CN111276332A - Guide pin type capacitor and production method thereof, integrated circuit board and electronic product - Google Patents
Guide pin type capacitor and production method thereof, integrated circuit board and electronic product Download PDFInfo
- Publication number
- CN111276332A CN111276332A CN202010038548.0A CN202010038548A CN111276332A CN 111276332 A CN111276332 A CN 111276332A CN 202010038548 A CN202010038548 A CN 202010038548A CN 111276332 A CN111276332 A CN 111276332A
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- CN
- China
- Prior art keywords
- negative
- positive
- conductor
- nail
- type capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- 239000011888 foil Substances 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 238000004804 winding Methods 0.000 claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 6
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 4
- 239000003792 electrolyte Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a production method of a guide pin type capacitor, which comprises the following steps: electrically connecting a positive foil with a positive conductive nail through a positive conductor, electrically connecting a negative foil with a negative conductive nail through a negative conductor, and respectively winding the positive conductor and the negative conductor through electrolytic paper; step two, winding the positive conductor and the negative conductor which are wound by the electrolytic paper in the step one, and gluing tapes on the positive conductor and the negative conductor to form elements; step three, putting the element into an aluminum electrolyte to be soaked completely, sleeving a rubber plug on the soaked element, packaging the element into an aluminum shell, and exposing the positive conductive connecting nail and the negative conductive connecting nail out of the same end of the aluminum shell after packaging; and step four, mounting a base plate at the end of the aluminum shell with the positive conductive connecting nail and the negative conductive connecting nail, and bending the positive conductive connecting nail and the negative conductive connecting nail on the same end face of the mounting base plate. After the capacitor produced by the production method is installed on the integrated circuit board, the problems of twice high-temperature damage and higher cost of the integrated circuit board caused by horizontal installation of the capacitor are solved.
Description
Technical Field
The invention belongs to the technical field of capacitor production, and particularly relates to a guide pin type capacitor, a production method thereof, an integrated circuit board and an electronic product.
Background
In industrial production, especially in the production of electronic products, an important electronic component guide pin type capacitor is often used. Along with the development of science and technology, the PCB integrated circuit board in the electronic product requires to be thinner and thinner, and the thinning purpose of integrated circuit is realized for horizontal installation through designing the electric capacity in the prior art, however, the cost of labor that horizontal installation electric capacity brought is higher, and the installation is that the line passes through reflow soldering and accomplishes through wave soldering, and the installation can often bring the harm to components and parts itself because both sides high temperature toast like this, and also bring extravagant energy, problem that the cost increases because need two kinds of welding.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art.
The invention aims to provide a production method of a guide pin type capacitor, which comprises the following steps:
electrically connecting a positive foil with a positive conductive nail through a positive conductor, electrically connecting a negative foil with a negative conductive nail through a negative conductor, and respectively winding the positive conductor and the negative conductor through electrolytic paper;
step two, winding the positive conductor and the negative conductor which are wound by the electrolytic paper in the step one, and gluing tapes on the positive conductor and the negative conductor to form elements;
step three, putting the element into an aluminum electrolyte to be soaked completely, sleeving a rubber plug on the soaked element, packaging the element into an aluminum shell, and exposing the positive conductive connecting nail and the negative conductive connecting nail out of the same end of the aluminum shell after packaging;
and step four, mounting a base plate at the end of the aluminum shell with the positive conductive connecting nail and the negative conductive connecting nail, and bending the positive conductive connecting nail and the negative conductive connecting nail on the same end face of the mounting base plate.
And further, after the step three, packaging the aluminum shell, and sleeving a layer of rubber on the outer surface of the aluminum shell.
Further, after the aluminum shell is packaged in the third step, the element is aged and charged.
Further, in the fourth step, the positive conductive connecting nail and the negative conductive connecting nail are respectively bent on the same end face of the installation seat plate along opposite directions.
Further, the seat plate is made of insulating materials.
The invention also provides a guide pin type capacitor, which is produced by the production method of the guide pin type capacitor.
The invention also provides an integrated circuit board which comprises the guide pin type capacitor.
The invention also provides an electronic product, which comprises the integrated circuit board.
The invention has the advantages that the mounting base plate is arranged at the outer end of the aluminum shell through the fourth step, the positive conductive connecting nail and the negative conductive connecting nail are bent on the same end surface of the mounting base plate, the capacitor manufactured by the method is mounted on the integrated circuit board, the height along the direction vertical to the integrated circuit board is lower, and the occupied space is smaller, so that the integrated circuit board is thinner, the characteristic of miniaturization is realized, and the problems of twice high-temperature damage and higher cost caused by horizontal mounting of the capacitor are solved. The electronic product with the guide pin type capacitor has the advantages of small volume and low cost.
The invention also provides an electronic product which comprises the integrated circuit board.
The specific principles and other advantages of the present invention that achieve the above-described effects can be seen in the embodiments described herein, and will not be described in detail herein.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
The following examples of the present invention are described in detail for the purpose of illustration only and are not to be construed as limiting the invention.
Unless otherwise specified, the terms "upper, lower, bottom, top, vertical, overlooking, horizontal, top, bottom" and the like in this application shall not be construed as limiting the technical solutions of the present invention.
In an embodiment of the present invention, the lead-pin type capacitor is a lead-pin type aluminum electrolytic capacitor. Are commonly used on integrated circuit boards.
The production method comprises the following steps: the method comprises the following steps of firstly, electrically connecting positive foil with a positive conducting nail through a positive conductor, electrically connecting negative foil with a negative conducting nail through a negative conductor, and respectively winding the positive conductor and the negative conductor through electrolytic paper.
And step two, winding the positive conductor and the negative conductor which are wound by the electrolytic paper in the step one, and gluing the tapes to form elements. The element is commonly called a capacitor cell.
And step three, putting the element into an aluminum electrolyte to be soaked completely, sleeving a rubber plug on the soaked element, packaging the element into an aluminum shell, and exposing the positive conductive connecting nail and the negative conductive connecting nail out of the same end of the aluminum shell after packaging. The positive guide connecting nail and the negative guide connecting nail are arranged outside the aluminum shell in an exposed mode, and the guide connection to the outside is achieved.
And step four, mounting a base plate at the end of the aluminum shell with the positive conductive connecting nail and the negative conductive connecting nail, and bending the positive conductive connecting nail and the negative conductive connecting nail on the same end face of the mounting base plate. Through bending, the capacitor is mounted on the integrated circuit board, and the mounting space is reduced.
After the guide pin type capacitor produced and obtained by the method is installed on an integrated circuit board, the cost is lower, and because twice welding is not needed, the damage to the performance of the capacitor caused by high welding temperature is reduced.
Preferably, after the step three, the aluminum shell is packaged, and a layer of rubber is sleeved on the outer surface of the aluminum shell. Thereby the conductive pin type capacitor is insulated from the outside.
Preferably, after the packaging to the aluminum shell in the step three, the element is subjected to aging charging. And the defective products are removed in the aging and charging purpose, and the oxide films are repaired at the damaged positions of the positive foil and the negative foil in the manufacturing process, so that the products with better quality are obtained.
Preferably, in the fourth step, the positive connecting pin and the negative connecting pin are respectively bent on the same end face of the mounting seat plate along opposite directions. The positive conductive connecting nail and the negative conductive connecting nail are bent along opposite directions, so that the integrated circuit board can be conveniently mounted on the back. The positive connecting pin and the negative connecting pin are usually made of materials with good bending performance.
Preferably, the seat plate is made of insulating materials. After the seat plate made of insulating materials is installed on the integrated circuit board, the effect of insulating and isolating the integrated circuit board is achieved.
An embodiment of the present invention provides a lead pin type capacitor, which is produced by the method for producing the lead pin type capacitor according to the embodiment. The capacitor has low production cost and does not need high-temperature welding on two sides, thereby reducing the occurrence of damage in the installation process.
An embodiment of the present invention further provides an integrated circuit board, which includes the above-mentioned pin type capacitor. The integrated circuit board with the capacitor can achieve the purpose of being thinner and can achieve installation with lower cost.
An embodiment of the present invention further provides an electronic product, which includes the integrated circuit board according to the embodiment. The electronic product with the integrated circuit board has the advantage of smaller volume, and the production and manufacturing cost is lower.
In summary, according to the method for producing the guide pin type capacitor of the invention, the mounting base plate is arranged at the outer end of the aluminum shell through the fourth step, the positive conductive connecting nail and the negative conductive connecting nail are bent on the same end surface of the mounting base plate, and the capacitor produced by the method is mounted on the integrated circuit board, so that the height along the direction vertical to the integrated circuit board is lower, the occupied space is smaller, the integrated circuit board is thinner, the miniaturization characteristic is realized, and the problems of twice high-temperature damage and higher cost caused by horizontally mounting the capacitor are reduced. The electronic product with the guide pin type capacitor has the advantages of small volume and low cost.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. A method of manufacturing a pin-type capacitor, the method comprising:
electrically connecting a positive foil with a positive conductive nail through a positive conductor, electrically connecting a negative foil with a negative conductive nail through a negative conductor, and respectively winding the positive conductor and the negative conductor through electrolytic paper;
step two, winding the positive conductor and the negative conductor which are wound by the electrolytic paper in the step one, and gluing tapes on the positive conductor and the negative conductor to form elements;
step three, putting the element into an aluminum electrolyte to be soaked completely, sleeving a rubber plug on the soaked element, packaging the element into an aluminum shell, and exposing the positive conductive connecting nail and the negative conductive connecting nail out of the same end of the aluminum shell after packaging;
and step four, mounting a base plate at the end of the aluminum shell with the positive conductive connecting nail and the negative conductive connecting nail, and bending the positive conductive connecting nail and the negative conductive connecting nail on the same end face of the mounting base plate.
2. The method of claim 1 further comprising sleeving a rubber layer over the outer surface of the aluminum shell after step three of encapsulating the aluminum shell.
3. The method of manufacturing a lead-type capacitor of any of claims 1 or 2, wherein said element is aged and charged after being packaged into an aluminum case in step three.
4. The method for manufacturing a lead-type capacitor as claimed in claim 1, wherein in the fourth step, the positive lead pin and the negative lead pin are respectively bent in opposite directions on the same end face of the mounting plate.
5. A method of manufacturing a lead-type capacitor as claimed in claim 1 wherein said base plate is made of insulating material.
6. A guide pin type capacitor, characterized in that the guide pin type capacitor is produced by the method for producing a guide pin type capacitor of any one of claims 1 to 5.
7. An integrated circuit board, characterized in that it comprises a pin-type capacitor according to claim 6.
8. An electronic product, characterized in that the electronic product comprises the integrated circuit board of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010038548.0A CN111276332A (en) | 2020-01-14 | 2020-01-14 | Guide pin type capacitor and production method thereof, integrated circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010038548.0A CN111276332A (en) | 2020-01-14 | 2020-01-14 | Guide pin type capacitor and production method thereof, integrated circuit board and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111276332A true CN111276332A (en) | 2020-06-12 |
Family
ID=71003012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010038548.0A Pending CN111276332A (en) | 2020-01-14 | 2020-01-14 | Guide pin type capacitor and production method thereof, integrated circuit board and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111276332A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2884478Y (en) * | 2006-03-15 | 2007-03-28 | 珠海华冠电容器有限公司 | Gilled aluminium electrolysis capacity |
| CN101197213A (en) * | 2006-12-05 | 2008-06-11 | 三洋电机株式会社 | Electrolytic capacitor |
| CN202093985U (en) * | 2011-05-18 | 2011-12-28 | 丰宾电子（深圳）有限公司 | Aluminum electrolytic capacitor |
-
2020
- 2020-01-14 CN CN202010038548.0A patent/CN111276332A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2884478Y (en) * | 2006-03-15 | 2007-03-28 | 珠海华冠电容器有限公司 | Gilled aluminium electrolysis capacity |
| CN101197213A (en) * | 2006-12-05 | 2008-06-11 | 三洋电机株式会社 | Electrolytic capacitor |
| CN202093985U (en) * | 2011-05-18 | 2011-12-28 | 丰宾电子（深圳）有限公司 | Aluminum electrolytic capacitor |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200612 |