CN111286720B

CN111286720B - Source bottle and semiconductor equipment

Info

Publication number: CN111286720B
Application number: CN201811503125.0A
Authority: CN
Inventors: 王勇飞; 兰云峰; 王帅伟
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2018-12-10
Filing date: 2018-12-10
Publication date: 2021-12-17
Anticipated expiration: 2038-12-10
Also published as: CN111286720A

Abstract

The invention provides a source bottle and a semiconductor device, the source bottle includes: body and fixed mounting be in bottle lid on the body, the body with the bottle lid can form airtight space, still be provided with on the bottle lid with intake pipe and outlet duct of airtight space intercommunication, the intake pipe be used for to airtight space lets in the carrier gas, the outlet duct be used for to airtight space exports outside the reaction precursor with the carrier gas still includes: a tray disposed in the enclosed space for loading a solid state source; the cover plate is arranged opposite to the tray; the lifting device is used for driving the cover plate to descend to a first position covering the solid state source on the tray; or to a second position separate from the tray. By the invention, the problems of insufficient steam concentration of the solid source and scattering of the solid source in the transportation and installation process are solved.

Description

Source bottle and semiconductor equipment

Technical Field

The invention relates to the field of semiconductor manufacturing, in particular to a source bottle and semiconductor equipment.

Background

At present, the thin film deposition reaction system and method are widely applied to equipment in various fields, such as: semiconductors, integrated circuits, solar panels, flat panel displays, microelectronics, light emitting diodes, and the like. The formation of a thin film of 10 μm or less on the surface of a substrate by Chemical vapor Deposition (hereinafter, referred to as CVD) is a common method for performing thin film Deposition. In the thin film Deposition method using Atomic Layer Deposition (ALD), a plurality of reaction gases or vapors are required to enter the reaction chamber in an alternative manner, sequentially and continuously, and cannot react with each other before entering the chamber. Since the ALD technique can produce extremely thin films with certain characteristics, the ALD technique has an application value incomparable with the CVD technique in some application sites.

The preparation of gaseous reaction precursors by CVD or ALD is mainly achieved by introducing a carrier gas (generally an inert gas) into a reaction source bottle and introducing the reaction source (including liquid and solid) into a reaction chamber with the carrier gas. The saturated vapor pressure of the solid reaction precursor is relatively low, and besides the increase of carrier gas carrying, a heating device is required to be added externally to increase the saturated vapor pressure.

The evaporation capacity of a solid source in the existing source bottle is small, the time for reaching saturated vapor pressure is long, and ALD reaction is a fast switching process, so that the solid source carried by the source bottle can not meet the film forming requirement. To increase the evaporation capacity, the source bottle is usually heated to a high temperature, which causes the solid source to decompose and the composition to change. Another method of increasing the evaporation is to extend the time the source is carried over, which results in an increased time to complete each cycle and a reduced film formation rate. From the physical property of the solid source, the form of the solid source cannot be compared with that of the liquid source, and the liquid source with the same liquid level is always positioned in the source bottle under the influence of gravity due to the fluid characteristic of the liquid source.

The solid powder source is loaded in the solid source bottle, the plane of the solid powder source can not be smooth, and further the solid powder source can incline and jolt in the transportation process, so that the shape of the solid powder source in the bottle can not be determined and guaranteed, the films with the same quality can not be made by using the same process parameters, the process parameters need to be newly determined when the source bottle is replaced every time, the time waste and the workload are large, and the recovery time is long.

Disclosure of Invention

The invention aims to at least solve one technical problem in the prior art and provides a source bottle and a semiconductor device.

To achieve the object of the present invention, there is provided a source bottle comprising: body and fixed mounting be in bottle lid on the body, the body with the bottle lid can form airtight space, still be provided with on the bottle lid with intake pipe and outlet duct of airtight space intercommunication, the intake pipe be used for to airtight space lets in the carrier gas, the outlet duct be used for to airtight space exports outside the reaction precursor with the carrier gas still includes:

a tray disposed in the enclosed space for loading a solid state source;

the cover plate is arranged opposite to the tray;

the lifting device is used for driving the cover plate to descend to a first position covering the solid state source on the tray; or to a second position separate from the tray.

Preferably, the number of the trays is multiple, and the trays are arranged at intervals along the vertical direction;

the number of the cover plates is multiple, and the cover plates and the trays are arranged in a one-to-one correspondence manner; the lifting device is used for driving the cover plates to synchronously descend or ascend.

Preferably, a plurality of said trays are concentrically arranged.

Preferably, a part of the air inlet pipe is vertically arranged in the closed space, and at least one air outlet is arranged on the air inlet pipe, above the tray on the uppermost layer and between every two adjacent trays.

Preferably, a plurality of the trays are fixedly connected with the air inlet pipe.

Preferably, a guide hole is vertically formed in the bottle cap, and the air inlet pipe extends to the outside of the closed space through the guide hole; and, the guide hole may define a rotational degree of freedom of the intake pipe.

Preferably, the air inlet pipe is fixedly connected with the edge of the tray.

Preferably, a groove is arranged on the upper surface of the tray and used for containing the solid-state source; the first position is a position where the lower surface of the cover plate is attached to the upper surface of the tray; the second position is a position where the lower surface of the cover plate is higher than the upper surface of the tray by a preset distance.

Preferably, the air inlet pipe is a plurality of air inlet pipes, and the plurality of air inlet pipes are arranged along the edge of the tray.

Preferably, the lifting device comprises a guide bar, an elastic member, a fixing bracket, a connecting member, and a lifting screw, wherein,

the guide rods are vertically arranged in the closed space and connected with the cover plates, and the upper ends of the guide rods penetrate through the bottle cap and extend to the outside of the closed space;

the fixing bracket is arranged on the bottle cap, and a threaded hole is vertically formed in the fixing bracket and positioned above the guide rod;

the lifting screw is arranged in the threaded hole and matched with the threaded hole;

the connecting piece is rotatably connected with the lower end of the lifting screw and fixedly connected with the upper end of the guide rod;

the elastic piece is arranged between the connecting piece and the bottle cap.

Preferably, a hemisphere is arranged at the tail end of the lifting screw; and the upper surface of the connecting piece is provided with a groove for accommodating the hemispheroid.

A semiconductor device comprising a reaction chamber, a carrier gas line, a source bottle, and a gas inlet line, wherein the carrier gas line is configured to deliver a carrier gas to the source bottle; the source bottle is used for containing a solid source, and adopts the source bottle in the application; the gas inlet pipeline is used for conveying the carrier gas and the reaction gas in the source bottle to the reaction chamber.

The invention has the following beneficial effects:

the invention provides a source bottle, comprising: the lifting device drives the cover plate to descend to a first position covering the solid-state source on the tray; or to a second position separate from the tray. Loading the tray with the solid state source increases the contact area of the solid state source with the carrier gas, thereby increasing the vapor concentration of the solid state source; when the source bottle is transported, the cover plate is used for covering the solid source on the tray, so that the solid source can be prevented from being scattered in the transportation process, and the shape of the solid source can be kept; the lifting tray of the lifting device is convenient for operating the cover plate. Therefore, the invention solves the problems of insufficient steam concentration of the solid source and the scattering of the solid source in the transportation and installation process.

According to another embodiment of the present invention, a semiconductor device is provided, which comprises a carrier gas pipeline, a gas inlet pipeline, a reaction chamber and a source bottle, wherein the gas inlet pipeline is used for conveying the carrier gas and the reaction gas in the source bottle to the reaction chamber.

Drawings

FIG. 1 is a schematic view of a source bottle according to an embodiment of the present invention after a cover plate is lowered;

FIG. 2 is a schematic diagram illustrating a raised state of a cover plate in a source bottle according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a lifting device according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a lifting screw according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a via in an embodiment of the invention;

FIG. 6 is a schematic structural diagram of a source bottle according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the source bottle and the semiconductor device provided by the present invention will be described in detail below with reference to the accompanying drawings.

Implement one

Fig. 1 is a schematic structural diagram of a source bottle according to an embodiment of the present invention, the source bottle includes: body 1 and fixed mounting bottle lid 2 on body 1, body 1 and bottle lid 2 can form airtight space, still are provided with intake pipe 3 and outlet duct 4 with airtight space intercommunication on the bottle lid 2, and intake pipe 3 is used for letting in the carrier gas to airtight space, and outlet duct 4 is used for exporting reaction precursor and carrier gas outside airtight space, and the source bottle still includes: a tray 5 disposed in the closed space for loading the solid state source; a cover plate 6 arranged opposite to the tray 5; a lifting device 7 for driving the cover plate 6 to descend to a first position covering the solid state source on the tray 5; or to a second position separated from the tray 5.

In the embodiment of the invention, the tray for loading the solid source is arranged in the closed space of the source bottle, the cover plate is arranged above the tray, and the lifting device drives the cover plate to descend to the first position for covering the solid source or ascend to the second position separated from the tray; further, when the transportation, elevating gear drive apron covers solid-state source, can solve the unrestrained problem of solid-state source in the transportation installation.

In the embodiment of the present invention, the tray 5 may be fixedly installed in the enclosed space, further, as shown in fig. 1 and fig. 2, the tray 5 is fixedly installed in the enclosed space through a bracket, or may be fixedly installed on the bottle wall of the bottle body 1, and the fixing manner and the fixing position of the tray 5 are not limited in this embodiment.

Specifically, a groove is arranged on the upper surface of the tray 5 and used for containing the solid source; the first position is a position where the lower surface of the cover plate 6 is attached to the upper surface of the tray 5; the second position is a position where the lower surface of the cover 6 is higher than the upper surface of the tray 5 by a predetermined distance. In the embodiment of the present invention, the preset distance may be determined according to the specific structure calibration of the lifting device, for example, the preset distance is 12 mm.

Specifically, as shown in fig. 1 and 2, the tray 5 is plural, and the plural trays 5 are arranged at intervals in the vertical direction; the cover plates 6 are multiple, and the cover plates 6 are arranged in one-to-one correspondence with the trays 5; the lifting device 7 is used for driving the cover plates 6 to synchronously descend or ascend.

Further, a plurality of trays 5 are concentrically arranged; in this embodiment, with the tray concentric arrangement, can be when a plurality of trays are all the same shape convenient to the synchronous setting of tray.

Further, the distance between every two cover plates 6 of the plurality of cover plates 6 is the same as the distance between every two trays 5. Thereby ensuring that each cover plate 6 is able to contact the upper surface of the tray 5.

In the embodiment of the invention, the trays are multiple, so that the solid sources can be dispersed in each tray, the thickness of the powdery solid sources on each tray can be ensured to be the same, a layered structure is formed, and further, the cover plate above each tray can keep the original state of the solid sources in the transportation process.

Specifically, as shown in fig. 3, the lifting device 7 includes a guide rod 71, an elastic member 72, a fixing bracket 73, a connecting member 74 and a lifting screw 75, wherein the guide rod 71 is vertically disposed in the closed space and connected to each cover plate 6, and an upper end of the guide rod 71 extends to the outside of the closed space through the bottle cap 2; the fixing bracket 73 is arranged on the bottle cap 2, and a threaded hole is vertically formed in the fixing bracket 73 above the guide rod 71; the lifting screw 75 is arranged in the threaded hole and matched with the threaded hole; the connecting piece 74 is rotatably connected with the lower end of the lifting screw 75, and the connecting piece 74 is fixedly connected with the upper end of the guide rod 71; the elastic member 72 is disposed between the connecting member 74 and the bottle cap 2. Specifically, as shown in fig. 3, the connection member 74 may include two parts connected by a screw, one of which is rotatably connected to the lower end of the lifting screw, and the other of which is fixedly connected to the upper end of the guide bar 71 by a screw.

Further, as shown in fig. 3, a sealing ring 8 is disposed between the bottle cap 2 and the elastic member 72. In this embodiment, can guarantee the leakproofness between bottle lid and the elastic component through setting up the sealing washer.

Further, as shown in fig. 4, a hemisphere 751 is provided at the end of the lifting screw 75; a groove for receiving the hemisphere 751 is provided on the upper surface of the connector. Further, the upper end of the lifting screw 75 is a structure that can be clamped by a wrench or manually rotated, and the shape of the structure can be an outer hexagon or an inner hexagon.

Specifically, in the embodiment of the present invention, the through hole 51 may be vertically provided on the tray 5; the guide rod 71 passes through the through hole 51 on the tray 5; further, the through-hole 51 may be near the edges of the tray 5 and the cover 6; as shown in fig. 5, the through hole 51 may be located at the center of the tray 5, and further, the position of the through hole 51 may be specifically set according to the arrangement position and the shape of the guide bar 71.

Further, the radial sectional shape of the guide rod 71 includes a rectangular shape, an oblong shape, or a spline shape. Specifically, the shape of the through hole 51 may also be set according to the shape of the guide bar, for example, the shape of the through hole 51 includes a rectangle, an oval, or a spline.

Carry out two

Specifically, as shown in fig. 5, an air inlet valve 32 and an air outlet valve 41 may be disposed on the air inlet pipe 3 and the air outlet pipe 4 outside the enclosed space, the air inlet valve 32 and the air outlet valve 41 may be manual valves or automatic valves, and the air inlet flow and the air outlet flow of the air inlet pipe 3 and the air outlet pipe 4 may be controlled by the air inlet valve 32 and the air outlet valve 41.

As shown in fig. 6, a portion of the air inlet duct 3 is vertically disposed in the enclosed space, and at least one air outlet 31 is disposed on the air inlet duct 3 above the tray 5 on the uppermost layer and between each two adjacent layers of trays 5. Specifically, the air outlet 31 is located 1-10mm above the connection position of the air inlet pipe 3 and the tray 5, preferably 4mm, in the embodiment of the present invention, the air outlet 31 may face the center of the tray 5, and further, the cross-sectional shape of the air outlet 31 relative to the extending direction of the air inlet pipe 3 may be a sector; in the embodiment of the present invention, the sum of the areas of all the air outlets 31 is not greater than the sectional area of the air inlet pipe 3.

Further, tray 5 is a plurality of, and a plurality of trays 5 set up along vertical direction interval, a plurality of

trays

5 and 3 fixed connection of intake pipe. Specifically, the connection manner of the tray 5 and the air inlet pipe 3 may be welding, bonding, screwing, or the like.

Further, as shown in fig. 6, the air inlet pipe 3 is fixedly connected to the edge of the tray 5. Specifically, in another embodiment of the present invention, the air inlet pipe 3 may also be located in the middle of the tray 5, and relative to the middle position, the fixed connection between the air inlet pipe 3 and the edge of the tray 5 may facilitate opening and closing the cover plate 6.

Further, in order to increase the purging force for the solid state source, in another embodiment of the present invention, the number of the air inlet pipes 3 may be multiple, and the multiple air inlet pipes 3 are arranged along the edge of the tray 5. Further, at least one air outlet 31 is arranged on each air inlet pipe 3, above the tray 5 on the uppermost layer and between each two adjacent layers of trays 5.

In the embodiment of the invention, at least one air outlet is arranged on the tray at the uppermost layer and the air inlet pipe between every two adjacent layers of trays, so that carrier gas in the air inlet pipe can sweep towards the solid source in the trays, and on the basis of ensuring that the solid source is of a multilayer structure, each layer is provided with an independent air path, and each layer is provided with an independent cover plate, so that the solid source can be limited in the trays; furthermore, the air inlet pipes are arranged in a plurality of numbers, and the air inlet pipes are arranged along the edge of the tray, so that the carrier gas can be blown to the solid source on the tray through the air outlets in the air inlet pipes, the blowing strength to the solid source is increased, and the steam concentration of the solid source is higher. Therefore, according to the present embodiment, the vapor concentration of the solid source can be increased, and the evaporation amount of the solid source can be further increased.

EXAMPLE III

In another embodiment of the present invention, a guide hole is vertically formed in the bottle cap 2, and the air inlet tube 3 extends to the outside of the closed space through the guide hole; and, the guide hole can define the rotational degree of freedom of the intake pipe 3.

In the embodiment of the invention, the degree of freedom of the air inlet pipe is limited by the guide hole, so that the air inlet pipe can rotate in multiple directions in the closed space, and further, the tray fixed with the air inlet pipe can rotate in multiple directions in the closed space, thereby facilitating the loading of the solid source.

Example four

Aiming at the source bottle, the embodiment of the invention also provides semiconductor equipment, which comprises a reaction chamber, a carrier gas pipeline, the source bottle and a gas inlet pipeline, wherein the carrier gas pipeline is used for conveying carrier gas to the source bottle; the source bottle is used for containing a solid source, and adopts the source bottle in the embodiment; the gas inlet pipeline is used for conveying the carrier gas and the reaction gas in the source bottle to the reaction chamber.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims

1. A source vial, comprising: body and fixed mounting be in bottle lid on the body, the body with the bottle lid can form airtight space, still be provided with on the bottle lid with intake pipe and outlet duct of airtight space intercommunication, the intake pipe be used for to airtight space lets in the carrier gas, the outlet duct be used for to airtight space exports outside the precursor of reaction with the carrier gas, its characterized in that still includes:

a tray disposed in the enclosed space for loading a solid state source;

the cover plate is arranged opposite to the tray;

2. The source bottle of claim 1, wherein the tray is plural, and the plural trays are arranged at intervals in a vertical direction;

3. The source vial of claim 2, wherein a plurality of the trays are concentrically arranged.

4. The source bottle of claim 3, wherein a portion of the air inlet conduit is vertically disposed in the enclosed space and at least one air outlet is disposed on the air inlet conduit above the uppermost tray and between each adjacent two of the trays.

5. The source bottle of claim 4, wherein a plurality of the trays are fixedly connected to the air inlet tube.

6. The source bottle of claim 4, wherein a guide hole is vertically provided in the bottle cap, and the air inlet pipe extends to the outside of the closed space through the guide hole; and, the guide hole may define a rotational degree of freedom of the intake pipe.

7. The source bottle of any of claims 1-6, wherein the air inlet tube is fixedly connected to an edge of the tray.

8. The source vial of any one of claims 1-6, wherein a recess is provided in an upper surface of the tray for holding the solid state source; the first position is a position where the lower surface of the cover plate is attached to the upper surface of the tray; the second position is a position where the lower surface of the cover plate is higher than the upper surface of the tray by a preset distance.

9. The source bottle of any one of claims 1 to 6, wherein the air inlet tube is plural and is disposed along an edge of the tray.

10. Source bottle according to claim 2, characterized in that the lifting means comprise a guide rod, an elastic element, a fixing support, a connecting element and a lifting screw, wherein,

the elastic piece is arranged between the connecting piece and the bottle cap.

11. The source bottle of claim 10, wherein the lifting screw is provided with a hemisphere at its distal end; and the upper surface of the connecting piece is provided with a groove for accommodating the hemispheroid.

12. A semiconductor device comprising a reaction chamber, a carrier gas line, a source bottle, and a gas inlet line, wherein the carrier gas line is configured to deliver a carrier gas to the source bottle; the source bottle is used for containing a solid source, and the source bottle adopts the source bottle of any one of claims 1-11; the gas inlet pipeline is used for conveying the carrier gas and the reaction gas in the source bottle to the reaction chamber.