CN111276478B - Layout structure of efuse fuse - Google Patents
Layout structure of efuse fuse Download PDFInfo
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- CN111276478B CN111276478B CN202010063863.9A CN202010063863A CN111276478B CN 111276478 B CN111276478 B CN 111276478B CN 202010063863 A CN202010063863 A CN 202010063863A CN 111276478 B CN111276478 B CN 111276478B
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- adjacent metal
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- efuse
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
Abstract
The invention provides a layout structure of an efuse fuse, which comprises a middle metal layer of a fuse body; the adjacent metal layers are respectively distributed above and below the middle metal layer and are adjacent to the middle metal layer, and the adjacent metal layers are connected with the fuse body on the middle metal layer through the through hole; sub-adjacent metal layers respectively distributed above and below the adjacent metal layers, and bonding pads are arranged on the sub-adjacent metal layers; the pad is connected to the adjacent metal layer through the via. The length of the fuse body in the plane of the intermediate metal layer is 1.16 microns; the pad has a length of 0.32 microns and a width of 0.15 microns in the plane of the next adjacent metal layer. The efuse fuse layout structure adopted by the invention utilizes the multilayer metal and the through holes between the multilayer metal as pad layout design, so that the effective heat dissipation area in the vertical direction is formed, the layout area occupied on the plane is reduced, and a better heat dissipation effect can be obtained. Meanwhile, a parallel structure is formed among the multiple layers of metal through the through holes, and the current passing capacity can be increased.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a layout structure of an efuse fuse.
Background
The efuses are based on the electro-migration (EM) principle, adopt standard CMOS technology, and realize a highly reliable on-chip programming function by blowing out the fuse. With the increasingly competitive market, the requirements for chip area and power consumption are higher and higher. The efuse is used as a special module for parameter setting in a chip, the whole area of the efuse becomes one of main design indexes, and an array formed by efuse units occupies more than half of the whole area of the efuse. In the efuse cell, the pad part occupies a large area. Therefore, how to reduce the pad area in the efuse unit becomes an object of study.
The conventional efuse fuse wire is in a wine glass shape and an I shape, the whole fuse wire is composed of two layout parts, namely a Pad part and a fuse wire body (link), the Pad part and the fuse wire body are arranged on the same metal layer plane, and the Pad part usually occupies a large area in consideration of current capacity and heat dissipation characteristics. The fuse of the conventional efuse unit is respectively in a wine cup shape and an I shape in sequence as shown in fig. 1, fig. 2a and fig. 2b, and is characterized in that the whole fuse is composed of two layout parts, namely a Pad part and a fuse body (link), wherein the Pad part and the fuse body are both arranged in the same metal layer plane, and the Pad part usually occupies a larger area in consideration of current capacity and heat dissipation characteristics.
Therefore, reducing the area of the basic cell is one of the main approaches to designing a competitive efuse IP.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a layout structure of an efuse fuse, which is used to solve the problem that a pad of an efuse cell in the prior art occupies a large area.
In order to achieve the above and other related objects, the present invention provides a layout structure of an efuse fuse, which at least includes: an intermediate metal layer including a fuse body; adjacent metal layers which are distributed above and below the middle metal layer and are adjacent to the middle metal layer respectively, wherein the adjacent metal layers are connected with the fuse body on the middle metal layer through a through hole between the adjacent metal layers and the middle metal layer;
the sub-adjacent metal layers are respectively distributed above and below the adjacent metal layers, and each sub-adjacent metal layer comprises a bonding pad; the bonding pad is connected with the adjacent metal layer through a through hole between the next adjacent metal layer and the adjacent metal layer;
the fuse body is in a strip shape, and the length of the fuse body in the plane of the middle metal layer is 1.16 micrometers; the pad is rectangular in shape, with a length of 0.32 microns and a width of 0.15 microns in the plane of the next adjacent metal layer.
Preferably, both ends of the fuse body are connected to the adjacent metal layers through the through holes.
Preferably, two ends of the fuse body are respectively connected to the adjacent metal layers through a plurality of through holes distributed in a single row.
Preferably, the adjacent metal layers are respectively connected to the next adjacent metal layers through a plurality of through holes distributed in a single row.
Preferably, the single row of through holes connecting the fuse body and the adjacent metal layer overlaps with the single row of through holes connecting the adjacent metal layer and the pad in projection in the vertical direction.
Preferably, the through holes distributed in a single row are arranged at equal intervals on the respective planes.
Preferably, each of the sub-adjacent metal layers includes 1 pad.
Preferably, the through holes are identical to each other in size and shape.
Preferably, the cross-sectional shape of the through-hole is rectangular.
Preferably, one side of the through hole is 50 nm.
As mentioned above, the layout structure of the efuse fuse wire of the invention has the following beneficial effects: the efuse fuse layout structure adopted by the invention utilizes the multilayer metal and the through holes between the multilayer metal as pad layout design, so that the effective heat dissipation area in the vertical direction is formed, the layout area occupied on the plane is reduced, and a better heat dissipation effect can be obtained. Meanwhile, a parallel structure is formed among the multiple layers of metal through the through holes, and the current passing capacity can be increased.
Drawings
FIG. 1 is a schematic diagram of an efuse fuse layout structure in the prior art;
FIG. 2a is a schematic plan view of an efuse fuse layout structure in another prior art;
FIG. 2b is a schematic longitudinal cross-sectional view of the efuse fuse of FIG. 2 a;
FIG. 3 is a schematic diagram showing the layout and dimensions of Pad and via in the efuse fuse layout structure of the present invention;
FIG. 4 is a schematic longitudinal cross-sectional view of an efuse fuse of the present invention;
FIG. 5 is a diagram showing a simulation of thermal distribution when a conventional efuse fuse in the prior art is blown;
FIG. 6 is a schematic diagram illustrating a three-dimensional structure of a portion of an efuse fuse according to the present invention;
FIG. 7 is a schematic plan view illustrating pad sizes in an efuse fuse layout structure in the prior art;
FIG. 8 is a schematic plan view showing pad sizes in the efuse fuse layout structure of the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 3 to 8. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The invention provides a layout structure of an efuse fuse, as shown in fig. 6, fig. 6 shows a schematic three-dimensional structure diagram of a partial structure in the efuse fuse. Referring to fig. 4, fig. 4 is a schematic longitudinal sectional view of an efuse fuse according to the present invention.
The layout structure of the efuse fuse at least comprises the following components: an intermediate metal layer including a fuse body; the adjacent metal layers are respectively distributed above and below the middle metal layer and are adjacent to the middle metal layer, and the adjacent metal layers are connected with the fuse body on the middle metal layer through a through hole between the adjacent metal layers and the middle metal layer; the sub-adjacent metal layers are respectively distributed above and below the adjacent metal layers, and each sub-adjacent metal layer comprises a bonding pad; the bonding pad is connected with the adjacent metal layer through a through hole between the next adjacent metal layer and the adjacent metal layer.
The fuse body in the invention is in a strip shape, and the length of the fuse body in the plane of the intermediate metal layer is 1.16 microns; the pad is rectangular in shape and has a length of 0.32 microns and a width of 0.15 microns in the plane of the next adjacent metal layer.
In this embodiment, the middle metal layer where the fuse body is located shown in fig. 6 is M3, and two ends of the fuse body are connected to the adjacent metal layers through the through holes. Only a portion of the middle of the fuse body is shown in fig. 6. Referring to FIG. 4, FIG. 4 is a schematic longitudinal sectional view of an efuse fuse of the present invention. In this embodiment, the metal layer distributed above the middle metal layer M3 and adjacent to the middle metal layer M3 is the adjacent metal layer M4, and the metal layer distributed below the middle metal layer M3 and adjacent to the middle metal layer M3 is the adjacent metal layer M2. In this embodiment, the adjacent metal layer M4 is connected to the fuse body on the middle metal layer M3 through a via V3 located between the adjacent metal layer M4 and the middle metal layer M3; the adjacent metal layer M2 is connected to the fuse body on the middle metal layer M3 through a via V2 between the adjacent metal layer M2 and the middle metal layer M3. Further, as shown in fig. 6, in this embodiment, two ends of the fuse body are connected to the adjacent metal layer through the via, that is, the left end portion of the fuse body is connected to the adjacent metal layer M4 through the via V3, and the right end portion of the fuse body is connected to the adjacent metal layer M2 through the via V2.
Still further, in the present invention, two ends of the fuse body in this embodiment are respectively connected to the adjacent metal layers through a plurality of through holes distributed in a single row. That is, there are a plurality of vias V3 connected to the adjacent metal layer M4 and the middle metal layer M3, and the plurality of vias V3 are distributed in a single row at the left end portion of the fuse; there are also a plurality of vias V2 connected to the adjacent metal layer M2 and the middle metal layer M3, and the plurality of vias V2 are distributed in a single row at the right end portion of the fuse.
And furthermore, the through holes distributed in a single row are arranged at equal intervals on the respective planes. That is, the through holes V3 distributed in a single row are arranged at equal intervals on the plane where they are located, the through holes V2 distributed in a single row are also arranged at equal intervals on the plane where they are located, the through holes V4 distributed in a single row are arranged at equal intervals on the plane where they are located, and the through holes V1 distributed in a single row are arranged at equal intervals on the plane where they are located.
The layout structure of the efuse fuse further comprises the following steps: the sub-adjacent metal layers are respectively distributed above and below the adjacent metal layers, and each sub-adjacent metal layer comprises a bonding pad; as shown in fig. 4, the metal layer distributed above the adjacent metal layer M4 is the sub-adjacent metal layer M5, and the metal layer distributed below the adjacent metal layer M2 is the sub-adjacent metal layer M1. And the secondary adjacent metal layer M5 and the secondary adjacent metal layer M1 are respectively provided with a Pad, the Pad on the secondary adjacent metal layer M5 is Pad1, and the Pad on the secondary adjacent metal layer M1 is Pad 2.
The bonding pad is connected with the adjacent metal layer through a through hole between the next adjacent metal layer and the adjacent metal layer. And the adjacent metal layers are connected to the bonding pads of the next adjacent metal layers through a plurality of through holes distributed in a single row. The adjacent metal layer M4 is connected to the pad of the next adjacent metal layer M5 through a plurality of through holes V4 distributed in a single row; the adjacent metal layer M2 is connected to the pad of the next adjacent metal layer M1 through a plurality of vias V1 distributed in a single row.
As shown in fig. 4, the Pad1 is connected to the adjacent metal layer M4 through a via V4 located between the next adjacent metal layer M5 and the adjacent metal layer M4; the Pad2 is connected to the adjacent metal layer M2 through a via V1 located between the next adjacent metal layer M1 and the adjacent metal layer M2.
Further, the adjacent metal layers are connected to the next adjacent metal layers by a plurality of through holes distributed in a single row. As shown in fig. 4, the adjacent metal layer M4 is connected to the next adjacent metal layer M5 by a plurality of vias V4 distributed in a single row; the adjacent metal layer M2 is connected to the next adjacent metal layer M1 through a plurality of vias V1 distributed in a single row. Furthermore, the single row of through holes connecting the fuse body and the adjacent metal layers and the single row of through holes connecting the adjacent metal layers and the bonding pad are overlapped in a projection mode in the vertical direction.
Further, the size and shape of the through hole V1, the through hole V2, the through hole V3 and the through hole V4 are the same as each other. And the cross section shapes of the through hole V1, the through hole V2, the through hole V3 and the through hole V4 are rectangular. As shown in fig. 3, fig. 3 is a schematic diagram showing the layout and size of Pad and via in the efuse fuse layout structure of the present invention, wherein the width of the via in the same plane satisfies the minimum value of the via width under the process condition, and further, one side of the via is 50 nm. And the distance between the through holes connected with each metal layer is the minimum distance under the process condition.
The bonding pads are rectangular, and the bonding pads distributed on the sub-adjacent metal layers are the same in size and shape. That is, the Pad1 and the Pad2 are both rectangular in shape in their respective planes, and the Pad1 and the Pad2, both of which are rectangular in shape, are identical in size and shape to each other. In this embodiment, as shown in fig. 8, the pad has a length of 0.32 micrometers and a width of 0.15 micrometers in the plane of the sub-adjacent metal layers.
As shown in FIG. 5, FIG. 5 is a diagram showing a simulation of thermal distribution when a conventional efuse fuse in the prior art is blown. It can be seen that, in the conventional layout method, the fuse pad occupies a large area, so that the area of the efuse unit is increased, and the overall area of the efuse is enlarged. As shown in FIG. 7, FIG. 7 is a schematic plan view showing pad sizes in an efuse fuse layout structure in the prior art. In general, the vertical height of the pad in fig. 7 in the prior art is 3.29um (1.38um x 2+0.53um), if the length of the pad in the horizontal direction is 0.32um, which is the same as the width of the pad layout in the prior art group, the area of the pad layout in the vertical direction of the invention can reach 1.05um2, which is much larger than the area of the pad in the conventional layout (about 0.128um2), while the planar area (product of horizontal length and horizontal width) occupied by the pad in the horizontal direction in fig. 8 is only 0.32x0.15 ═ 0.048um2, which is much smaller than the area value of the conventional pad layout. Thus, the area of the efuse fuse in the present example is reduced from 0.62um2 to 0.46um 2.
As shown in fig. 3, the horizontal distance between the Pad1 and the Pad2 satisfies the minimum size limit under the process condition, and the length thereof is adjustable. And the width of the pad on each metal layer meets the minimum size limit under the process condition, and the length of the pad is adjustable.
In summary, the efuse fuse layout structure adopted by the invention utilizes multiple layers of metal and through holes therebetween as pad layout design, so as to form effective heat dissipation area in the vertical direction, thereby not only reducing the layout area occupied on the plane, but also obtaining better heat dissipation effect. Meanwhile, the multi-layer metal forms a parallel structure through the through hole and can increase the current passing capacity, so the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A layout structure of an efuse fuse is characterized by at least comprising:
an intermediate metal layer including a fuse body; adjacent metal layers which are distributed above and below the middle metal layer and are adjacent to the middle metal layer respectively, wherein the adjacent metal layers are connected with the fuse body on the middle metal layer through a through hole between the adjacent metal layers and the middle metal layer;
the sub-adjacent metal layers are respectively distributed above and below the adjacent metal layers, and each sub-adjacent metal layer comprises a bonding pad; the bonding pad is connected with the adjacent metal layer through a through hole between the sub-adjacent metal layer and the adjacent metal layer;
the fuse body is in a strip shape, and the length of the fuse body in the plane of the middle metal layer is 1.16 micrometers; the pad is rectangular in shape and has a length of 0.32 microns and a width of 0.15 microns in the plane of the next adjacent metal layer.
2. The layout structure of the efuse fuse according to claim 1, wherein: and the two ends of the fuse body are connected to the adjacent metal layers through the through holes.
3. The layout structure of the efuse fuse according to claim 2, wherein: the two ends of the fuse body are connected to the adjacent metal layers through a plurality of through holes which are distributed in a single row.
4. The layout structure of the efuse fuse according to claim 3, wherein: and the adjacent metal layers are connected to the next adjacent metal layers through a plurality of through holes distributed in a single row.
5. The layout structure of the efuse fuse according to claim 4, wherein: and the single row of through holes for connecting the fuse body and the adjacent metal layers and the single row of through holes for connecting the adjacent metal layers and the bonding pad are overlapped in a projection mode in the vertical direction.
6. The layout structure of the efuse fuse according to claim 5, wherein: the through holes distributed in a single row are arranged at equal intervals on the planes where the through holes are located.
7. The layout structure of the efuse fuse according to claim 6, wherein: the sub-adjacent metal layers respectively comprise 1 bonding pad.
8. The layout structure of the efuse fuse according to claim 7, wherein: the through holes are identical to each other in size and shape.
9. The layout structure of the efuse fuse according to claim 8, wherein: the cross section of the through hole is rectangular.
10. The layout structure of the efuse fuse according to claim 9, wherein: one side length of the through hole is 50 nm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010063863.9A CN111276478B (en) | 2020-01-20 | 2020-01-20 | Layout structure of efuse fuse |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010063863.9A CN111276478B (en) | 2020-01-20 | 2020-01-20 | Layout structure of efuse fuse |
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| CN111276478A CN111276478A (en) | 2020-06-12 |
| CN111276478B true CN111276478B (en) | 2022-06-14 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856250A (en) * | 2011-06-28 | 2013-01-02 | 格罗方德半导体公司 | Integrated circuit with fin-based fuse, and related fabrication method |
| CN107785420A (en) * | 2016-08-29 | 2018-03-09 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor devices and its manufacture method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8261229B2 (en) * | 2010-01-29 | 2012-09-04 | Xilinx, Inc. | Method and apparatus for interconnect layout in an integrated circuit |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856250A (en) * | 2011-06-28 | 2013-01-02 | 格罗方德半导体公司 | Integrated circuit with fin-based fuse, and related fabrication method |
| CN107785420A (en) * | 2016-08-29 | 2018-03-09 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor devices and its manufacture method |
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