KR100900570B1 - Terminal for coin-type cell and method for manufacturing the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal for a coin-type battery element and a method of manufacturing the same, and more particularly, a terminal having a plating film formed on an upper surface, a lower surface, and a side surface of a soldering part, and a raw material base as a method of manufacturing the terminal. A first cutting process of cutting the plate to form a soldering portion; A plating process of plating a plating material on upper, lower and side surfaces of the soldering portion; And a second cutting step of cutting parts other than the soldering part of the raw material base plate to have a shape of a terminal. According to the present invention, the plating material is plated on all surfaces of the soldering portion, that is, the upper surface and the lower surface, as well as the side surface, and has an effect of having excellent soldering characteristics during surface mounting using the reflow method. Accordingly, short circuits are prevented during external impact, and stable mounting on the PCB substrate is possible.

Terminals, Soldering, Plating, Reflow, PCBs, Cells, Capacitors

Description

Coin-type battery element terminal and manufacturing method thereof {TERMINAL FOR COIN-TYPE CELL AND METHOD FOR MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal for a coin-type battery element and a method of manufacturing the same, and more particularly, to plate a plating film on all surfaces of a soldering part, thereby surface mounting using a reflow process. The present invention relates to a terminal for a coin-type battery element and a method of manufacturing the same, which improve soldering characteristics and prevent a short circuit during an external impact and enable stable mounting on a PCB substrate.

Battery elements such as lithium secondary batteries and electric double layer capacitors are frequently used for the purpose of backing up portable devices and starting RTCs. Such battery elements have a coin-type form, and terminals are welded to the body. This will be described with reference to the accompanying drawings.

1 is a perspective view of a coin-type battery device (such as a lithium secondary battery or an electric double layer capacitor) according to the prior art, and FIG. 2 is a front configuration view of the battery device viewed in the X direction shown in FIG. 1. 3 is a flowchart illustrating a method for manufacturing a terminal according to the prior art.

First, referring to FIGS. 1 and 2, a coin type battery element (such as a lithium secondary battery or an electric double layer capacitor) generally includes an outer case including an upper cap 1 and a lower can 2, and the upper cap ( A gasket 3 packed for insulation and sealing between 1) and the lower can 2. At this time, two electrodes which are sufficiently impregnated with an electrolytic solution are attached to the inner surfaces of the upper cap 1 and the lower can 2, and a separator is interposed between the two electrodes, and then a gasket is interposed. (3) is packed and assembled. In addition, terminals 4 are welded and attached to the outer case, specifically, the upper cap 1 and the lower can 2, respectively.

The coin-type battery device as described above is attached to the PCB substrate together with the memory device for use as a backup power source. At this time, in attaching the coin-type battery element on the PCB substrate, a manual soldering method using the terminal 4 and the substrate by iron has been mainly used.

However, in recent years, as miniaturization and high functionality of portable devices have progressed, it is necessary to mount many electronic components on a PCB substrate, and it is difficult to secure a gap between the components for soldering. In addition, this manual soldering method requires a lot of manpower and time, so automation is required. Accordingly, in attaching the coin-type battery element on the PCB substrate, a reflow process, which is a method of surface mounting, has been attempted.

In the reflow method, a solder cream or the like is applied to a portion to be soldered on a PCB substrate, and then an electronic component is supplied to the portion, and the soldering portion is more than the melting point of the solder cream (for example, , Pb-Free is a method of soldering electronic components on a PCB substrate by dissolving the solder cream while passing in a high temperature atmosphere set to 250 ~ 270 ℃). In order to solder the coin type battery elements (lithium secondary battery and electric double layer capacitor, etc.) on the substrate accurately and quickly using such a reflow method, generally, the end portions of the terminal 4 of the battery element, that is, the soldering portions ( In S), the plating film C is formed. This plating film C enables soldering of the terminal 4 and the substrate. Specifically, the terminal 4 is mainly made of SUS material, SUS is difficult to solder directly on the substrate, but the soldering becomes easier when the plating material such as tin (Sn) is plated.

Generally, the terminal 4 is manufactured by the following method conventionally.

Referring to FIG. 3, in manufacturing a conventional terminal 4, first, a masking plating process is performed on a lower portion of a raw material base plate 4 ′ made of SUS material, that is, a portion where a soldering portion S is to be formed. After the plated film C is formed, it is cut and manufactured to have the shape of the terminal 4 to be realized through a press cutting process. That is, the plating process is first performed, and then the cutting process is performed.

However, the terminal 4 completed and manufactured by the conventional method as described above has a problem in that a soldering characteristic is not good in a reflow process, so that a short circuit occurs when an external impact occurs, and stable mounting on a PCB substrate is difficult. Specifically, the terminal 4, which is completed and manufactured according to the prior art, has a plating material on the upper surface 4a and the lower surface 4b of the soldering part S, as shown in FIGS. 1 and 2. There is no plating material on the side surface 4c. That is, the plating film C is not formed in the side surface 4c by the cutting process performed after the plating process. Accordingly, when put into the reflow process for soldering bonding on the PCB substrate, the solder cream is not evenly applied to all surfaces of the soldering portion S of the terminal 4, the upper surface (4a) and lower surface There is a problem in that it is applied only to (4b) and does not have good soldering properties. That is, in the reflow process, the upper surface 4a and the lower surface 4b of the soldering part S have soldering characteristics, but the soldering characteristics are not provided on the side surface 4c on which the plating film C is not formed. There is a problem. Accordingly, the terminal 4 according to the related art does not have good soldering characteristics as described above, that is, the side 4c does not have soldering characteristics, and thus short circuit occurs during external impact, and it is difficult to mount on the substrate. have.

The present invention is to solve the problems of the prior art as described above, by plating so that the plating film (C) is formed on all surfaces of the soldering portion (S), the soldering characteristics are improved to prevent short circuit during external impact, It is an object of the present invention to provide a terminal for a coin-type battery element and a method for manufacturing the same, which can be stably mounted on a phase.

In order to achieve the above object, the present invention provides a coin-type battery element terminal having a plating film formed on all surfaces of the soldering portion. Specifically, the present invention provides a terminal formed with a plating film on the upper and lower surfaces of the soldering portion as well as the side surface.

In addition, the present invention is a method of manufacturing a terminal that can be plated film formed on all surfaces (upper surface, lower surface and side) of the soldering portion as described above,

A first cutting process of cutting the raw material base plate to form a soldering portion;

A plating process of plating a plating material on all surfaces (upper surface, lower surface and side surface) of the soldering portion;

And a second cutting step of cutting parts other than the soldering part of the raw material base plate to have a terminal shape.

According to the present invention, the plating material is plated on all surfaces of the soldering portion, that is, the upper surface and the lower surface, as well as the side surface, and has an effect of having excellent soldering coupling properties when surface mounting using the reflow method. Accordingly, short circuits are prevented during external impact, and stable mounting on the PCB substrate is possible.

Hereinafter, with reference to the accompanying drawings will be described the present invention in more detail.

FIG. 4 is a perspective view of a coin-type battery device (such as a lithium secondary battery or an electric double layer capacitor) with a terminal according to the present invention, and FIG. 5 is a front configuration view of the battery device viewed in the X direction shown in FIG. 4. 6 is a flowchart illustrating a method of manufacturing a terminal according to the present invention.

As shown in FIGS. 4 and 5, the terminal 40 according to the present invention is used by being welded and attached to a body such as a coin-type battery element (a lithium secondary battery or an electric double layer capacitor). Specifically, a coin-type battery including an outer case consisting of an upper cap 10 and a lower can 20, and a gasket 3 packed for insulation and sealing between the upper cap 10 and the lower can 20. It is usefully used as the positive and negative terminals of the device.

Terminal 40 according to the present invention may be made of a SUS material as usual, the plated film (C) is formed on one end portion thereof, that is, the soldering portion (S) to be soldered during surface mounting using the reflow method. In this case, the plating film C is formed on all surfaces of the soldering portion S, that is, the upper surface 40a and the lower surface 40b of the soldering portion S, as well as on the side surface 40c. In the present invention, "side" means all surfaces except for the upper surface 40a and the lower surface 40b of the soldering portion S. Specifically, in FIG. 4, a plane viewed from the A direction, a plane viewed from the B direction, and a plane viewed from the C direction.

Plating material constituting the plated film (C) is included in the present invention as long as it has a bonding cream and a bonding property, preferably, such as tin (Sn) excellent in solder cream and bonding properties (Sn) This can be usefully selected. At this time, the solder cream in the present invention is not particularly limited, for example, lead (Pb); Alloys including lead (Pb); Metals having a relatively lower melting point than other metals such as lead (Pb); And alloys thereof; And the like, and may be usefully applied to the present invention as long as it can be applied to a reflow process. In addition, the plating film (C) is preferably made of two layers, and the nickel (Ni) base layer formed by plating nickel (Ni) on the main body of the terminal 40 (eg, SUS material); The tin (Sn) upper layer is formed by plating tin (Sn) on the nickel (Ni) underlayer. When the plating film C is made of the nickel (Ni) base layer and the tin (Sn) top layer as described above, good bonding force is achieved. Specifically, nickel (Ni) has excellent bonding (plating) properties for both SUS material and tin (Sn). Accordingly, the solder (Sn) having good bonding properties with the solder cream is plated with a good bonding force on the main body of the terminal 40 made of SUS through the nickel (Ni) underlayer.

The terminal 40 according to the present invention is formed on all surfaces of the soldering portion S, that is, the upper surface 40a and the lower surface 40b of the soldering portion S as well as the side surface 40c, thereby providing excellent soldering characteristics. Has That is, when the surface is mounted using the reflow method (automatic soldering method), molten solder cream is evenly applied to all surfaces of the soldering part S, and thus has excellent soldering coupling characteristics. Accordingly, it is firmly soldered to the PCB substrate to prevent short circuit during external impact, and stable mounting on the PCB substrate is possible.

The terminal 40 according to the present invention as described above is manufactured so that the plating film (C) is formed on all surfaces of the soldering portion (S) through the manufacturing method of the present invention described below. Hereinafter, a method of manufacturing a terminal according to the present invention will be described in detail with reference to FIG. 6.

The terminal manufacturing method according to the present invention includes at least a first cutting process, a plating process and a second cutting process.

As shown in FIG. 6, the first cutting process is a process of cutting the lower end portion of the raw material base plate 40 ′ so that the soldering portion S is formed. Specifically, it is a step of forming a hollow space P having a predetermined shape by cutting and removing a portion around the soldering part S to have a shape of the soldering part S as illustrated in the drawing. The side surface 40c of the soldering part S is exposed to the outside by the first cutting process. Accordingly, the plating film C is formed on the side surface 40c as well as the upper surface 40a and the lower surface 40b of the soldering part S in the subsequent plating process.

The plating process is a process of plating a plating material on all surfaces of the soldering portion S, that is, the upper surface 40a, the lower surface 40b, and the side surface 40c of the soldering portion S. In this plating process, nickel is plated on the soldering portion S of the raw material base plate 40 'so that the plating film C is formed of a nickel (Ni) base layer and a tin (Sn) top layer. It is preferable to include the (Ni) base layer plating process, and the tin (Sn) upper layer plating process which plating tin (Sn) on the said nickel (Ni) base layer. In this case, the nickel (Ni) base layer plating process may be performed before or after the first cutting process. That is, the terminal manufacturing method according to the present invention is a nickel (Ni) base layer plating process of first plating nickel (Ni) on the base plate 40 'according to the first embodiment of the present invention-> first cutting process -> It can be carried out in the order of the tin (Sn) plating process, or in the order of the first cutting process-> nickel (Ni) base layer plating process-> tin (Sn) plating process according to the second embodiment of the present invention. Can be.

The plating process as described above may use a plating method that is commonly used, for example, a masking plating method, a jig plating method and the like may be used.

In the second cutting process, after the plating process is performed as described above, the remaining portion of the raw material base plate 40 ', that is, the portion other than the soldering part S is cut to have a shape of the terminal 40 to be realized. It is a process. After the second cutting process, the plating film C is formed on the side surface 40c as well as the upper surface 40a and the lower surface 40b of the soldering part S according to the present invention. After the second cutting process as described above, a final cutting process, that is, a process of cutting the Y line in FIG. 6 may be performed.

In addition, the plating process is not particularly limited, but may be performed to form a plating film (C) having a thickness of 1 μm or more, specifically, 1 to 12 μm, and preferably, a plating film having a thickness of 2 to 8 μm ( C) can be implemented. In addition, the first and second cutting process may be performed using a press method using a press cutting device. In FIG. 6, reference numeral H denotes workability in the manufacturing process as described above, and is used to fix the base plate 40 ′ in the cutting device and to transfer it at a predetermined interval during the first and second cutting processes. It is an index hole.

Hereinafter, experimental examples of the present invention are illustrated.

Example 1

First, an electric double layer capacitor was prepared as follows.

An active material composed of 84 wt% of activated carbon, 10 wt% of a conductive agent (carbon black), and 6 wt% of a binder (polytetrafluoroethylene; PTEE) was prepared in a sheet state, and then cut into a diameter of 3 mm and a thickness of 0.6 mm to prepare a polarizable electrode. It was. In addition, a conductive adhesive was applied to inner surfaces of the upper cap 10 and the lower can 20 to attach the cut polarizable electrodes. In this way, the upper cap 10 and the lower can 20 to which the polarizable electrodes were attached were dried in a high temperature furnace. Next, the electrolytic solution (1 mole of tetra ethyl ammonium tetrafluoroborate (TEABF4) in a well-controlled dry room having a dew point of -40 ° C. or lower was attached to the upper cap 10 and the lower can 20 to which the dried electrodes were attached. Was dissolved in 1 L of propylene carbonate (PC)). The separator was placed on the upper cap 10 containing the electrode impregnated with the electrolytic solution, and a gasket 30 made of polyether ether ketone was inserted. Then, the upper cap 10 assembled with the gasket 30 was well covered with the lower can 20 prepared in advance, and a coin-type electric double layer capacitor as shown in FIGS. 4 and 5 was manufactured through a clipping sealing process. The coin-type electric double layer capacitor was 4mm in diameter and 1.4mm in height, and had a capacity of 2.5V 0.08F.

In addition, the plating film C is formed on all surfaces of the soldering portion S of the terminal 40, that is, the upper surface 40a, the lower surface 40b, and the side surface 40c, as shown in FIG. 6. However, the terminal 40 was first subjected to nickel (Ni) -base plating on the main body (SUS material), and then subjected to primary press cutting. Then, tin (Sn) was plated by a tape masking plating method, and the remaining part was press cut again to complete and manufacture the terminal 40. (Ni-base layer plating process-> first cutting process- > Sn plating process-> 2nd cutting process)

The terminal 40 manufactured as described above was attached to the coin type electric double layer capacitor prepared above using a laser welding machine.

Next, surface mount the capacitor specimen with the terminal 40 on the PCB substrate through the reflow method, and evaluate the soldering characteristics (the number of soldering failures and the Sn soldering area relative to the area of the terminal). It is shown in [Table 1].

Example 2

In manufacturing the terminal 40 in comparison with the first embodiment, after the primary press cutting to the main body of the terminal 40 (SUS material), Ni-base plating on the soldering portion (S) by the masking plating method And tin (Sn) plating was carried out in the same manner as in Example 1 except that the sequential plating was carried out and the remaining part was press-cut again. (First cutting process-> Ni-base layer plating process-> Sn plating Process-> 2nd Cutting Process)

Comparative Example 1

In comparison with the first embodiment, the terminal was manufactured in the same manner as in the first embodiment except that the terminal was manufactured in the same manner as shown in FIG. 3. At this time, after the Ni-base plating was performed on the terminal body (SUS material), tin (Sn) plating was performed, but the thickness of the tin (Sn) plating was 3 μm.

Comparative Example 2

Compared with Comparative Example 1, it was carried out in the same manner as in Comparative Example 1 except that the thickness of the tin (Sn) plating was 4㎛.

Ni-Unplated Sn plating Number of specimens (EA) ^{# Of} soldering failures after reflow Sn soldering area to terminal area after reflow Example 1 0.5 μm 4㎛ 200 0/200 90-95% Example 2 0.7 μm 3㎛ 200 0/200 90-95% Comparative Example 1 0.5 μm 4㎛ 200 2/200 70-75% Comparative Example 2 0.7 μm 3㎛ 200 3/200 70-75%  # 1: Short circuit due to poor soldering or separation from PCB side

As shown in [Table 1], in manufacturing the terminal, according to the present invention, the Ni-base layer plating process-> first cutting process-> Sn plating process-> second cutting process for the entire terminal material (Example 1) or by performing the first cutting process-> Ni-base layer plating process-> Sn plating process-> 2nd cutting process (Example 2), ie, all surfaces of the soldering part S, ie, When tin (Sn) is plated on the upper surface (40a), the lower surface (40b) and the side surface (40c), it can be seen that the area of soldering is increased compared to the comparative example according to the conventional method, short circuit after the reflow process It was confirmed that the number of the soldering or the soldering failure is small.

As described above, in the present invention, the plating material is plated on all surfaces of the soldering portion S, that is, the upper surface 40a and the lower surface 40b as well as the side surface 40c, and thus the surface using the reflow method. It has the effect of having excellent soldering characteristics during mounting. Accordingly, short circuits are prevented during external impact, and stable mounting on the PCB substrate is possible. In addition, when the surface is mounted using the reflow method, it is not necessary to re-introduce the reflow process due to the soldering failure, thereby preventing deterioration of the battery elements (battery, capacitors, etc.) and deterioration of electrical characteristics. .

1 is a perspective view of a coin-type battery device according to the prior art.

2 is a front configuration diagram of the battery device shown in FIG.

3 is a process chart for explaining a method for manufacturing a terminal according to the prior art.

4 is a perspective view of a coin-type battery device with a terminal according to the present invention.

5 is a front configuration diagram of the battery device shown in FIG. 4.

6 is a flowchart illustrating a method of manufacturing a terminal according to the present invention.

<Description of Symbols for Major Parts of Drawings>

10: upper cap 20: lower can

30: gasket 40: terminal

40a: upper surface 40b: lower surface

40c: side S: soldering part

C: plating film

Claims (5)

delete delete A first cutting process of cutting the raw material base plate to form a soldering portion; A plating process of plating a plating material on upper, lower and side surfaces of the soldering portion; And a second cutting step of cutting portions other than the soldering portions of the raw material base plate to have a shape of a terminal. The method of claim 3, The plating process may include a nickel (Ni) base layer plating process for plating nickel (Ni) on a soldering part, and a tin (Sn) upper layer plating process for plating tin (Sn) on the nickel (Ni) base layer. Method of manufacturing a terminal for a coin-type battery element comprising a. A nickel (Ni) base layer plating process of plating nickel (Ni) on a raw material base plate; A first cutting process of cutting the raw material base plate to form a soldering part; A tin (Sn) upper layer plating process of plating tin (Sn) on the top, bottom and side surfaces of the soldering part; And a second cutting step of cutting portions other than the soldering portions of the raw material base plate to have a shape of a terminal.

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