CN111322779B - Miniature refrigerating device - Google Patents
Miniature refrigerating device Download PDFInfo
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- CN111322779B CN111322779B CN202010294020.XA CN202010294020A CN111322779B CN 111322779 B CN111322779 B CN 111322779B CN 202010294020 A CN202010294020 A CN 202010294020A CN 111322779 B CN111322779 B CN 111322779B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
- F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
- F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B45/00—Arrangements for charging or discharging refrigerant
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Abstract
The invention relates to the technical field of precision manufacturing, in particular to a miniature refrigerating device which comprises a miniature moving coil type linear compressor, a micro-channel condenser, a micro-channel evaporator, a pore plate throttling device and a control system. The micro moving-coil linear compressor of the micro refrigerating device is a piston compression type system driven by a micro moving-coil linear motor, and comprises a shell and a piston compressor assembly, wherein a refrigerant completes the reciprocating circulation of air suction, compression and exhaust. The micro moving-coil linear compressor, the micro-channel condenser and the micro-channel evaporator are integrated in the system, the surface of the micro-channel evaporator is directly attached to the surface of the electronic element by utilizing the characteristic of heat absorption of refrigerant evaporation, the heat of the electronic element is taken away, and the micro-channel evaporator has the characteristics of high-efficiency integration, intelligent control, large heat dissipation density of a unit contact surface, small volume and convenience in installation, and is particularly suitable for the heat management of high-power electronic devices.
Description
Technical Field
The invention relates to the technical field of precision manufacturing, in particular to a miniature refrigerating device.
Background
At present, with the rapid development of electronic technology, the power density of power electronic components is continuously increased, and in the actual application process, the thermal failure rate of the power electronic components caused by temperature is rapidly increased, and thermal energy management is a challenge faced by power electronic devices, especially high-power electronic devices.
At present, the cooling methods of power electronic devices mainly include the following methods: air cooling (including natural convection cooling and forced convection), liquid cooling, heat pipes, and other semiconductor microchannels.
Air cooling is to transfer heat from the surface of a device or a heat sink to the surrounding environment by air flow and convection (natural or forced convection) to cool the device.
Air cooling is divided into direct air cooling and indirect air cooling according to different contact modes of cooling air and devices. Direct air cooling is a way of cooling air to directly take away heat from the surface of a device, and has small heat transfer resistance but low heat dissipation efficiency of the device. Indirect air cooling refers to a mode that a radiator is adopted to increase the heat dissipation area of a heating device, heat is firstly conducted to the radiator, and cooling air takes away the heat from the surface of the radiator. The indirect air cooling heat dissipation area is large, the heat efficiency is high, and the indirect air cooling becomes a main air cooling heat dissipation mode. With the improvement of the integration of power electronic devices, the thermal power density is continuously increased, and under the form of natural convection cooling of a radiator, a forced convection heat dissipation mode with multiple coexisting modes is developed, namely a forced convection cooling system combining a fan and the radiator is widely applied.
Liquid cooling is another way of cooling power electronics devices by using water or similar liquid as a cooling medium to remove heat from the device. Because the forced convection heat transfer coefficient of water is high and is more than one hundred times of the forced convection heat transfer coefficient of gas, the cooling mode adopting liquid cooling has higher efficiency and very wide application for high-power electronic devices. Liquid cooling is also divided into direct cooling and indirect cooling, and indirect cooling is dominant in practical application. Among indirect cooling systems, cold plate heat sinks are most widely used. The cold plate cooling system generally comprises a pump, a cold plate radiator, a circulating pipeline and an external radiator, the heat of the device is firstly transmitted to the cold plate in a heat conduction mode, then the heat is taken away by a cooling working medium in the cold plate, the cooling working medium returns to the cold plate after being radiated by the external radiator, and the circulation is repeated to achieve the cooling effect.
The semiconductor cooling is thermoelectric refrigeration or temperature difference refrigeration, has quick refrigeration and can be used in a superposition way; the power controllability is strong, and the refrigeration power can be adjusted by controlling the current; the reversibility is strong, and the interconversion of refrigeration and heating can be realized through the change of the current direction; the device has strong applicability, can normally work under overweight or weightlessness and any inclination angle, and is widely applied to the fields of aerospace, medical equipment, scientific research and the like.
However, the existing liquid cooling technology does not have a cold source, the heat dissipation capacity of a cold plate per unit area is insufficient, the refrigerating capacity of the existing semiconductor cooling unit per unit volume is low, and the energy consumption of the unit refrigerating capacity is high.
Disclosure of Invention
Based on the technical problems in the prior art, the invention provides a miniature refrigerating device which has the characteristics of high-efficiency integration, intelligent control, large heat dissipation density of a unit contact surface, small volume and convenience in installation, and solves the problems that the existing liquid cooling technology does not have a cold source, the heat dissipation capacity of a cold plate in unit area is insufficient, the refrigerating capacity of the existing semiconductor cooling in unit volume is low, and the energy consumption of unit cold energy is high.
The invention provides the following technical scheme: a micro refrigerating device comprises a micro moving-coil linear compressor, a micro-channel condenser, a micro-channel evaporator, an orifice plate throttling device and a control system;
the micro moving-coil linear compressor adopts a piston compression system driven by a micro moving-coil linear motor, and comprises a shell and a piston compressor assembly, wherein a refrigerant completes the reciprocating circulation of air suction, compression and exhaust in the micro moving-coil linear compressor, and an exhaust cavity of the micro moving-coil linear compressor is connected with a micro-channel condenser;
the micro-channel condenser comprises a first shunting cavity and a first micro-channel cooling fin, wherein the first shunting cavity and the first micro-channel cooling fin are formed on the upper outer surface of the shell in a machining mode;
the micro-channel evaporator comprises a second shunting cavity and a second micro-channel cooling fin which are formed on the lower surface of the shell in a machining mode, and the micro-channel evaporator is connected with a gas suction cavity of the micro moving-coil linear compressor;
the orifice plate throttling device is arranged in a connecting channel between the microchannel condenser and the microchannel evaporator, and a high-temperature high-pressure refrigerant of the microchannel condenser is converted into a low-temperature low-pressure refrigerant after being throttled by an orifice plate and enters the microchannel evaporator;
the control system comprises a liquid crystal display screen and a main control board which are assembled inside the left outer cavity and the right outer cavity of the shell of the miniature moving-coil linear compressor.
Preferably, the piston compressor assembly comprises a piston cylinder, a piston, a moving coil, a permanent magnet stator, an air suction and exhaust valve, a spring and a slide rod structure, the piston cylinder is communicated with the micro-channel condenser through an air exhaust channel and the air exhaust valve, the piston is integrally processed by a piston head, a connecting rod and a coil mounting ring, and the piston head is arranged in the piston cylinder and reciprocates under the action of the moving coil, the permanent magnet stator and the spring.
Preferably, the piston cylinder, the permanent magnet stator, the moving coil, the air suction and exhaust valve, the spring and the slide bar structure of the miniature moving-coil linear compressor are all arranged in a mechanical cavity in the middle of the shell, the permanent magnet stator is arranged in the shell, and the moving coil and the coil reciprocate in a gap between the permanent magnet stator and the outer wall of the piston cylinder.
Preferably, the slide bar structure includes slide bar and fixed plate two parts, the fixed plate passes through the bolt fastening on the casing front surface, the fixed plate passes through O shape circle with the front surface of casing and seals, the slide bar stretches into inside the casing, the spring mounting is on the slide bar, the one end of spring is fixed on the fixed plate of slide bar, and the piston afterbody is connected to the other end of spring.
Preferably, the first flow dividing cavity comprises a first flow dividing baffle, a first refrigerant inlet and a first refrigerant outlet, the first refrigerant inlet of the first flow dividing cavity is communicated with the exhaust channel of the piston cavity, the first refrigerant outlet of the first flow dividing cavity is communicated with the microchannel evaporator, the second flow dividing cavity comprises a second flow dividing baffle, a second refrigerant inlet and a second refrigerant outlet, and the second refrigerant inlet of the second flow dividing cavity is communicated with the outlet of the microchannel condenser; and a second refrigerant outlet of the second branch cavity is communicated with a suction channel of the piston cavity.
Preferably, the first microchannel cooling fin and the second microchannel cooling fin are connected with the shell into a whole through vacuum diffusion welding, and the orifice plate throttling device comprises two throttling orifice plates.
Preferably, the rear surface of the shell and the air suction channel of the piston cavity are connected with a refrigerant quick filling valve which is used for system vacuumizing, refrigerant filling and system checking, the rear surface of the shell is further provided with a liquid indicating mirror for observing the running state of the system, and the outer side of the shell is provided with a shielding power supply plug for connecting an external power supply.
Preferably, the cold surface of the microchannel evaporator is directly attached to the outer surface of the object to be cooled when in use, and the heat of the attachment surface is taken away through direct evaporation and heat absorption of a refrigerant.
Preferably, the main control board is used for controlling the start and stop of the refrigeration device, the rotation speed regulation of the micro moving coil linear compressor and the evaporation temperature of the microchannel evaporator, the reciprocating speed of the moving coil and the coil of the micro moving coil linear compressor is regulated by a 0-5V voltage signal sent by the main control board, the power specification is one of DC5V, DC12V, DC24V and DC48V, the main control board further comprises a control cover plate, the liquid crystal display screen is used for displaying the stop and running states of the refrigeration device, and the liquid crystal display screen further comprises a display cover plate.
Preferably, the first shunting cavity and the second shunting cavity are both directly formed on the surface of the shell in a machining mode, and the first micro-channel cooling fin and the second micro-channel cooling fin are formed by precision casting or an etching method in a machining mode.
The invention provides a miniature refrigerating device, which is used for carrying away heat of a high-power electronic device by refrigerating in a miniature moving coil type linear piston compression mode and directly attaching to the surface of the power electronic device by taking the outer surface of a microchannel evaporator as a radiating surface, adopts a miniature moving coil type linear compressor which is a self-cold source, greatly improves the radiating capacity of a unit area, has the advantages of low cold volume of 2/3 compared with the same refrigerating capacity of a semiconductor, and higher energy efficiency by more than 50 percent compared with the semiconductor refrigerating, and has the characteristics of high-efficiency integration, intelligent control, high radiating density of a unit contact surface, small volume and convenient installation by combining the microchannel evaporator and a microchannel condenser with high radiating density, thereby being particularly suitable for the thermal management of the high-power electronic device.
Drawings
FIG. 1 is an exploded view of a micro refrigeration unit according to the present invention;
FIG. 2 is a schematic view of a first microchannel heat sink configuration in accordance with the present invention;
FIG. 3 is a schematic structural view of a first shunting chamber of the present invention;
FIG. 4 is a schematic view of a second microchannel heat sink configuration in accordance with the present invention;
FIG. 5 is a schematic structural view of a second distribution chamber according to the present invention;
FIG. 6 is a schematic structural diagram of an orifice plate throttling device according to the present invention.
In the figure: 1. a micro moving-coil linear compressor; 2. a piston cylinder; 3. a suction/exhaust valve; 4. a piston; 5. a permanent magnet stator; 6. moving coils; 7. a slide bar structure; 8. a spring; 9. a coil; 10. an orifice plate throttling device; 11. a microchannel condenser; 12. a microchannel evaporator; 13. a main control board; 14. a refrigerant quick filling valve; 15. a liquid display mirror; 16, liquid crystal display screen; 17. a display cover plate; 18. a control cover plate; 19. a first microchannel heat sink; 20. a first diversion chamber; 21. a first refrigerant inlet; 22. a first refrigerant outlet; 23. a first splitter baffle; 24. a second microchannel heat sink; 25. a second diversion cavity; 26. a second refrigerant inlet; 26. a second refrigerant outlet; 27. a second splitter baffle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a micro refrigerating device comprises a micro moving-coil linear compressor 1, a micro-channel condenser 11, a micro-channel evaporator 12, an orifice plate throttling device 10 and a control system;
the micro moving-coil linear compressor 1 adopts a piston compression system driven by a micro moving-coil linear motor, and comprises a shell and a piston compressor assembly, wherein a refrigerant completes the reciprocating cycle of air suction, compression and exhaust in the micro moving-coil linear compressor 1, and an exhaust cavity of the micro moving-coil linear compressor 1 is connected with a micro-channel condenser 11; the piston type compressor assembly comprises a piston cylinder 2, a piston 4, a moving coil 6, a coil 9, a permanent magnet stator 5, an air suction and exhaust valve 3, a spring 8 and a slide bar structure 7, wherein the piston cylinder 2 is communicated with a micro-channel condenser 11 through an air exhaust channel and an air exhaust valve, the piston 4 is integrally processed by a piston head, a connecting rod and a coil mounting ring, and the piston head is arranged inside the piston cylinder 2 and reciprocates under the action of the moving coil 6, the coil 9, the permanent magnet stator 5 and the spring 8.
The piston 4 does reciprocating motion, the working volume formed by the piston cylinder 2, the piston 4 and the top surface of the piston cylinder 2 can be changed periodically, the piston 4 reciprocates once, and the processes of air inlet, compression and air exhaust are successively realized in the piston cylinder 2, namely a working cycle is completed.
As shown in fig. 2-3, the microchannel condenser 11 comprises a first shunting cavity 20 and a first microchannel cooling fin 19 which are formed on the upper outer surface of the shell, and the microchannel condenser 11 is connected with the microchannel evaporator 12 through the orifice plate throttling device 10; the first flow dividing cavity 20 comprises a first flow dividing baffle 23, a first refrigerant inlet 21 and a first refrigerant outlet 22, the first refrigerant inlet 21 of the first flow dividing cavity 20 is communicated with the exhaust channel of the piston cavity, the first refrigerant outlet 22 of the first flow dividing cavity 20 is communicated with the microchannel evaporator 12,
the first shunting cavity 20 of the micro-channel condenser 11 is directly formed on the upper surface of the shell in a precision machining mode; the first microchannel cooling fin 19 is formed by precision casting or etching, and the formed first microchannel cooling fin 19 is connected with the shell to form a whole through vacuum diffusion welding; the first microchannel heat sink 19 is machined from a material having high thermal conductivity and processability; the structural difference of the first shunting cavity 20 of the microchannel and the area of the first microchannel cooling fin 19 determine different heat exchange amounts;
as shown in fig. 4-5, the microchannel evaporator 12 comprises a second shunting cavity 25 and a second microchannel cooling fin 24 which are formed on the lower surface of the shell, and the microchannel evaporator 12 is connected with the air suction cavity of the micro moving coil linear compressor 1; the second flow dividing cavity 25 comprises a second flow dividing baffle 28, a second refrigerant inlet 26 and a second refrigerant outlet 27, and the second refrigerant inlet 26 of the second flow dividing cavity 25 is communicated with the outlet of the microchannel condenser 11; the second refrigerant outlet 27 of the second branch chamber 25 is communicated with the suction passage of the piston chamber.
The second branch cavity 25 of the micro-channel evaporator 12 is directly formed on the upper surface of the shell in a precision machining mode; the second microchannel cooling fins 24 are formed by precision casting or etching, and the formed second microchannel cooling fins 24 are connected with the shell to form a whole through vacuum diffusion welding; the second microchannel heat sink 24 is machined from a material having high thermal conductivity and machinability; the structural difference of the second shunting cavity 25 of the microchannel and the area of the second microchannel cooling fin 24 determine different heat exchange amounts;
when in use, the cold surface of the micro-channel evaporator 12 is directly attached to the outer surface of a radiated object, and the heat of the attachment surface is taken away through direct evaporation and heat absorption of a refrigerant.
The orifice plate throttling device 10 is installed in a connecting channel between the microchannel condenser 11 and the microchannel evaporator 12, and a high-temperature high-pressure refrigerant of the microchannel condenser 11 is converted into a low-temperature low-pressure refrigerant after being throttled by an orifice plate and enters the microchannel evaporator 12; the orifice plate throttling device 10 includes two orifice plates, one of which is shown in the attached FIG. 6.
The control system comprises a liquid crystal display screen 16 and a main control board 13 which are assembled inside the left outer cavity and the right outer cavity of the shell of the micro moving coil type linear compressor 1. The main control board 13 is used for controlling the start and stop of the refrigerating device, the rotation speed regulation of the micro moving coil type linear compressor 1 and the evaporation temperature of the micro channel evaporator 12, the reciprocating speed of the moving coil 6 and the coil 9 of the micro moving coil type linear compressor 1 is regulated by a 0-5V voltage signal sent by the main control board 13, and the power specification is one of DC5V, DC12V, DC24V and DC 48V.
The liquid crystal display 16 is used for displaying the stop and running state of the refrigerating device, the liquid crystal display 16 further comprises a display cover plate 17, and the main control board 13 further comprises a control cover plate 18.
The casing rear surface just is connected with refrigerant fast filling valve 14 with the inspiratory channel department in piston cavity, and refrigerant fast filling valve 14 uses when filling and system inspection as system evacuation, refrigerant, still is equipped with on the casing rear surface to show liquid mirror 15 for observation system running state, and the casing outside is equipped with the shielding power plug that is used for connecting external power source.
In the invention, the micro moving coil type linear piston compression refrigeration is adopted, the second micro-channel radiating fins 24 on the outer surface of the micro-channel evaporator 12 are taken as radiating surfaces to be directly attached to the surface of a power electronic device to take away the heat of the high-power electronic device, the self-contained cold source, namely the micro moving coil type linear compressor 1, is adopted, the refrigerant completes the reciprocating circulation of air suction, compression and exhaust in the micro moving coil type linear compressor, the refrigerant processed by the micro moving coil type linear compressor 1 enters the micro-channel condenser 11, the micro-channel condenser 11 rapidly radiates the heat to the air through the first micro-channel radiating fins 19, the high-temperature high-pressure refrigerant of the micro-channel condenser 11 is converted into the low-temperature low-pressure refrigerant to enter the micro-channel evaporator 12 after being subjected to orifice plate throttling by the orifice plate throttling device 10, and thus the circulating radiation is realized.
The technical scheme greatly improves the heat dissipation capacity of unit area, reduces the volume of cold energy compared with the same refrigeration capacity of semiconductor refrigeration by 2/3, improves the energy efficiency by more than 50 percent compared with the refrigeration efficiency of semiconductor, and has the characteristics of high-efficiency integration, intelligent control, large heat dissipation density of unit contact surface, small volume and convenient installation by combining the micro-channel evaporator 12 with high heat dissipation density and the micro-channel condenser 11, thereby being particularly suitable for the heat management of high-power electronic devices.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A miniature refrigeration apparatus, characterized by: the micro-channel evaporator comprises a micro moving-coil linear compressor (1), a micro-channel condenser (11), a micro-channel evaporator (12), a pore plate throttling device (10) and a control system;
the micro moving coil type linear compressor (1) adopts a piston compression type system driven by a micro moving coil type linear motor, and comprises a shell and a piston type compressor assembly, wherein a refrigerant completes the reciprocating circulation of air suction, compression and exhaust in the micro moving coil type linear compressor (1), and an exhaust cavity of the micro moving coil type linear compressor (1) is connected with a micro-channel condenser (11);
the micro-channel condenser (11) comprises a first shunting cavity (20) and a first micro-channel cooling fin (19), wherein the first shunting cavity is formed on the upper outer surface of the shell in a machining mode, and the micro-channel condenser (11) is connected with the micro-channel evaporator (12) through a pore plate throttling device (10);
the micro-channel evaporator (12) comprises a second flow dividing cavity (25) and a second micro-channel cooling fin (24), wherein the second flow dividing cavity is formed in the lower surface of the shell in a machining mode, and the micro-channel evaporator (12) is connected with a gas suction cavity of the micro moving coil type linear compressor (1);
the orifice plate throttling device (10) is arranged in a connecting channel between the micro-channel condenser (11) and the micro-channel evaporator (12), and a high-temperature high-pressure refrigerant of the micro-channel condenser (11) is converted into a low-temperature low-pressure refrigerant after being throttled by an orifice plate and enters the micro-channel evaporator (12);
the control system comprises a liquid crystal display screen (16) and a main control board (13) which are assembled in the left outer cavity and the right outer cavity of the shell of the miniature moving-coil linear compressor (1);
the piston type compressor assembly comprises a piston cylinder (2), a piston (4), a moving coil (6), a coil (9), a permanent magnet stator (5), a suction and exhaust valve (3), a spring (8) and a slide bar structure (7), wherein the piston cylinder (2) is communicated with a micro-channel condenser (11) through an exhaust channel and an exhaust valve, the piston (4) is integrally processed by a piston head, a connecting rod and a coil mounting ring, and the piston head is arranged in the piston cylinder (2) and reciprocates under the action of the moving coil (6), the coil (9), the permanent magnet stator (5) and the spring (8);
the piston cylinder (2), the permanent magnet stator (5), the moving coil (6), the coil (9), the suction and exhaust valve (3), the spring (8) and the slide bar structure (7) of the miniature moving coil type linear compressor (1) are all arranged in a mechanical cavity in the middle of the shell, the permanent magnet stator (5) is arranged in the shell, and the moving coil (6) and the coil (9) reciprocate in a gap between the permanent magnet stator (5) and the outer wall of the piston cylinder (2);
the first flow dividing cavity (20) comprises a first flow dividing baffle plate (23), a first refrigerant inlet (21) and a first refrigerant outlet (22), the first refrigerant inlet (21) of the first flow dividing cavity (20) is communicated with an exhaust channel of the piston cavity, the first refrigerant outlet (22) of the first flow dividing cavity (20) is communicated with the microchannel evaporator (12), the second flow dividing cavity (25) comprises a second flow dividing baffle plate (28), a second refrigerant inlet (26) and a second refrigerant outlet (27), and the second refrigerant inlet (26) of the second flow dividing cavity (25) is communicated with an outlet of the microchannel condenser (11); and a second refrigerant outlet (27) of the second branch cavity (25) is communicated with a suction channel of the piston cavity.
2. A micro refrigeration unit according to claim 1, wherein: slide bar structure (7) include slide bar and fixed plate two parts, the fixed plate passes through the bolt fastening on the casing front surface, the fixed plate passes through O shape circle with the front surface of casing and seals, inside the slide bar stretched into the casing, spring (8) are installed on the slide bar, the one end of spring (8) is fixed on the fixed plate of slide bar, and piston (4) afterbody is connected to the other end of spring (8).
3. A micro refrigeration unit according to claim 1, wherein: the first microchannel cooling fin (19) and the second microchannel cooling fin (24) are connected with the shell into a whole through vacuum diffusion welding, and the orifice plate throttling device (10) comprises two throttling orifice plates.
4. A micro refrigeration unit according to claim 1, wherein: the quick refrigerant filling device is characterized in that a refrigerant quick filling valve (14) is connected to the rear surface of the shell and a suction channel of the piston cavity, the refrigerant quick filling valve (14) is used for vacuumizing the system, filling the refrigerant and checking the system, a liquid indicating mirror (15) used for observing the running state of the system is further arranged on the rear surface of the shell, and a shielding power supply plug used for connecting an external power supply is arranged on the outer side of the shell.
5. A micro refrigeration unit according to claim 1, wherein: the cold surface of the micro-channel evaporator (12) is directly attached to the outer surface of a radiated object when in use, and the heat of the attachment surface is taken away through direct evaporation and heat absorption of a refrigerant.
6. A micro refrigeration unit according to claim 1, wherein: the main control board (13) is used for controlling starting and stopping of a refrigerating device, rotating speed adjustment of the micro moving coil type linear compressor (1) and evaporation temperature of the micro-channel evaporator (12), reciprocating speed of the moving coil (6) and the coil (9) of the micro moving coil type linear compressor (1) is adjusted by a 0-5V voltage signal sent by the main control board (13), the power specification is one of DC5V, DC12V, DC24V and DC48V, the main control board (13) further comprises a control cover plate (18), the liquid crystal display screen (16) is used for displaying stopping and running states of the refrigerating device, and the liquid crystal display screen (16) further comprises a display cover plate (17).
7. A micro refrigeration unit according to claim 3, wherein: the first shunting cavity (20) and the second shunting cavity (25) are both directly formed on the surface of the shell in a machining mode, and the first micro-channel radiating fin (19) and the second micro-channel radiating fin (24) are formed in a machining mode through precision casting or an etching method.
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| CN202010294020.XA CN111322779B (en) | 2020-04-15 | 2020-04-15 | Miniature refrigerating device |
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| CN202010294020.XA CN111322779B (en) | 2020-04-15 | 2020-04-15 | Miniature refrigerating device |
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| CN111322779B true CN111322779B (en) | 2022-01-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100483079B1 (en) * | 2002-10-23 | 2005-04-14 | 재단법인서울대학교산학협력재단 | Active Micro Cooler |
| US7259965B2 (en) * | 2005-04-07 | 2007-08-21 | Intel Corporation | Integrated circuit coolant microchannel assembly with targeted channel configuration |
| BRPI0505060B1 (en) * | 2005-11-09 | 2020-11-10 | Embraco Indústria De Compressores E Soluções Em Refrigeração Ltda | linear compressor control system, linear compressor and linear compressor control method |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN105298792B (en) * | 2015-11-06 | 2017-11-28 | 南京理工大学 | Electric linear compressor |
| CN206238522U (en) * | 2016-10-14 | 2017-06-13 | 上海朗旦制冷技术有限公司 | For the refrigeration system of air-ventilating garments |
| CN209131234U (en) * | 2018-11-14 | 2019-07-19 | 武汉麦丘科技有限公司 | Miniature cooling-water machine |
| CN209925168U (en) * | 2019-05-09 | 2020-01-10 | 辽宁工程技术大学 | Moving-coil linear compressor |
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