CN110398654A - Automatic measured value machine - Google Patents

Automatic measured value machine Download PDF

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Publication number
CN110398654A
CN110398654A CN201910767425.8A CN201910767425A CN110398654A CN 110398654 A CN110398654 A CN 110398654A CN 201910767425 A CN201910767425 A CN 201910767425A CN 110398654 A CN110398654 A CN 110398654A
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CN
China
Prior art keywords
measured value
pipeline
needle
automatic
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910767425.8A
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Chinese (zh)
Inventor
刘博�
潘磊
雷利军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Blue Eye Technology Co Ltd
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Shenzhen Blue Eye Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Shenzhen Blue Eye Technology Co Ltd filed Critical Shenzhen Blue Eye Technology Co Ltd
Priority to CN201910767425.8A priority Critical patent/CN110398654A/en
Publication of CN110398654A publication Critical patent/CN110398654A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The embodiment provides a kind of automatic measured value machines, are related to surface mounting technology field.The automatic measured value machine includes: feeder, delivery platform, testing agency.The pipeline for material conveying band is provided on delivery platform.Feeder is connected to delivery platform, and feeder is used for along pipeline material conveying band.Testing agency is movably disposed in delivery platform, and it is located above pipeline, testing agency is provided with measured value needle close to the side of pipeline, measured value needle is for penetrating encapsulating film and to electronic component measured value, testing agency can drive measured value needle selectively mobile close to pipeline, or drive measured value needle mobile far from pipeline.Electronic component on the automatic measured value function automatic feeding band provided in the embodiment of the present invention carries out measured value, and then realize the automation of electronic component detection, and encapsulating film realization can be passed through by measured value needle to avoid tearing encapsulating film off manually, and then improves the purpose of production efficiency.

Description

Automatic measured value machine
Technical field
The present invention relates to surface mounting technology fields, in particular to a kind of automatic measured value machine.
Background technique
In China, this can be described as development at full speed in several years to SMT (surface mounting technology) industry.And during development People require constantly to improve to the quality of product, structural framing, and surface mounting technology is to the advance of passive element, surface Mount components are smaller and smaller.
At this stage the problem of SMT industry is had a headache the most it is exactly that electronic component is more and more, size is smaller and smaller, and Quality is higher and higher, and this requires factories to want stringent control quality in supplied materials link.At present for major part SMT factory, need Manually supplied materials is detected, detailed process: take material disc to be measured, tear encapsulation plastic mold, under magnifying glass take out to It surveys material and is put into particular detection position, then polarity measured value point is found accurately by magnifying glass, hand-held bridge measurement test pencil measured value simultaneously records.
Summary of the invention
The purpose of the present invention includes, being capable of electronics member on automatic feeding band for example, provide a kind of automatic measured value machine Part carries out measured value, and then realizes the automation of electronic component detection, and can pass through encapsulating film realization by measured value needle and avoid hand It is dynamic to tear encapsulating film off, and then improve the purpose of production efficiency.
The embodiment of the present invention this can be implemented so that
The embodiment provides a kind of automatic measured value machine, on the material strip in SMT technique electronic component from Measured value is moved, the encapsulating film for encapsulating the electronic component is provided on the material strip and is arranged along the material strip extending direction Multiple through-holes, the automatic measured value machine includes: feeder, delivery platform, testing agency.
The pipeline for conveying the material strip is provided on the delivery platform.
The feeder is connected to the delivery platform, and the feeder is used to convey the material along the pipeline Band.
The testing agency is movably disposed in the delivery platform, and is located above the pipeline, the detection Mechanism is provided with measured value needle close to the side of the pipeline, and the measured value needle is for penetrating the encapsulating film and to the electronics Element measured value, the testing agency can drive the measured value needle selectively mobile close to the pipeline, or described in drive Measured value needle is mobile far from the pipeline.
Selectively, the testing agency includes the first measured value structure, the second measured value structure and location structure.
The first measured value structure and the second measured value structure are movably disposed in the delivery platform and are located at Above the pipeline, the first measured value structure and the second measured value spacing structure setting, the first measured value structure and The second measured value structure is provided with the measured value needle close to the side of the pipeline.
The location structure is installed on the first measured value structure, and the first measured value structure can drive the location structure Towards the pipeline movement and the location structure is made to be caught in the through-hole.
Selectively, the location structure includes mounting rack, the first positioning tooth and the second positioning tooth, the mounting rack installation In the first measured value structure, and the mounting rack extends to below the second measured value structure.
First positioning tooth and second positioning tooth are convexly equipped in the mounting rack close to the side of the pipeline, And first positioning tooth is located at below the first measured value structure, and second positioning tooth is located at the second measured value structure Lower section.
Selectively, the mounting rack includes connection frame and the first tabletting, and the connection frame is installed on first measured value Structure, first tabletting is installed on the connection frame close to the side of the pipeline, and first tabletting extends to Below the second measured value structure.
First positioning tooth and second positioning tooth are mounted on first tabletting close to the one of the pipeline Side.
Selectively, multiple escape groove are provided in first tabletting, escape groove described at least two of which is right respectively It should be set to below the first measured value structure and below the second measured value structure, the measured value needle passes through the escape groove simultaneously First tabletting is protruded from close to the side of the pipeline.
Selectively, the testing agency further includes at least two knit stitch mechanisms and at least two replacement structures, two institutes State that knit stitch mechanism is mobilizable to be installed on the delivery platform, and two knit stitch are inter-agency every setting, described in two Replacement structure is removably installed in two knit stitch mechanisms, the first measured value structure and the second measured value structure respectively It is respectively arranged in two replacement structures.
Selectively, the measured value needle includes the first measured value needle and the second measured value needle, and the first measured value needle is used for first The measured value of the electronic component of specification, measured value of the second measured value needle for the electronic component of the second specification are described First measured value needle is installed on the first measured value structure, and the second measured value needle is installed on the second measured value structure.
Selectively, delivery chute extending in a straight line is offered on the pipeline, the delivery chute is described for conveying Material strip, the feeder are set to wherein one end of the delivery chute, and the delivery chute is located at below the location structure, described Location structure can protrude into the delivery chute and be caught in the through-hole.
Selectively, the inside of the delivery chute is additionally provided with the second tabletting, second tabletting and the delivery chute The conveying space for conveying the material strip is formed between bottom wall, is offered in second tabletting and is adapted to the location structure Locating holes, the location structure can pass through and the locating holes and protrude into the conveying space.
Selectively, the measured value needle is wedge shaped close to one end of the pipeline.
The beneficial effect of the automatic measured value machine of the embodiment of the present invention compared with the existing technology includes, for example:
Automatic measured value function provided by the invention is movable relative to delivery platform by testing agency, and drives measured value simultaneously Needle is close or far from pipeline, and then can be when measured value needle is close to pipeline to the electronic component on the material strip of pipeline conveying Measured value is carried out, and then the electronic component on energy automatic feeding band carries out measured value detection, avoids the error of artificial detection appearance, together When improve efficiency for measured value.In addition, passing through encapsulating film by measured value needle carries out measured value to electronic component, it is avoided that craft The waste for tearing time cost caused by encapsulating film, further increases production efficiency.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of the automatic measured value machine provided in the embodiment of the present invention;
Fig. 2 is the structural schematic diagram of material strip;
Fig. 3 is the enlarged structure schematic diagram in Fig. 1 at III;
Fig. 4 is the structural schematic diagram of the automatic measured value machine part provided in the embodiment of the present invention;
Fig. 5 is the structural schematic diagram at first the first visual angle of tabletting provided in the embodiment of the present invention;
Fig. 6 is the structural schematic diagram at first the second visual angle of tabletting provided in the embodiment of the present invention;
Fig. 7 is the structural schematic diagram of the delivery platform provided in the embodiment of the present invention;
Fig. 8 is the enlarged structure schematic diagram of VIII in Fig. 7;
Fig. 9 is the structural schematic diagram of the automatic measured value machine part provided in the embodiment of the present invention;
Figure 10 is the enlarged structure schematic diagram in Fig. 1 at X.
Icon: the automatic measured value machine of 10-;11- material strip;12- electronic component;13- through-hole;100- delivery platform;110- conveying Line;120- delivery chute;121- conveying space;The second tabletting of 122-;123- mounting groove;200- testing agency;210- knit stitch mechanism; 220- replaces structure;230- the first measured value structure;240- the second measured value structure;250- measured value needle;251- the first measured value needle;252- Second measured value needle;260- location structure;261- mounting rack;262- connection frame;The first tabletting of 263-;The first positioning tooth of 264-; The second positioning tooth of 265-;266- escape groove;300- feeder;310- conveyance gear;The 311- gear teeth;400- cuts material device.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that if there is the side of the instructions such as term " on ", "lower", "inner", "outside" Position or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when the side usually put Position or positional relationship, are merely for convenience of description of the present invention and simplification of the description, rather than the device or member of indication or suggestion meaning Part must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, being only used for distinguishing description if there is term " first ", " second " etc., it is not understood to indicate or imply phase To importance.
It should be noted that in the absence of conflict, the feature in the embodiment of the present invention can be combined with each other.
Referring to Fig. 1, providing a kind of automatic measured value machine 10 in the present embodiment, which is used for surface mount The electronic component 12 on material strip 11 conveyed in the process flow of technology (SMT, Surface Mounting Technology) into Row measured value, and then whether detect electronic component 12 qualified.The automatic measured value machine 10 being capable of electronic component on automatic feeding band 11 12 carry out measured value, and then realize the automation that electronic component 12 detects, and can pass through encapsulating film realization by measured value needle 250 and keep away Exempt to tear encapsulating film off manually, and then improves the purpose of production efficiency.
It should be noted that please referring to Fig. 1 and Fig. 2, in the present embodiment, it is provided on material strip 11 for encapsulating electricity The encapsulating film (not shown) of subcomponent 12 can encapsulate electronic component 12 by encapsulating film, be avoided that electronic component 12 is touched Damage and oxidation damage.In addition, multiple through-holes 13 of the extending direction arrangement along material strip 11 are provided on material strip 11, meanwhile, The orientation of multiple electronic components 12 on material strip 11 is equally arranged along the extending direction of material strip 11.
Wherein, Fig. 1-Fig. 3 is please referred to, automatic measured value machine 10 includes feeder 300, delivery platform 100 and detection machine Structure 200.Feeder 300 is connected to delivery platform 100, and material strip 11 of the feeder 300 for that will be equipped with electronic component 12 is defeated It send to delivery platform 100.Delivery platform 100 is used for material conveying band 11, so that material strip 11 can move up in specified path It is dynamic, in order to the detection of the electronic component 12 on material strip 11, while can also taking and being installed on print convenient for electronic component 12 Circuit board processed.Optionally, in the present embodiment, the pipeline 110 for material conveying band 11 is provided on delivery platform 100, it is defeated Send platform 100 that can convey material strip 11 along the transport path that pipeline 110 limits.Testing agency 200 is movably arranged In delivery platform 100, and testing agency 200 is located at the top of pipeline 110, so that testing agency 200 can be relative to defeated Send platform 100 mobile and selectively close to or far from pipeline 110, it just can be by testing agency 200 in close material strip 11 When to material strip 11 carry out measured value, and then realize for electronic component 12 on material strip 11 automatic measured value.It should be noted that at this In embodiment, testing agency 200 is provided with measured value needle 250 close to the side of pipeline 110, which can pass through and be used for The encapsulating film of encapsulating compound band 11 simultaneously directly gos deep into encapsulating film interior contact electronic component 12, and realizes for electronic component 12 Measured value.
Further, Fig. 1 and Fig. 4 are please referred to, testing agency 200 includes the first measured value structure 230, the second measured value knot Structure 240 and location structure 260.
Wherein, the first measured value structure 230 and the second measured value structure 240 are movably installed on delivery platform 100 and position Above pipeline 110, at the same the first measured value structure 230 and the setting of the second measured value structure 240 interval, the first measured value structure 230 It is provided with measured value needle 250 close to the side of pipeline 110 with the second measured value structure 240, so that the first measured value structure 230 Measured value can be carried out to electronic component 12 respectively with the second measured value structure 240.
Optionally, measured value needle 250 may include the first measured value needle 251 and the second measured value needle 252, and the first measured value needle 251 is used In the electronic component 12 for detecting the first specification, the second measured value needle 252 is used to detect the electronic component 12 of the second specification.And first Measured value needle 251 is installed in the first measured value structure 230, and the second measured value needle 252 is installed in the second measured value structure 240, just can be real The measured value needle 250 for now detecting different size respectively by the first measured value structure 230 and the second measured value structure 240, in other words, right When the electronic component 12 of different size is detected, need to respectively correspond in the electronic component 12 of different size be placed in it is corresponding First measured value structure 230 perhaps the lower section of the second measured value structure 240 in order to passing through the first measured value structure 230 or the second measured value Structure 240 carries out corresponding measured value, guarantees the Accuracy and high efficiency for 12 measured value of electronic component.
It should be noted that in the present embodiment, the first measured value structure 230 and the second measured value structure 240 can be set To be multiple, and the measured value needle 250 being arranged in each first measured value structure 230 and each second measured value structure 240 can be used respectively In the electronic component 12 of measurement different size.In other words, measured value needle 250 can also include for detecting third specification electronic component 12 third measured value needle, the 4th measured value needle for detecting the 4th specification electronic component 12 and for detecting the 5th specification electronics The 5th measured value needle of element 12 etc., and third measured value needle, the 4th measured value needle and the 5th measured value needle are respectively arranged in multiple In one measured value structure 230 or the second measured value structure 240, so that each first measured value structure 230 and each second measured value The electronic component 12 that structure 240 can correspond to different size carries out measured value, and then realizes efficient for plurality of specifications electronic component 12 Accurately measured value significantly promotes measurement efficiency.
Optionally, in the present embodiment, the quantity of the first measured value structure 230 is set as one, the second measured value structure 240 Quantity is set as two, also, the first measured value structure 230 is set between two the second measured value structures 240.Wherein, it first surveys The measured value needle 250 installed in value structure 230 and two the second measured value structures 240 can be directed to the electronic component 12 of different size into Row measured value.It, can also will be in the first measured value structure 230 and two the second measured value structures 240 it should be appreciated that in other embodiments Measured value needle 250 be set as the electronic component 12 for specification of the same race, setting for measured value needle 250 can be carried out according to actual demand It sets, when only needing the electronic component 12 to a kind of specification to carry out measured value, need to only be surveyed in the first measured value structure 230 and two second It is worth setting in structure 240 for the measured value needle 250 of the electronic component 12 of the specification, when needing to the electronics of plurality of specifications member When part 12 carries out measured value, a variety of corresponding measured value needles 250 are just set and are respectively arranged in the first measured value structure 230 or two second In measured value structure 240.
Further, in the present embodiment, measured value needle 250 is set as wedge-shaped part close to one end of pipeline 110, and then makes Encapsulating film can be penetrated and stretch to inside encapsulating film to the progress measured value of electronic component 12 inside encapsulating film, energy by obtaining measured value needle 250 It avoids tearing time caused by the encapsulating film i.e. increase of cost by hand, and then reduces cost and improve measured value efficiency.It should be appreciated that In other embodiments, the end of measured value needle 250 may be set to be sharp other shapes, such as taper or point of a knife shape Deng.
In addition, location structure 260 is installed on the first measured value structure 230, and the first measured value structure 230 can be in opposite conveying It drives location structure 260 mobile while platform 100 is mobile, and then passes through when the first measured value structure 230 is close to pipeline 110 Location structure 260 provides positioning action to material strip 11, and the electronic component 12 on material strip 11 is protected while measuring The stable state in position is held, so that the measurement for electronic component 12 is efficiently and stable.Optionally, in the present embodiment In, location structure 260 can be caught in the through-hole 13 on material strip 11 under the induced effect of the first measured value structure 230, in turn Stable positioning action is provided to material strip 11, it should be understood that in other embodiments, location structure 260 can also pass through other Mode to material strip 11 provide positioning action, for example, location structure 260 can be pressed does not install electronic component 12 on material strip 11 Part, and then guarantee material strip 11 stability etc..
Further, location structure 260 includes mounting rack 261, the first positioning tooth 264 and the second positioning tooth 265.Mounting rack 261 are installed on the first measured value structure 230, and mounting rack 261 extends to 240 lower section of the second measured value structure.First positioning tooth 264 Mounting rack 261 is convexly equipped in close to the side of pipeline 110 with the second positioning tooth 265, and the first positioning tooth 264 is located at first 230 lower section of measured value structure, the second positioning tooth 265 are located at 240 lower section of the second measured value structure.It can be aligned by the first positioning tooth 264 Material strip 11 in 230 lower section of the first measured value structure provides positioning action, and then guarantees the first measured value structure 230 to the first measured value When electronic component 12 on the material strip 11 of 230 lower section of structure is detected, the stabilization of electronic component 12 can guarantee.Similarly, can lead to It crosses the second positioning tooth 265 and provides positioning action to the material strip 11 for being located at 240 lower section of the second measured value structure, and then guarantee the second measured value Structure 240 can guarantee electronics member when to detecting for the electronic component 12 on the material strip 11 below the second measured value structure 240 The stabilization of part 12.It should be noted that the one end for material strip 11 occur is located at when material strip 11 is in the transmission process of pipeline 110 First measured value structure, 230 lower section, when the other end is located at the second measured value 240 lower section of structure, can pass through the first positioning tooth simultaneously at this time 264 and second positioning tooth 265 to material strip 11 provide positioning action, and then guarantee material strip 11 stabilization.Wherein, the first positioning tooth 264 and second the quantity of positioning tooth 265 may each be multiple, the similarly quantity of the first positioning tooth 264 and the second positioning tooth 265 It can be one.
Optionally, in the present embodiment, since the two sides of the first measured value structure 230 are provided with the second measured value structure 240, That is, mounting rack 261 can extend in both directions, and two the second measured value structures, 240 lower section is extended respectively to, and respectively two The lower section of a second measured value structure 240 is provided with the second positioning tooth 265, and then guarantees that material strip 11 is being located at the second measured value structure When 240 lower section, stable positioning action can be provided to material strip 11 by corresponding second positioning tooth 265.
In the present embodiment, when material strip 11 is delivered to 230 lower section of the first measured value structure and needs through the first measured value structure When measured value needle 250 on 230 detects electronic component 12, the first measured value structure 230 is controlled at this time and is moved towards pipeline 110 It is dynamic, and can be by the first positioning tooth 264 to the stability of the position assurance material strip 11 of material strip 11, and then pass through the first measured value structure Measured value needle 250 on 230 carries out measured value to electronic component 12, and the second measured value structure 240 can not generate movement at this time.Similarly, When material strip 11 is delivered to 240 lower section of the second measured value structure and needs to survey electronic component 12 by the second measured value structure 240 When value, it is mobile towards pipeline 110 first to control the first measured value structure 230, and provide by the second positioning tooth 265 material strip 11 and determine Position effect guarantees the stability of material strip 11, then mobile towards pipeline 110 by the second measured value structure 240 of control and to electronics Element 12 carries out measured value, it should be understood that the first measured value structure 230 and the second measured value structure 240 can also move at the same time at this time.
In addition, in other embodiments, the setting of measured value needle 250 can also be cancelled in the first measured value structure 230, i.e., first Measured value structure 230 only provides positioning action to material strip 11.
It should be noted that measured value needle 250 is when being installed in the first measured value structure 230 and the second measured value structure 240, energy Across mounting rack 261 and mounting rack 261 is protruded from close to the side of pipeline 110, so that measured value needle 250 is to first When measured value structure 230 or the second measured value structure 240 mobile close to pipeline 110, mounting rack 261 can be passed through and to electronic component 12 carry out measured value.
Further, Fig. 1, Fig. 4, Fig. 5 and Fig. 6 are please referred to, in the present embodiment, mounting rack 261 includes connection frame 262 and first tabletting 263.Connection frame 262 is installed on the first measured value structure 230, and the first tabletting 263 is installed on connection frame 262 and leans on The side of nearly pipeline 110, and the first tabletting 263 extends to 240 lower section of the second measured value structure.It should be noted that at this In embodiment, connection frame 262 is installed on the two sides of the first measured value structure 230, and the first tabletting 263 is then installed on positioned at the first measured value On the connection frame 262 of 230 two sides of structure, and then it can guarantee the mounting stability of the first tabletting 263, meanwhile, it can be surveyed convenient for first It is worth the installation of measured value needle 250 in structure 230, i.e., measured value needle 250 is installed between the connection frame 262 of two sides.First positioning tooth 264 and second positioning tooth 265 be mounted on the first tabletting 263 close to the side of pipeline 110, i.e. the first positioning tooth 264 installation In in the first tabletting 263 for being located at 230 lower section of the first measured value structure, the second positioning tooth 265 is installed on positioned at the second measured value structure In first tabletting 263 of 240 lower sections.
In the present embodiment, measured value needle 250 pass through the first tabletting 263 and enable measured value needle 250 to electronic component 12 into Row measured value avoids the first tabletting 263 from impacting the detection of electronic component 12.Optionally, it is provided in the first tabletting 263 more A escape groove 266, multiple escape groove 266 correspond respectively to multiple measured value needles 250 and are arranged, wherein at least two escape groove 266 are divided Not Dui Yingyu the first measured value structure 230 and the second measured value structure 240 so that the measured value needle 250 in the first measured value structure 230 The realization of corresponding escape groove 266 can be passed through across the purpose of the first tabletting 263, while making the survey in the second measured value structure 240 The realization of corresponding escape groove 266 can be passed through across the purpose of the first tabletting 263 by being worth needle 250.It should be noted that escape groove 266 Set-up mode can be directly in the first tabletting 263 through opening up, while fold-line-shaped can also be set by the first tabletting 263 Or with curved shape etc., the part of the recess of the first tabletting 263 at this time forms escape groove 266.
Further, in the present embodiment, the length that measured value needle 250 protrudes from the first tabletting 263 across escape groove 266 is small The length of the first tabletting 263 is protruded from the first positioning tooth 264, and protrudes from the first tabletting 263 less than the second positioning tooth 265 Protrude from the length of the first tabletting 263.It can to pass through through-hole 13 in the first positioning tooth 264 and the second positioning tooth 265 and to material When band 11 provides positioning action, measured value can be carried out to the electronic component 12 on material strip 11 convenient for measured value needle 250.
In addition, testing agency 200 further includes at least two knit stitch mechanisms 210 and at least two replacement structures 220.Under two Needle mechanism 210 is mobilizable to be installed on delivery platform 100, and the interval setting of Liang Ge knit stitch mechanism 210, Liang Ge knit stitch mechanism 210 can be relative to 100 activity of delivery platform selectively close to pipeline 110 or far from pipeline 110.Two replacements Structure 220 is removably installed in Liang Ge knit stitch mechanism 210, the first measured value structure 230 and the second measured value structure 240 difference respectively It is installed in two replacement structures 220, and then realization the can be detachably connected by replacement structure 220 and knit stitch mechanism 210 The dismounting and change of one measured value structure 230 and the second measured value structure 240.
It should be noted that replacement structure 220 can be the fixture block for being connected in knit stitch mechanism 210, while knit stitch mechanism 210 On be provided with the card slot being adapted in fixture block, fixture block can protrude into inside card slot realize knit stitch mechanism 210 and replace structure 220 can Dismantling connection, or replacement structure 220 can be using part made of magnetic part, can be detachable by way of magnetic-adsorption Be installed in knit stitch mechanism 210 etc..
Fig. 1, Fig. 7, Fig. 8 and Fig. 9 are please referred to, pipeline 110 includes delivery chute 120 extending in a straight line, the conveying Slot 120 is opened on delivery platform 100, and delivery chute 120 is for conveying material strip 11.It should be appreciated that in other realities It applies in example, the extension path of delivery chute 120 is also possible to curve or broken line, and it is corresponding at this time, in testing agency 200 One measured value structure 230 and the second measured value structure 240 need to be arranged according to the transport path of delivery chute 120, so that testing agency 200 can carry out measured value to the electronic component 12 on the material strip 11 on delivery chute 120 when mobile relative to pipeline 110.
Wherein, Fig. 1 and Figure 10 are please referred to, feeder 300 is set to wherein one end of delivery chute 120, so that sending Material machine 300 can convey material strip 11 along delivery chute 120.It should be noted that feeder 300 includes conveyance gear 310, tooth is conveyed Wheel 310 is rotationally connected with delivery platform 100, and multiple gear teeth compatible with through-hole 13 are provided in conveyance gear 310 311, when material strip 11 is placed in 120 inside of delivery chute, at least one gear teeth 311 is stretched to inside through-hole 13, and in conveying tooth Material strip 11 is conveyed along delivery chute 120 in the rotation process of wheel 310.
In addition, the other end of delivery chute 120, which is provided with, cuts material device 400, the electricity that material device 400 is used to complete measured value is cut The corresponding material strip 11 of subcomponent 12 is cut, and then guarantees that subsequent production continues.It should be appreciated that in other embodiments, it can also To cancel the setting for cutting material device 400.
Further, in the present embodiment, be additionally provided with the second tabletting 122 inside delivery chute 120, the second tabletting 122 with The conveying space 121 for being used for material conveying band 11 is formed between the bottom wall of delivery chute 120.I.e. in the present embodiment, the second tabletting 122 It is roughly parallel to the bottom wall of delivery chute 120, so that the second tabletting 122 can limit one between the bottom wall of delivery chute 120 The conveying space 121 for adapting to material strip 11 can guarantee that material strip 11 in the conveying of 121 internal stability of conveying space, avoids material strip 11 There is a situation where warping or sideslip, and then guarantee to provide the measured value of stability and high efficiency to the electronic component 12 on material strip 11.Separately Outside, the locating holes for adapting to location structure 260 are additionally provided in the second tabletting 122, so that location structure 260 is close to material When band 11 is mobile, locating holes can be passed through and penetrate the through-hole 13 on material strip 11, realize the positioning action for material strip 11.
It should be noted that in the present embodiment, being provided on the side wall of delivery chute 120 and adapting to the second tabletting 122 Mounting groove 123 realizes that the second tabletting 122 in the installation of delivery chute 120, can make the second tabletting 122 to material by mounting groove 123 Stable chip hold down is provided with 11, and then guarantees that material strip 11 can be stable convey.
In addition, in the present embodiment, automatic measured value machine 10 can also include control system (not shown), driving device (figure Do not show) and measured value instrument (not shown).Wherein, detection device (not shown) can be set at the both ends of delivery chute 120, for detecting Material strip 11 is output and input, i.e., when material strip 11 is put into delivery chute 120 close to one end of feeder 300, detection device inspection Being put into for material strip 11 is measured, the driving device that control system control at this time is connected to feeder 300 carries out set a distance to material strip 11 Material strip 11, is delivered to specified position by conveying.When material strip 11 is delivered to specified position, the control of 13 control system of through-hole The driving device for being connected to testing agency 200 drives the first measured value structure 230 mobile close to pipeline 110, can pass through positioning knot The position correction of material strip 11 is realized in the cooperation of structure 260 and through-hole 13, can improve the location accuracy of material strip 11, then can be by the Measured value needle 250 in one measured value structure 230 contacts electronic component 12 and carries out measured value, or passes through control driving device driving second Measured value structure 240 moves through measured value needle 250 close to pipeline 110 and contacts the progress measured value of electronic component 12.Measured value instrument can be with Measured value needle 250 is electrically connected, so that measured value instrument can carry out electronic component 12 by the contact with electronic component 12 of measured value needle 250 Measured value, and the reading of data can be carried out on measured value instrument.
Wherein, control system can be PLC control unit.Detection device can be photosensitive sensors such as infrared, laser etc.. In addition, measured value needle 250 can be by connecting host computer to the wire cables such as usb, serial ports, cable, bluetooth, wifi or wireless mode (not shown) sends control instruction, and host computer passes through wire cables or the wireless modes such as usb, serial ports, GPIB, cable, wifi The measured values instrument such as the LCR table of connection, multimeter, impedance analyzer, oscillograph, Network Analyzer, comprehensive tester obtain institute's measured value.
In conclusion the automatic measured value machine 10 provided in the present embodiment can be by testing agency 200 relative to delivery platform 100 activities, and drive measured value needle 250 close simultaneously or separate pipeline 110, and then can be in measured value needle 250 close to pipeline The electronic component 12 on material strip 11 conveyed when 110 to pipeline 110 carries out measured value, and then the electronics on energy automatic feeding band 11 Element 12 carries out measured value detection, avoids the error of artificial detection appearance, while improving the efficiency for measured value.In addition, logical It crosses measured value needle 250 and measured value is carried out to electronic component 12 across encapsulating film, be avoided that and tear time cost caused by encapsulating film by hand Waste, further increase production efficiency.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims It is quasi-.

Claims (10)

1. a kind of automatic measured value machine, the automatic measured value of electronic component on the material strip in SMT technique is provided on the material strip For encapsulating the encapsulating film of the electronic component and along multiple through-holes of material strip extending direction arrangement, which is characterized in that The automatic measured value machine includes: feeder, delivery platform, testing agency;
The pipeline for conveying the material strip is provided on the delivery platform;
The feeder is connected to the delivery platform, and the feeder is used to convey the material strip along the pipeline;
The testing agency is movably disposed in the delivery platform, and is located above the pipeline, the testing agency The side of the pipeline is provided with measured value needle, the measured value needle is for penetrating the encapsulating film and to the electronic component Measured value, the testing agency can drive the measured value needle selectively mobile close to the pipeline, or drive the measured value Needle is mobile far from the pipeline.
2. automatic measured value machine according to claim 1, which is characterized in that the testing agency include the first measured value structure, Second measured value structure and location structure;
The first measured value structure and the second measured value structure are movably disposed in the delivery platform and are located at described Above pipeline, the first measured value structure and the second measured value spacing structure setting, the first measured value structure and described Second measured value structure is provided with the measured value needle close to the side of the pipeline;
The location structure is installed on the first measured value structure, and the first measured value structure can drive the location structure direction The pipeline is mobile and the location structure is made to be caught in the through-hole.
3. automatic measured value machine according to claim 2, which is characterized in that the location structure includes mounting rack, first fixed Position tooth and the second positioning tooth, the mounting rack are installed on the first measured value structure, and the mounting rack extends to described the Below two measured value structures;
First positioning tooth and second positioning tooth are convexly equipped in the mounting rack close to the side of the pipeline, and First positioning tooth is located at below the first measured value structure, and second positioning tooth is located under the second measured value structure Side.
4. automatic measured value machine according to claim 3, which is characterized in that the mounting rack includes connection frame and the first pressure Piece, the connection frame are installed on the first measured value structure, and first tabletting is installed on the connection frame close to the conveying The side of line, and first tabletting extends to below the second measured value structure;
First positioning tooth and second positioning tooth are mounted on first tabletting close to the side of the pipeline.
5. automatic measured value machine according to claim 4, which is characterized in that be provided with multiple evacuation in first tabletting Slot, escape groove described at least two of which, which respectively corresponds, to be set to below the first measured value structure and the second measured value structure Lower section, the measured value needle pass through the escape groove and protrude from first tabletting close to the side of the pipeline.
6. automatic measured value machine according to claim 2, which is characterized in that the testing agency further includes at least two knit stitch Mechanism and at least two replacement structures, two knit stitch mechanisms are mobilizable to be installed on the delivery platform, and two The knit stitch is inter-agency every setting, and two replacement structures are removably installed in two knit stitch mechanisms respectively, described First measured value structure and the second measured value structure are respectively arranged in two replacement structures.
7. automatic measured value machine according to claim 2, which is characterized in that the measured value needle includes the first measured value needle and second Measured value needle, measured value of the first measured value needle for the electronic component of the first specification, the second measured value needle are used for second The measured value of the electronic component of specification, the first measured value needle are installed on the first measured value structure, the second measured value needle It is installed on the second measured value structure.
8. the automatic measured value machine according to any one of claim 2-7, which is characterized in that the pipeline includes along straight The delivery chute that line extends, for the delivery chute for conveying the material strip, the feeder is set to wherein the one of the delivery chute End, the delivery chute are located at below the location structure, and the location structure can protrude into the delivery chute and be caught in the through-hole.
9. automatic measured value machine according to claim 8, which is characterized in that the inside of the delivery chute is additionally provided with the second pressure Piece, forms the conveying space for conveying the material strip between second tabletting and the bottom wall of the delivery chute, and described second The locating holes for adapting to the location structure are offered in tabletting, the location structure can pass through the locating holes and protrude into The conveying space.
10. automatic measured value machine according to any one of claims 1-7, which is characterized in that the measured value needle is close to institute The one end for stating pipeline is wedge shaped.
CN201910767425.8A 2019-08-20 2019-08-20 Automatic measured value machine Pending CN110398654A (en)

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CN111182780A (en) * 2020-01-16 2020-05-19 深圳市蓝眼博科科技有限公司 Material belt splicing machine
CN111239513A (en) * 2020-01-16 2020-06-05 深圳市蓝眼博科科技有限公司 Measuring device
CN111260819A (en) * 2020-01-16 2020-06-09 深圳市蓝眼科技有限公司 Electronic component detection method and apparatus, and computer-readable storage medium
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