CN210120702U - Makeup structure of PCB unit board - Google Patents

Abstract

The utility model discloses a makeup structure of PCB cell board. The PCB unit board is connected with the motherboard through the connecting groove, and the upper surface of the motherboard is higher than the upper surfaces of the connecting groove and the PCB unit board to form a height difference. The PCD unit plates are continuously and equidistantly arranged in the mother plate, through holes are formed in the centers of the PCB unit plates, punching grooves are formed among the PCB unit plates in the mother plate, and positioning holes are formed in the end points of the mother plate. Through the height difference and the connection between the connecting grooves and the PCB unit boards, a structural basis is provided for keeping the shapes of the punched PCB unit boards consistent, and the yield of the PCB unit boards is ensured.

Description

Makeup structure of PCB unit board

Technical Field

The utility model relates to a PCB board field, in particular to makeup structure of PCB cell board.

Background

At present, the PCB unit board has the advantages of good performance and low cost, and is widely used in the field of electronic assembly. Because the PCB unit board is small in size and large in quantity, the requirements on transportation and production efficiency cannot be met. In order to solve the problem, the prior scheme adopts a makeup structure, and a plurality of PCB unit boards are manufactured in a mother board by blanking or routing, so that the production efficiency is greatly improved. However, when the PCB splicing structure is used, a customer needs to punch out the PCB unit board by using a stamping die, the PCB unit board and a mother board in the existing splicing structure are integrally formed, and the PCB unit board has certain hardness, so that the shape of the punched PCB unit board is difficult to keep consistent, the PCB unit board is easy to damage, and the yield of the PCB unit board is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve one of the technical problem that exists among the prior art at least, provide a makeup structure of PCB cell board, realize that PCB cell board and mother board separation back shape remain unanimous, improve the yields of product.

According to the utility model discloses an aspect provides a makeup structure of PCB cell board, include: the PCB unit boards are connected with the motherboard through connecting grooves;

the upper surface of the motherboard is higher than the upper surfaces of the connecting grooves, and the upper surfaces of the PCB unit boards and the connecting grooves are located on the same horizontal plane.

The makeup structure of the PCB unit board at least comprises the following beneficial effects: the utility model discloses an including mother board and two at least PCB unit boards among the makeup structure, PCB unit board and mother board are connected through the spread groove, and the upper surface of mother board is higher than the upper surface of spread groove for form the difference in height between mother board and the spread groove, be favorable to realizing the disconnection from the spread groove when receiving stamping die's impulsive force, keep the shape unanimous for the PCB unit board that dashes out and provide the structure basis.

According to the utility model discloses the first aspect a makeup structure of PCB cell board, the PCB cell board is in arrange in succession and the equidistance in the mother board. Because the number of the PCB unit boards is large, the adoption of the continuous and equidistant layout splicing mode is more beneficial to punching the PCB unit boards by using a stamping die, namely, the continuous and equidistant layout splicing mode is suitable for the plate punching method in the industry.

According to the utility model discloses the first aspect a makeup structure of PCB cell board, the PCB cell board still is provided with the through-hole, the through-hole is located the center of PCB cell board. Set up the through-hole at PCB cell board center, can make the makeup structure of this application be applied to the stamping die of taking the punching needle, be favorable to keeping the even of atress at the punching process to make the makeup structure of this application be applicable to the stamping die of more types.

According to the utility model discloses an aspect a makeup structure of PCB cell board, still include the die-cut in the mother board, the die-cut sets up in adjacent two between the PCB cell board, the width of all die-cuts in the mother board is the same. In the actual use process, not all the PCB unit boards in the makeup structure need to be punched out for use, and when the actual required number is smaller than the number of the PCB unit boards in the makeup structure, the PCB unit boards which do not need to be used can be separated from the mother board along the punching grooves, so that the material and the cost are saved.

According to the utility model discloses the first aspect a makeup structure of PCB cell board, still including the locating hole that is used for stamping die location in the mother board, the locating hole set up in the endpoint department of mother board. The positioning holes are arranged, so that the makeup structure can be fixed in the stamping die, and the stamping plate processing in the industry is facilitated.

According to the utility model discloses the first aspect a makeup structure of PCB cell board, the spread groove around connect in the outside edge of PCB cell board. The connecting grooves are arranged around the outer side edges of the PCB unit boards, so that the connecting stability of the PCB unit boards and the mother board can be enhanced, and meanwhile, the processing is convenient.

Drawings

The present invention will be further described with reference to the accompanying drawings and examples;

FIG. 1 is a schematic diagram of a layout structure according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB unit board according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view along a direction in fig. 1 according to an embodiment of the present invention.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1, an aspect of the present invention relates to a makeup structure of a PCB unit board, which structurally includes a motherboard 100 and at least two PCB unit boards 200, wherein the PCB unit boards 200 are connected to the motherboard 100 through a connection groove 210. On the other hand, the first embodiment of the present invention further relates to a layout structure of PCB units, in the arrangement of the PCB unit boards, the PCB unit boards 200 are continuously and equidistantly arranged in the motherboard 100.

It should be noted that the number of the PCB unit boards 200 may be any number greater than or equal to 2, and in the actual production process, the single PCB unit board 200 does not need to be produced using a makeup structure, which is not beneficial to cost control, so that the present embodiment at least includes 2 PCB unit boards 200. Under the condition that a plurality of PCB unit boards 200 are arranged in the same motherboard 100, the space of the motherboard 100 can be saved more effectively by adopting a continuous arrangement mode, the arrangement mode is preferably that the PCB unit boards are arranged in a line in the same row, the maximum number of each row is 5, a line is newly added below the line after the line is fully arranged, and the like; certainly, the expansion and the arrangement in the column direction can also be adopted, and the adjustment can be specifically carried out according to the production requirement; it is understood that the continuous arrangement is only a preferable scheme, and some defective products may be skipped to perform the board punching process in consideration of defective products that may occur during the manufacturing process of the PCB unit board 200; in addition, the punches in the stamping die are usually distributed equidistantly, and in order to match the use of the stamping die, it is preferable in this embodiment to keep the distance between the PCB unit boards 200 the same on the premise of continuous distribution, it can be understood that the equidistant distribution is only a preferable scheme, and considering that there may be different models of the PCB unit boards 200 on the motherboard 100, it is also possible to differentiate between different models by unequal distance distribution, which is specifically adjusted according to the production requirements.

Referring to fig. 3, in another aspect, embodiments of the present invention further relate to a makeup structure of a PCB unit board, in a positional relationship between the motherboard 100, the PCB unit board 200, and the connection groove 210, an upper surface of the motherboard 100 is higher than an upper surface of the connection groove 210, and an upper surface of the PCB unit board 200 and an upper surface of the connection groove 210 are located at the same horizontal plane.

It should be noted that the PCB unit board 200 and the connecting slot 210 are usually produced by punching the motherboard 100 through a die, so that the thicknesses of the PCB unit board 200, the connecting slot 210 and the motherboard 100 are the same, which can simplify the production process, and certainly, the thickness of the connecting slot 210 may be smaller than that of the motherboard 100 and the PCB unit board 200, and the smaller the thickness of the connecting slot 210 is, the smaller the force required for punching the PCB unit board 200 through the punching die is, which is more advantageous for punching the board; it can be understood that the connection mode of the motherboard 100, the connection groove 210 and the PCB unit board 200 is an integrated molding, and certainly, the PCB unit board can be embedded into a hole reserved in the motherboard 100 through the connection groove 210, and the specific connection mode can be adjusted according to the production requirement. In addition, in this embodiment, it is preferable that the upper surface of the motherboard 100 is higher than the upper surfaces of the connection grooves 210, and the upper surfaces of the connection grooves 210 and the upper surfaces of the PCB unit boards 200 are maintained at the same level, so that a height difference between the motherboard 100 and the connection grooves 210 can be formed, and specific values of the height difference can be set according to production requirements.

Referring to fig. 2, the PCB unit board 200 is further provided with a through hole 220, and the through hole 220 is located at the center of the PCB unit board 200. The coupling groove 210 is coupled around the outer side edge of the PCB unit board 200.

It should be noted that, because some stamping dies are provided with stamping pins for fixing the imposition structures, in this embodiment, it is preferable to provide the through holes 220 in the PCB unit board 200, and the through holes 220 may be provided at any position in the PCB unit board 200, and in this embodiment, it is preferable to provide the through holes at a central position, so that the fixing effect of the stamping pins is better. In this embodiment, the through hole 200 is preferably a circular through hole, and it can be understood that the through hole 200 may also be a square through hole, which is specifically adjusted according to the requirement during production. In addition, the connection groove 210 surrounds the outer side of the PCB unit board 200, i.e. has the same shape as the outer profile of the PCB unit board 200, which is beneficial to maintain the stability of the connection. It is understood that the connection slots 210 may also be square connection bars arranged at random, so that the PCB unit board can be connected to the motherboard 100, and the specific shape and arrangement are adjusted according to the production requirement.

Referring to fig. 1, the motherboard 100 further includes a punching groove, the punching groove is disposed between two adjacent PCB unit boards 200, and the width of all the punching grooves in the motherboard 100 is the same; the mother plate 100 further includes a positioning hole 400 for positioning a stamping die, and the positioning hole 400 is disposed at an end point of the mother plate 100.

It should be noted that the punching grooves in the present embodiment preferably include 3 types, such as a first punching groove 300, a second punching groove 310 and a third punching groove 320 shown in the figure. The first notching 300 is disposed at a side close to the lateral edge of the motherboard 100, and is located between two adjacent PCB unit boards 200, for example, the first notching 300 between the first and second PCB unit boards 200 at the upper left corner in fig. 1; the second washout groove 310 is arranged between two adjacent PCB unit boards 200 in the same column; the third washout groove 320 is arranged between the adjacent 4 PCB unit boards 200, and the 4 PCB unit boards are in a shape of Chinese character 'tian'; in addition, in order to ensure that the integrity of the imposition structure is maintained after the PCB unit boards 200 are separated, the width of the notching is preferably the same in this embodiment. It is understood that the number, shape and width of the punching grooves can be set according to actual use requirements, for example, one punching groove can be arranged between every two PCB unit boards 200, and the specific shape and arrangement position can be adjusted according to production requirements. In addition, in this embodiment, it is preferable to provide positioning holes 400 at 4 end points of the mother plate 100 for positioning and fixing the split structure by the plate punching tool. It is understood that the positioning holes 400 are provided at 4 end points of the mother plate 100, which is only a preferred form of the present embodiment, and it is also possible to provide any number of positioning holes 400 at any position of the mother plate 100, particularly adjusted to actual requirements during production, in consideration of the fact that the templates of the stamping die may be different from one another; it is understood that the mother board 100 is preferably a square board, and the positioning holes 400 are disposed at 4 end points of the square board, but the shape of the mother board 100 may be other shapes, such as irregular shape and circular shape, and the position of the positioning holes 400 is adjusted in this case, and can be used for positioning and fixing by a stamping die.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (6)

1. The utility model provides a makeup structure of PCB unit board which characterized in that includes: the PCB unit boards are connected with the motherboard through connecting grooves;

the upper surface of the motherboard is higher than the upper surfaces of the connecting grooves, and the upper surfaces of the PCB unit boards and the connecting grooves are located on the same horizontal plane.

2. The imposition structure of a PCB unit board according to claim 1, characterized in that: the PCB unit boards are continuously and equidistantly arranged in the motherboard.

3. The imposition structure of a PCB unit board according to claim 1, characterized in that: the PCB unit board is also provided with a through hole, and the through hole is positioned in the center of the PCB unit board.

4. The imposition structure of a PCB unit board according to claim 1, characterized in that: the motherboard also comprises punching grooves, the punching grooves are arranged between two adjacent PCB unit boards, and the width of all the punching grooves in the motherboard is the same.

5. The imposition structure of a PCB unit board according to claim 1, characterized in that: the mother board also comprises a positioning hole for positioning the stamping die, and the positioning hole is arranged at the end point of the mother board.

6. The imposition structure of a PCB unit board according to claim 1, characterized in that: the connection groove is connected around the outer side edge of the PCB unit board.

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