CN111260819A - Electronic component detection method and apparatus, and computer-readable storage medium - Google Patents
Electronic component detection method and apparatus, and computer-readable storage medium Download PDFInfo
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Abstract
The embodiment of the invention discloses an electronic element detection method, which is applied to an electronic element detection device and is connected with at least one test device, wherein each test device comprises at least one test probe; the method comprises the following steps: acquiring identification information of a material belt to be detected; acquiring the specification information to be tested of the electronic element to be tested according to the identification information; selecting at least one electronic element to be tested as a first sample to be tested, and driving a testing device matched with the specification information to be tested to move to the position above the first sample to be tested; driving at least one test probe of the test device to penetrate through the packaging film to electrically contact with a first sample to be tested; adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample; and judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested. The invention also discloses an electronic component detection device and a computer readable storage medium. The invention can effectively improve the testing efficiency, reduce the testing difficulty and reduce the quality control risk.
Description
Technical Field
The present invention relates to the field of automation technologies, and in particular, to a method and an apparatus for detecting an electronic component, and a computer-readable storage medium.
Background
Along with the improvement of science and technology, the electronic components required by the assembly of the intelligent terminal are more and more in types and smaller in size, the requirement on quality is higher and higher, and the quality is strictly controlled in the incoming material link of a factory. At present, for most SMT (surface mount Technology) factories, incoming materials need to be detected manually, workers take a material tray to be detected, tear a packaging plastic mold, take out the material to be detected under a magnifier, place the material to be detected at a specific detection position, find a polarity measurement point through the magnifier, and hold a bridge test meter to record the value. The detection method has the advantages of low efficiency, non-standard data statistics, high quality management and control risk due to paper record or manual entry system, small material, difficulty in operation, high difficulty in manual measurement and great harm to eyes of workers.
Disclosure of Invention
In view of the above, it is necessary to provide an electronic component detecting method and apparatus and a computer-readable storage medium for solving the above problems.
An electronic component detection method is applied to an electronic component detection device, the electronic component detection device is connected with at least one test device, and each test device comprises at least one test probe; the electronic component detection method comprises the following steps: acquiring identification information of a material belt to be tested, wherein the material belt to be tested comprises a plurality of electronic elements to be tested and packaging films packaged on the surfaces of the electronic elements to be tested; acquiring the specification information to be tested of the electronic element to be tested according to the identification information; selecting at least one electronic element to be tested as a first sample to be tested, and driving a testing device matched with the specification information to be tested to move to the position above the first sample to be tested; the at least one test probe of the test device for driving the matching of the specification information to be tested penetrates through the packaging film to be electrically contacted with the first sample to be tested; adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample; and judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested.
After the step of judging whether the test result of the sample to be tested belongs to the preset standard range, the method comprises the following steps: if the test result of the first sample to be tested does not belong to the preset standard range, selecting at least one remaining electronic element to be tested of the material belt to be tested as a second sample to be tested, and judging whether the test result of the second sample to be tested belongs to the preset standard range; and if the test result of the second sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
After the step of judging whether the test result of the sample to be tested belongs to the preset standard range, the method comprises the following steps: if the test result of the first to-be-tested sample does not belong to the preset standard range, selecting at least one remaining to-be-tested electronic element of the to-be-tested material belt as a second to-be-tested sample; and if the test result of the second sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
The electronic component detection device is also connected with the shearing device; before the step of putting the material belt to be tested into production, the method comprises the following steps: and driving the shearing device to cut off the first sample to be detected and/or the second sample to be detected in the material belt to be detected.
Wherein, the step of judging whether to put the material belt to be tested into production based on the test result of the first sample to be tested comprises the following steps: and if the test result of the second sample to be tested does not belong to the preset standard range, judging that the material belt to be tested is not put into production, and storing the test results of the first sample to be tested and the second sample to be tested.
Wherein each test probe comprises a test chip for testing the use state of the test probe and/or the communication quality with the test device; after the step of driving the at least one test probe of the test device matched with the specification information to be tested to penetrate through the packaging film to be electrically contacted with the first sample to be tested, the method comprises the following steps: acquiring and saving the use state of each test probe and/or the communication quality with the test device; the step of determining whether the test result of the first sample to be tested does not belong to the preset standard range and/or the step of determining whether the test result of the second sample to be tested does not belong to the preset standard range includes: and acquiring and storing the tested photos of the first sample to be tested and/or the second sample to be tested.
After the step of obtaining the specification information to be tested of the electronic element to be tested in the material belt to be tested according to the identification information, the method comprises the following steps: acquiring current specification information of a currently used current electronic element, and judging whether the specification information to be detected is matched with the current specification information; if the information of the specification to be detected is not matched with the information of the current specification, sending prompt information and suspending the execution of the subsequent steps; and if the specification information to be detected is matched with the current specification information, transmitting the material belt to be detected to a feeding port.
An electronic component detection device, wherein the electronic component detection device is connected with at least one test device, and the test device comprises at least one test probe; the electronic component detection device includes: the identification acquisition module is used for acquiring identification information of a material belt to be detected, and the material belt to be detected comprises an electronic element to be detected and an encapsulation film encapsulated on the surface of the electronic element to be detected; the information acquisition module is used for acquiring the to-be-detected specification information of the to-be-detected electronic element according to the identification information; the selection module is used for selecting at least one electronic element to be tested as a first sample to be tested and driving the testing device matched with the specification information to be tested to move to the position above the first sample to be tested; the driving module is used for driving at least one testing probe of the testing device matched with the to-be-tested specification information to penetrate through the packaging film to be electrically contacted with the first to-be-tested sample; the test module is used for adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample; and the judging module is used for judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested.
An electronic component inspection apparatus comprising: a processor coupled to the memory and a memory having a computer program stored therein, the processor executing the computer program to implement the method as described above.
A computer-readable storage medium storing a computer program executable by a processor to implement a method as described above.
The embodiment of the invention has the following beneficial effects:
the method comprises the steps of obtaining specification information to be tested of electronic elements to be tested in a material belt to be tested according to identification information of the material belt to be tested, selecting at least one electronic element to be tested from a plurality of electronic elements to be tested as a first sample to be tested, driving at least one test probe of a test device matched with the specification information to be tested to penetrate through an encapsulation film of the material belt to be tested to be electrically contacted with the first sample to be tested, adjusting test parameters of the test device according to the specification information to be tested to test the first sample to be tested, judging whether the material belt to be tested is put into production or not based on a test result, being free of manual testing of staff, effectively improving test efficiency, reducing test difficulty and reducing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
fig. 1 is a schematic flow chart of a first embodiment of an electronic component detection method provided by the present invention;
FIG. 2 is a schematic flow chart of a second embodiment of the electronic component inspection method provided by the present invention;
FIG. 3 is a schematic structural diagram of a first embodiment of an electronic component detecting device provided in the present invention;
FIG. 4 is a schematic structural diagram of a second embodiment of an electronic component detecting device according to the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of a computer-readable storage medium provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
At present, the electronic element to be tested in the material belt to be tested needs to be manually detected, a worker takes the material disc to be tested, the packaging plastic mold is torn, the material to be tested is taken out under the magnifier and is placed at a specific detection position, the polarity measurement point is found through the magnifier, and the pen-hold value of the bridge test meter is recorded. The detection method has the advantages of low efficiency, non-standard data statistics, high quality management and control risk due to paper record or manual entry system, small material, difficulty in operation, high difficulty in manual measurement and great harm to eyes of workers.
In this embodiment, in order to solve the above problems, a method for detecting an electronic component is provided, which can effectively improve the test efficiency, reduce the test difficulty, and reduce the quality control risk without manual testing by staff.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for detecting an electronic component according to a first embodiment of the present invention. The electronic component detection method provided by the invention comprises the following steps:
s101: and acquiring identification information of the material belt to be detected.
In a specific implementation scenario, in the production line working process of an SMT (Surface mount Technology) high-speed chip mounter, in order to avoid line stop, when a currently used tape is running out, a new tape needs to be accessed. Before the new material belt is put into use, electronic elements in the material belt need to be detected, and the electronic elements with unqualified quality are prevented from being put into production.
In this implementation scenario, the material strips are all provided with identification codes, which can be two-dimensional codes or bar codes. The identification information of the material belt to be detected can be obtained by scanning the identification code of the material belt to be detected. The identification information comprises the specification information to be tested of the electronic element to be tested in the material belt to be tested.
Specifically, the electronic component device scans the identification code through the scanning gun to acquire the identification information, and the scanning gun and the electronic component detection device perform data transmission in a wired or wireless mode such as usb, serial port, network cable, bluetooth, wifi, nfc and the like. The electronic component detecting apparatus acquires identification information from a System such as a factory MES (Manufacturing Execution System)/ERP (Enterprise Resources Planning) or an identification code itself.
In this implementation scenario, the tape to be tested includes an electronic component to be tested and an encapsulation film encapsulated on the surface of the electronic component to be tested.
S102: and acquiring the specification information to be tested of the electronic element to be tested according to the identification information.
In this implementation scenario, the electronic component detecting device obtains specification information to be detected, such as a model, a manufacturer, and a material number, of the electronic component to be detected according to the identification information of the material strap to be detected. Further, the specification information to be measured further includes parameters such as a voltage range, a current range, a resistance value, a category and the like of the operation of at least one electronic element.
S103: at least one electronic element to be tested is selected as a first sample to be tested, and the testing device matched with the specification information to be tested is driven to move to the position above the first sample to be tested.
In this implementation scenario, at least one electronic component is selected from the multiple electronic components to be tested in the tape to be tested as the first sample to be tested, for example, one electronic component to be tested at the end of the tape to be tested may be selected as the first sample to be tested. In other implementation scenarios, a plurality of electronic components to be tested may also be selected as the first sample to be tested.
In this embodiment, the electronic component detection device is connected to at least one test device, and each test device has at least one test probe. Since different electronic components have different shapes and different pin numbers, items to be measured are different, for example, some electronic components need to measure resistance values, and some electronic components need to measure capacitance values. Therefore, a test using a matched test apparatus is required. Therefore, the electronic component detection device needs to select a test device matched with the specification information to be tested, and drive the test device to move to the position above the first sample to be tested, so that at least one test probe of the test device corresponds to the pin of the first sample to be tested, which needs to be tested.
In this implementation scenario, the testing device includes at least one of an LCR meter, a multimeter, an impedance analyzer, an oscilloscope, a network analyzer, and a comprehensive tester. The material of at least one test probe is metal, alloy or nonmetal with conductive performance.
S104: at least one test probe of the test device for driving the matching of the specification information to be tested penetrates through the packaging film to be electrically contacted with the first sample to be tested.
In this implementation scenario, after the testing device is driven to move above the first sample to be tested, the at least one testing probe is driven to move downward, penetrate through the packaging film, and electrically contact with the first sample to be tested. Specifically, the at least one test probe may be driven to move downward in an electric drive mode, and the at least one test probe may be driven to move downward in a pneumatic drive mode.
S105: and adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample.
In the implementation scenario, test parameters such as a gear, a frequency, a voltage, a current and the like of the test device are adjusted according to parameters such as a voltage range, a current range, a resistance value and the like in the specification information to be tested, the first sample to be tested is tested through at least one test probe, and a test result is obtained.
S106: and judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested.
In the implementation scenario, a preset standard range of the electronic component to be tested is obtained according to the specification information to be tested, and if the test result belongs to the preset standard range, the first sample to be tested is judged to be qualified, and the material belt to be tested can be put into production. For example, the preset resistance range of the electronic element to be tested is 2K Ω -2.5K Ω, and the resistance of the first sample to be tested is 2.3K Ω, so that the first sample to be tested is qualified, and the material belt to be tested can be put into production.
In the implementation scene, at least one electronic element to be detected in the material belt to be detected is selected as a first sample to be detected for detection, and if the first sample to be detected is judged to be qualified according to the detection result, the material belt to be detected can be put into production use. In other implementation scenarios, a plurality of electronic components to be tested in the material belt to be tested can be selected as the first sample to be tested for testing, and if the test results of the electronic components to be tested are all qualified, the material belt to be tested can be put into production use.
According to the above description, in this embodiment, the identification information of the material belt to be tested is obtained to obtain the specification information to be tested of the electronic element to be tested in the material belt to be tested, at least one electronic element to be tested is selected as a first sample to be tested, at least one test probe of the test device matched with the specification information to be tested is driven to penetrate through the packaging film of the material belt to be tested and electrically contact with the first sample to be tested, the test parameter of the test device is adjusted according to the specification information to be tested to test the first sample to be tested, whether the material belt to be tested is put into production is judged based on the test result, manual testing by staff is not needed, the test efficiency can be effectively improved, the test difficulty is reduced.
Referring to fig. 2, fig. 2 is a schematic flow chart of a method for detecting an electronic component according to a second embodiment of the present invention. The electronic component detection method provided by the invention comprises the following steps:
s201: and acquiring identification information of the material belt to be detected.
S202: and acquiring the specification information to be tested of the electronic element to be tested according to the identification information.
In a specific implementation scenario, steps S201 to S202 are substantially the same as steps S101 to S102 of the first implementation of the electronic component detection method provided by the present invention, and are not described herein again.
S203: and acquiring the current specification information of the current electronic element currently used by the assembly line, and judging whether the specification information to be detected is matched with the current specification information. If not, go to step S204, and if so, go to step S205.
In this implementation scenario, the tape to be tested is used to be newly connected to the currently used tape when the currently used tape is running out, so as to avoid stopping the line, and therefore, the electronic component to be tested in the tape to be tested should have the same or matched specification information as the currently used electronic component. Before the material belt to be tested is put into use, the current specification information of the currently used current electronic element is obtained, whether the specification information to be tested is matched with the current specification information is judged, specifically, whether the contents of specified items in the specification information to be tested and the current specification information are the same, such as manufacturers, models, material numbers and the like, or whether the difference of the contents of the specified items in the specification information to be tested and the current specification information is within a preset range, such as whether the difference of the delivery date is within a specified range, and the like can be judged.
S204: sending out prompt information and suspending the execution of subsequent steps.
In this implementation scenario, the specification information to be tested does not match the current specification information, for example, if the models of the electronic component to be tested and the current electronic component are different, a prompt message is sent to notify the user that the tape to be tested cannot be put into use. And meanwhile, the execution of the subsequent steps is suspended, so that the management confusion of production materials is avoided.
S205: and conveying the material belt to be detected to a feeding port.
In this implementation scenario, the specification information to be detected is matched with the current specification information, and then the material belt to be detected can be put into production and used, and the material belt to be detected is transmitted to a feeding port of the electronic element detection device. The step can be manual operation for conveying the material belt to be detected to the feeding port, or automatic operation for conveying the material belt to be detected to the feeding port by a mechanical arm or a conveying belt and other methods.
The pan feeding mouth is provided with detection device for whether there is the material area that awaits measuring. The detection device can be a photosensitive sensor such as infrared and laser.
S206: selecting at least one electronic element to be tested as a first sample to be tested, transmitting the material belt to be tested to a test position, and driving a test device matched with the specification information to be tested to move to the position above the test position.
In the implementation scene, a test position is set, the material belt to be tested is transmitted to the test position, specifically, an electric control signal is output through a system such as a single chip microcomputer and a PLC (programmable logic controller), a synchronous motor and a stepping motor are driven to control feeding mechanisms such as gears, screw rods and belts, and the material belt to be tested is transmitted to the test position. Meanwhile, an electric control signal is output through systems such as a single chip microcomputer and a PLC, and the testing device is controlled to move above a testing position in modes such as driving a synchronous motor and a stepping motor. In other implementation scenarios, the test device may not move, and the material belt to be tested is transported to the lower side of the test device, or the test device is controlled to move to the upper side of the material belt to be tested without transporting the material belt to be tested.
In this implementation scenario, since the electronic component to be tested has a small size, the position of the material tape to be tested needs to be calibrated, so that at least one test probe of the test device can be aligned to the pin to be tested of the first sample to be tested, and the pin to be tested can penetrate through the packaging film and electrically contact the pin to be tested during testing. Further, the position of the strip of material to be tested is calibrated based on the selected position of the first sample to be tested. Specifically, the position of the material belt can be calibrated through a physical positioning mechanism, and the position of the material belt can also be calibrated through infrared and laser light photosensitive sensors and a mechanical arm.
Furthermore, in order to prevent the inaccurate test result caused by the displacement of the material belt to be tested in the test process, the material belt to be tested after the position calibration is fixed, and the material belt can be fixed by adopting physical structures such as a limiting column.
S207: at least one test probe of the test device for driving the matching of the specification information to be tested penetrates through the packaging film to be electrically contacted with the first sample to be tested.
In this implementation scenario, step S207 is substantially the same as step S104 of the first implementation of the electronic component detection method provided by the present invention, and details thereof are not repeated here.
S208: the use state of each test probe and/or the communication quality with the test apparatus is acquired.
In this implementation scenario, each test probe is installed with a test chip, the test chip is used to obtain a use state and/or a communication quality between the test probe and the test apparatus, and when the test probe penetrates through the encapsulation film and electrically contacts with the first sample to be tested, a current use state and/or a communication quality of the test probe is obtained and stored.
Further, the use state includes the number of times of use of the test probe. The test probe has a preset maximum test frequency, and a user can judge whether the use frequency reaches the preset maximum frequency according to the use frequency calculated by the test chip and needs to replace the use frequency. The user can also judge whether the test result of the first sample to be tested has larger error due to the excessive test times of the test probe.
In other implementations, the usage status includes a remaining number of uses of the test probe.
In this implementation scenario, after the use state of each test probe and/or the communication quality with the test device is obtained, the use state is immediately fed back to the user, so that the user can replace the test probe which is used for a super time or has poor communication quality in time, and the accuracy of the test is prevented from being influenced. In other implementation scenarios, the use state and/or the communication quality with the test device can be fed back to the user when the test result is unqualified or the test value is not obtained, and the user can judge whether the result is caused by a large error caused by the problem of the test probe.
S209: and adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample.
In this implementation scenario, step S209 is substantially the same as step S105 of the first implementation of the electronic component detection method provided by the present invention, and is not described herein again.
S210: and acquiring a preset standard range matched with the specification information to be tested, and judging whether the test result of the first sample to be tested belongs to the preset standard range. If not, step S211 is executed, and if yes, step S213 is executed.
In the implementation scenario, a preset standard range of the electronic component to be tested is obtained according to the specification information to be tested, if the test result belongs to the preset standard range, the electronic component to be tested is judged to be qualified, and if the test result does not belong to the preset standard range, the electronic component to be tested is judged to be unqualified.
S211: and acquiring and storing the tested picture of the first sample to be tested.
In this implementation scenario, the electronic component detection apparatus further includes a camera for obtaining a picture of the first sample to be detected after the test.
In the implementation scenario, the stored photos are fed back to the user, so that the user can analyze the reason why the test is not qualified based on the photos.
S212: selecting at least one remaining electronic component to be tested of the tape to be tested as a second sample to be tested, and determining whether the test result of the second sample to be tested belongs to the preset standard range, if so, executing step S213, and if not, executing step S214.
In this implementation scenario, if it is determined that the first to-be-tested sample is not qualified, at least one remaining to-be-tested electronic component in the to-be-tested material tape is selected as a second to-be-tested sample, and the second to-be-tested sample is tested, where the testing process is substantially the same as the testing process for the first to-be-tested sample, and is not repeated here. And judging whether the test result of the second sample to be tested is qualified, if so, performing the subsequent steps, otherwise, giving a prompt to inform a user that the material belt to be tested cannot be put into use.
In this implementation scenario, the number of the second samples to be tested is greater than or equal to the number of the first samples to be tested, so as to improve the reliability of the test.
In other implementation scenarios, when the user determines that the first to-be-tested sample is not qualified due to the use state and/or the communication quality of the test probe, step S212 is executed, otherwise, the to-be-tested strip is not put into production use.
S213: and driving the shearing device to cut off the first sample to be detected and/or the second sample to be detected in the material belt to be detected.
In this implementation scenario, the electronic component detecting device is further connected to the cutting device. The electronic element to be tested at the end part of the material belt to be tested is selected as a first sample to be tested for testing, when the test result of the first sample to be tested is qualified, the material belt to be tested is put into production for use, the first sample to be tested at the end part of the material belt to be tested of the control shearing device and part of the material belt structure of the end part are sheared together, the detected electronic element to be tested can be removed, and the rest material belt to be tested is put into production for use.
In other implementation scenarios, if the test result of the first to-be-tested sample is not qualified, selecting the to-be-tested electronic element adjacent to the first to-be-tested sample as a second to-be-tested sample for testing, and when the test result of the second to-be-tested sample is qualified, controlling the shearing device to shear the first to-be-tested sample and the second to-be-tested sample at the end part of the to-be-tested material belt together with part of the material belt structure at the end part before the to-be-tested material belt is put into production use, so that the detected to-be-tested electronic element can be removed, and the.
S214: acquiring and storing the use state and/or communication quality of each test probe and the test device; and acquiring and storing the tested picture of the second sample to be tested.
In this implementation scenario, this step substantially coincides with step S211. No further description is given.
In other implementation scenarios, when the user determines that the first to-be-tested sample is not qualified due to the use state and/or communication quality of the test probe, step S212 is repeatedly executed, otherwise step S215 is executed.
S215: and judging that the material belt to be tested is not put into production, and storing the test results of the first sample to be tested and the second sample to be tested.
And if the test result of the second sample to be tested is unqualified in the implementation scene, judging that the material belt to be tested is not put into production, storing and packaging the test results of the first sample to be tested and the second sample to be tested, and uploading the test results to a factory ERP/MES system in a wired or wireless connection mode such as a network cable and wifi. Specifically, the test result may be packaged in a format such as xml, txt, binary, and the like, and uploaded by webservice, http, and the like. The user can remotely obtain the test result of the material belt to be tested through the system, and whether the manufacturer or the model corresponding to the material belt to be tested is selected in the subsequent production can be determined according to the test result.
It can be known from the above description that, in this embodiment, by judging whether the current specification information of the current electronic element matches with the specification information to be tested of the electronic element to be tested, if matching, then performing subsequent testing steps, and if not matching, then sending a prompt, thereby avoiding a phenomenon of confusion of production materials.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an electronic component detecting device according to a first embodiment of the present invention. The electronic component detecting device 10 includes an identification obtaining module 11, an information obtaining module 12, a selecting module 13, a driving module 14, a testing module 15, and a judging module 16.
The identification obtaining module 11 is configured to obtain identification information of a tape to be tested, where the tape to be tested includes an electronic element to be tested and an encapsulation film encapsulated on the surface of the electronic element to be tested. The information obtaining module 12 is configured to obtain specification information to be tested of the electronic component to be tested according to the identification information. The selection module 13 is configured to select at least one electronic component to be tested as a first sample to be tested, and drive the testing device matched with the specification information to be tested to move to a position above the first sample to be tested. The driving module 14 is used for driving at least one testing probe of the testing device matched with the specification information to be tested to penetrate through the packaging film to electrically contact with the first sample to be tested. The test module 15 is configured to adjust test parameters of the test apparatus according to the specification information to be tested, so as to test the first sample to be tested. The judging module 16 is configured to judge whether to put the tape to be tested into production based on the test result of the first sample to be tested.
The judging module 16 is further configured to obtain a preset standard range matched with the specification information to be tested, and judge whether the test result of the first sample to be tested belongs to the preset standard range. And if the test result of the first sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
The determining module 16 is further configured to select at least one remaining electronic component to be tested in the tape to be tested as a second sample to be tested if the test result of the first sample to be tested does not belong to the preset standard range, and determine whether the test result of the second sample to be tested belongs to the preset standard range. And if the test result of the second sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
The electronic component detecting device 10 further includes a removing module 17 for driving the shearing device to cut off the first sample to be detected and the second sample to be detected in the material strip to be detected.
The electronic component detecting device 10 further includes a saving module 18, configured to determine not to put the tape to be tested into production and save the test results of the first sample to be tested and the second sample to be tested if the test result of the second sample to be tested does not belong to the preset standard range.
Each test probe includes a test chip for testing the use status of the test probe and/or the quality of communication with the test device.
The saving module 18 is also used for acquiring and saving the use state of each test probe and/or the communication quality with the test device.
The storage module 18 is further configured to obtain and store a picture of the first sample to be tested and/or the second sample to be tested after testing.
The identifier obtaining module 11 is further configured to obtain current specification information of a currently used current electronic component, and determine whether the specification information to be detected matches the current specification information. And if the specification information to be detected is not matched with the current specification information, sending out prompt information and suspending the execution of subsequent steps. And if the specification information to be detected is matched with the current specification information, transmitting the material belt to be detected to the feeding port.
According to the above description, in this embodiment, the electronic component detecting device obtains the identification information of the material belt to be tested to obtain the specification information to be tested of the electronic component to be tested in the material belt to be tested, selects at least one electronic component to be tested as the first sample to be tested, drives the testing device matched with the specification information to be tested to move to the top of the first sample to be tested, drives at least one testing probe of the testing device to penetrate through the packaging film of the material belt to be tested to electrically contact with the first sample to be tested, adjusts the testing parameters of the testing device according to the specification information to be tested to test the first sample to be tested, judges whether the material belt to be tested is put into production based on the testing result, does not need manual testing by staff, can effectively improve the testing efficiency, reduces the testing.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an electronic component detecting device according to a second embodiment of the present invention. The electronic component detecting device 20 includes a processor 21 and a memory 22. The processor 21 is coupled to a memory 22. The memory 22 has stored therein a computer program which is executed by the processor 21 in operation to implement the method as shown in fig. 1-2. The detailed methods can be referred to above and are not described herein.
It can be known from the above description that, the electronic component detecting device in this embodiment obtains identification information of the tape to be tested to obtain specification information to be tested of the electronic component to be tested in the tape to be tested, selects at least one electronic component to be tested as a first sample to be tested, drives the testing device matched with the specification information to be tested to move to a position above the first sample to be tested, drives at least one testing probe of the testing device to penetrate through an encapsulation film of the tape to be tested to electrically contact with the first sample to be tested, adjusts testing parameters of the testing device according to the specification information to be tested to test the first sample to be tested, and judges whether the tape to be tested is put into production based on a testing result.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a computer-readable storage medium according to the present invention. The computer-readable storage medium 30 stores at least one computer program 31, and the computer program 31 is used for being executed by a processor to implement the method shown in fig. 1-2, and the detailed method can be referred to above and will not be described herein again. In one embodiment, the computer readable storage medium 30 may be a memory chip in a terminal, a hard disk, or other readable and writable storage tool such as a removable hard disk, a flash disk, an optical disk, or the like, and may also be a server or the like.
As can be seen from the above description, the computer program stored in the computer-readable storage medium in this embodiment may be used to obtain the identification information of the tape to be tested, obtain the specification information of the electronic component to be tested in the tape to be tested, select at least one electronic component to be tested as a first sample to be tested, drive the testing device matched with the specification information to be tested to move to a position above the first sample to be tested, drive at least one testing probe of the testing device to penetrate through the packaging film of the tape to be tested and electrically contact the first sample to be tested, adjust the testing parameters of the testing device according to the specification information to be tested to test the first sample to be tested, and determine whether to put the tape to be tested into production based on the testing result.
Different from the prior art, the test device provided by the invention has the advantages that at least one test probe of the drive test device penetrates through the packaging film of the material belt to be tested to electrically contact with the electronic element to be tested, the test parameters matched with the specification information to be tested are selected to test the electronic element to be tested, manual testing by staff is not needed, the test efficiency can be effectively improved, the test difficulty is reduced, and the quality control risk is reduced.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.
Claims (10)
1. An electronic component detection method is characterized in that the method is applied to an electronic component detection device which is connected with at least one test device, and each test device comprises at least one test probe;
the electronic component detection method comprises the following steps:
acquiring identification information of a material belt to be tested, wherein the material belt to be tested comprises a plurality of electronic elements to be tested and packaging films packaged on the surfaces of the electronic elements to be tested;
acquiring the specification information to be tested of the electronic element to be tested according to the identification information;
selecting at least one electronic element to be tested as a first sample to be tested, and driving a testing device matched with the specification information to be tested to move to the position above the first sample to be tested;
the at least one test probe of the test device for driving the matching of the specification information to be tested penetrates through the packaging film to be electrically contacted with the first sample to be tested;
adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample;
and judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested.
2. The method for inspecting electronic components of claim 1, wherein the step of determining whether to put the tape into production based on the result of the test on the first sample to be tested comprises:
acquiring a preset standard range matched with the to-be-detected specification information, and judging whether the test result of the first to-be-detected sample belongs to the preset standard range;
and if the test result of the first sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
3. The method for inspecting electronic components of claim 2, wherein the step of determining whether the test result of the sample under test falls within the predetermined standard range comprises:
if the test result of the first sample to be tested does not belong to the preset standard range, selecting at least one remaining electronic element to be tested of the material belt to be tested as a second sample to be tested, and judging whether the test result of the second sample to be tested belongs to the preset standard range;
and if the test result of the second sample to be tested belongs to the preset standard range, putting the material belt to be tested into production.
4. The electronic component inspection method of claim 3, wherein the electronic component inspection apparatus is further connected to a cutting apparatus;
before the step of putting the material belt to be tested into production, the method comprises the following steps:
and driving the shearing device to cut off the first sample to be detected and/or the second sample to be detected in the material belt to be detected.
5. The method for inspecting electronic components of claim 3, wherein the step of determining whether to put the tape into production based on the result of the test on the first sample to be tested comprises:
and if the test result of the second sample to be tested does not belong to the preset standard range, judging that the material belt to be tested is not put into production, and storing the test results of the first sample to be tested and the second sample to be tested.
6. The electronic component inspection method according to claim 3, wherein each of the test probes includes a test chip for testing a use state of the test probe and/or a communication quality with the test apparatus;
after the step of driving the at least one test probe of the test device matched with the specification information to be tested to penetrate through the packaging film to be electrically contacted with the first sample to be tested, the method comprises the following steps:
acquiring and saving the use state of each test probe and/or the communication quality with the test device;
the step of determining whether the test result of the first sample to be tested does not belong to the preset standard range and/or the step of determining whether the test result of the second sample to be tested does not belong to the preset standard range includes:
and acquiring and storing the tested photos of the first sample to be tested and/or the second sample to be tested.
7. The method for detecting electronic components according to claim 1, wherein the step of obtaining the specification information of the electronic components to be tested in the tape to be tested according to the identification information comprises:
acquiring current specification information of a currently used current electronic element, and judging whether the specification information to be detected is matched with the current specification information;
if the information of the specification to be detected is not matched with the information of the current specification, sending prompt information and suspending the execution of the subsequent steps;
and if the specification information to be detected is matched with the current specification information, transmitting the material belt to be detected to a feeding port.
8. An electronic component detection device, characterized in that the electronic component detection device is connected with at least one test device, the test device comprises at least one test probe;
the electronic component detection device includes:
the identification acquisition module is used for acquiring identification information of a material belt to be detected, and the material belt to be detected comprises an electronic element to be detected and an encapsulation film encapsulated on the surface of the electronic element to be detected;
the information acquisition module is used for acquiring the to-be-detected specification information of the to-be-detected electronic element according to the identification information;
the selection module is used for selecting at least one electronic element to be tested as a first sample to be tested and driving the testing device matched with the specification information to be tested to move to the position above the first sample to be tested;
the driving module is used for driving at least one testing probe of the testing device matched with the to-be-tested specification information to penetrate through the packaging film to be electrically contacted with the first to-be-tested sample;
the test module is used for adjusting the test parameters of the test device according to the to-be-tested specification information so as to test the first to-be-tested sample;
and the judging module is used for judging whether the material belt to be tested is put into production or not based on the test result of the first sample to be tested.
9. An electronic component inspection apparatus, comprising: a processor coupled to the memory and a memory having a computer program stored therein, the processor executing the computer program to implement the method of any of claims 1-7.
10. A computer-readable storage medium, in which a computer program is stored, which computer program is executable by a processor to implement the method according to any one of claims 1-7.
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