CN111278223B - Flexible circuit board manufacturing method and stamping template typesetting method - Google Patents
Flexible circuit board manufacturing method and stamping template typesetting method Download PDFInfo
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- CN111278223B CN111278223B CN202010111458.XA CN202010111458A CN111278223B CN 111278223 B CN111278223 B CN 111278223B CN 202010111458 A CN202010111458 A CN 202010111458A CN 111278223 B CN111278223 B CN 111278223B
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- circuit board
- flexible circuit
- stamping
- gum
- template
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a flexible circuit board, which comprises the following steps: step S1, preparing a flexible circuit board stamping template and an adhesive-backed auxiliary material, and dividing the stamping template into a plurality of stamping units; step S2, punching the punching template; step S3, punching the auxiliary material of the gum; step S4, attaching and fixing the gum auxiliary material to the stamping template; step S5, carrying out stamping processing on the stamping template; and S6, cutting the cutting line, and separating the flexible circuit board from the stamping unit. The invention also discloses a typesetting method of the stamping template, which comprises the following steps: step S11, dividing the stamping template into a plurality of stamping units; and step S12, dividing the stamping unit into two flexible circuit board forming areas which are arranged in central symmetry and a gum handle area which is connected with the two flexible circuit board forming areas. Compared with the prior art, the flexible circuit board manufacturing method and the stamping template typesetting method have high typesetting utilization rate.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board manufacturing method and a stamping template typesetting method.
[ background of the invention ]
As flexible circuit boards are used more and more. It is very important to reduce the cost of the flexible circuit board to reduce the cost of the product, and splicing a plurality of flexible circuit boards on a motherboard is a common technique.
As shown in fig. 9-10, the flexible circuit board in the prior art includes a molding region 1 ' and an adhesive-backed handle 2 ' attached to the molding region 1 '.
In the process of preparing the flexible circuit board, a single flexible circuit board is often used as a stamping unit, but due to the limitation of a stamping process, the distance between any two stamping units is at least 2-2.5mm, so the specified range of the flexible circuit board typesetting distance d3 is generally 2-2.5mm, the typesetting utilization rate is limited by the arrangement mode of the gum pull handles 2' of the flexible circuit board and the distance between adjacent flexible circuit boards, and the problem to be solved is how to optimize the arrangement of the gum pull handles and reduce the distance to improve the typesetting utilization rate.
Therefore, there is a need to provide a new method to solve the above technical problems.
[ summary of the invention ]
The invention aims to overcome the technical problems and provides a flexible circuit board manufacturing method and a stamping template typesetting method with high typesetting utilization rate.
In order to achieve the above object, the present invention provides a method for manufacturing a flexible circuit board, the method comprising the steps of:
s1, preparing a flexible circuit board stamping template and gum auxiliary materials, dividing the stamping template into a plurality of stamping units which are equidistantly spaced and are arranged in a rectangular array, wherein each stamping unit comprises two flexible circuit board forming areas which are arranged in a central symmetry manner and a gum handle area which is connected with the two flexible circuit board forming areas;
step S2, performing punching processing on the punching template, wherein the punching processing range comprises the back glue handle area;
step S3, carrying out punching processing on the gum auxiliary material, removing redundant gum auxiliary material, wherein the punched gum auxiliary material comprises a gum handle part and cutting lines for cutting the gum handle part into centrosymmetric patterns;
step S4, attaching and fixing the back adhesive auxiliary material subjected to the punching processing in the step S3 to the punching template subjected to the punching processing in the step S2, wherein the back adhesive handle part covers the back adhesive handle area, and the flexible circuit board forming area is centrosymmetric about the cutting line;
step S5, performing stamping processing on the stamping template attached with the gum auxiliary material in the step S4, wherein the stamping processing range is the external contour of the stamping unit;
and step S6, cutting the cutting line, and separating the flexible circuit board from the stamping unit.
Preferably, the distance between the two flexible circuit board forming areas in the same stamping unit is less than 2-2.5 mm.
Preferably, the cutting line is in a zigzag shape.
Preferably, in the step S2, the punching process range further includes a corner-shaped corner penetrating through the through hole on the flexible circuit board molding area and the outer contour of the flexible circuit board molding area.
The invention also provides a stamping template typesetting method applied to the flexible circuit board manufacturing method, which comprises the following steps:
step S11, dividing the stamping template into a plurality of stamping units which are equidistantly spaced and are arranged in a rectangular array;
step S12, dividing the stamping unit into two flexible circuit board forming areas which are arranged in central symmetry and a gum handle area which is connected with the two flexible circuit board forming areas; the flexible circuit board forming area corresponds to the stamped flexible circuit board, and the back adhesive handle area is correspondingly attached with the back adhesive handle.
Preferably, the distance between two adjacent stamping units is less than 2-2.5 mm.
Compared with the prior art, the manufacturing method of the flexible circuit board comprises the following steps: step S1, preparing a flexible circuit board stamping template and an adhesive-backed auxiliary material, and dividing the stamping template into a plurality of stamping units; step S2, punching the punching template; step S3, punching the auxiliary material of the gum; step S4, attaching and fixing the gum auxiliary material to the stamping template; step S5, carrying out stamping processing on the stamping template; and S6, cutting the cutting line, and separating the flexible circuit board from the stamping unit. The typesetting method of the stamping template comprises the following steps: step S11, dividing the stamping template into a plurality of stamping units; and step S12, dividing the stamping unit into two flexible circuit board forming areas which are arranged in central symmetry and a gum handle area which is connected with the two flexible circuit board forming areas. According to the flexible circuit board manufacturing method and the stamping template typesetting method, two flexible circuit board forming areas which are arranged in a central symmetry mode and the gum pull area which is connected with the two flexible circuit board forming areas are arranged in the same stamping unit, gum auxiliary materials are covered on the gum pull area after punching, the gum pull portion and the cutting line which divides the gum pull portion into the central symmetry patterns are arranged through the gum auxiliary materials, the distance between the two flexible circuit board forming areas of the same stamping unit is smaller due to the arrangement, the distance is smaller than that between two flexible circuit boards in the related technology, the influence of the width of the gum pull on the distance does not need to be considered, and therefore the typesetting utilization rate is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a flow chart of a method of manufacturing a flexible circuit board according to the present invention;
FIG. 2 is a schematic structural diagram of a flexible circuit board stamping template according to the present invention;
FIG. 3 is a schematic structural diagram of a punching unit of the flexible circuit board punching template of the invention;
fig. 4 is a schematic view of a punching unit of the flexible circuit board manufacturing method of the present invention in step S2;
fig. 5 is a schematic view of a punching unit of the flexible circuit board manufacturing method of the present invention in step S4;
fig. 6 is a schematic view of a punching unit of the flexible circuit board manufacturing method of the present invention in step S5;
fig. 7 is a schematic view of a punching unit of the flexible circuit board manufacturing method of the present invention in step S6;
FIG. 8 is a flow chart of the typesetting method for the stamped template according to the invention;
FIG. 9 is a schematic view of a prior art die plate;
fig. 10 is a partially enlarged schematic view of a prior art die plate.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a method for manufacturing a flexible printed circuit board, including the steps of:
step S1, preparing a flexible circuit board stamping template 100 and an adhesive-backed auxiliary material 200, and dividing the stamping template 100 into a plurality of stamping units 10 which are equidistantly spaced and arranged in a rectangular array.
Specifically, the stamping unit 10 includes two flexible circuit board forming areas 1 arranged in a central symmetry manner and a back adhesive handle area 2 connecting the two flexible circuit board forming areas 1.
In this embodiment, the distance between the two flexible circuit board forming regions 1 in the same stamping unit 10 is less than 2-2.5 mm. The following are specifically mentioned: the distance between the two flexible circuit board forming areas 1 is the minimum distance between the two flexible circuit board forming areas 1 connected through the gum pull handle area 2, namely, the gum pull handle area 2 is connected with the minimum width of the two flexible circuit board forming areas 1. The area of the stamping unit 10 is small due to the arrangement, so that more stamping units 10 can be typeset in the stamping template 100 under the same area, and the typesetting utilization rate of the stamping template 100 is high.
Step S2, performing a punching process on the punching template 100, where the punching process range includes the adhesive-backed handle area 2. Specifically, the back adhesive pull handle area 2 of the stamping die plate 100 is punched and removed, so that the back adhesive pull handle is conveniently attached and arranged subsequently.
For different structural designs of the flexible circuit board, in other embodiments, the punching processing range further includes a through hole 101 penetrating through the flexible circuit board molding area 1 and a corner 102 in an outer contour of the flexible circuit board molding area 1.
Step S3, performing punching processing on the auxiliary gum material 200, and removing the redundant auxiliary gum material 200. The back adhesive auxiliary material 200 after the punching processing comprises a back adhesive handle part 3 and cutting lines 4 for cutting the back adhesive handle part 3 into centrosymmetric patterns.
In this embodiment, the cutting line 4 is in a Z shape, and this arrangement is favorable for cutting in subsequent stamping processing the cutting line 4 will cut two of the gum auxiliary materials 200 the gum handle portion 3 is divided into centrosymmetric patterns.
Step S4, attaching and fixing the adhesive-backed auxiliary material 200 subjected to the die cutting process in step S3 to the die plate 100 subjected to the punching process in step S2.
Specifically, the adhesive-backed handle part 3 covers the adhesive-backed handle area 2. The flexible circuit board forming area 1 is centrosymmetric about the cutting line 4. Through the arrangement of the cutting lines 4, when the flexible circuit board stamping template 100 is typeset, two flexible circuit boards share one gum handle part 3, and then the cutting lines 4 are cut through subsequent stamping processing to divide the flexible circuit boards into two parts. Therefore, the layout of the two flexible circuit board forming areas 1 of the stamping unit 10 does not need to consider the layout distance of the back adhesive handle part 3, thereby improving the layout utilization rate of the stamping template 100.
Step S5, performing a stamping process on the stamping die plate 100 attached with the adhesive-backed auxiliary material 200 in the step S4, where the stamping process range is the outer contour of the stamping unit 10.
Step S6, cutting the cutting line 4, and separating the flexible circuit board from the punching unit 10.
Referring to fig. 8, the present invention provides a stamping template typesetting method applied in the flexible circuit board manufacturing method, including the following steps:
step S11, dividing the stamping template 100 into a plurality of stamping units 10 which are equidistantly spaced and are arranged in a rectangular array;
step S12, dividing the stamping unit 10 into two flexible circuit board forming areas 1 arranged in central symmetry and an adhesive-backed handle area 2 connecting the two flexible circuit board forming areas 1. Flexible circuit board shaping district 1 corresponds the punching press flexible circuit board, gum handle district corresponds to paste establishes the gum handle gum auxiliary material 200 includes gum handle portion 3 and will gum handle portion 3 cuts apart into the line 4 that cuts of centrosymmetric figure, flexible circuit board shaping district 1 about it is central symmetry to cut line 4.
Wherein, the distance between two adjacent punching units 10 is less than 2-2.5 mm. By the arrangement, more stamping units 10 can be typeset in the stamping template 100 under the same area, so that the typesetting utilization rate of the stamping template 100 is high.
Aiming at different structural designs of the flexible circuit board, in other embodiments, the method further comprises a step S13 of dividing the flexible circuit board forming area 1 into a through hole 101 penetrating through the flexible circuit board forming area 1 and a turning arc angle 102 in the outer contour of the flexible circuit board forming area 1, wherein the punching processing range comprises the gum handle area 2, the through hole 101 and the turning arc angle 102.
In order to verify that the typesetting efficiency in the flexible circuit board manufacturing method and the stamping template typesetting method of the present invention is high, the stamping template 100 in the present embodiment is compared with the stamping template 100' in the related art as a comparative example. The areas of the stamping die plate 100 and the stamping die plate 100 'are the same, and the stamping die plate 100' are both 250 mm long and 98 mm wide.
Referring to fig. 9-10, two flexible circuit board forming regions 1 in the prior art are shown’The spacing of d2,. Wherein, any one of the two gum handle parts 3’A distance from another flexible circuit board forming area 1’Is d 3. The interval data are detailed in table 1.
TABLE 1 Pitch data for two Flexible Circuit boards
| Item | This example | Comparative example | Unit of |
| Spacing d1 | 2.16 | Millimeter | |
| Spacing d2 | 3.95 | Millimeter | |
| Spacing d3 | 2.00 | Millimeter |
Wherein the specified range of the typesetting pitch is 2-2.5 mm.
In the present embodiment, the spacing d1 is 2.16 mm, and the range of the typesetting spacing is 2-2.5 mm.
The pitch d3 in the comparative example was 2.00 mm, and the range specified for the layout pitch was 2-2.5 mm. However, to meet the range of spacing d3, the spacing d2 is actually made to be 3.95 mm wide.
Typesetting results:
the layout data is detailed in table 2.
TABLE 2 typesetting data for two flexible circuit boards
And (4) comparing and concluding:
the typesetting utilization rate of the embodiment of the invention is improved by 4.13 percent compared with the typesetting utilization rate of the comparative example of the related technology. The typesetting utilization rate of the flexible circuit board manufacturing method and the punching template typesetting method can be obtained from the data.
Compared with the prior art, the manufacturing method of the flexible circuit board comprises the following steps: step S1, preparing a flexible circuit board stamping template and an adhesive-backed auxiliary material, and dividing the stamping template into a plurality of stamping units; step S2, punching the punching template; step S3, punching the auxiliary material of the gum; step S4, attaching and fixing the gum auxiliary material to the stamping template; step S5, carrying out stamping processing on the stamping template; and S6, cutting the cutting line, and separating the flexible circuit board from the stamping unit. The typesetting method of the stamping template comprises the following steps: step S11, dividing the stamping template into a plurality of stamping units; and step S12, dividing the stamping unit into two flexible circuit board forming areas which are arranged in central symmetry and a gum handle area which is connected with the two flexible circuit board forming areas. According to the flexible circuit board manufacturing method and the stamping template typesetting method, two flexible circuit board forming areas which are arranged in a central symmetry mode and the gum pull area which is connected with the two flexible circuit board forming areas are arranged in the same stamping unit, gum auxiliary materials are covered on the gum pull area after punching, the gum pull portion and the cutting line which divides the gum pull portion into the central symmetry patterns are arranged through the gum auxiliary materials, the distance between the two flexible circuit board forming areas of the same stamping unit is smaller due to the arrangement, the distance is smaller than that between two flexible circuit boards in the related technology, the influence of the width of the gum pull on the distance does not need to be considered, and therefore the typesetting utilization rate is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A method for manufacturing a flexible circuit board, comprising the steps of:
s1, preparing a flexible circuit board stamping template and gum auxiliary materials, dividing the stamping template into a plurality of stamping units which are equidistantly spaced and are arranged in a rectangular array, wherein each stamping unit comprises two flexible circuit board forming areas which are arranged in a central symmetry manner and a gum handle area which is connected with the two flexible circuit board forming areas;
step S2, performing punching processing on the punching template, wherein the punching processing range comprises the back glue handle area;
step S3, carrying out punching processing on the gum auxiliary material, removing redundant gum auxiliary material, wherein the punched gum auxiliary material comprises a gum handle part and cutting lines for cutting the gum handle part into centrosymmetric patterns;
step S4, attaching and fixing the back adhesive auxiliary material subjected to the punching processing in the step S3 to the punching template subjected to the punching processing in the step S2, wherein the back adhesive handle part covers the back adhesive handle area, and the flexible circuit board forming area is centrosymmetric about the cutting line;
step S5, performing stamping processing on the stamping template attached with the gum auxiliary material in the step S4, wherein the stamping processing range is the external contour of the stamping unit;
and step S6, cutting the cutting line, and separating the flexible circuit board from the stamping unit.
2. The method of manufacturing a flexible circuit board according to claim 1, wherein a distance between two flexible circuit board molding regions in the same punching unit is less than 2-2.5 mm.
3. The method of manufacturing a flexible circuit board according to claim 1, wherein the cutting line is zigzag-shaped.
4. The method of manufacturing a flexible printed circuit board according to claim 1, wherein the punching process range in step S2 further includes a corner through the through hole on the flexible printed circuit board molding area and the outer contour of the flexible printed circuit board molding area.
5. A stencil layout method applied to the flexible circuit board manufacturing method according to any one of claims 1 to 3, characterized by comprising the steps of:
step S11, dividing the stamping template into a plurality of stamping units which are equidistantly spaced and are arranged in a rectangular array;
step S12, dividing the stamping unit into two flexible circuit board forming areas which are arranged in central symmetry and a gum handle area which is connected with the two flexible circuit board forming areas; the flexible circuit board forming area corresponds to the stamped flexible circuit board, and the back adhesive handle area is correspondingly attached with the back adhesive handle.
6. The method for manufacturing a flexible circuit board according to claim 4, wherein the distance between two adjacent punching units is 2-2.5 mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010111458.XA CN111278223B (en) | 2020-02-24 | 2020-02-24 | Flexible circuit board manufacturing method and stamping template typesetting method |
| PCT/CN2020/079289 WO2021168918A1 (en) | 2020-02-24 | 2020-03-13 | Flexible circuit board fabrication method and punching template arrangement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010111458.XA CN111278223B (en) | 2020-02-24 | 2020-02-24 | Flexible circuit board manufacturing method and stamping template typesetting method |
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| Publication Number | Publication Date |
|---|---|
| CN111278223A CN111278223A (en) | 2020-06-12 |
| CN111278223B true CN111278223B (en) | 2021-09-03 |
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| CN202010111458.XA Expired - Fee Related CN111278223B (en) | 2020-02-24 | 2020-02-24 | Flexible circuit board manufacturing method and stamping template typesetting method |
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| Country | Link |
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| CN (1) | CN111278223B (en) |
| WO (1) | WO2021168918A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113923874A (en) * | 2021-10-22 | 2022-01-11 | 恒赫鼎富(苏州)电子有限公司 | FPC auxiliary material secondary multiple laminating method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206353887U (en) * | 2016-12-16 | 2017-07-25 | 昆山意力电路世界有限公司 | A kind of compartmented high alignment golden finger wiring board of flexible high density |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080860A (en) * | 2004-10-18 | 2007-11-28 | 艾吉尔莱特股份有限公司 | Microelectronics package and method |
| CN102802355A (en) * | 2011-05-25 | 2012-11-28 | 江苏同昌电路科技有限公司 | Mounting jig |
| JP2014045221A (en) * | 2013-12-09 | 2014-03-13 | Sumitomo Electric Printed Circuit Inc | Manufacturing method of flexible printed wiring board sheet |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| CN204235627U (en) * | 2014-11-05 | 2015-04-01 | 深圳市新宇腾跃电子有限公司 | A kind of punching die produced for flexible PCB |
| CN206272958U (en) * | 2016-12-14 | 2017-06-20 | 广州视源电子科技股份有限公司 | Pcb board and PCB jigsaw |
| CN207560446U (en) * | 2017-11-23 | 2018-06-29 | 瑞声声学科技(苏州)有限公司 | FPC plates |
| CN208079501U (en) * | 2018-03-28 | 2018-11-09 | 广东欧珀移动通信有限公司 | A kind of multiple-printed-panel for circuit board |
| CN108848617B (en) * | 2018-08-02 | 2021-01-26 | 深圳市中诺通电子有限公司 | Manufacturing and assembling process of FPC (flexible printed circuit) hand tearing handle 3M glue |
-
2020
- 2020-02-24 CN CN202010111458.XA patent/CN111278223B/en not_active Expired - Fee Related
- 2020-03-13 WO PCT/CN2020/079289 patent/WO2021168918A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206353887U (en) * | 2016-12-16 | 2017-07-25 | 昆山意力电路世界有限公司 | A kind of compartmented high alignment golden finger wiring board of flexible high density |
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| Publication number | Publication date |
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| WO2021168918A1 (en) | 2021-09-02 |
| CN111278223A (en) | 2020-06-12 |
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