low profile and light weight are realized.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a 2.5 dimension miniaturized electromagnetism band gap structure for microwave circuit module encapsulation, constitute by the electromagnetism band gap unit that a plurality of horizontal interval range was laid, every electromagnetism band gap unit all includes the metal covering plate that is located the magnetic band gap unit top and is located the metal base of magnetic band gap unit bottom, fixed surface microstrip circuit substrate on the metal base, the lower surface of metal covering plate is fixed with 2.5 dimension electromagnetism band gap substrate, the lower surface of 2.5 dimension electromagnetism band gap substrate is fixed with a horizontal metal paster, have the clearance between horizontal metal paster and the microstrip circuit substrate, thereby form the air bed, the middle part of horizontal metal paster is connected with metal covering plate through a central metallized hole that runs through 2.5 dimension electromagnetism band gap substrate, characterized by: the 2.5-dimensional electromagnetic band gap substrate is provided with a plurality of groups of symmetrical metalized hole arrays which take the horizontal metal patch as the center around the horizontal metal patch, each metalized hole array is electrically connected with the horizontal metal patch, each metalized hole array comprises a plurality of edge metalized holes, the edge metalized holes in the same metalized hole array are electrically connected with each other, the lower ends of the edge metalized holes are opened on the lower surface of the 2.5-dimensional electromagnetic band gap substrate, and the upper ends of the edge metalized holes are blind holes.
In order to optimize the structural form, the specific measures adopted further comprise:
the 2.5-dimensional electromagnetic band gap substrate is formed by sequentially stacking and fixing an upper electromagnetic band gap substrate, a connecting substrate and a lower electromagnetic band gap substrate from top to bottom, wherein a central metalized hole simultaneously penetrates through the upper electromagnetic band gap substrate, the connecting substrate and the lower electromagnetic band gap substrate, and an edge metalized hole only penetrates through the lower electromagnetic band gap substrate.
The horizontal metal patch is a round metal sheet or a square metal sheet.
The metalized hole arrays are connected with the horizontal metal patches through thin metal strips or metal wires, and the edge metalized holes in the same metalized hole array are connected through the thin metal strips or the metal wires.
The metallized hole arrays are four and are distributed around the horizontal metal patch in equal radian, and each metallized hole array is provided with three edge metallized holes.
Compared with the prior art, the invention has the advantages that: the method is characterized in that a plurality of metallized hole arrays are loaded on the periphery of a horizontal metal patch, equivalent capacitance among periodic units of the electromagnetic band gap structure is enhanced through electric coupling among the metallized hole arrays among adjacent units, meanwhile, the metallized hole arrays can also effectively increase equivalent inductance of the periodic units, the working frequency of an electromagnetic band gap stop band can be finally reduced through the increase of the equivalent capacitance among the periodic units and the equivalent inductance of the periodic units, the suppression of resonance noise of a parallel flat plate cavity in the package of a microwave circuit module is realized, the reduction of the noise suppression frequency enables the electrical size of the periodic units of the provided 2.5-dimensional electromagnetic band gap structure to be reduced, and the design of low-profile miniaturization is realized.
Drawings
Fig. 1 is a three-dimensional schematic diagram of a 2.5-dimensional miniaturized electromagnetic bandgap structure periodic unit for microwave circuit module packaging according to the present invention.
Fig. 2 is a design labeled top view of a 2.5-dimensional miniaturized electromagnetic bandgap structure periodic unit for microwave circuit module packaging according to the present invention.
Fig. 3 is a graph comparing simulated dispersion curves of periodic units of a 2.5-dimensional miniaturized electromagnetic bandgap structure for microwave circuit module packaging and a conventional inverted mushroom-type electromagnetic bandgap structure according to the present invention.
Wherein the reference numerals are: the circuit comprises a horizontal metal patch 1, a metallized hole array 2, a microstrip circuit substrate 3, an upper electromagnetic band gap substrate 4, a connecting substrate 5, a lower electromagnetic band gap substrate 6, an air layer 7, a metal cover plate 8, a metal base 9, a central metallized hole 10 and an edge metallized hole 11.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
The 2.5-dimensional miniaturized electromagnetic band gap structure for packaging the microwave circuit module in the embodiment is composed of a plurality of electromagnetic band gap units which are horizontally arranged at intervals, each electromagnetic band gap unit comprises a metal cover plate 8 positioned at the top of each magnetic band gap unit and a metal base 9 positioned at the bottom of each magnetic band gap unit, a microstrip circuit substrate 3 is fixed on the upper surface of each metal base 9, a 2.5-dimensional electromagnetic band gap substrate is fixed on the lower surface of each metal cover plate 8, a horizontal metal patch 1 is fixed on the lower surface of each 2.5-dimensional electromagnetic band gap substrate, a gap is formed between each horizontal metal patch 1 and each microstrip circuit substrate 3, so that an air layer 7 is formed, and the middle part of each horizontal metal patch 1 is connected with the metal cover plate 8 through a central metallized hole 10 penetrating through the 2.5-dimensional electromagnetic band gap substrate, and is characterized: the 2.5-dimensional electromagnetic band gap substrate is provided with a plurality of groups of symmetrical metalized hole arrays 2 taking the horizontal metal patch 1 as the center around the horizontal metal patch 1, each metalized hole array 2 is electrically connected with the horizontal metal patch 1, each metalized hole array 2 comprises a plurality of edge metalized holes 11, the edge metalized holes 11 in the same metalized hole array 2 are electrically connected with each other, the lower ends of the edge metalized holes 11 are opened on the lower surface of the 2.5-dimensional electromagnetic band gap substrate, and the upper ends of the edge metalized holes are blind holes.
The 2.5-dimensional electromagnetic band gap substrate is formed by sequentially stacking and fixing an upper electromagnetic band gap substrate 4, a connecting substrate 5 and a lower electromagnetic band gap substrate 6 from top to bottom, a central metalized hole 10 simultaneously penetrates through the upper electromagnetic band gap substrate 4, the connecting substrate 5 and the lower electromagnetic band gap substrate 6, and an edge metalized hole 11 only penetrates through the lower electromagnetic band gap substrate 6.
The horizontal metal patch 1 is a round metal sheet or a square metal sheet.
The metallized hole arrays 2 are connected with the horizontal metal patches 1 through thin metal strips or metal wires, and the edge metallized holes 11 in the same metallized hole array 2 are connected through the thin metal strips or the metal wires.
The metallized hole arrays 2 are four and are distributed around the horizontal metal patch 1 in an equal radian manner, and each metallized hole array 2 is provided with three edge metallized holes 11.
Fig. 1 is a three-dimensional schematic diagram of a 2.5-dimensional miniaturized electromagnetic bandgap structured periodic cell for microwave circuit module packaging, which is fabricated by printed circuit board technology. The thicknesses of four layers of media and air gaps adopted by the invention are respectively 4=0.254mm of an upper layer electromagnetic band gap substrate, 5=0.1mm of a connecting substrate, 6=0.5mm of a lower layer electromagnetic band gap substrate, 3=0.508mm of a microstrip circuit substrate and 7=1mm of an air layer. In the embodiment, the microstrip circuit substrate 3 is Rogers 4350B, and the upper layer electromagnetic band gap substrate 4, the connection substrate 5 and the lower layer electromagnetic band gap substrate 6 of the 2.5-dimensional periodic unit structure are Rogers 4350B, RO4450B/F, Rogers 4350B respectively; wherein the connection substrate 5 plays a role of bonding the upper electromagnetic bandgap substrate 4 and the lower electromagnetic bandgap substrate 6 to constitute a multilayer board.
Dielectric constant of dielectric Rogers 4350B
=3.66, tangent loss
Dielectric constant of dielectric RO4450B/F of =0.004
=3.52, tangent loss
=0.004。
As shown in fig. 2, a design labeled top view of a 2.5-dimensional miniaturized electromagnetic bandgap structure periodic unit for microwave circuit module packaging is provided, and the specific geometric structural parameters are as follows:
=0.15mm，
=0.3mm，
=7.5mm，
=3.2mm，
=2.8mm，
=0.4mm，
=0.4mm，
=2mm。
fig. 3 is a graph comparing simulated dispersion curves of periodic units of a 2.5-dimensional miniaturized electromagnetic bandgap structure for packaging a microwave circuit module according to the present invention and a conventional inverted mushroom-type electromagnetic bandgap structure. As can be seen from the figure, under the condition that the physical sizes of the periodic units are equal, the stop band frequency range of the periodic units of the traditional inverted mushroom-shaped electromagnetic band gap structure is 5.8 GHz-10.5 GHz, and the relative bandwidth is 57.7%; after four metallized hole arrays are introduced, the stopband frequency range of the metallized hole arrays is shifted to 3.4 GHz-5.2 GHz from a low frequency position, and the relative bandwidth is 42%. In addition, the periodic unit structure can obviously reduce the section electrical size and the periodic unit plane size of the whole packaging structure, and can load more periodic units in a given physical space range, thereby improving the isolation and suppression degree of noise.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (4)
1. A2.5 dimension miniaturized electromagnetic band gap structure used for microwave circuit module packaging is composed of a plurality of electromagnetic band gap units which are horizontally arranged at intervals, each electromagnetic band gap unit comprises a metal cover plate (8) positioned at the top of a magnetic band gap unit and a metal base (9) positioned at the bottom of the magnetic band gap unit, a microstrip circuit substrate (3) is fixed on the upper surface of the metal base (9), a 2.5 dimension electromagnetic band gap substrate is fixed on the lower surface of the metal cover plate (8), a horizontal metal patch (1) is fixed on the lower surface of the 2.5 dimension electromagnetic band gap substrate, a gap is formed between the horizontal metal patch (1) and the microstrip circuit substrate (3) so as to form an air layer (7), the middle part of the horizontal metal patch (1) is connected with the metal cover plate (8) through a central metallized hole (10) penetrating through the 2.5 dimension electromagnetic band gap substrate, the method is characterized in that: the 2.5-dimensional electromagnetic band gap substrate is provided with a plurality of groups of symmetrical metalized hole arrays (2) taking the horizontal metal patch (1) as the center around the horizontal metal patch (1), each metalized hole array (2) is electrically connected with the horizontal metal patch (1), each metalized hole array (2) comprises a plurality of edge metalized holes (11), the edge metalized holes (11) in the same metalized hole array (2) are electrically connected with each other, the lower ends of the edge metalized holes (11) are opened on the lower surface of the 2.5-dimensional electromagnetic band gap substrate, and the upper ends of the edge metalized holes are blind holes; the 2.5-dimensional electromagnetic band gap substrate is formed by sequentially stacking and fixing an upper electromagnetic band gap substrate (4), a connecting substrate (5) and a lower electromagnetic band gap substrate (6) from top to bottom, the central metalized hole (10) penetrates through the upper electromagnetic band gap substrate (4), the connecting substrate (5) and the lower electromagnetic band gap substrate (6) simultaneously, and the edge metalized hole (11) only penetrates through the lower electromagnetic band gap substrate (6).
2. A 2.5 dimensional miniaturized electromagnetic bandgap structure for microwave circuit module packaging as claimed in claim 1, wherein: the horizontal metal patch (1) is a round metal sheet or a square metal sheet.
3. A 2.5 dimensional miniaturized electromagnetic bandgap structure for microwave circuit module packaging as claimed in claim 1, wherein: the metallized hole arrays (2) are connected with the horizontal metal patches (1) through thin metal strips or metal wires, and the edge metallized holes (11) in the same metallized hole array (2) are connected through the thin metal strips or the metal wires.
4. A 2.5 dimensional miniaturized electromagnetic bandgap structure for microwave circuit module packaging as claimed in claim 1, wherein: the four metallized hole arrays (2) are arranged around the horizontal metal patch (1) in an equal radian manner, and each metallized hole array (2) is provided with three edge metallized holes (11).
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| CN106602252A (en) * | 2017-01-20 | 2017-04-26 | 浙江大学 | 2.5-dimensional ultra-wide band mobile communication radome of grid square ring loading via hole structure |
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