CN111266695A - Moving platform for electronic chip welding - Google Patents
Moving platform for electronic chip welding Download PDFInfo
- Publication number
- CN111266695A CN111266695A CN202010247106.7A CN202010247106A CN111266695A CN 111266695 A CN111266695 A CN 111266695A CN 202010247106 A CN202010247106 A CN 202010247106A CN 111266695 A CN111266695 A CN 111266695A
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- Prior art keywords
- axis
- axis moving
- disposed
- base plate
- ball screw
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
Abstract
The invention discloses a moving platform facing to electronic chip welding, which comprises an X-axis moving platform, a Y-axis moving platform and a Z-axis moving platform, wherein the Y-axis moving platform comprises a left Y-axis moving platform and a right Y-axis moving platform arranged in parallel with the left Y-axis moving platform; the invention has the beneficial effects that: the cooperation of the X, Y, Z three movable stages can realize the automatic welding of the electronic chip.
Description
Technical Field
The invention relates to the technical field of electronic chip welding, in particular to a mobile platform for electronic chip welding.
Background
Electronic chip bonding is an advanced manufacturing technology that has emerged in recent years, which has revolutionized the field of electronics and has also attracted widespread attention throughout the world. Advances in the microelectronics industry have facilitated the development of micro-interconnect processes and devices. At present, electronic welding mainly depends on manual work, and welding is carried out through an industrial robot, but the efficiency of manual work is low, a large amount of human resources are required to be consumed, the price of the robot is expensive, and the economic benefit is low.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a mobile platform for electronic chip welding, which is reasonable in structural design.
The technical scheme of the invention is as follows:
a movable platform for welding an electronic chip is characterized by comprising an X-axis movable platform, a Y-axis movable platform and a Z-axis movable platform, wherein the Y-axis movable platform comprises a left Y-axis movable platform and a right Y-axis movable platform arranged in parallel with the left Y-axis movable platform, the X-axis movable platform is arranged between the left Y-axis movable platform and the right Y-axis movable platform and realizes the movement of the X-axis movable platform in the Y-axis direction through the Y-axis movable platform, the Z-axis movable platform is fixedly arranged on the X-axis movable platform and realizes the movement of the Z-axis movable platform in the X-axis direction through the X-axis movable platform, and a welding device is arranged on the Z-axis movable platform and realizes the movement of the welding device in the Z-axis direction through the Z-axis movable platform.
The moving platform for welding the electronic chip is characterized in that the X-axis moving platform deck comprises an X-axis bottom plate, a first servo motor arranged on the X-axis bottom plate, first supporting seats arranged at two ends of the X-axis bottom plate, a first ball screw arranged on the first supporting seats, a first screw nut arranged on the first ball screw and a driven sprocket arranged at the tail end of the first ball screw, wherein a driving sprocket is arranged on the first servo motor, the driving sprocket and the driven sprocket are connected through chain transmission, first guide rails are arranged on the X-axis bottom plate in parallel at positions close to two sides of the ball screw, a first sliding block is arranged on the first guide rails, and the first screw nut is fixedly connected with the first sliding block.
The moving platform for welding the electronic chip is characterized in that the left Y-axis moving carrying platform comprises a first Y-axis bottom plate, a second guide rail arranged on the first Y-axis bottom plate and a second sliding block arranged on the second guide rail, and first supporting columns are respectively arranged at two ends of the bottom of the first Y-axis bottom plate.
The moving platform for welding the electronic chip is characterized in that the right Y-axis moving platform deck comprises a second Y-axis base plate, a second supporting column arranged at the bottom of the Y-axis base plate, a second servo motor arranged at one end of the Y-axis base plate, second supporting seats arranged at two ends of the second Y-axis base plate, a second ball screw arranged on the second supporting seats and a second screw nut arranged on the second ball screw, the second servo motor and the second ball screw are in transmission connection through a first elastic coupling, a third guide rail is arranged on the second Y-axis base plate in parallel at a position close to the second ball screw, and a third sliding block is arranged on the third guide rail in a matched mode.
The moving platform for welding the electronic chip is characterized in that the Z-axis moving platform deck comprises a side frame, a third servo motor arranged at the top of the side frame, a third ball screw in transmission connection with the third servo motor, a third screw nut arranged on the third ball screw, a connecting plate fixed on the third screw nut and a bottom plate arranged at the bottom of the connecting plate, wherein the third servo motor is in transmission connection with the third ball screw through a second elastic coupling.
The utility model provides a moving platform towards electronic chip welded, its characterized in that, welding set is including sending tin machine and welding module, send the tin machine setting on the bottom plate, be equipped with L type mounting panel near sending tin machine position department on the bottom plate, the welding module sets up on L type mounting panel, be equipped with the regulation mounting hole on the L type mounting panel to can realize the regulation to welding module horizontal position and vertical position through adjusting the mounting hole.
The mobile platform for welding the electronic chip is characterized in that a camera is fixedly arranged on the third servo motor, and the working state of the welding device can be monitored in real time through the camera.
The mobile platform for welding the electronic chip is characterized in that the bottom plate is provided with a position sensor, and the three-dimensional coordinate position of the bottom plate can be monitored in real time through the position sensor.
The invention has the beneficial effects that: the automatic welding of the electronic chip can be realized through the cooperative matching of X, Y, Z three moving carriers; in addition, X, Y, Z three movable carrying platforms are driven by ball screws, the welding position precision is higher, and meanwhile, the working state of the welding module can be remotely monitored in real time by an additional camera.
Drawings
FIG. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic overall front view of the present invention;
FIG. 3 is a schematic diagram of an X-axis mobile carrier structure according to the present invention;
FIG. 4 is a schematic diagram of a right Y-axis mobile carrier structure according to the present invention;
FIG. 5 is a schematic diagram of a left Y-axis mobile carrier structure according to the present invention;
FIG. 6 is a schematic diagram of a Z-axis mobile carrier structure according to the present invention;
FIG. 7 is a schematic view of a camera mounting structure of the present invention;
in the figure: 1-X axis moving stage, 101-first support base, 102-X axis base plate, 103-first ball screw, 104-first slider, 105-first guide rail, 106-first screw nut, 107-X axis drag chain connecting plate, 108-first servo motor, 109-driving sprocket, 110-chain, 111-driven sprocket, 2-left Y axis moving stage, 201-second servo motor, 202-first elastic coupling, 203-third slider, 204-second screw nut, 205-second support column, 206-second ball screw, 207-third guide rail, 208-second support base, 209-second Y axis base plate, 3-Z axis moving stage, 301-third servo motor, 302-second elastic coupling, 303-a third ball screw, 304-a third screw nut, 305-a bottom plate, 306-a tin feeder, 307-an L-shaped mounting plate, 308-a welding module, 309-a camera, 310-a connecting plate, 311-a side frame, 4-a right Y-axis moving stage, 401-a first Y-axis bottom plate, 402-a first support column, 403-a second guide rail and 404-a second sliding block.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 to 7, a moving platform facing electronic chip soldering includes an X-axis moving stage 1, a first support base 101, an X-axis base plate 102, a first ball screw 103, a first slider 104, a first guide rail 105, a first screw nut 106, an X-axis drag chain connecting plate 107, a first servo motor 108, a driving sprocket 109, a chain 110, a driven sprocket 111, a left Y-axis moving stage 4, a second servo motor 201, a first elastic coupling 202, a third slider 203, a second screw nut 204, a second support column 205, a second ball screw 206, a third guide rail 207, a second support base 208, a second Y-axis base plate 209, a Z-axis moving stage 3, a third servo motor 301, a second elastic coupling 302, a third ball screw 303, a third screw nut 304, a base plate 305, a tin feeder 306, an L-shaped mounting plate 307, a soldering module 308, a camera 309, a connecting plate 310, a camera 309, a first support base 101, a first servo motor 102, a first slider 104, a first guide, Side frame 311, right Y-axis moving stage 2, first Y-axis base plate 401, first support column 402, second guide rail 403, and second slider 404.
The moving platform facing the electronic chip welding comprises an X-axis moving carrying platform 1, a Y-axis moving carrying platform and a Z-axis moving carrying platform 3; wherein the Y-axis moving stage is divided into two parts including a left Y-axis moving stage 4 and a right Y-axis moving stage 2 arranged in parallel with the left Y-axis moving stage 4.
The X-axis moving stage 1 is provided at a position between the left Y-axis moving stage 4 and the right Y-axis moving stage 2, and movement of the X-axis moving stage 1 in the Y-axis direction is realized by the Y-axis moving stage, the Z-axis moving stage 3 is fixedly provided on the X-axis moving stage 1, and movement of the Z-axis moving stage 3 in the X-axis direction is realized by the X-axis moving stage 1, and the welding device is provided on the Z-axis moving stage 3, and movement of the welding device in the Z-axis direction is realized by the Z-axis moving stage 3.
The X-axis moving stage 1 includes an X-axis base plate 102, a first servo motor 108 disposed on the X-axis base plate 102, first support seats 101 disposed at two ends of the X-axis base plate 102, a first ball screw 103 disposed on the first support seats 101, a first screw nut 106 disposed on the first ball screw 103, and a driven sprocket 111 disposed at a tail end of the first ball screw 103, wherein a driving sprocket 109 is disposed on the first servo motor 108, the driving sprocket 109 and the driven sprocket 108 are connected by a chain 110 in a transmission manner, first guide rails 105 are disposed on the X-axis base plate 102 in parallel at positions close to two sides of the ball screw 103, a first slider 104 is disposed on the first guide rails 105, and the first screw nut 106 is fixedly connected to the first slider 104. When the X-axis moving stage 1 works, the first servo motor 108 drives the first ball screw 103 to rotate, so that the first screw nut 106 horizontally moves along the first ball screw 103, and the first guide rail 105 is used for guiding the movement of the first screw nut 106.
The left Y-axis moving stage 4 includes a first Y-axis base plate 401, a second guide rail 403 arranged on the first Y-axis base plate 401, and a second slider 404 arranged on the second guide rail 403, first support columns 405 are respectively arranged at two ends of the bottom of the first Y-axis base plate 401, and one end of the X-axis base plate 102 is fixedly connected with the second slider 404 through screws.
The right Y-axis moving stage 2 comprises a second Y-axis base plate 209, a second support column 205 arranged at the bottom of the Y-axis base plate 209, a second servo motor 201 arranged at one end of the Y-axis base plate, second support seats 209 arranged at two ends of the second Y-axis base plate 209, a second ball screw 206 arranged on the second support seats 209, and a second screw nut 204 arranged on the second ball screw 206, wherein the second servo motor 201 and the second ball screw 206 are in transmission connection through an elastic coupling 202, a second guide rail 207 is arranged on the second Y-axis base plate 209 in parallel at a position close to the second ball screw 206, a third slider 203 is arranged on the second guide rail 207 in a matching manner, the third slider 203 is fixedly connected with the second screw nut 204, and the other end of the X-axis base plate 102 is fixedly connected with the third slider 203 through screws. When the right Y-axis moving stage 2 works, the second servo motor 201 drives the second ball screw 206 to rotate, and the second screw nut 204 moves linearly along the second ball screw 206, so that the third slider 203 drives the X-axis base plate 102 to move.
The Z-axis moving stage 3 includes a side frame 311, a third servo motor 301 disposed on the top of the side frame 311, a third ball screw 303 drivingly connected to the third servo motor 301, a third screw nut 304 disposed on the third ball screw 303, a connecting plate 310 fixed to the third screw nut 304, and a bottom plate 305 disposed at the bottom of the connecting plate 310, wherein the third servo motor 301 and the third ball screw 303 are drivingly connected by an elastic coupling 302. The side frame 311 is fixedly connected with the X-axis bottom plate 102, and when the Z-axis moving stage 3 works, the third servo motor 301 drives the third ball screw 303 to rotate, so that the connecting plate 310 drives the bottom plate 305 to move up and down.
The welding device comprises a tin feeding machine 306 and a welding module 308, wherein the tin feeding machine 306 is arranged on a base plate 305, an L-shaped mounting plate 307 is arranged at the position, close to the tin feeding machine 306, on the base plate 305, the welding module 308 is arranged on the L-shaped mounting plate 307, an adjusting mounting hole is formed in the L-shaped mounting plate 307, and the horizontal position and the vertical position of the welding module 308 can be adjusted by adjusting the mounting hole.
The third servo motor 301 is welded with a camera 309, and the working state of the welding device can be monitored in real time through the camera 309, so that the production safety is ensured. The position sensor 309 is fixed on the base plate 305 by bolts, and the three-dimensional coordinate position of the base plate 305 can be monitored in real time by the position sensor 309.
Claims (8)
1. A moving platform facing to electronic chip welding is characterized by comprising an X-axis moving carrier (1), a Y-axis moving carrier and a Z-axis moving carrier (3), the Y-axis moving carrying platform comprises a left Y-axis moving carrying platform (4) and a right Y-axis moving carrying platform (2) which is arranged in parallel with the left Y-axis moving carrying platform (4), the X-axis moving carrier (1) is arranged at a position between the left Y-axis moving carrier (4) and the right Y-axis moving carrier (2), the movement of the X-axis moving carrier (1) in the Y-axis direction is realized through the Y-axis moving carrier, the Z-axis moving carrier (3) is fixedly arranged on the X-axis moving carrier (1), and realizes the movement of the Z-axis moving carrier (3) in the X-axis direction through the X-axis moving carrier (1), the Z-axis moving carrier (3) is provided with a welding device, and the movement of the welding device in the Z-axis direction is realized through the Z-axis moving carrier (3).
2. The moving platform facing electronic chip soldering of claim 1, wherein the X-axis moving stage (1) comprises an X-axis base plate (102), a first servo motor (108) disposed on the X-axis base plate (102), first supporting seats (101) disposed at two ends of the X-axis base plate (102), a first ball screw (103) disposed on the first supporting seat (101), a first screw nut (106) disposed on the first ball screw (103), and a driven sprocket (111) disposed at a distal end of the first ball screw (103), a driving sprocket (109) is disposed on the first servo motor (108), the driving sprocket (109) and the driven sprocket (108) are in transmission connection through a chain (110), first guide rails (105) are disposed on the X-axis base plate (102) in parallel at positions close to two sides of the ball screw (103), the first guide rail (105) is provided with a first sliding block (104), and the first lead screw nut (106) is fixedly connected with the first sliding block (104).
3. The moving platform for electronic chip bonding according to claim 1, wherein the left Y-axis moving stage (4) comprises a first Y-axis base plate (401), a second guide rail (403) disposed on the first Y-axis base plate (401), and a second slider (404) disposed on the second guide rail (403), and the first support columns (402) are respectively disposed at two ends of the bottom of the first Y-axis base plate (401).
4. The mobile platform for electronic chip bonding according to claim 1, the right Y-axis moving carrying platform (2) comprises a second Y-axis bottom plate (209), a second supporting column (205) arranged at the bottom of the Y-axis bottom plate (209), a second servo motor (201) arranged at one end part of the Y-axis bottom plate, second supporting seats (208) arranged at two ends of the second Y-axis bottom plate (209), a second ball screw (206) arranged on the second supporting seats (208) and a second screw nut (204) arranged on the second ball screw (206), the second servo motor (201) is in transmission connection with the second ball screw (206) through a first elastic coupling (202), and a third guide rail (207) is arranged on the second Y-axis base plate (209) in parallel at a position close to the second ball screw (206), and a third sliding block (203) is arranged on the third guide rail (207) in a matching way.
5. The moving platform facing electronic chip soldering of claim 1, wherein the Z-axis moving stage (3) comprises a side frame (311), a third servo motor (301) disposed on top of the side frame (311), a third ball screw (303) drivingly connected to the third servo motor (301), a third screw nut (304) disposed on the third ball screw (303), a connecting plate (310) fixed on the third screw nut (304), and a bottom plate (305) disposed at bottom of the connecting plate (310), and the third servo motor (301) and the third ball screw (303) are drivingly connected through a second elastic coupling (302).
6. The moving platform facing electronic chip soldering of claim 5, wherein the soldering device comprises a tin feeder (306) and a soldering module (308), the tin feeder (306) is disposed on a base plate (305), an L-shaped mounting plate (307) is disposed on the base plate (305) at a position close to the tin feeder (306), the soldering module (308) is disposed on the L-shaped mounting plate (307), and an adjusting mounting hole is disposed on the L-shaped mounting plate (307), and the horizontal position and the vertical position of the soldering module (308) can be adjusted by adjusting the mounting hole.
7. The moving platform for electronic chip welding according to claim 5, wherein a camera (309) is fixedly arranged on the third servo motor (301), and the working state of the welding device can be monitored in real time through the camera (309).
8. The moving platform for electronic chip bonding as claimed in claim 5, wherein the base plate (305) is provided with a position sensor (309), and the three-dimensional coordinate position of the base plate (305) can be monitored in real time by the position sensor (309).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010247106.7A CN111266695A (en) | 2020-03-31 | 2020-03-31 | Moving platform for electronic chip welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010247106.7A CN111266695A (en) | 2020-03-31 | 2020-03-31 | Moving platform for electronic chip welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111266695A true CN111266695A (en) | 2020-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010247106.7A Pending CN111266695A (en) | 2020-03-31 | 2020-03-31 | Moving platform for electronic chip welding |
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| Country | Link |
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| CN (1) | CN111266695A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102463416A (en) * | 2011-07-19 | 2012-05-23 | 福建省维德科技有限公司 | Laser compound welding equipment |
| CN102974962A (en) * | 2012-11-20 | 2013-03-20 | 浙江久立特材科技股份有限公司 | Welding test-bed |
| CN203778918U (en) * | 2014-04-14 | 2014-08-20 | 苏州志东岚自动化设备有限公司 | Visual positioning four-axis heteromorphic bar solder wire automatic welding machine |
| CN104002033A (en) * | 2014-05-27 | 2014-08-27 | 深圳市川菱科技有限公司 | Automatic contact welding machine |
| CN204545636U (en) * | 2015-02-13 | 2015-08-12 | 佛山市中科源自动化设备有限公司 | A kind of automatic tin welding machine |
| CN110560839A (en) * | 2019-09-29 | 2019-12-13 | 河南省昊搏自动化设备有限公司 | Be used for welded biaxial adjusting device |
-
2020
- 2020-03-31 CN CN202010247106.7A patent/CN111266695A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102463416A (en) * | 2011-07-19 | 2012-05-23 | 福建省维德科技有限公司 | Laser compound welding equipment |
| CN102974962A (en) * | 2012-11-20 | 2013-03-20 | 浙江久立特材科技股份有限公司 | Welding test-bed |
| CN203778918U (en) * | 2014-04-14 | 2014-08-20 | 苏州志东岚自动化设备有限公司 | Visual positioning four-axis heteromorphic bar solder wire automatic welding machine |
| CN104002033A (en) * | 2014-05-27 | 2014-08-27 | 深圳市川菱科技有限公司 | Automatic contact welding machine |
| CN204545636U (en) * | 2015-02-13 | 2015-08-12 | 佛山市中科源自动化设备有限公司 | A kind of automatic tin welding machine |
| CN110560839A (en) * | 2019-09-29 | 2019-12-13 | 河南省昊搏自动化设备有限公司 | Be used for welded biaxial adjusting device |
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