CN111312920A - Display device and manufacturing method thereof - Google Patents
Display device and manufacturing method thereof Download PDFInfo
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- CN111312920A CN111312920A CN202010095682.4A CN202010095682A CN111312920A CN 111312920 A CN111312920 A CN 111312920A CN 202010095682 A CN202010095682 A CN 202010095682A CN 111312920 A CN111312920 A CN 111312920A
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- layer
- water
- display device
- heat
- cover plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 238000004806 packaging method and process Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000010521 absorption reaction Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 230000002209 hydrophobic effect Effects 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 150000004812 organic fluorine compounds Chemical class 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 229920006335 epoxy glue Polymers 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 71
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present disclosure relates to display technologies, and particularly to a display device and a manufacturing method thereof. The display device includes: the waterproof layer is formed on the substrate, a water absorption layer is formed on one side of the waterproof layer, which is far away from the substrate, and a metal packaging cover plate is formed on one side of the water absorption layer, which is far away from the waterproof layer; the water-absorbing layer is provided with a plurality of through holes, each through hole is internally provided with a heat-conducting part, and the heat-conducting parts are used for transferring the heat of the water-blocking layer to the metal packaging cover plate. The application provides a display device has improved the radiating efficiency on layer that absorbs water, reduces the too high condition of base plate local temperature and produces to improve display device's life.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display device and a manufacturing method thereof.
Background
The OLED (Organic Light-Emitting Diode) display device has the advantages of high contrast, high brightness, fast response, wide viewing angle, wide operating temperature, flexibility, and the like, and is a new generation display device with a promising future.
However, organic materials in the OLED display device in the prior art are sensitive to water and oxygen, and a small amount of organic materials may cause light emission failure, and heat in the working process may also affect the lifetime of the OLED display device.
Therefore, how to increase the heat dissipation speed of the display panel is an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
The application provides a display device has improved the radiating efficiency on layer that absorbs water, reduces the too high condition of base plate local temperature and produces to improve display device's life.
In order to achieve the above object, the present application provides a display device including:
the waterproof layer is formed on the substrate, a water absorption layer is formed on one side of the waterproof layer, which is far away from the substrate, and a metal packaging cover plate is formed on one side of the water absorption layer, which is far away from the waterproof layer;
the water-absorbing layer is provided with a plurality of through holes, each through hole is internally provided with a heat-conducting part, and the heat-conducting parts are used for transferring the heat of the water-blocking layer to the metal packaging cover plate.
Display device in this application, one side that deviates from the base plate at the water blocking layer is formed with the layer that absorbs water, and a plurality of through-holes have been established on the layer that absorbs water, be equipped with the heat-conducting part in every through-hole, when the device on the base plate produced heat, the heat transmitted the layer that absorbs water through the water blocking layer, at this moment, the heat that is located the heat-conducting part in the through-hole can be quick transmits to the metal package apron on, so that the heat is through the metal package apron effluvium, thereby the radiating efficiency of device has been improved, the life of device has been guaranteed.
In addition, because the heat conducting parts are arranged in the through holes formed in the water absorbing layer, the thickness of the water absorbing layer is not increased, the space between the metal packaging assembly and the substrate is ensured, and the heat dissipation performance of the whole device is improved.
Preferably, the heat conducting part is fixedly connected with the metal packaging cover plate.
Preferably, an inner diameter of the through hole corresponding to the TFT on the substrate is larger than an inner diameter of the through hole corresponding to a portion outside the TFT on the substrate.
Preferably, the projected pattern of the heat conducting part on the metal packaging cover plate is a semi-closed frame or a semi-circle with a peano curve distribution, a checkerboard distribution.
Preferably, the water-blocking layer comprises hydrophobic functional silicone, an organofluorine material and hydrophobic epoxy rubber.
Preferably, the material of the heat conducting part is a functionalized graphene-doped epoxy resin adhesive.
Preferably, the water-absorbing layer includes a polymer doped with calcium oxide, magnesium oxide, and an epoxy resin.
Another object of the present invention is to provide a method for manufacturing a display device, including the steps of:
manufacturing a heat conduction part and a water absorption layer on the metal packaging cover plate, wherein a plurality of through holes are formed in the water absorption layer, and the heat conduction part is arranged in the through holes;
and manufacturing a water resisting layer on one side of the water absorbing layer, which is far away from the metal packaging cover plate.
According to the manufacturing method of the display device, the heat conducting portion and the water absorbing layer are directly manufactured on the metal packaging cover plate, and the heat conducting portion and the water absorbing layer are arranged on the same layer, so that the heat dissipation function is additionally arranged under the condition that the water absorbing layer is relatively thin, the distance between the TFT and the metal packaging cover plate on the substrate is reduced, the water and oxygen entering sectional area is reduced, and meanwhile heat generated by an electroluminescent device can be quickly and uniformly released. The packaging structure is simple, and meanwhile, the functional layer is directly manufactured on the metal film, so that the process flow is reduced, and the cost is reduced.
Preferably, the step of forming the heat conducting portion and the water absorbing layer on the metal package cover plate includes:
manufacturing a heat conducting part on the metal packaging cover plate in a printing mode;
and manufacturing a water absorption layer outside the heat conduction part in a coating mode, wherein the water absorption layer and the heat conduction part are the same in layer and thickness.
Preferably, the step of forming the heat conducting portion and the water absorbing layer on the metal package cover plate includes:
manufacturing a water absorption layer on the metal packaging cover plate in a coating mode;
a plurality of through holes are formed in the water absorption layer;
a heat conduction portion is formed in each through hole.
Drawings
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present application;
fig. 2 is a schematic partial structure diagram of a display device according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of FIG. 2;
FIG. 4 is a projection of a thermal conductor on a metal package cover in a display device according to an embodiment of the present disclosure;
FIG. 5 is a perspective view of a heat conducting portion of a metal cover of a display device according to an embodiment of the present disclosure;
fig. 6 is a flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure.
Icon: 1-a substrate; 11-an electroluminescent device; 2-a water-resistant layer; 3-a water-absorbing layer; 4-a heat conducting portion; and 5-metal packaging cover plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to fig. 3, an embodiment of the present application provides a display device, including:
the waterproof packaging structure comprises a substrate 1 and a waterproof layer 2 formed on the substrate 1, wherein a water absorption layer 3 is formed on one side, away from the substrate 1, of the waterproof layer 2, and a metal packaging cover plate 5 is formed on one side, away from the waterproof layer 2, of the water absorption layer 3;
the water absorbing layer 3 is provided with a plurality of through holes, each through hole is internally provided with a heat conducting part 4, and the heat conducting parts 4 are used for transferring the heat of the water resisting layer 2 to the metal packaging cover plate 5.
Display device in this application, one side that deviates from base plate 1 at water blocking layer 2 is formed with the layer 3 that absorbs water, and a plurality of through-holes have been established on layer 3 that absorbs water, be equipped with heat-conducting part 4 in every through-hole, when device on base plate 1 produced heat, the heat passed through water blocking layer 2 and transmitted layer 3 that absorbs water, at this moment, the heat transfer that heat-conducting part 4 that is located in the through-hole can be quick arrives on metal package apron 5, so that the heat looses through metal package apron 5, thereby the radiating efficiency of device has been improved, the life of device has been guaranteed.
In addition, because the heat conducting part 4 is arranged in the through hole arranged on the water absorbing layer 3, the thickness of the water absorbing layer 3 is not increased, the distance between the metal packaging assembly and the substrate 1 is ensured, and the heat dissipation performance of the whole device is improved.
Note that, an electroluminescent device 11 is provided above the substrate 1, and the water blocking layer 2 covers the electroluminescent device 11.
As an alternative, the heat conducting portion 4 is fixedly connected to the metal sealing cover 5. In this way, the connection between the heat conducting portion 4 and the metal packaging cover plate 5 is more stable, so as to improve the stability of the whole device, and the contact connection between the metal packaging cover plate 5 and the heat conducting portion 4 can also increase the speed of the heat conducting portion 4 transferring heat to the metal packaging cover plate 5.
In a specific use process, a high thermal conductive material coating film may be disposed at an end of the metal package cover plate 5 contacting the thermal conductive portion 4, so as to further improve the heat dissipation efficiency of the device. Wherein, the material of the high heat-conducting material coating film can be selected from copper or aluminum and the like.
Alternatively, the inner diameter of the through-hole corresponding to the TFT on the substrate 1 is larger than the inner diameter of the through-hole corresponding to the portion of the substrate 1 other than the TFT. Because the part of the substrate 1 provided with the TFTs has larger heat productivity, the size of the inner diameter of the through hole corresponding to the TFT on the substrate 1 is increased, the volume of the heat conducting part 4 arranged at the part is increased, and the efficiency and the speed of the part on the metal transferring packaging cover plate 5 are improved, so that the heat dissipation speed of each part on the substrate 1 is relatively uniform, and the situation that the local temperature of the substrate 1 is overhigh is prevented.
As an alternative, with continued reference to fig. 4-5, the projected pattern of the heat conducting portion 4 on the metal package cover plate 5 is a semi-closed frame or a semi-circle with a peano curve distribution, a checkerboard distribution.
As an alternative, the water-blocking layer 2 includes a hydrophobic functional silicone, an organofluorine material, and a hydrophobic epoxy rubber. The water-blocking layer 2 can ensure the water-blocking performance by adopting the materials, and the heat-conducting performance can be improved, thereby being beneficial to leading out the heat generated on the substrate 1.
It should be noted that, the water-blocking layer 2 made of the above material can prevent the invasion of external water vapor, reduce the risk of crushing the electroluminescent device 11 during the packaging process, and buffer the pressure of the water-absorbing layer 3 after water absorption and expansion, thereby improving the safety of the whole device during use.
As an alternative, the material of the heat conducting portion 4 is a functionalized graphene-doped epoxy resin adhesive. The heat conducting part 4 is made of silver nanowires and graphene nanometer hybrid materials, and the composite material has high heat conductivity and high processing stability, so that the agglomeration phenomenon of graphene in epoxy resin is avoided. In addition, the graphene has outstanding thermal conductivity (5000W/m.K), so that the heat conducting part 4 can conduct heat quickly.
As an alternative, the water-absorbing layer 3 includes a polymer doped with calcium oxide, magnesium oxide, and an epoxy resin. This arrangement can ensure the water-absorbing performance of the water-absorbing layer 3 and also can control the manufacturing cost.
With reference to fig. 6, another objective of the present application is to provide a manufacturing method of a display device, which has the display device as described above, and includes the following steps:
s101: manufacturing a heat conduction part 4 and a water absorption layer 3 on the metal packaging cover plate 5, wherein a plurality of through holes are formed in the water absorption layer 3, and the heat conduction part 4 is arranged in the through holes;
s102: and a water-resistant layer 2 is manufactured on one side of the water-absorbing layer 3, which is far away from the metal packaging cover plate 5.
According to the manufacturing method of the display device, the heat conducting part 4 and the water absorbing layer 3 are directly manufactured on the metal packaging cover plate 5, and the heat conducting part 4 and the water absorbing layer 3 are arranged on the same layer, so that the heat dissipation function is additionally arranged under the condition that the water absorbing layer 3 is relatively thin, the distance between the TFT on the substrate 1 and the metal packaging cover plate 5 is reduced, the water oxygen entering sectional area is reduced, and meanwhile, heat generated by the electroluminescent device 11 can be quickly and uniformly released. The packaging structure is simple, and meanwhile, the functional layer is directly manufactured on the metal film, so that the process flow is reduced, and the cost is reduced.
The specific manufacturing method of the heat conducting part 4 and the water absorbing layer 3 comprises the following specific manufacturing methods:
the first method is as follows:
the steps of manufacturing the heat conducting part 4 and the water absorbing layer 3 on the metal packaging cover plate 5 comprise:
manufacturing a heat conduction part 4 on the metal packaging cover plate 5 by a printing mode;
and manufacturing a water absorbing layer 3 outside the heat conducting part 4 in a coating mode, wherein the water absorbing layer 3 and the heat conducting part 4 are the same in layer and thickness.
The second method comprises the following steps:
the steps of manufacturing the heat conducting part 4 and the water absorbing layer 3 on the metal packaging cover plate 5 comprise:
manufacturing a water absorption layer 3 on the metal packaging cover plate 5 in a coating mode;
a plurality of through holes are formed in the water absorption layer 3;
a heat conduction portion 4 is formed in each through hole.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display device, comprising:
the waterproof layer is formed on the substrate, a water absorption layer is formed on one side of the waterproof layer, which is far away from the substrate, and a metal packaging cover plate is formed on one side of the water absorption layer, which is far away from the waterproof layer;
the water-absorbing layer is provided with a plurality of through holes, each through hole is internally provided with a heat-conducting part, and the heat-conducting parts are used for transferring the heat of the water-blocking layer to the metal packaging cover plate.
2. The display device of claim 1, wherein the thermal conductor is fixedly connected to the metal encapsulation cover.
3. The display device according to claim 1, wherein an inner diameter of the through-hole corresponding to the TFT on the substrate is larger than an inner diameter of the through-hole corresponding to a portion other than the TFT on the substrate.
4. The display device according to claim 1, wherein a projected pattern of the heat conducting portion on the metal sealing cover plate is a semi-closed frame or a semi-circle having a peano curve distribution, a checkerboard distribution.
5. The display device of claim 1, wherein the water resistant layer comprises a hydrophobic functional silicone, an organofluorine material, and a hydrophobic epoxy rubber.
6. The display device according to claim 1, wherein the material of the thermal conductive portion is a functionalized graphene-doped epoxy glue.
7. The display device of claim 1, wherein the water-absorbing layer comprises a polymer doped with calcium oxide, magnesium oxide, and an epoxy resin.
8. A method of manufacturing a display device having a display device according to any one of claims 1 to 7, comprising the steps of:
manufacturing a heat conduction part and a water absorption layer on the metal packaging cover plate, wherein a plurality of through holes are formed in the water absorption layer, and the heat conduction part is arranged in the through holes;
and manufacturing a water resisting layer on one side of the water absorbing layer, which is far away from the metal packaging cover plate.
9. The method of claim 8, wherein the step of forming a heat conducting portion and a water absorbing layer on the metal cover comprises:
manufacturing a heat conducting part on the metal packaging cover plate in a printing mode;
and manufacturing a water absorption layer outside the heat conduction part in a coating mode, wherein the water absorption layer and the heat conduction part are the same in layer and thickness.
10. The method of claim 8, wherein the step of forming a heat conducting portion and a water absorbing layer on the metal cover comprises:
manufacturing a water absorption layer on the metal packaging cover plate in a coating mode;
a plurality of through holes are formed in the water absorption layer;
a heat conduction portion is formed in each through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095682.4A CN111312920A (en) | 2020-02-17 | 2020-02-17 | Display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095682.4A CN111312920A (en) | 2020-02-17 | 2020-02-17 | Display device and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111312920A true CN111312920A (en) | 2020-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010095682.4A Pending CN111312920A (en) | 2020-02-17 | 2020-02-17 | Display device and manufacturing method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037337A (en) * | 2014-06-09 | 2014-09-10 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel, packaging method thereof and display device |
| TWI583037B (en) * | 2016-03-01 | 2017-05-11 | 南臺科技大學 | Oled plane with function of heat dissipation and method for manufacture of the same |
| CN106816548A (en) * | 2015-11-27 | 2017-06-09 | 乐金显示有限公司 | Organic Light-Emitting Display Device |
| CN107154465A (en) * | 2017-05-26 | 2017-09-12 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
| CN107221607A (en) * | 2017-05-25 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of display device and preparation method thereof, display device |
| CN109585670A (en) * | 2017-09-29 | 2019-04-05 | 乐金显示有限公司 | The organic light-emitting display device of package substrate with high heat conductance |
-
2020
- 2020-02-17 CN CN202010095682.4A patent/CN111312920A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037337A (en) * | 2014-06-09 | 2014-09-10 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel, packaging method thereof and display device |
| CN106816548A (en) * | 2015-11-27 | 2017-06-09 | 乐金显示有限公司 | Organic Light-Emitting Display Device |
| TWI583037B (en) * | 2016-03-01 | 2017-05-11 | 南臺科技大學 | Oled plane with function of heat dissipation and method for manufacture of the same |
| CN107221607A (en) * | 2017-05-25 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of display device and preparation method thereof, display device |
| CN107154465A (en) * | 2017-05-26 | 2017-09-12 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
| CN109585670A (en) * | 2017-09-29 | 2019-04-05 | 乐金显示有限公司 | The organic light-emitting display device of package substrate with high heat conductance |
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Application publication date: 20200619 |