CN111298516A - Device and method for recovering grinding wastewater in semiconductor manufacturing - Google Patents
Device and method for recovering grinding wastewater in semiconductor manufacturing Download PDFInfo
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- CN111298516A CN111298516A CN202010131783.2A CN202010131783A CN111298516A CN 111298516 A CN111298516 A CN 111298516A CN 202010131783 A CN202010131783 A CN 202010131783A CN 111298516 A CN111298516 A CN 111298516A
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Abstract
The invention relates to the technical field of semiconductor grinding wastewater treatment, in particular to a device and a method for recovering grinding wastewater from semiconductor manufacturing.
Description
Technical Field
The invention relates to the technical field of semiconductor grinding wastewater treatment, in particular to a device and a method for recovering grinding wastewater in semiconductor manufacturing.
Background
In the Semiconductor manufacturing technology, whether silicon Semiconductor (silicon Semiconductor) or Compound Semiconductor (Compound Semiconductor) such as gallium arsenide (GaAs), silicon carbide (SiC), gallium nitride (GaN), etc., wafers (wafers) or substrates (substrates) thereof are used in the process of solar cell (solar cell), Integrated Circuit (Integrated Circuit), and Power (Power), sensing (Sensor), Photo-electronics (Photo-electronics), Microwave (Microwave), Display (Display), etc., after being grown or pulled, ingots (ingos) are trimmed (Edge Trimming), sliced (Slicing), or peeled (peoff), etc., and then polished (Lapping) or ground (Grinding) to form and flatten, polish, or precision polish defects on the surface layer, in the manufacturing process, it is also necessary to perform a Planarization (Planarization) process by Chemical Mechanical Polishing (Chemical Mechanical Polishing) when the flatness of the circuit stack changes, and to perform manufacturing processes such as Wafer recycling (Wafer), Wafer Back Grinding (Wafer Back Grinding), Thinning (Wafer Thinning), and dicing (dicing).
In the foregoing processes, the polishing waste water is discharged in large amount from the periphery cutting, the two-end cutting, the slicing, the chamfering, the mechanical physical polishing, the chemical etching polishing, the mechanical chemical polishing, the wafer regeneration film removal of the crystal rod, so as to polish, thin, cut the crystal grain of the crystal back before packaging, and the like, and the generated waste water components include high-concentration and stable-to-chemical fine polishing powder such as silicon oxide (SiO2), aluminum trioxide (Al2O3), Zircon (zirconia), Diamond (Diamond) and others, chemical agents such as Oxidant (Oxidant) Surfactant (Surfactant), Acid-base Solution (Acid-base Solution) and the like, the debris generated by polishing such as Zircon, Diamond and other abrasive dust and the like, and metal ions such as wafer substrate, copper, tungsten, aluminum and other abrasive dust and the like, and the content of the ultra-pure water is large.
The conventional grinding wastewater can be treated by Filtration (Filtration), Coagulation (coagulated Coagulation), Precipitation (Precipitation), Pressurized Floating (Pressurized Floating) and the like, the wastewater containing organic matters can be treated by biological-digestion, Activated carbon adsorption (Activated carbon adsorption) and the like, and the wastewater containing ions can be treated by Ion Exchange Resin (Ion Exchange Resin), Reverse Osmosis membrane (Reverse Osmosis membrane), Electrodialysis (Electrodialysis) and the like; however, the waste water from the grinding process has various substances contained therein, and no matter what kind of treatment method, a large amount of waste water is discharged, chemicals need to be added, or the treatment process is complicated, a large amount of space is occupied, and the like, the waste water treatment is relatively difficult and the cost is high, so that in the waste water treatment process of the grinding process, the requirements of meeting the environmental protection requirement and improving the treatment efficiency are met, the treatment cost is reduced, the recycling rate is increased, and the like, and the important subject is to be achieved.
Disclosure of Invention
The invention aims to provide a device and a method for recovering grinding wastewater from semiconductor manufacturing, which aim to solve the problems of complex treatment process, overlarge volume of treatment equipment, difficult wastewater treatment and higher cost of the semiconductor grinding wastewater in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a grinding wastewater recovery device for semiconductor manufacturing comprises a shell body of the grinding wastewater recovery device, wherein a filtering membrane fiber assembly is arranged in the shell body, a to-be-filtered wastewater storage space is formed between the side wall of the shell body and the filtering membrane fiber assembly, the top end side wall of the filtering membrane fiber assembly is in sealing connection with the side wall of the shell body, a filtered recovered water storage space is formed between the inner top end of the shell body and the top end of the filtering membrane fiber assembly, the lower part of the shell body is communicated with a sludge recovery device, the lower part of the side wall of the shell body is respectively provided with a grinding wastewater inlet connecting pipe and a compressed air inlet connecting pipe which are communicated with the to-be-filtered wastewater storage space, the upper part of the side wall of the shell body is respectively provided with a grinding wastewater backflow connecting pipe and an exhaust port which are communicated with the filtered recovered water storage space, the outlet at the lower end of the sludge recovery device is communicated with an outlet connecting pipe for recovering the grinding particle concentrated solution.
Preferably, the recycled water outlet connecting pipe is respectively communicated with a recycled water recycling pipeline and a compressed air pipeline.
Preferably, filtration membrane fiber assembly includes grip ring, filtration membrane fiber tube bank and protection outer tube, and the tube bank head of filtration membrane fiber tube bank is fixed in the grip ring, and the protection outer tube cover is established outside filtration membrane fiber tube bank, and the upper end and the grip ring of protection outer tube are connected.
Preferably, the filter membrane fiber tube bundle is circular tube filter membrane fibers.
Preferably, the wall of the circular tube filtering membrane fiber is a porous wall with a circular tube filtering membrane fiber sponge structure.
Preferably, the sludge recovery device is a conical rotary sedimentation device.
Preferably, the grinding wastewater inlet connecting pipe, the compressed air inlet connecting pipe, the grinding wastewater backflow connecting pipe, the exhaust port and the recovered grinding particle concentrated solution outlet connecting pipe are all provided with electromagnetic valves for connection and disconnection of the ports, the recovered water recycling pipeline and the compressed air pipeline which are communicated with the recovered water outlet connecting pipe are also provided with electromagnetic valves, and all the electromagnetic valves are controlled by a controller to be connected and disconnected.
Preferably, the grinding waste water inlet connecting pipe is communicated with a grinding process waste water collecting pipeline after passing through the electromagnetic valve,
the grinding wastewater backflow connecting pipe is communicated with the inlet end of the electromagnetic valve at the grinding wastewater inlet connecting pipe after passing through the electromagnetic valve at the position,
the compressed air inlet connecting pipe is communicated with the compressed air pipeline after passing through the electromagnetic valve at the position,
the electromagnetic valve at the exhaust interface is an exhaust valve, the exhaust interface is communicated with an exhaust valve outlet pipeline through the exhaust valve,
the outlet connecting pipe of the recovered grinding particle concentrated solution is communicated with a pipeline of the recovered grinding particle concentrated solution after passing through the electromagnetic valve at the outlet connecting pipe.
In order to achieve the above purpose, the invention also provides the following technical scheme: a using method of a semiconductor manufacturing grinding waste water recovery device,
the method comprises the following steps:
(1) the waste water of the cutting, grinding and polishing process in the semiconductor manufacturing is intensively discharged or stored by a special pipeline of the grinding waste water category;
(2) guiding and injecting the grinding wastewater into a wastewater storage space to be filtered in the grinding wastewater treatment and recovery device;
(3) filtering water and fine particles in the grinding fluid by using round tube strip-shaped filter membrane fibers, and separating the water from the fine particles;
(4) leading the recovered water to enter a recovered water pipeline and returning the recovered water to be used as a water source;
(5) discharging the precipitated abrasive fines from the conical cyclonic settling device;
(6) collecting and dehydrating the ground fine particles;
(7) recycling according to the chemical property or refining or purifying by a resource recycling manufacturer.
Compared with the prior art, the invention has the beneficial effects that: the present invention is to recycle polishing wastewater generated in semiconductor manufacturing through a treatment and recovery device, and to recycle various fine abrasive grains in the polishing wastewater to a specific treatment manufacturer for refining into useful metals or raw materials. The grinding waste water treatment and recovery device and the method are based on the grinding process waste water discharged by semiconductor manufacturing to be recycled, thereby reducing the use amount of water resources, reducing the manufacturing cost, improving the enterprise to protect the global environment responsibility as much as possible and meeting the requirements of government environmental protection regulations.
Drawings
FIG. 1 is a flow chart of a semiconductor polishing wastewater recycling apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for operating a wastewater reclamation apparatus for semiconductor polishing according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a semiconductor polishing wastewater recycling apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic view of a circular tubular filtering membrane assembly of the semiconductor polishing wastewater recycling device in an embodiment of the present invention;
FIG. 5 is a schematic view of a fiber structure of a circular tube strip-shaped fiber membrane of a wastewater recycling device for semiconductor grinding according to an embodiment of the present invention.
In the figure: 1. a grinding wastewater recovery device; 10. a housing main body of the grinding waste water recovery device; 11. a waste water storage space to be filtered; 12. grinding a wastewater inlet connecting pipe; 13. grinding a wastewater backflow connecting pipe; 14. a compressed air inlet connection pipe; 15. an exhaust valve interface;
20. recovering the water storage space after filtering; 21. a recovered water outlet connection pipe;
30. a filtration membrane fiber assembly; 31. a grip ring; 311. filtering the outer fiber wall of the membrane by a round tube; 312. the inner wall of the circular tube filtering membrane fiber; 313. a water recycling space passing through the circular tube filter membrane fiber; 314. the circular tube is a filtering membrane and is provided with a fiber sponge structure hole wall; 32. a cylindrical circular tube filtration membrane fiber tube bundle 33 and a cylindrical circular tube filtration membrane fiber tube bundle head; 34. protecting the outer tube;
40. a sludge recovery device; 41. an outlet connecting pipe for recovering the grinding particle concentrated solution;
50. a grinding process wastewater collection pipeline; 51. a grinding process wastewater control return line;
60. a recycled water reuse pipeline;
61. a pipeline for recovering the grinding particle concentrated solution;
70. a compressed air conduit;
71. a compressed air conduit;
80. an exhaust valve outlet conduit;
90. and a controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In view of the problems of the background art, the present invention provides a method and an apparatus for treating and recycling polishing wastewater from semiconductor manufacturing technology, wherein the polishing wastewater from the CMP process is most difficult to recycle because the water contains different chemical components and abrasive dust particles; the present embodiment uses the wastewater quality of the Chemical Mechanical Polishing (CMP) process, which is CMP wastewater from a 12-inch IC manufacturing plant (a) in the new bamboos scientific park of taiwan and a 12-inch IC manufacturing plant (B) in the scientific park of tainan, and the experiments are conducted on the apparatus and the process method for treating and recovering polishing wastewater of the present invention.
Referring to fig. 1 to 5, the present invention provides a technical solution: a grinding wastewater recovery device for semiconductor manufacturing comprises a shell body of the grinding wastewater recovery device, wherein a filtering membrane fiber assembly is arranged in the shell body, a to-be-filtered wastewater storage space is formed between the side wall of the shell body and the filtering membrane fiber assembly, the top end side wall of the filtering membrane fiber assembly is in sealing connection with the side wall of the shell body, a filtered recovered water storage space is formed between the inner top end of the shell body and the top end of the filtering membrane fiber assembly, the lower part of the shell body is communicated with a sludge recovery device, the lower part of the side wall of the shell body is respectively provided with a grinding wastewater inlet connecting pipe and a compressed air inlet connecting pipe which are communicated with the to-be-filtered wastewater storage space, the upper part of the side wall of the shell body is respectively provided with a grinding wastewater backflow connecting pipe and an exhaust port which are communicated with the filtered recovered water storage space, the outlet at the lower end of the sludge recovery device is communicated with an outlet connecting pipe for recovering the grinding particle concentrated solution.
The device is characterized in that the recycled water outlet connecting pipe is respectively communicated with a recycled water recycling pipeline and a compressed air pipeline, electromagnetic valves for connection and disconnection of the grinding wastewater inlet connecting pipe, the compressed air inlet connecting pipe, the grinding wastewater backflow connecting pipe, the exhaust port and the recycled grinding particle concentrated solution outlet connecting pipe are respectively provided with an electromagnetic valve, the recycled water recycling pipeline and the compressed air pipeline which are communicated with the recycled water outlet connecting pipe are also provided with electromagnetic valves, and all the electromagnetic valves are controlled by a controller in a connection and disconnection manner.
The grinding waste water inlet connecting pipe is communicated with a grinding process waste water collecting pipeline after passing through the electromagnetic valve at the position, the grinding process waste water collecting pipeline is used for connecting grinding waste water at the discharge end of the process equipment and other etching or cleaning waste water to a grinding waste water treatment and recovery device through special pipelines or collecting the grinding waste water by a storage container and then sending the grinding waste water to a grinding waste water treatment device, so that centralized treatment is facilitated, and the situation that the grinding waste water is difficult to recover due to mixing with waste water discharged by other process acid waste water, alkali waste water, organic solvent waste water, cleaning waste water and the like is avoided.
The grinding wastewater backflow connecting pipe is communicated with the inlet end of the electromagnetic valve at the grinding wastewater inlet connecting pipe after passing through the electromagnetic valve at the position, the grinding process wastewater controls a backflow pipeline, the flow of a to-be-filtered wastewater storage space is adjusted to be pressure difference by a backflow control valve in the filtering operation of the grinding wastewater treatment and recovery device, and the filtering flow is controlled to be 10-22 cubic meters per hour, preferably 20 cubic meters per hour; the pressure difference is controlled to be 1.0-3.0 kg/cm, preferably 2.0 kg/cm; the above operation was carried out at a filter area of 50 square meters and an indoor temperature of 26 ℃.
The reclaimed water recycling pipeline is used for collecting reclaimed water filtered by the grinding wastewater treatment recycling device, sending the reclaimed water to a front-end water tank of a reverse osmosis membrane process of the ultrapure water system, and providing the reclaimed water to the ultrapure water system as a recycled water resource; the recovered water quality is enough to provide deionized water at the back end of the ultrapure water system reverse osmosis membrane process for combined use, and is optimally sent to a front end water tank of the ultrapure water system reverse osmosis membrane process.
The compressed air inlet connecting pipe is communicated with the compressed air pipeline after passing through the electromagnetic valve at the position,
the electromagnetic valve at the exhaust interface is an exhaust valve, the exhaust interface is communicated with an exhaust valve outlet pipeline through the exhaust valve,
the recovery grinding particle concentrated solution outlet connecting pipe is communicated with the recovery grinding particle concentrated solution pipeline after passing through the electromagnetic valve at the position, the recovery grinding particle concentrated solution pipeline filters the grinding wastewater treatment and recovery device and then passes through the grinding sludge conical convolution sedimentation device, the treated concentrated sludge is collected and sent to the sludge storage tank, the sludge contains various fine abrasive particles, and the example comprises the following components: silicon (Si), copper (Cu), aluminum (Al), tungsten (W), calcium (Ca), magnesium (Mg), iron (Fe), chlorine (Cl) and other fine particles, and the sludge may be dehydrated and then delivered to a qualified resource recycling manufacturer, and refined or purified according to its chemical properties to become a useful resource to be recycled.
As shown in fig. 3 to 5, the filtering membrane fiber assembly comprises a holding ring, a filtering membrane fiber tube bundle and a protecting outer tube, wherein a tube bundle head of the filtering membrane fiber tube bundle is fixed in the holding ring, the protecting outer tube is sleeved outside the filtering membrane fiber tube bundle, and the upper end of the protecting outer tube is connected with the holding ring.
The fiber bundle of the filtering membrane is circular tube filtering membrane fiber, the material fiber of the circular tube strip filtering membrane is a porous sponge structure membrane body taking polyvinyl alcohol (PVA) as a base material, and the surface of the porous sponge structure membrane body is coated with Polymeric Fluoride (PF); the cylindrical filtering membrane body combination is fixed by a membrane body protection outer tube with a metal net structure.
The pipe wall of the circular pipe filtering membrane fiber is a porous pipe wall with a circular pipe filtering membrane fiber sponge structure, the polymeric Fluoride is Poly (fluoroethylene) (PVDF) or Polytetrafluoroethylene (PTFE) or Polystyrene (PVS), and the best is Poly (fluoroethylene) (PVDF); the wall structure of the holes of the circular tube filtering membrane fiber sponge structure is distributed with countless micro holes, the diameter of the holes is 0.005-1.0 micron, preferably 0.01-0.03 micron, and most preferably 0.02 micron.
The sludge recovery device is a conical rotary sedimentation device.
As shown in fig. 1 and 2, a method for using a semiconductor manufacturing grinding waste water recycling device,
the method comprises the following steps:
(1) the waste water of the cutting, grinding and polishing process in the semiconductor manufacturing is intensively discharged or stored by a special pipeline of the grinding waste water category;
(2) guiding and injecting the grinding wastewater into a wastewater storage space to be filtered in the grinding wastewater treatment and recovery device;
(3) filtering water and fine particles in the grinding fluid by using round tube strip-shaped filter membrane fibers, and separating the water from the fine particles;
(4) leading the recovered water to enter a recovered water pipeline and returning the recovered water to be used as a water source;
(5) discharging the precipitated abrasive fines from the conical cyclonic settling device;
(6) collecting and dehydrating the ground fine particles;
(7) recycling according to the chemical property or refining or purifying by a resource recycling manufacturer.
The method for collecting grinding waste water generated in the cutting, grinding and polishing process in the semiconductor manufacturing process is to utilize a special pipeline to connect or store a container so as to be treated in a centralized way;
the discharge end of the processing equipment connects the grinding wastewater and other etching or cleaning wastewater to a grinding wastewater treatment and recovery device through special pipelines or collects the grinding wastewater and sends the grinding wastewater to a grinding wastewater treatment device through a storage container, so as to be convenient for centralized treatment and avoid the situation of difficult recovery caused by mixing with wastewater discharged by other processing acid wastewater, alkali wastewater, organic solvent wastewater, cleaning wastewater and the like;
dehydrating the ground fine particle sludge by a dehydrating device;
the recovered water source is supplied to a front water tank of a Reverse Osmosis membrane process (Reverse Osmosis) of an ultrapure water system, and various fine abrasive particles such as silicon, copper, aluminum, tungsten and other particles are recovered and then delivered to a specific processing manufacturer to be classified and refined (Refine) or purified (Purification) to be useful raw materials, depending on actual requirements, but is not limited to the description.
The chemical mechanical polishing wastewater quality of the present embodiment is obtained from CMP wastewater of a 12-hour factory (a) in the new bamboo science park of taiwan and a 12-hour factory (B) in the scientific park of tainan, and the mixed water quality inspection items and values of a and B are as follows:
| water quality detection | Numerical value | Unit of | Water quality detection | Numerical value | Unit of |
| pH | 8.61 | K | 33.2 | mg/L | |
| Degree of electrical conductivity | 139.2 | μS/cm | Al | 22.6 | mg/L |
| Total alkalinity | 51 | mg/L@CaCO3 | Cu | 5.2 | mg/L |
| TOC | 18.6 | mg/L | Ca | 0.42 | mg/L |
| Total solids | 1568 | mg/L | Mg | 0.33 | mg/L |
| Turbidity of water | 140 | NTU | Fe | 0.32 | mg/L |
| Si | 695.6 | mg/L | Cl | 0.11 | mg/L |
In this embodiment, the CMP wastewater sample is obtained by the polishing wastewater recovery apparatus, and the quality items and values of the recovered water are as follows:
| water quality detection | Numerical value | Unit of | Water quality detection | Numerical value | Unit of |
| pH | 8.56 | K | 0.2 | mg/L | |
| Degree of electrical conductivity | 22.1 | μS/cm | Al | ＜0.01 | mg/L |
| Total alkalinity | 10.5 | mg/L@CaCO3 | Cu | ＜0.01 | mg/L |
| TOC | 3.2 | mg/L | Ca | ＜0.01 | mg/L |
| Total solids | 268 | mg/L | Mg | ＜0.01 | mg/L |
| Turbidity of |
12 | NTU | Fe | ＜0.01 | mg/ |
| Si | |||||
| 20 | mg/L | Cl | ＜0.01 | mg/L |
With respect to the aforementioned results of the present example, the semiconductor polishing wastewater recycling apparatus and method of the present invention were verified in experiments.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a semiconductor manufacturing grinds effluent recovery unit which characterized in that: the waste water recovery device comprises a shell main body of a grinding waste water recovery device, wherein a filtering membrane fiber assembly is arranged in the shell main body, a waste water storage space to be filtered is arranged between the side wall of the shell main body and the filtering membrane fiber assembly, the top side wall of the filtering membrane fiber assembly is in sealing connection with the side wall of the shell main body, a filtered recovered water storage space is arranged between the inner top end of the shell main body and the top end of the filtering membrane fiber assembly, the lower part of the shell main body is communicated with a sludge recovery device, the lower part of the side wall of the shell main body is respectively provided with a grinding waste water inlet connecting pipe and a compressed air inlet connecting pipe which are communicated with the waste water storage space to be filtered, the upper part of the side wall of the shell main body is respectively provided with a grinding waste water backflow connecting pipe and, the outlet at the lower end of the sludge recovery device is communicated with an outlet connecting pipe for recovering the grinding particle concentrated solution.
2. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 1, wherein: the recycled water outlet connecting pipe is respectively communicated with a recycled water recycling pipeline and a compressed air pipeline.
3. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 1, wherein: the filtering membrane fiber assembly comprises a holding ring, a filtering membrane fiber tube bundle and a protective outer tube, wherein a tube bundle head of the filtering membrane fiber tube bundle is fixed in the holding ring, the protective outer tube is sleeved outside the filtering membrane fiber tube bundle, and the upper end of the protective outer tube is connected with the holding ring.
4. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 3, wherein: the filter membrane fiber tube bundle is circular tube filter membrane fiber.
5. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 4, wherein: the wall of the circular tube filtering membrane fiber is a hole wall with a circular tube filtering membrane fiber sponge structure.
6. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 1, wherein: the sludge recovery device is a conical rotary sedimentation device.
7. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 2, wherein: the grinding waste water inlet connecting pipe, the compressed air inlet connecting pipe, the grinding waste water backflow connecting pipe, the exhaust interface and the recovered grinding particle concentrated solution outlet connecting pipe are all provided with electromagnetic valves for connection and disconnection of the interfaces, the recovered water recycling pipeline and the compressed air pipeline which are communicated with the recovered water outlet connecting pipe are also provided with electromagnetic valves, and all the electromagnetic valves are controlled by a controller in a connection and disconnection manner.
8. The wastewater reclamation apparatus for semiconductor manufacturing grinding as recited in claim 7, wherein:
the grinding waste water inlet connecting pipe is communicated with a grinding process waste water collecting pipeline after passing through the electromagnetic valve,
the grinding wastewater backflow connecting pipe is communicated with the inlet end of the electromagnetic valve at the grinding wastewater inlet connecting pipe after passing through the electromagnetic valve at the position,
the compressed air inlet connecting pipe is communicated with the compressed air pipeline after passing through the electromagnetic valve at the position,
the electromagnetic valve at the exhaust interface is an exhaust valve, the exhaust interface is communicated with an exhaust valve outlet pipeline through the exhaust valve,
the outlet connecting pipe of the recovered grinding particle concentrated solution is communicated with a pipeline of the recovered grinding particle concentrated solution after passing through the electromagnetic valve at the outlet connecting pipe.
9. The use method of the semiconductor manufacturing grinding wastewater recovery device is characterized in that:
the method comprises the following steps:
(1) the waste water of the cutting, grinding and polishing process in the semiconductor manufacturing is intensively discharged or stored by a special pipeline of the grinding waste water category;
(2) guiding and injecting the grinding wastewater into a wastewater storage space to be filtered in the grinding wastewater treatment and recovery device;
(3) filtering water and fine particles in the grinding fluid by using round tube strip-shaped filter membrane fibers, and separating the water from the fine particles;
(4) leading the recovered water to enter a recovered water pipeline and returning the recovered water to be used as a water source;
(5) discharging the precipitated abrasive fines from the conical cyclonic settling device;
(6) collecting and dehydrating the ground fine particles;
(7) recycling according to the chemical property or refining or purifying by a resource recycling manufacturer.
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| CN202010131783.2A CN111298516A (en) | 2020-02-29 | 2020-02-29 | Device and method for recovering grinding wastewater in semiconductor manufacturing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831302B (en) * | 2022-07-20 | 2024-02-01 | 中國鋼鐵股份有限公司 | Reverse osmosis system and method of cleaning the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI831302B (en) * | 2022-07-20 | 2024-02-01 | 中國鋼鐵股份有限公司 | Reverse osmosis system and method of cleaning the same |
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