CN111326441A - Substrate processing apparatus and method - Google Patents
Substrate processing apparatus and method Download PDFInfo
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- CN111326441A CN111326441A CN201811543948.6A CN201811543948A CN111326441A CN 111326441 A CN111326441 A CN 111326441A CN 201811543948 A CN201811543948 A CN 201811543948A CN 111326441 A CN111326441 A CN 111326441A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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Abstract
A substrate processing apparatus includes a processing device, a supplying device, a cleaning device, and a control device. The control device is configured to instruct a switching element of the supply device to switch from a first configuration to a second configuration to alter the reservoir for supplying the processing liquid when the first parameter reaches a first condition. The control device is further configured to instruct the cleaning device to provide cleaning fluid into the processing device for use in cleaning the processing device when the second parameter reaches a second condition. The invention also provides a substrate processing method. The substrate processing equipment and the method can save related human resources and improve the operation efficiency.
Description
Technical Field
The present invention relates to a semiconductor device manufacturing process, and more particularly, to a technique for processing a substrate using a processing liquid.
Background
The fabrication of semiconductor devices may use a processing fluid to process the substrate. For example, wet etching may use an acid solution as an etchant to create a specific pattern on the substrate. The processing liquid is generally stored in a reservoir of the liquid supply apparatus and is delivered to the substrate as needed. In order to maintain the stability and accuracy of the process, the reservoir of the liquid supply apparatus must be manually replaced at intervals, and the processing facilities must be manually cleaned at intervals. However, such manual work is time-consuming and sometimes even causes errors due to human factors.
Disclosure of Invention
It is an object of the present invention to provide a substrate processing apparatus and method that avoids at least one of the above-mentioned disadvantages of the prior art.
In some aspects, the substrate processing apparatus includes a processing device having a chamber and configured to receive a substrate therein. The substrate processing apparatus further comprises a supply device having a switching element and a plurality of reservoirs for storing processing liquid and configured to provide processing liquid into the processing device for processing a substrate, wherein the switching element is operable to allow one of the reservoirs to provide processing liquid to the processing device. The substrate processing apparatus also includes a cleaning device configured to provide a cleaning fluid into the processing device for cleaning the processing device. The substrate processing apparatus further comprises a control device configured to instruct the switching element to switch from a first configuration to a second configuration when a first parameter related to the consumption of the processing fluid reaches a first condition, wherein the first configuration allows the processing fluid to be provided to the processing device from a first reservoir of the plurality of reservoirs and the second configuration allows the processing fluid to be provided to the processing device from a second reservoir of the plurality of reservoirs. The control device is also configured to instruct the cleaning device to provide cleaning liquid into the treatment device when a second parameter related to the operation of the switching element reaches a second condition.
In some embodiments, the first parameter is one of the following: a total amount of processing liquid provided to the processing apparatus from the first reservoir since the switching element was last switched to the first state, a total amount of time the first reservoir provided the processing liquid to the processing apparatus each time after the switching element was last switched to the first state, and any combination thereof; and the first condition is at least one predetermined threshold.
In some implementations, the first parameter is time and the first condition is a predetermined time point.
In some implementations, the second parameter is a number of times the switching element has performed the switching, and the second condition is a predetermined threshold.
In some embodiments, the cleaning device is further configured to provide the cleaning fluid into the plurality of reservoirs for cleaning the reservoirs, and the control device is further configured to instruct the cleaning device to provide the cleaning fluid into the first reservoir in parallel with the operation of the cleaning device to provide the cleaning fluid into the processing device after the switching element is switched from the first configuration allowing the processing fluid to be provided from the first reservoir to the second configuration allowing the processing fluid to be provided from the second reservoir to the processing device.
In some implementations, the control device is further configured to perform the following operations after the switching element is switched to the second configuration: determining whether to perform a test job according to a third parameter related to the test job; after determining that the test operation is to be performed, instructing the processing apparatus and the supply apparatus to perform the test operation, and scheduling at least one substrate to be processed in a chamber of the processing apparatus after the test operation is completed, wherein the test operation causes a test substrate to be processed in the chamber of the processing apparatus; and instructing the processing apparatus to schedule the at least one substrate to be processed in a chamber of the processing apparatus after determining not to perform the test operation.
In some embodiments, the substrate processing method comprises the following steps: scheduling at least one substrate to be processed in a chamber of a processing apparatus; indicating a switching element of a supply device capable of providing a processing liquid into the processing device for processing the at least one substrate to switch from a first configuration to a second configuration when a first parameter related to the consumption of the processing liquid reaches a first condition, wherein the first configuration allows the processing liquid to be provided to the processing device from a first reservoir of the supply device and the second configuration allows the processing liquid to be provided to the processing device from a second reservoir of the supply device; and instructing a cleaning device to provide cleaning liquid into the processing device for use in cleaning the processing device when a second parameter related to the operation of the switching element reaches a second condition.
In some embodiments, the first parameter is one of the following: a total amount of processing liquid provided to the processing apparatus from the first reservoir since the switching element was last switched to the first state, a total amount of time the first reservoir provided the processing liquid to the processing apparatus each time after the switching element was last switched to the first state, and any combination thereof; and the first condition is at least one predetermined threshold.
In some implementations, the first parameter is time and the first condition is a predetermined time point.
In some implementations, the second parameter is a number of times the switching element has performed switching, and the second condition is a predetermined threshold.
In some embodiments, the substrate processing method further comprises: instructing the cleaning device to provide the cleaning liquid into the first reservoir for use in cleaning the first reservoir in parallel with the operation of the cleaning device to provide the cleaning liquid into the processing device after the switching element switches from the first configuration allowing the processing liquid to be provided from the first reservoir of the supply device to the second configuration allowing the processing liquid to be provided from the second reservoir of the supply device to the processing device.
In some embodiments, the substrate processing method further comprises: after the switching element switches from the first configuration allowing the processing liquid to be provided to the processing apparatus from a first reservoir of the supply apparatus to the second configuration allowing the processing liquid to be provided to the processing apparatus from a second reservoir of the supply apparatus, instructing the cleaning apparatus to provide the cleaning liquid into the first reservoir for cleaning the first reservoir in parallel with an operation of providing the processing liquid from the second reservoir into a chamber of the processing apparatus for processing at least one substrate of the at least one substrate.
In some embodiments, the substrate processing method further comprises: determining whether to perform a test operation according to a third parameter associated with the test operation after the switching element is switched to the second configuration; instructing the processing apparatus and the supply apparatus to perform the test operation when it has been determined that the test operation is to be performed, and scheduling at least one other substrate to be processed in the chamber of the processing apparatus after the test operation is completed, wherein the test operation causes a test substrate to be processed in the chamber of the processing apparatus; and scheduling at least one other substrate to be processed in a chamber of the processing apparatus when it has been determined that the test operation is not to be performed.
In some embodiments, the substrate processing method further comprises: when it has been decided that the test operation is to be performed, instructing the cleaning device to supply the cleaning liquid into the first tank for cleaning the first tank in parallel with the test operation after the switching element switches from the first configuration allowing the processing liquid to be supplied from a first tank of the supply device to the second configuration allowing the processing liquid to be supplied from a second tank of the supply device to the processing device.
The invention has the beneficial effects that: can save the related human resources and avoid the errors caused by human factors. In addition, such automated procedures are also more time efficient than conventional manual procedures.
Drawings
FIG. 1 is a schematic view illustrating a substrate processing apparatus according to an embodiment of the present invention;
fig. 2 is a flow chart illustrating a method of processing a substrate in accordance with an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 1, a substrate processing apparatus 100 is illustrated in accordance with an embodiment of the present invention for performing a substrate wet process (which may include, for example, etching, cleaning, drying, etc.). The illustrated apparatus 100 comprises a processing device 110, a supply device 120, a cleaning device 130, and a control device 140 electrically connected to the processing device 110, the supply device 120, and the cleaning device 130.
According to one embodiment, the processing apparatus 110 has a chamber and is configured to receive at least one substrate 150 to be processed therein. According to some embodiments, the substrate 150 may be processed by the processing device 110 in connection with a single substrate wet process, a multi-substrate wet process, a single square wafer under-bump metal etching, a thinned wafer support or lift-off, a bonding or lift-off process, a silicon carbide reconstituted wafer, a reconstituted silicon wafer, or the like. For simplicity, only one substrate 150 is illustrated in FIG. 1. In one embodiment, only one substrate 150 is received and processed at a time in the chamber, although the invention is not so limited. According to some embodiments of the present invention, the substrate 150 may be in the form of a carrier plate, wafer, chip or other device, and may have a circular, square, rectangular or other geometric shape.
According to one embodiment, the supply device 120 has a plurality of processing liquid reservoirs 122 (e.g., two processing liquid reservoirs including a first reservoir 122-1 and a second reservoir 122-2 are shown in the figure, but the invention is not so limited), and a switching element 121, the processing liquid reservoirs 122 are used for storing processing liquid, and the switching element 121 is operable to enable one of the processing liquid reservoirs 122 to communicate with the processing device 110 and provide the processing liquid to the chamber of the processing device 110. The switching element 121 includes a first line connected to the processing apparatus 110 so that the supply apparatus 120 can supply the processing liquid stored in the processing liquid storage tank 122 into the processing apparatus 110 through the first line. The switching element 121 is configured to allow only one of the treatment liquid reservoirs 122 to be able to provide treatment liquid to the treatment device 110 at a time. The processing fluid is applied to the substrate 150 in the chamber of the processing apparatus 110 to perform a certain process (e.g., etching) on the substrate 150. In one embodiment, the switching element 121 further comprises a plurality of control valves and a second pipeline connected to the processing liquid storage tanks 122, so that the switching element 121 can switch between the processing liquid storage tanks 122 to select which processing liquid storage tank 122 is to be used as the source of the processing liquid. In one embodiment, the supply device 120 further includes a replenishing device (not shown) storing a replenishing liquid (i.e., an unused processing liquid) and connected to the processing liquid tank 122 through a third line for replenishing the processing liquid tank 122. In yet another embodiment, the supply device 120 further comprises a temperature controller connected to the processing liquid storage tank 122 and a circulation pipeline for controlling the temperature of the processing liquid stored in the processing liquid storage tank 122.
According to one embodiment, the cleaning device 130 has a lotion reservoir 131 for storing a cleaning fluid and is connected to the processing device 110 via a fourth line, thereby enabling the cleaning device 130 to supply cleaning fluid into the processing device 110 via the fourth line for cleaning the processing device 110. The cleaning device 130 may be further connected to the processing liquid tank 122 via a fifth line, so that the cleaning device 130 can supply a cleaning liquid into the processing liquid tank 122 via the fifth line for cleaning the processing liquid tank 122.
According to one embodiment, the control device 140 has an input module 141 and a processor 142 electrically connected to each other. The processor 142 is configured to receive control information from a user of the apparatus 100 through the input module 141, and to automatically control the operations of the processing device 110, the supplying device 120 and the cleaning device 130 according to the received control information. The control information may include, but is not limited to, at least one of: number of substrates, time length, time, amount of used processing liquid, number of times of switching, number of times of testing. The processor 142 is further configured to automatically control when the processing fluid is provided through which of the processing fluid reservoirs 122 based on the received control information.
FIG. 2 is a flow chart illustrating a method of processing a substrate that may be implemented by the apparatus 100 illustrated in FIG. 1, in accordance with an embodiment of the present invention. The method will be described below with respect to the apparatus 100 of fig. 1.
Referring to fig. 2, in the following description, it is assumed that the switching element 121 of the supplying device 120 is configured to be in the first configuration for allowing the processing liquid to be provided from the first tank 122-1 to the processing device 110 (i.e., the first tank 122-1 responsible for providing the processing liquid to the processing device 110) when the procedure is about to be performed.
At step 205, the control device 140 of the apparatus 100 schedules at least a portion of a plurality of substrates to be processed in a chamber of the processing device 110. According to some embodiments, the at least a portion of the substrates may be one, several, or all of the substrates of the batch of substrates, and when the at least a portion of the substrates includes several substrates, the substrates may be processed one by one or in groups.
In step 210, the control device 140 determines whether to perform a tank replacement operation. If yes, go to step 215; if not, the process may return to step 205 to schedule another portion of the same batch of substrates or at least a portion of another batch of substrates. According to one embodiment, step 210 may determine whether to perform a tank replacement operation by determining whether a first parameter related to the consumption of processing fluid reaches a first condition for the last substrate scheduled in step 205. The first parameter may be, for example, the number of substrates processed in the processing apparatus 110 since the switching element 121 was last configured or switched to the first configuration allowing the processing liquid to be provided by the first reservoir 122-1, the elapsed time since the switching element 121 was last configured or switched to the first configuration, the total amount of processing liquid provided to the processing apparatus 110 from the first reservoir 122-1 since the switching element 121 was last configured or switched to the first configuration, the total amount of time each time the first reservoir 122-1 provides processing liquid to the processing apparatus 110 since the switching element 121 was last configured or switched to the first configuration, or any combination thereof; and the first condition may be at least one predetermined threshold value, the value of which may be set, for example, based on control information input by a user. According to another embodiment, the first parameter may also be time, and the first condition may be a predetermined time point.
At step 215, the control device 140 instructs the supply device 120 to perform a tank replacement operation and schedules the tank replacement operation to replace a processing solution tank that is allowed to provide processing solution to the processing device 110 (i.e., a processing solution tank responsible for providing processing solution to the processing device 110) from the first tank 122-1 to another tank, such as the second tank 122-2. In this case, this step includes instructing the switching element 121 to switch from the first configuration allowing the processing liquid to be supplied from the first tank 122-1 to the second configuration allowing the processing liquid to be supplied from the second tank 122-2. According to one embodiment, this operation of replacing the processing liquid tanks 122 may be accomplished, for example, by changing the configuration of the control valves provided for each processing liquid tank 122. In one embodiment, once all of the substrates scheduled in step 205 have been processed, the tank replacement operation may proceed. However, in another embodiment, the replacement tank operation is only performed after the entire batch of substrates has been processed, and therefore, in this embodiment, if the batch of substrates scheduled in step 205 still have not been processed, the control device 140 schedules all of the unprocessed substrates in the batch of substrates to be processed in the processing apparatus 110 before scheduling the replacement tank operation in step 215.
As described herein, the treatment liquid tank 122 to be used and replaced is not limited to the above. For example, the identities of the first reservoir 122-1 and the second reservoir 122-2 may be interchanged while performing the foregoing procedure; in other words, in the above-mentioned procedure, the second tank 122-2 may be responsible for supplying the processing liquid to the processing apparatus 110 before the tank replacement operation is performed, and the tank replacement operation may be performed by replacing the tank responsible for supplying the processing liquid from the second tank 122-2 to the first tank 122-1.
In step 220, the control device 140 determines whether a chamber cleaning operation is to be performed. If yes, go to step 225; if the answer is no, proceed to step 230. According to some embodiments, the determination of whether to perform the cleaning chamber operation may be made by determining whether a second parameter associated with the operation of the switching element 121 has reached a second condition. The second parameter may be, for example, the number of times the switching element 121 has performed the switching, and the second condition may be a predetermined threshold value, the value of which may be set, for example, according to control information input by a user.
At step 225, the control device 140 directs and schedules the cleaning device 130 and the processing device 110 to perform the cleaning chamber operations. This step includes instructing the cleaning device 130 to provide cleaning fluid into the processing device 110 for cleaning the processing device 110.
In step 230, the control device 140 determines whether a test operation is to be performed. If yes, go to step 235; if not, the process may return to step 205 to schedule another portion of the same batch of substrates or at least a portion of another batch of substrates. The purpose of the test operation is to ensure that the processing apparatus 110 can correctly process the substrate after replacing the processing liquid tank 122 for supplying the processing liquid. According to some embodiments, whether to perform the test operation may be determined according to a third parameter associated with the test operation. For example, the third parameter may be a flag, and whether to perform a test operation may be determined by determining whether the third parameter is a specific value. In a further embodiment, the control device 140 may set and may alter the value of the third parameter. For example, the control device 140 may set the value of the third parameter to a value indicating that a test operation is to be performed or a value indicating that a test operation is not to be performed in advance, and may change the value of the third parameter based on, for example, control information input by a user. In one embodiment, the preset value of the third parameter is a first value indicating that a test operation is to be performed, and after the switching element 121 performs a certain number of times (e.g., five times) of switching, the control device 140 changes the value of the third parameter to a second value indicating that a test operation is not to be performed; in a further embodiment, the control device 140 may change the value of the third parameter back to the first value after a certain number of further (e.g. five) switchings of the switching element 121 or when a certain predetermined time is reached.
At step 235, the control device 140 instructs the processing device 110 and the supply device 120 to perform the test operation and schedule the test operation. In one embodiment, at least one test substrate dedicated for testing during a testing operation is processed in the chamber of the processing apparatus 110 by the processing fluid from the supply apparatus 120. For example, in this implementation, since the switching element 121 has been switched to the second configuration that allows the processing liquid to be provided from the second reservoir 122-2 at this time, at least one test substrate is processed in the chamber of the processing apparatus 110 by the processing liquid from the second reservoir 122-2 during the test operation. After the testing operation is completed, the process may return to step 205 to schedule another portion of the substrates of the same batch of substrates or at least a portion of the substrates of another batch of substrates.
It should be noted that in the method illustrated in FIG. 2, the reservoir replacement operation, the chamber cleaning operation, and the testing operation are automatically scheduled and performed by the machine, so that the implementation of the method can save the related human resources and avoid the human error. In addition, such automated procedures are also more time efficient than conventional manual procedures.
Those skilled in the art will recognize that steps 215 through 230 need not be performed in the order shown in fig. 2. For example, step 220 may be performed at any point between step 210 and step 225, without necessarily being sandwiched between step 215 and step 225, and step 230 may be performed at any point between step 210 and step 235, without necessarily being sandwiched between step 225 and step 235.
In addition, there may be more variations of the method. For example, in one embodiment, the control device 140 may further perform a step of determining whether to perform a tank cleaning operation after determining that a tank replacement operation is to be performed in step 210 (this determination may be made, for example, based on whether a fourth parameter that is a flag is a particular value). In this embodiment, if the cleaning tank operation is determined to be performed, the control device 140 instructs the cleaning device 130 and the first tank 122-1 to perform the cleaning tank operation for the first tank 122-1 after completing the tank replacement operation of step 215 for replacing the processing liquid tank allowed to supply the processing liquid to the processing device 110 from the first tank 122-1 to the second tank 122-2, and schedules the cleaning tank operation. In some embodiments, the control device 140 schedules the purge tank operation to be concurrent (e.g., simultaneous) with other operations to make efficient use of time. For example, the control device 140 may schedule cleaning reservoir operations performed by the cleaning device 130 and the first reservoir 122-1 to be concurrent with cleaning chamber operations performed by the cleaning device 130 and the processing device 110, testing operations performed by the supply device 120 and the processing device 110, or processing operations performed by the processing device 110 on one or more substrates 150 with processing fluid from the second reservoir 122-2 to save time. In operation of the cleaning reservoir, the first reservoir 122-1 is emptied of processing fluid therein, and the cleaning device 130 then fills the first reservoir 122-1 with cleaning fluid for cleaning the first reservoir 122-1, according to one embodiment. In a further embodiment, the control device 140 instructs the replenishing device of the supplying device 120 to fill the first reservoir 122-1 with the replenishing liquid (i.e., the processing liquid) after the operation of the cleaning reservoir is completed, and maintains the temperature of the processing liquid replenished into the first reservoir 122-1 within a specific temperature range through the circulation line and the temperature controller of the supplying device 120.
Although the foregoing description details certain embodiments of the invention in order to provide a thorough understanding of the embodiments, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments that do not necessarily include all of the details described above. Furthermore, it should be appreciated that the description herein of one embodiment, or several embodiments, and the like, is intended to refer to a particular feature, structure, or characteristic that may be present in implementing the invention in the described manner. In addition, in the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various aspects of the disclosure. It should be recognized that one or more features or specific details from one embodiment may be implemented together with one or more features or specific details from another embodiment as appropriate when practicing the invention.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and broad scope of the invention.
Claims (11)
1. A substrate processing method; the method is characterized in that:
scheduling at least one substrate to be processed in a chamber of a processing apparatus;
indicating a switching element of a supply device capable of providing the processing liquid into the processing device for processing the at least one substrate to switch from a first configuration to a second configuration when a first parameter related to the consumption of the processing liquid reaches a first condition, wherein the first configuration allows the processing liquid to be provided to the processing device from a first reservoir of the supply device and the second configuration allows the processing liquid to be provided to the processing device from a second reservoir of the supply device; and
instructing a cleaning device to provide cleaning fluid into the processing device for use in cleaning the processing device when a second parameter related to operation of the switching element reaches a second condition.
2. The substrate processing method according to claim 1, wherein:
the first parameter is one of the following: a total amount of processing liquid provided to the processing apparatus from the first reservoir since the switching element was last switched to the first state, a total amount of time the first reservoir provided the processing liquid to the processing apparatus each time after the switching element was last switched to the first state, and any combination thereof; and is
The first condition is at least one predetermined threshold.
3. The substrate processing method according to claim 1, wherein: wherein the first parameter is time and the first condition is a predetermined time point.
4. The substrate processing method according to claim 1, wherein: the second parameter is a number of times the switching element has performed the switching, and the second condition is a predetermined threshold.
5. The substrate processing method according to claim 1, wherein: further comprises
Instructing the cleaning device to provide the cleaning liquid into the first reservoir for use in cleaning the first reservoir in parallel with the operation of the cleaning device to provide the cleaning liquid into the processing device after the switching element switches from the first configuration allowing the processing liquid to be provided from the first reservoir of the supply device to the second configuration allowing the processing liquid to be provided from the second reservoir of the supply device to the processing device.
6. The substrate processing method according to claim 1, wherein: further comprises
After the switching element switches from the first configuration allowing the processing liquid to be provided to the processing apparatus from a first reservoir of the supply apparatus to the second configuration allowing the processing liquid to be provided to the processing apparatus from a second reservoir of the supply apparatus, instructing the cleaning apparatus to provide the cleaning liquid into the first reservoir for cleaning the first reservoir in parallel with an operation of providing the processing liquid from the second reservoir into a chamber of the processing apparatus for processing at least one substrate of the at least one substrate.
7. The substrate processing method according to claim 1, wherein: further comprises
Determining whether to perform a test operation according to a third parameter related to the test operation after the switching element is switched to the second configuration;
instructing the processing apparatus and the supply apparatus to perform the test operation when it has been determined that the test operation is to be performed, and scheduling at least one other substrate to be processed in a chamber of the processing apparatus after the test operation is completed, wherein the test operation causes a test substrate to be processed in the chamber of the processing apparatus; and
scheduling another at least one substrate to be processed in a chamber of the processing apparatus when it has been determined that the test operation is not to be performed.
8. The substrate processing method according to claim 7, wherein:
when it has been decided that the test operation is to be performed, instructing the cleaning device to supply the cleaning liquid into the first tank for cleaning the first tank in parallel with the test operation after the switching element switches from the first configuration allowing the processing liquid to be supplied from a first tank of the supply device to the second configuration allowing the processing liquid to be supplied from a second tank of the supply device to the processing device.
9. A substrate processing apparatus; the method is characterized in that:
the substrate processing apparatus includes
A processing apparatus having a chamber and configured to receive a substrate therein;
a supply apparatus configured to supply a processing liquid into the processing apparatus for processing the substrate, the supply apparatus having a switching element and a plurality of reservoirs for storing the processing liquid, the switching element being operable to allow one of the reservoirs to supply the processing liquid to the processing apparatus;
a cleaning device configured to provide a cleaning fluid into the processing device for cleaning the processing device; and
a control device configured to perform the following operations:
instructing the switching element to switch from a first configuration to a second configuration when a first parameter related to the consumption of the processing fluid reaches a first condition, wherein the first configuration allows the processing fluid to be provided to the processing apparatus from a first one of the plurality of reservoirs and the second configuration allows the processing fluid to be provided to the processing apparatus from a second one of the plurality of reservoirs, and
instructing the cleaning device to provide the cleaning liquid into the processing device when a second parameter related to the operation of the switching element reaches a second condition.
10. The substrate processing apparatus according to claim 9, wherein: the first parameter is one of the following: a total amount of processing liquid provided to the processing apparatus from the first reservoir since the switching element was last switched to the first state, a total amount of time the first reservoir provided the processing liquid to the processing apparatus each time after the switching element was last switched to the first state, and any combination thereof;
the first condition is at least one predetermined threshold;
the second parameter is the switching times of the switching element; and is
The second condition is another predetermined threshold.
11. The substrate processing apparatus according to claim 9, wherein: the first parameter is time;
the first condition is a predetermined time point;
the second parameter is the switching times of the switching element; and is
The second condition is a predetermined threshold.
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