CN110459678B - Flexible organic light emitting display panel and preparation method thereof - Google Patents
Flexible organic light emitting display panel and preparation method thereof Download PDFInfo
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- CN110459678B CN110459678B CN201910749764.3A CN201910749764A CN110459678B CN 110459678 B CN110459678 B CN 110459678B CN 201910749764 A CN201910749764 A CN 201910749764A CN 110459678 B CN110459678 B CN 110459678B
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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Abstract
The embodiment of the invention relates to a flexible organic light-emitting display panel and a preparation method of the flexible organic light-emitting display panel, wherein the preparation method comprises the following steps: providing an organic light emitting display panel; wherein the organic light emitting display panel includes an organic light emitting device, and further includes: the packaging structure comprises a rigid substrate, a flexible substrate, a packaging layer and a heat conduction protective film, wherein the flexible substrate is positioned on the rigid substrate and bears the organic light-emitting device; the packaging layer is used for packaging the organic light-emitting device on the flexible substrate, and the heat conduction protective film is arranged on the packaging layer; and separating the flexible substrate and the rigid substrate in the organic light-emitting display panel by adopting a laser separation method to obtain the flexible organic light-emitting display panel.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a flexible organic light-emitting display panel and a preparation method of the flexible organic light-emitting display panel.
Background
Organic Light-Emitting diodes (OLEDs) are widely used in the display and lighting fields. The flexible organic light-emitting display panel can enable the display screen to be rolled freely due to the flexible substrate, and can meet the requirements of various products in the market.
In order to provide flexibility to an organic light emitting display panel, it is necessary to separate a flexible substrate from a rigid substrate in the organic light emitting display panel. A common separation method is Laser Lift-off (LLO), but after the organic light emitting display panel is irradiated by Laser, severe thermal stress is generated, and each film structure is deformed by heating, even film separation or film breakage occurs.
Disclosure of Invention
Accordingly, the present invention is directed to an organic light emitting display panel and a method for manufacturing a flexible organic light emitting display panel.
The invention provides a preparation method of a flexible organic light-emitting display panel, which comprises the following steps:
providing an organic light emitting display panel; wherein the organic light emitting display panel includes an organic light emitting device, and further includes: the packaging structure comprises a rigid substrate, a flexible substrate, a packaging layer and a heat conduction protective film, wherein the flexible substrate is positioned on the rigid substrate and bears the organic light-emitting device; the packaging layer is used for packaging the organic light-emitting device on the flexible substrate, and the heat-conducting protective film is arranged on the packaging layer;
and separating the flexible substrate and the rigid substrate in the organic light-emitting display panel by adopting a laser separation method to obtain the flexible organic light-emitting display panel.
According to the preparation method of the flexible organic light-emitting display panel, the heat-conducting protective film is arranged on the packaging layer of the organic light-emitting display panel and can be used for dissipating heat, in the process of separating the rigid substrate from the flexible substrate by adopting a laser separation method to obtain the flexible organic light-emitting display panel, the organic light-emitting display panel can generate serious thermal stress after being irradiated by light, and the heat-conducting protective film can dissipate heat of the organic light-emitting display panel and reduce the thermal stress on the organic light-emitting display panel in the separation process.
The present invention also provides a flexible organic light emitting display panel including an organic light emitting device, the organic light emitting display panel further including:
a flexible substrate for carrying the organic light emitting device;
the packaging layer is used for packaging the organic light-emitting device on the flexible substrate; and
and the heat conduction protective film is arranged on the packaging layer.
Drawings
Fig. 1 is a schematic structural diagram of a heat conductive protective film according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of an organic light emitting display panel according to an embodiment of the invention;
FIG. 3 is a flow chart illustrating a method for fabricating an organic light emitting display panel according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a laser-incident OLED panel according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a peeling process of a rigid substrate and a flexible substrate according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a flexible organic light emitting display panel obtained in an embodiment of the present invention;
fig. 7 is a schematic flow chart of a method for manufacturing a flexible organic light emitting display panel according to a second embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating a peeling process of the heat conductive protective film according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of a flexible organic light emitting display panel with a heat conductive protective film peeled off according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment of the invention provides an organic light emitting display panel; the organic light emitting display panel may be specifically an organic light emitting display screen. The organic light emitting display panel of the embodiment of the invention comprises an organic light emitting device, and further comprises: the packaging structure comprises a rigid substrate, a flexible substrate, a packaging layer and a heat conduction protective film, wherein the flexible substrate is positioned on the rigid substrate and bears the organic light-emitting device; and the heat conduction protective film is arranged on the packaging layer and used for dissipating heat.
As the heat conductive protective film, a protective film having a heat conductive property itself such as a high heat conductivity may be used. Thermal conductivity, also known as "coefficient of thermal conductivity," is a measure of the ability of a substance to conduct heat, and is designated λ or K. The protective film having high thermal conductivity may have a thermal conductivity of 30W/(K × m) or more. The heat conductive protective film may be a protective film in which particles having high thermal conductivity are added, and the particles having high thermal conductivity may be heat conductive particles having a thermal conductivity of 30W/(K × m) or more. The heat conducting particles have the characteristics of small particle size, good transparency and high heat conductivity. Specifically, the thermally conductive particles include at least one of carbon nanotubes, graphene, and carbon quantum dots. Specifically, the carbon quantum dots are a novel carbon-based zero-dimensional material, and have the advantages of excellent optical properties, good water solubility, low toxicity, environmental friendliness, wide raw material source, low cost, good biocompatibility and the like.
Further, the heat-conducting protective film can be transparent, and the organic light-emitting display panel is beneficial to checking the device structure when the wafer test is carried out. Two embodiments of transparent thermally conductive protective films are described below.
In one embodiment, the heat-conducting protective film is made of a transparent and heat-conducting material.
In another embodiment, the thermally conductive protective film includes a transparent material and thermally conductive particles mixed in the transparent material. Specifically, the heat conducting particles are uniformly distributed in the transparent material, so that the heat conducting protective film can uniformly dissipate heat. Fig. 1 is a schematic structural diagram of a heat-conducting protective film in an embodiment, and in fig. 1, the heat-conducting protective film includes a transparent material and heat-conducting particles mixed in the transparent material, and the transparent material may be a transparent colloid.
In one embodiment, the thickness of the heat conductive protective film may be set between 20um and 200 um. The heat conduction protection film within the thickness range has the effects of heat conduction and mechanical damage prevention on the organic light-emitting display panel, and the organic light-emitting display panel cannot be too thick.
In one embodiment, the heat conductive protective film is a protective film that is peelable from the encapsulation layer. The heat-conducting protective film can dissipate heat of the organic light-emitting display panel when the rigid substrate and the flexible substrate of the organic light-emitting display panel are separated to generate thermal stress, and can be stripped from the packaging layer after heat dissipation when the heat-conducting protective film is not needed, so that the thickness of the organic light-emitting display panel can be reduced. The heat-conducting protective film can be attached to the packaging layer, and specifically, the heat-conducting protective film with the adhesion coefficient lower than a preset value can be adopted, and the preset value enables the heat-conducting protective film to be stripped from the packaging layer. Therefore, the adhesion force between the heat conduction protective film and the packaging layer is smaller, and the heat conduction protective film is convenient to peel off.
In other embodiments, the heat conductive protective film may also be a protective film that is not peeled off from the encapsulation layer. The heat-conducting protective Film can be used as a Barrier Film (BF for short) of the organic light-emitting display panel to be reserved on the packaging layer, so that the packaging layer and the organic light-emitting layer of the organic light-emitting display panel can be prevented from being deformed or damaged, and the mechanical protection performance and the heat-conducting performance of the heat-conducting protective Film can be better exerted.
For the flexible substrate, the flexible substrate may be, but not limited to, a substrate formed of a flexible material such as polyimide (abbreviated as PI), polycarbonate (abbreviated as PC), or polyethylene terephthalate (abbreviated as PET).
For a rigid substrate, the rigid substrate may be, but is not limited to, a glass substrate.
The organic light-emitting device also comprises a cathode, wherein an encapsulation layer is positioned on the cathode, and the encapsulation layer can protect the organic light-emitting display panel from water and oxygen.
For the organic light emitting display panel, taking an organic light emitting display panel as an example, fig. 2 shows a specific structure of the organic light emitting display panel, and as shown in fig. 2, the organic light emitting display panel includes a rigid substrate 10 which is a glass substrate, a flexible substrate 20, a semiconductor layer 32, a gate insulating layer 33, a gate electrode 34, an insulating layer 35, a source electrode 36, a drain electrode 37, an interlayer insulating layer 38, a planarization layer 39, a pixel defining layer 40, an anode 41, an organic light emitting layer 42, a cathode 43, an encapsulation layer 50, and a transparent heat conducting protective film 60. The organic light-emitting display panel comprises a pixel driving circuit, which is located on a flexible substrate, the pixel driving circuit comprises the semiconductor layer 32, a gate insulating layer 33, a gate 34, an insulating layer 35, a source-drain electrode (a source electrode 36, a drain electrode 37), an interlayer insulating layer 38, a flat layer 39 and a pixel defining layer 40 from bottom to top, and further comprises the anode 41, and the anode 41 is located on the flat layer 39 and extends into the interlayer insulating layer 38 through the flat layer 39. The organic light emitting layer 42 is positioned on the anode electrode 41 and extends onto the pixel defining layer 40, and the cathode electrode 43 is positioned on the pixel defining layer 40 and covers the pixel defining layer 40. Wherein the flexible substrate 20 is located under the semiconductor layer 32 and under a portion of the gate insulating layer 33; the encapsulation layer 50 is located on the cathode 41.
In this embodiment, the organic light emitting device includes the pixel driving circuit, the organic light emitting layer 42, and the cathode 43. In this embodiment, the organic light emitting display panel includes a flexible substrate 20, a rigid substrate 10 that is a glass substrate, an organic light emitting device, an encapsulation layer 50, and a heat conductive protective film 60.
Specifically, the semiconductor layer 32 includes an active layer 321, a source contact region 322, and a drain contact region 323, the source electrode 36 is led out from the source contact region 322, and the drain electrode 37 is led out from the drain contact region 323.
Among them, the anode 41 may use a semitransparent material, and the organic light emitting display panel may implement top emission; the cathode 43 may use a semitransparent material, and the organic light emitting display panel may implement top emission; transparent materials can be selected for both the anode 41 and the cathode 43, and the organic light emitting display panel can realize double-sided emission. Bottom emission refers to light exiting the device substrate. Double-sided emission refers to light exiting both the substrate of the device and the top of the device. Top emission refers to light exiting the top of the device.
In the conventional method, in order for the organic light emitting display panel to have flexibility, the flexible substrate needs to be separated from the rigid substrate. A commonly used separation method is Laser Lift Off (LLO), but after the organic light emitting display panel is irradiated by Laser, severe thermal stress is generated, each film layer is deformed by heating, and even film layer separation or film layer damage occurs.
In the organic light-emitting display panel in the embodiment of the invention, the heat-conducting protective film is arranged on the packaging layer and can be used for dissipating heat, and if a separation means which can generate thermal stress such as a laser separation method is adopted to separate the rigid substrate from the flexible substrate, the heat-conducting protective film can dissipate heat of the organic light-emitting display panel, so that the thermal stress on the organic light-emitting display panel in the separation process is reduced. And the heat conduction protective film is arranged on the packaging layer, so that the organic light-emitting display panel can be protected from being damaged by water and oxygen, the organic light-emitting display panel can be prevented from being polluted by external foreign matters, and the packaging layer, the organic light-emitting layer and the like can be prevented from being mechanically damaged.
The embodiment of the present invention further provides a method for manufacturing a flexible organic light emitting display panel, and fig. 3 is a schematic flow chart of the method for manufacturing the flexible organic light emitting display panel according to the embodiment of the present invention. Referring to fig. 3, the preparation method includes steps 302 to 304:
step 302: there is provided an organic light emitting display panel as described in any one of the above embodiments.
In this step, for specific limitations in the organic light emitting display panel, refer to limitations in the foregoing embodiments of the organic light emitting display panel, and are not described herein again.
Taking an organic light emitting display panel as an organic light emitting display screen as an example, the step provides an organic light emitting display screen as shown in fig. 2, and the specific structure of the organic light emitting display screen is described in the foregoing corresponding embodiments, which is not repeated herein.
Step 304: and separating the flexible substrate and the rigid substrate in the organic light-emitting display panel by adopting a laser separation method to obtain the flexible organic light-emitting display panel.
In this step, in order to make the organic light emitting display panel flexible, the flexible substrate and the rigid substrate need to be separated. The flexible substrate and the rigid substrate can be separated by physical separation or chemical separation.
Taking the organic light emitting display panel in fig. 2 as an example, the flexible substrate 20 is physically separated from the rigid substrate 10, which is a glass substrate, by a laser separation method, and as shown in fig. 4, laser light is incident from the glass substrate side and is incident on the interface of the flexible substrate 20 and the glass substrate until carbonization occurs at the interface of the flexible substrate 20 facing the glass substrate side, and then, as shown in fig. 5, the glass substrate and the flexible substrate 20 are separated. After the flexible substrate 20 and the rigid substrate 10 in the organic light emitting display panel are separated by a laser separation method, the flexible organic light emitting display panel shown in fig. 6 is obtained.
In this embodiment, since a small portion of the laser energy is reflected or absorbed by the glass substrate when the laser is incident from the glass substrate side, a large portion of the laser energy penetrates the glass substrate and is transmitted to the interface between the glass substrate and the flexible substrate 20, the interface of the flexible substrate 20 is carbonized due to the temperature increase caused by the absorption of the laser energy, the adhesion between the flexible substrate 20 and the glass substrate is weakened, and then the glass substrate can be easily peeled.
However, the heat absorbed by the flexible substrate 20 not only carbonizes at the interface of the flexible substrate 20, but also continues to be conducted to the upper side of the oled device, so that the temperature of each film structure of the oled is increased, and thermal stress is caused in each film. In the temperature-raising process and the subsequent temperature-lowering process of stopping laser separation, each film structure of the organic light-emitting diode is deformed in different degrees due to different thermal expansion coefficients, and then tensile stress and compressive stress are generated in each film structure or at the interface of each film. When the stress is too large, the structures of the films are separated and even damaged. In the embodiment of the invention, as the organic light-emitting diode device adopts the heat-conducting protective film 60, the heat generated in the process of separating the rigid substrate and the flexible substrate by the laser separation method can be quickly dissipated through the heat-conducting protective film 60, so that the influence of thermal stress on the organic light-emitting diode device can be effectively reduced.
In the embodiment of the invention, the flexible substrate and the rigid substrate in the organic light-emitting display panel are separated by adopting a laser separation method, so that the separation efficiency is high, and the operation is convenient.
In one embodiment, referring to fig. 7, taking the flexible organic light emitting display panel in fig. 6 as an example, after step 304, a step 306 of peeling the heat conductive protective film 60 from the encapsulation layer 50 in the flexible organic light emitting display panel in fig. 6 may be further included. Fig. 8 is a schematic diagram illustrating a heat conductive protective film 60 being peeled off from the encapsulation layer 50 of the flexible organic light emitting display panel in fig. 6 according to an embodiment of the present invention. Fig. 9 is a schematic structural diagram of a flexible organic light emitting display panel with a heat conductive protective film 60 removed according to an embodiment of the invention.
In the embodiment, the heat conductive protection film 60 may dissipate heat of the organic light emitting display panel when thermal stress is generated by separating the rigid substrate 10 and the flexible substrate 20 of the organic light emitting display panel, and may peel the heat conductive protection film 60 from the encapsulation layer 50 after the heat dissipation when the heat conductive protection film 60 is not needed, so that the thickness of the flexible organic light emitting display panel may be reduced.
Specifically, in the organic light emitting display panel, the heat conductive protective film 60 may be disposed on the encapsulation layer 50 in an attached manner. The heat conductive protective film 6 may specifically employ a heat conductive protective film 60 having an adhesion coefficient lower than a preset value that enables the heat conductive protective film 60 to be peeled off from the encapsulation layer 50. Thus, the adhesion between the heat conductive protection film 60 and the encapsulation layer 50 is relatively small, which facilitates the peeling of the heat conductive protection film 60.
In other embodiments, the heat conductive protection Film 60 may not be peeled off from the encapsulation layer 50 as shown in fig. 6, and the heat conductive protection Film 60 may be retained on the encapsulation layer 50 as a Barrier Film (BF) of the flexible organic light emitting display panel, so as to prevent the encapsulation layer 50 and the organic light emitting layer 42 of the flexible organic light emitting display panel from being deformed or damaged, and to better exert the mechanical protection performance and the heat conductive performance of the heat conductive protection Film.
In the conventional method, in order for the organic light emitting display panel to have flexibility, the flexible substrate needs to be separated from the rigid substrate. A commonly used separation method is Laser Lift Off (LLO), but after the organic light emitting display panel is irradiated by Laser, severe thermal stress is generated, each film layer is deformed by heating, and even film layer separation or film layer damage occurs. In the preparation method of the flexible organic light-emitting display panel, the heat-conducting protective film is arranged on the packaging layer of the organic light-emitting display panel and can be used for dissipating heat, and in the process of separating the rigid substrate from the flexible substrate by adopting a laser separation method to obtain the flexible organic light-emitting display panel, the organic light-emitting display panel can generate serious thermal stress after being irradiated by laser, but the heat-conducting protective film can dissipate heat of the organic light-emitting display panel, so that the thermal stress on the organic light-emitting display panel in the separation process is reduced. In addition, when the heat conduction protection film is arranged on the flexible organic light-emitting display panel packaging layer, the organic light-emitting display panel can be further protected from being damaged by water and oxygen, the organic light-emitting display panel can be prevented from being polluted by external foreign matters, and the packaging layer, the organic light-emitting layer and the like can be prevented from being mechanically damaged. In addition, when the heat-conducting protective film is peeled off from the flexible organic light-emitting display panel packaging layer, the thickness of the flexible organic light-emitting display panel can be reduced.
The embodiment of the present invention further provides a flexible organic light emitting display panel, which includes an organic light emitting device, and the organic light emitting display panel further includes:
a flexible substrate for carrying the organic light emitting device;
the packaging layer is used for packaging the organic light-emitting device on the flexible substrate; and
and the heat conduction protective film is arranged on the packaging layer.
As the heat conductive protective film, a protective film having a heat conductive property itself such as a high heat conductivity may be used. Thermal conductivity, also known as "coefficient of thermal conductivity," is a measure of the ability of a substance to conduct heat, and is designated λ or K. The protective film having high thermal conductivity may have a thermal conductivity of 30W/(K × m) or more. The heat conductive protective film may be a protective film in which particles having high thermal conductivity are added, and the particles having high thermal conductivity may be heat conductive particles having a thermal conductivity of 30W/(K × m) or more. The heat conducting particle has the characteristics of small particle size, good transparency and high heat conductivity. Specifically, the thermally conductive particles include at least one of carbon nanotubes, graphene, and carbon quantum dots. Specifically, the carbon quantum dots are a novel carbon-based zero-dimensional material, and have the advantages of excellent optical properties, good water solubility, low toxicity, environmental friendliness, wide raw material source, low cost, good biocompatibility and the like.
Furthermore, the heat conduction protective film can be transparent, and the flexible organic light-emitting display panel is beneficial to checking the device structure when the wafer test is carried out. Two embodiments of transparent thermally conductive protective films are described below.
In one embodiment, the heat-conducting protective film is made of a transparent and heat-conducting material.
In another embodiment, the thermally conductive protective film includes a transparent material and thermally conductive particles mixed in the transparent material. Specifically, the heat conducting particles are uniformly distributed in the transparent material, so that the heat conducting protective film can uniformly dissipate heat. Fig. 1 is a schematic structural diagram of a heat-conducting protective film in an embodiment, and in fig. 1, the heat-conducting protective film includes a transparent material and heat-conducting particles mixed in the transparent material, and the transparent material may be a transparent colloid.
In one embodiment, the thickness of the heat conductive protective film may be set between 20um and 200 um. The heat conduction protection film within the thickness range has the effects of heat conduction and mechanical damage prevention on the flexible organic light-emitting display panel, and the flexible organic light-emitting display panel cannot be too thick.
In one embodiment, the heat conductive protective film is a protective film that is peelable from the encapsulation layer. The heat-conducting protective film can dissipate heat of the organic light-emitting display panel when the rigid substrate and the flexible substrate of the organic light-emitting display panel are separated to generate thermal stress, and can be peeled off from the packaging layer when the formed flexible organic light-emitting display panel does not need the heat-conducting protective film after heat dissipation, so that the thickness of the flexible organic light-emitting display panel can be reduced. The heat-conducting protective film can be attached to the packaging layer, and specifically, the heat-conducting protective film with the adhesion coefficient lower than a preset value can be adopted, and the preset value enables the heat-conducting protective film to be stripped from the packaging layer. Therefore, the adhesion force between the heat conduction protective film and the packaging layer is smaller, and the heat conduction protective film is convenient to peel off.
In other embodiments, the heat conductive protective film may also be a protective film that is not peeled off from the encapsulation layer. The heat-conducting protective Film can be used as a Barrier Film (BF for short) of the flexible organic light-emitting display panel to be reserved on the packaging layer, so that the packaging layer and the organic light-emitting layer of the flexible organic light-emitting display panel can be prevented from being deformed or damaged, and the mechanical protection performance of the heat-conducting protective Film can be better exerted.
As for the flexible substrate, the flexible substrate may be, but not limited to, a substrate formed of a flexible material such as Polyimide (PI), Polycarbonate (PC), or polyethylene terephthalate (PET).
For the organic light emitting device, a cathode may be further included, and an encapsulation layer may be positioned over the cathode, the encapsulation layer may protect the flexible organic light emitting display panel from water and oxygen.
For the flexible organic light emitting display panel, taking a flexible organic light emitting display as an example, fig. 6 shows a specific structure of the flexible organic light emitting display, and as shown in fig. 6, the flexible organic light emitting display includes a flexible substrate 20, a semiconductor layer 32, a gate insulating layer 33, a gate electrode 34, an insulating layer 35, a source electrode 36, a drain electrode 37, an interlayer insulating layer 38, a planarization layer 39, a pixel defining layer 40, an anode 41, an organic light emitting layer 42, a cathode 43, an encapsulation layer 50, and a transparent heat conducting protection film 60. The flexible organic light-emitting display panel comprises a pixel driving circuit, which is located on a flexible substrate, the pixel driving circuit comprises the semiconductor layer 32, the gate insulating layer 33, the gate 34, the insulating layer 35, the source and drain electrodes (the source electrode 36 and the drain electrode 37), the interlayer insulating layer 38, the flat layer 39 and the pixel defining layer 40 from bottom to top, and further comprises the anode 41, and the anode 41 is located on the flat layer 39 and extends into the interlayer insulating layer 38 through the flat layer 39. The organic light emitting layer 42 is positioned on the anode electrode 41 and extends onto the pixel defining layer 40, and the cathode electrode 43 is positioned on the pixel defining layer 40 and covers the pixel defining layer 40. Wherein the flexible substrate 20 is located under the semiconductor layer 32 and under a portion of the gate insulating layer 33; the encapsulation layer 50 is located on the cathode 41.
In this embodiment, the organic light emitting device includes the pixel driving circuit, the organic light emitting layer 42, and the cathode 43. In this embodiment, the flexible organic light emitting display includes a flexible substrate 20, an organic light emitting device, an encapsulation layer 50, and a heat conductive protective film 60.
Specifically, the semiconductor layer 32 includes an active layer 321, a source contact region 322, and a drain contact region 323, the source electrode 36 is led out from the source contact region 322, and the drain electrode 37 is led out from the drain contact region 323.
Specifically, the anode 41 may use a translucent material, and the flexible organic light emitting display panel may implement top emission; the cathode 43 may use a semitransparent material, and the flexible organic light emitting display panel may implement top emission; transparent materials can be selected for both the anode 41 and the cathode 43, and the flexible organic light emitting display panel can realize double-sided emission. Bottom emission refers to light exiting the device substrate. Double-sided emission refers to light exiting both the substrate of the device and the top of the device. Top emission refers to light exiting the top of the device.
The embodiment of the present invention further provides a flexible organic light emitting display panel, which includes an organic light emitting device, and the organic light emitting display panel further includes:
a flexible substrate for carrying the organic light emitting device;
and the packaging layer is used for packaging the organic light-emitting device on the flexible substrate.
For specific limitations of the flexible organic light emitting display panel in the embodiments of the present invention, for example, specific limitations of the organic light emitting device, the flexible substrate, and the encapsulation layer, reference may be made to the specific limitations of the previous embodiment of the flexible organic light emitting display panel, and details are not repeated here.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method for manufacturing a flexible organic light emitting display panel includes:
providing an organic light emitting display panel; wherein the organic light emitting display panel includes an organic light emitting device, and further includes: the packaging structure comprises a rigid substrate, a flexible substrate, a packaging layer and a heat conduction protective film, wherein the flexible substrate is positioned on the rigid substrate and bears the organic light-emitting device; the packaging layer is used for packaging the organic light-emitting device on the flexible substrate, and the heat conduction protective film is arranged on the packaging layer;
separating a flexible substrate and a rigid substrate in the organic light-emitting display panel by adopting a laser separation method to obtain a flexible organic light-emitting display panel;
peeling the heat conductive protective film from the encapsulation layer in the flexible organic light emitting display panel.
2. The method of claim 1, wherein the heat conductive protective film is made of a transparent and heat conductive material.
3. The method of claim 1, wherein the thermally conductive protective film comprises a transparent material and thermally conductive particles mixed in the transparent material.
4. The method of claim 3,
the thermally conductive particles include at least one of carbon nanotubes, graphene, and carbon quantum dots.
5. The method of claim 1,
the heat-conducting protective film adopts a heat-conducting protective film with an adhesion coefficient lower than a preset value, and the preset value enables the heat-conducting protective film to be stripped from the packaging layer.
6. The method of claim 1, wherein the flexible substrate is polyimide, polycarbonate, or polyethylene terephthalate.
7. The method of claim 1, wherein the rigid substrate is a glass substrate.
8. The method according to any one of claims 1 to 7, wherein the organic light emitting device comprises, from bottom to top, a semiconductor layer, a gate insulating layer, a gate electrode, an insulating layer, source and drain electrodes, an interlayer insulating layer, a planarization layer, a pixel defining layer;
the organic light emitting device further includes an anode; the anode is positioned on the flat layer and extends into the interlayer insulating layer through the flat layer; the organic light-emitting device also comprises an organic light-emitting layer and a cathode, wherein the organic light-emitting layer is positioned on the anode and extends to the pixel defining layer, and the cathode is positioned on the pixel defining layer and covers the pixel defining layer;
wherein the flexible substrate is positioned below the semiconductor layer and below a portion of the gate insulating layer; the encapsulation layer is located on the cathode.
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| CN108155302A (en) * | 2018-01-31 | 2018-06-12 | 京东方科技集团股份有限公司 | A kind of organic light emitting display panel, preparation method |
| CN109390483A (en) * | 2017-08-11 | 2019-02-26 | Tcl集团股份有限公司 | A kind of display equipment and preparation method thereof |
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| WO2014082300A1 (en) * | 2012-11-30 | 2014-06-05 | 海洋王照明科技股份有限公司 | Organic light-emitting device and preparing method thereof |
| WO2017050630A1 (en) * | 2015-09-23 | 2017-03-30 | Osram Oled Gmbh | Flat light-emitting component and method for producing a flat light-emitting component |
| CN109390483A (en) * | 2017-08-11 | 2019-02-26 | Tcl集团股份有限公司 | A kind of display equipment and preparation method thereof |
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