CN111330903B - 一种硅片的物理清洗方法 - Google Patents
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 79
- 239000010703 silicon Substances 0.000 title claims abstract description 79
- 238000004140 cleaning Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000012459 cleaning agent Substances 0.000 claims abstract description 25
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- 239000004094 surface-active agent Substances 0.000 claims abstract description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 14
- 230000010355 oscillation Effects 0.000 claims abstract description 13
- 239000002270 dispersing agent Substances 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 51
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 25
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 25
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000176 sodium gluconate Substances 0.000 claims description 17
- 235000012207 sodium gluconate Nutrition 0.000 claims description 17
- 229940005574 sodium gluconate Drugs 0.000 claims description 17
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 claims description 14
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 claims description 14
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
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- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 11
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 10
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 8
- 239000008139 complexing agent Substances 0.000 claims description 8
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 8
- 239000002736 nonionic surfactant Substances 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 7
- 239000003945 anionic surfactant Substances 0.000 claims description 6
- 239000003093 cationic surfactant Substances 0.000 claims description 6
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 150000002191 fatty alcohols Chemical class 0.000 claims description 5
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 5
- 229910052708 sodium Inorganic materials 0.000 claims description 5
- 239000011734 sodium Substances 0.000 claims description 5
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 5
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 4
- 125000002252 acyl group Chemical group 0.000 claims description 4
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- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 4
- 235000011152 sodium sulphate Nutrition 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- 229920005862 polyol Polymers 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 235000019387 fatty acid methyl ester Nutrition 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 231100000719 pollutant Toxicity 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 230000003993 interaction Effects 0.000 abstract description 2
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- 239000007787 solid Substances 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 230000001112 coagulating effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 44
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 17
- 229960001484 edetic acid Drugs 0.000 description 10
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- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
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- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229960004756 ethanol Drugs 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/83—Mixtures of non-ionic with anionic compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
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- C11D3/201—Monohydric alcohols linear
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/22—Carbohydrates or derivatives thereof
- C11D3/221—Mono, di- or trisaccharides or derivatives thereof
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
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- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
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Abstract
本发明涉及硅片清洗技术领域,具体涉及一种硅片的物理清洗方法。首先分析硅片基底所带的电荷;然后将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片。采用超声波物理方法清洗硅片,利用电荷的相互作用去除硅片表面的污染物,避免了使用氢氧化钠,氢氧化钾等腐蚀性化学清洗方法对硅片的损伤。本发明的清洗剂中加入的表面活性剂和分散剂可使硅片表面存在的固体及液体颗粒有效溶解在清洗液中,同时也能防止颗粒的沉降和凝聚,形成安定的悬浮液,因此,在清洗的过程中,加入带有表面活性剂和分散剂的清洗液,配合超声波进行清洗能够有效的清洗硅片表面的污染物。
Description
技术领域
本发明涉及硅片清洗技术领域,具体涉及一种硅片的物理清洗方法。
背景技术
太阳能由于其无污染、可再生、无地域性等优点,越来越受到人们的青睐,太阳能产业也得以发展。伴随太阳能光伏产业的成熟,硅片的使用也越来越多。
硅片是太阳能光伏发电设备中重要的组件,清洗作为硅片的一个生产工序之一,清洗的好坏程度对硅片的使用性能有着很大的影响。清洗的主要目的是为了清洗掉切割过程中产生的沙粒,残留的切削磨料、金属离子及指纹等,使硅片表面达到无腐蚀、无氧化、无残留等技术指标。
传统的硅片清洗通常采用化学清洗液进行清洗,但是,现有技术中的化学清洗液容易对硅片造成损伤,且存在清洗效果较差,对于硅片表面的污渍难以做到更好的去除,降低了硅片的使用效果的技术问题。
此外,金刚线的应用给光伏行业带来了机遇与进步,可实现高速切割,切割速度可以提高到原来的2倍,但是金刚线太粗会导致硅片损失较大,硅片的损失与切割线的粗细有直接联系,越粗自然损失越多。因此,这就使得切割硅片的金刚线要求越来越细,原来的金刚线直径为125微米左右,逐渐发展到50微米左右,而采用较细的金刚线切割硅片切割形成的粉末也越来越细,使得硅片清洗的难度也越来越大。
发明内容
为了解决现有技术中存在的技术问题,本发明提供了一种硅片的物理清洗方法,其具体方法步骤如下:
(1)分析硅片基底所带的电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
其中,步骤(1)所述分析电荷采用Zeta电位仪进行分析测试。
步骤(2)所述清洗液由清洗剂和水按照1:25-35的质量比配制而成。
清洗剂由表面活性剂,醇、分散剂和络合剂组成,其中,表面活性剂,醇、分散剂和络合剂按照质量比其组成为:表面活性剂8-10份,醇8-10份,分散剂5-6份,络合剂5-8份。
分散剂为聚丙烯酸钠、羧酸-磺酸盐共聚物、丙烯酸-丙烯酸酯-磺酸盐三元共聚物,六偏磷酸钠、羧甲基纤维素中的一种或几种;醇为乙醇;表面活性剂为阴离子表面活性剂或阳离子表面活性剂和非离子表面活性剂按照1:1的质量比组成。
络合剂为乙二胺四乙酸二钠和葡糖酸钠盐按照1:1的质量比组成。
上述阴离子表面活性剂为:十二烷基苯磺酸,脂肪醇酰硫酸钠,乙氧基化脂肪酸甲酯磺酸钠,仲烷基磺酸钠,醇醚羧酸盐,醇醚磷酸盐中的一种;阳离子表面活性剂为:十六烷基三甲基季铵溴化物、十八烷基二甲基苄基季铵氯化物中的一种;非离子表面活性剂为:脂肪醇聚氧乙烯醚,烷基酚聚氧乙烯醚,多元醇酯聚氧乙烯醚中的一种。
当硅片基底所带的电荷是正电荷时,选用阴离子表面活性剂和非离子表面活性剂作为表面活性剂;当硅片基底所带的电荷是负电荷时,选用阳离子表面活性剂和非离子表面活性剂作为表面活性剂。
有益效果
本发明采用超声波物理方法清洗硅片,利用电荷的相互作用去除硅片表面的污染物,从而避免了使用氢氧化钠,氢氧化钾等腐蚀性化学清洗方法对硅片表面的损伤。
本发明采用的清洗剂中加入的分散剂可均一分散难于溶解于液体的无机,有机物的固体及液体颗粒,同时也能防止颗粒的沉降和凝聚,形成安定的悬浮液,在超声清洗的过程中,加入带有表面活性剂和分散剂的清洗液,配合超声波进行清洗,能够有效的清洗掉采用50微米左右线径的金刚线切割后的硅片表面的污染物。
具体实施方式
下面结合实施例对本发明做进一步描述,但不限于此。
实施例1
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:30的质量比配制而成。
清洗剂由十二烷基苯磺酸,脂肪醇聚氧乙烯醚,乙醇,六偏磷酸钠,乙二胺四乙酸二钠和葡糖酸钠组成,其中,十二烷基苯磺酸,脂肪醇聚氧乙烯醚,六偏磷酸钠、乙二胺四乙酸二钠和葡糖酸钠盐按照质量比的组成为:十二烷基苯磺酸5份,脂肪醇聚氧乙烯醚5份,乙醇10份,六偏磷酸钠5份,乙二胺四乙酸二钠3份葡糖酸钠3份。
所述硅片是采用50微米左右线径的金刚线切割后的硅片,下述实施例及对比实施例同本实施例。
实施例2
(1)采用Zeta电位仪分析硅片基底所带的电荷为负电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:30的质量比配制而成。
清洗剂由十六烷基三甲基季铵溴化物,脂肪醇聚氧乙烯醚,乙醇羧酸-磺酸盐共聚物,乙二胺四乙酸二钠和葡糖酸钠组成,其中,十六烷基三甲基季铵溴化物,脂肪醇聚氧乙烯醚,乙醇,乙醇羧酸-磺酸盐共聚物,乙二胺四乙酸二钠和葡糖酸钠按照质量比的组成为:十六烷基三甲基季铵溴化物5份,脂肪醇聚氧乙烯醚5份,乙醇10份,乙醇羧酸-磺酸盐共聚物5份,乙二胺四乙酸二钠2.5份,葡糖酸钠2.5份。
实施例3
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:25的质量比配制而成。
清洗剂由脂肪醇酰硫酸钠,烷基酚聚氧乙烯醚,乙醇,羧甲基纤维素,乙二胺四乙酸二钠和葡糖酸钠组成,其中,脂肪醇酰硫酸钠4份,烷基酚聚氧乙烯醚4份,乙醇8份,羧甲基纤维素5份,乙二胺四乙酸二钠4份,葡糖酸钠4份。
实施例4
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:35的质量比配制而成。
清洗剂由醇醚羧酸盐,多元醇酯聚氧乙烯醚,乙醇,聚丙烯酸钠,乙二胺四乙酸二钠和葡糖酸钠组成,其中,醇醚羧酸盐4份,多元醇酯聚氧乙烯醚4份,乙醇8份,聚丙烯酸钠5份,乙二胺四乙酸二钠4份,葡糖酸钠4份。
实施例5
(1)采用Zeta电位仪分析硅片基底所带的电荷为负电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:32的质量比配制而成。
清洗剂由十八烷基二甲基苄基季铵氯化物,烷基酚聚氧乙烯醚,乙醇聚丙烯酸钠,乙二胺四乙酸二钠和葡糖酸钠组成,其中,十八烷基二甲基苄基季铵氯化物4.5份,烷基酚聚氧乙烯醚4.5份,乙醇8份,聚丙烯酸钠6份,乙二胺四乙酸二钠3.5份,葡糖酸钠3.5份。
实施例6
(1)采用Zeta电位仪分析硅片基底所带的电荷为负电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:28的质量比配制而成。
清洗剂由十六烷基三甲基季铵溴化物,烷基酚聚氧乙烯醚,乙醇,聚丙烯酸钠,乙二胺四乙酸二钠和葡糖酸钠组成,其中,十六烷基三甲基季铵溴化物5份,烷基酚聚氧乙烯醚5份,乙醇10份,聚丙烯酸钠5份,乙二胺四乙酸二钠3份,葡糖酸钠3份。
对比实施例1
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,通过超声波震荡清洗硅片。
对比实施例2
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:30的质量比配制而成。
清洗剂由十二烷基苯磺酸,脂肪醇聚氧乙烯醚,乙醇组成,其中,十二烷基苯磺酸,脂肪醇聚氧乙烯醚,乙醇按照质量比的组成为:十二烷基苯磺酸5份,脂肪醇聚氧乙烯醚5份,乙醇10份。
对比实施例3
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:30的质量比配制而成。
清洗剂由十二烷基苯磺酸,脂肪醇聚氧乙烯醚,乙醇,六偏磷酸钠,乙二胺四乙酸二钠组成,其中,十二烷基苯磺酸,脂肪醇聚氧乙烯醚,六偏磷酸钠、乙二胺四乙酸二钠和葡糖酸钠盐按照质量比的组成为:十二烷基苯磺酸5份,脂肪醇聚氧乙烯醚5份,乙醇10份,六偏磷酸钠5份,乙二胺四乙酸二钠6份。
对比实施例4
(1)采用Zeta电位仪分析硅片基底所带的电荷为正电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
清洗液由清洗剂和水按照1:30的质量比配制而成。
清洗剂由十二烷基苯磺酸,脂肪醇聚氧乙烯醚,乙醇,六偏磷酸钠,乙二胺四乙酸二钠和葡糖酸钠组成,其中,十二烷基苯磺酸,脂肪醇聚氧乙烯醚,六偏磷酸钠和葡糖酸钠盐按照质量比的组成为:十二烷基苯磺酸5份,脂肪醇聚氧乙烯醚5份,乙醇10份,六偏磷酸钠5份,葡糖酸钠6份。
本发明上述实施例和对比实施例清洗硅片后硅片的水接触角和去污效果见表1。
所述实施例为本发明的优选的实施方式,但本发明并不限于上述实施方式,在不背离本发明的实质内容的情况下,本领域技术人员能够做出的任何显而易见的改进、替换或变型均属于本发明的保护范围。
Claims (3)
1.一种采用50微米线径的金刚线切割后的硅片的物理清洗方法,其特征在于,所述清洗方法步骤如下:
(1)采用Zeta电位仪分析硅片基底所带的电荷;
(2)将硅片放入超声波清洗设备,加入清洗液,通过超声波震荡清洗硅片;
所述清洗液由清洗剂和水按照1:25-35的质量比配制而成;
所述清洗剂由表面活性剂、 醇、分散剂和络合剂组成;
所述清洗剂中,表面活性剂、 醇、分散剂和络合剂按照质量比其组成为:表面活性剂8-10份,醇8-10份,分散剂5-6份,络合剂5-8份;
所述表面活性剂为阴离子表面活性剂或阳离子表面活性剂和非离子表面活性剂按照1:1的质量比组成;
所述络合剂为乙二胺四乙酸二钠和葡糖酸钠盐按照1:1的质量比组成;
当硅片基底所带的电荷是正电荷时,选用阴离子表面活性剂和非离子表面活性剂作为表面活性剂;当硅片基底所带的电荷是负电荷时,选用阳离子表面活性剂和非离子表面活性剂作为表面活性剂。
2.如权利要求1所述的采用50微米线径的金刚线切割后的硅片的物理清洗方法,其特征在于,所述阴离子表面活性剂为:十二烷基苯磺酸、 脂肪醇酰硫酸钠、 乙氧基化脂肪酸甲酯磺酸钠、 仲烷基磺酸钠、 醇醚羧酸盐、 醇醚磷酸盐中的一种;阳离子表面活性剂为:十六烷基三甲基季铵溴化物、十八烷基二甲基苄基季铵氯化物中的一种;非离子表面活性剂为:脂肪醇聚氧乙烯醚、 烷基酚聚氧乙烯醚、 多元醇酯聚氧乙烯醚中的一种。
3.如权利要求1所述的采用50微米线径的金刚线切割后的硅片的物理清洗方法,其特征在于,所述醇为乙醇;所述分散剂为:聚丙烯酸钠、羧酸-磺酸盐共聚物、丙烯酸-丙烯酸酯-磺酸盐三元共聚物,六偏磷酸钠、羧甲基纤维素中的一种或几种。
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