CN111251724A - Rapid aging device and aging method for thick film heating resistor - Google Patents
Rapid aging device and aging method for thick film heating resistor Download PDFInfo
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- CN111251724A CN111251724A CN202010213773.3A CN202010213773A CN111251724A CN 111251724 A CN111251724 A CN 111251724A CN 202010213773 A CN202010213773 A CN 202010213773A CN 111251724 A CN111251724 A CN 111251724A
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- module
- heating resistor
- heating
- control module
- thick film
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention provides a rapid aging device and an aging method for a thick film heating resistor, wherein the device comprises a control module, the control module is respectively connected with a heating module, an electric pulse generation module, a temperature measurement module and a resistance measurement module, and the heating module is used for heating a heating table for placing a thick film heating resistor substrate; the temperature measuring module is used for measuring the temperature of the heating table in real time; the resistance measuring module is used for measuring the resistance value of the heating resistor body in the thick-film heating resistor substrate; the electric pulse generation module is connected with the probe module, the individual electrode probes and the common electrode probe in the probe module are used for being connected with the heating resistor body, the electric pulse generation module generates electric pulses with expected level values according to the control of the control module, and the control module controls the cycle times of the electric pulses. The rapid aging device and the aging method for the thick film heating resistor adopt the synergistic effect of external heating and self heating of the heating resistor body to intensify charge vibration and accelerate rapid dissipation of internal residual charges.
Description
Technical Field
The invention relates to the technical field of thermal printing, in particular to a thick film heating resistor rapid aging device and an aging method.
Background
The thick film heating resistor is manufactured by mixing conductive particles with glass powder and then sintering, wherein the conductive particles in the resistor body of the thick film heating resistor are mixed with glass insulating particles, so that a conductive chain formed by the mutual contact of the conductive particles and a tiny capacitor formed by the glass and the conductive particles are stored, as shown in fig. 1-2.
Because the field of the thermal printing head, the resistance value of the small-size thick-film heating resistor can be adjusted only by adopting lossless high-voltage discharge pulses, partial charges can remain in a small capacitor formed by glass and conductive particles after high-voltage discharge resistance trimming is adopted, errors exist in resistance value testing caused by the residual charges, the residual charges can be dissipated in more than 100 hours, the resistance value can be slowly reduced in the charge dissipation process, the resistance value of the thick-film heating resistor is continuously changed, and the quality of a product is influenced.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a rapid aging device and an aging method for a thick film heating resistor, so that residual charges in the thick film heating resistor can be rapidly dissipated by a method of combining external heating and electric pulse self-heating application, and the problem that the resistance value of the thick film heating resistor continuously changes and deviates from a target value after discharge resistance trimming is solved.
In order to achieve the above object, in one aspect, the present invention provides a fast aging device for a thick film heating resistor, including a control module, where the control module is respectively connected to a heating module, an electric pulse generation module, a temperature measurement module, and a resistance measurement module, where the heating module is used to heat a heating table on which a thick film heating resistor substrate is placed; the temperature measuring module is used for measuring the temperature of the heating table in real time and transmitting the measured value to the control module; the resistance measuring module is used for measuring the resistance value of the heating resistor body in the thick-film heating resistor substrate and transmitting the measurement result to the control module; the electric pulse generation module is connected with the probe module, the individual electrode probes and the common electrode probes in the probe module are used for being connected with the heating resistor body in the thick film heating resistor substrate, the electric pulse generation module generates electric pulses with expected level values according to the control of the control module, and the control module controls the cycle times of the electric pulses.
In another aspect of the present invention, a thick film heating resistor rapid aging method based on the thick film heating resistor rapid aging apparatus is provided, the method includes the following steps:
the method comprises the following steps that 1, a thick film heating resistor substrate is placed on a heating table, a control module controls a heating module to heat, a temperature measuring module measures the temperature of the heating table in real time in the heating process and transmits the measured value to the control module, the heating table is heated to a preset temperature at a constant temperature by the heating module and is cooled to room temperature after the preset temperature is maintained for a preset time, and therefore partial or all residual charges in all heating resistors in the thick film heating resistor substrate are rapidly dissipated;
and 6, repeating the steps 2-5, and carrying out aging treatment on the next heating resistor body in the thick-film heating resistor substrate until the aging treatment on all the heating resistor bodies in the thick-film heating resistor substrate is completed.
Preferably, in the step 1, the heating table is heated to a preset temperature at a constant temperature by a heating module, and the preset temperature is 25-400 ℃.
Preferably, in the step 3, the electric pulse generating module generates a set of positive level pulses and negative level pulses, the pulse width of the set is 10ns to 1ms, and the frequency of the set is 1KHz to 10MHz, and each application is to apply the set of electric pulses to the heating resistor body in the step 2 through the probe module.
Preferably, in the step 3, the level value of the electric pulse may be controlled to be 0 to 36V.
Preferably, in the step 3, the number of cycles of the electric pulse may be controlled to be 1 to 10.
The scheme of the invention has the beneficial effects that the rapid aging device and the aging method of the thick film heating resistor adopt the synergistic effect of external heating and self heating of the heating resistor body to intensify charge vibration and accelerate rapid dissipation of internal residual charge, can realize rapid dissipation of residual charge of the thick film heating resistor body after 20000 high-voltage pulse discharge resistance trimming within 30-60 min, and ensure that the resistance value fluctuation of the heating resistor body is less than 0.5 percent.
Drawings
Fig. 1 shows a schematic view of the micro-capacitor structure in a thick film heating resistor.
Fig. 2 shows an equivalent schematic diagram of the capacitance-resistance characteristic of the thick film heating resistor.
Fig. 3 shows a schematic diagram of a fast aging device of a thick film heating resistor according to the present invention.
Fig. 4 shows a schematic circuit diagram of the functional blocks according to the invention.
Fig. 5 shows an enlarged view of the circuit schematic of the resistance measuring module according to the invention.
Fig. 6 shows an enlarged view of the circuit schematic of the thermometric module according to the present invention.
Fig. 7 shows an enlarged view of a schematic circuit diagram of a heating module according to the present invention.
Fig. 8 is an enlarged view of a schematic circuit diagram of the electric pulse generation module according to the present invention.
Reference numerals: the device comprises a control module, a 2-heating module, a 3-thick film heating resistor substrate, a 4-electric pulse generation module, a 5-probe module, a 6-temperature measurement module and a 7-resistance measurement module.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
According to the phenomenon, residual charges in the thick film heating resistor are quickly dissipated by a method of combining external heating and self-heating of electric pulses, and the problem that the resistance value of the thick film heating resistor continuously changes and deviates from a target value after discharging and resistance trimming is solved.
As shown in fig. 3, the fast aging device for the thick film heating resistor according to the present invention comprises a control module 1, wherein the control module 1 is respectively connected to a heating module 2, an electric pulse generation module 4, a temperature measurement module 6, and a resistance measurement module 7, wherein the heating module 2 is used for heating a heating platform on which a thick film heating resistor substrate 3 is placed; the temperature sensor in the temperature measuring module 6 is arranged on the heating table and used for measuring the temperature of the heating table in real time and transmitting the measured value to the control module 1; the resistance measuring module 7 is used for measuring the resistance value of the heating resistor body in the thick-film heating resistor substrate 3 and transmitting the measurement result to the control module 1; the electric pulse generation module 4 is connected with the probe module 5, the individual electrode probes and the common electrode probes in the probe module 5 are used for being connected with the heating resistor bodies in the thick film heating resistor substrate 3, the thick film heating resistor substrate 3 comprises a plurality of heating resistor bodies, the electric pulse generation module 4 generates electric pulses with expected level values according to the control of the control module 1, and the control module 1 controls the cycle times, namely the application times of the electric pulses.
The control module 1, the heating module 2, the electric pulse generation module 4, the temperature measurement module 6, and the resistance measurement module 7 are all common functional modules in the prior art, in this embodiment, schematic circuit diagrams of the control module 1, the heating module 2, the electric pulse generation module 4, the temperature measurement module 6, and the resistance measurement module 7 are shown in fig. 4-8, and a more detailed circuit description is not provided herein. Of course, other circuit configurations may be used as long as the same function is achieved.
The invention relates to a method for quickly aging a thick film heating resistor, which comprises the following steps:
The heating module 2 has low heat capacity, has the functions of rapid heating, cooling and constant temperature, the heating and temperature control are between 25 ℃ and 400 ℃, the time for keeping the peak temperature can be adjusted according to the requirement, and then the heating module is rapidly cooled to the room temperature, so that the rapid dissipation of part or all of residual charges in the full-number heating resistor in the thick film heating resistor substrate 3 is realized.
And 2, measuring the resistance value of one heating resistor in the thick-film heating resistor substrate 3 through the resistance measuring module 7, transmitting the measurement result to the control module 1, and comparing and calculating the resistance value with a preset aging target value by the control module 1.
And 3, when the resistance value does not reach the preset aging target value, the control module 1 controls the electric pulse generation module 4 to generate electric pulses with expected level values, the electric pulses are applied to the heating resistor body in the step 2 through the probe module 5 to carry out self-heating, and the cycle times, namely the application times, of the electric pulses are controlled through the control module 1.
The electric pulse generating module 4 can generate electric pulses for heating intermittently, the positive level pulse and the negative level pulse generated by the electric pulse generating module 4 form a group, the pulse width is 10ns-1ms, the frequency is 1KHz-10MHz, the control module 1 can control the level values of the group of electric pulses generated by the electric pulse generating module 4, namely the level values of the positive level pulse and the negative level pulse, and each application is to apply the group of electric pulses to the heating resistor body in the step 2 through the probe module 5. The specific electric pulse level value can be controlled at 0-36V, and the circulation times of the electric pulse can be controlled at 1-10 times. The control module 1 may terminate the output of the electrical pulse after the resistance value is stabilized.
And 4, measuring the resistance value of the heating resistor in the thick-film heating resistor substrate 3 again through the resistance measuring module 7, transmitting the measurement result to the control module 1, and comparing and calculating the resistance value with a preset aging target value by the control module 1.
And 5, when the resistance value does not reach the preset aging target value, repeating the step 3 and the step 4 until the charge dissipation is finished and the resistance value of the heating resistor is stable.
And 6, repeating the steps 2-5, and carrying out aging treatment on the next heating resistor body in the thick-film heating resistor substrate 3 until the aging treatment on all the heating resistor bodies in the thick-film heating resistor substrate 3 is completed.
The rapid aging device and the aging method for the thick film heating resistor adopt the synergistic effect of external heating and self heating of the heating resistor body to intensify charge vibration and accelerate rapid dissipation of internal residual charge, and can realize rapid dissipation of residual charge of the thick film heating resistor body after 20000 high-voltage pulse discharge resistance trimming within 30-60 min, so that the resistance value fluctuation of the heating resistor body is less than 0.5 percent.
Claims (6)
1. The utility model provides a quick aging device of thick film heating resistor which characterized in that: the heating device comprises a control module, wherein the control module is respectively connected with a heating module, an electric pulse generation module, a temperature measurement module and a resistance measurement module, and the heating module is used for heating a heating table for placing a thick film heating resistor substrate; the temperature measuring module is used for measuring the temperature of the heating table in real time and transmitting the measured value to the control module; the resistance measuring module is used for measuring the resistance value of the heating resistor body in the thick-film heating resistor substrate and transmitting the measurement result to the control module; the electric pulse generation module is connected with the probe module, the individual electrode probes and the common electrode probes in the probe module are used for being connected with the heating resistor body in the thick film heating resistor substrate, the electric pulse generation module generates electric pulses with expected level values according to the control of the control module, and the control module controls the cycle times of the electric pulses.
2. A thick film heating resistor rapid aging method based on the thick film heating resistor rapid aging device of claim 1, characterized in that: the method comprises the following steps:
the method comprises the following steps that 1, a thick film heating resistor substrate is placed on a heating table, a control module controls a heating module to heat, a temperature measuring module measures the temperature of the heating table in real time in the heating process and transmits the measured value to the control module, the heating table is heated to a preset temperature at a constant temperature by the heating module and is cooled to room temperature after the preset temperature is maintained for a preset time, and therefore partial or all residual charges in all heating resistors in the thick film heating resistor substrate are rapidly dissipated;
step 2, measuring the resistance value of a heating resistor body in the thick-film heating resistor substrate through a resistance measuring module, and transmitting the measurement result to a control module, wherein the control module compares the resistance value with a preset aging target value for calculation;
step 3, when the resistance value does not reach the preset aging target value, the control module controls the electric pulse generation module to generate electric pulses with expected level values, the electric pulses are applied to the heating resistor body in the step 2 through the probe module to carry out self-heating, and the cycle number of the electric pulses is controlled through the control module;
step 4, measuring the resistance value of the heating resistor body in the thick-film heating resistor substrate through the resistance measuring module again, and transmitting the measurement result to the control module, wherein the control module compares the resistance value with a preset aging target value for calculation;
step 5, when the resistance value does not reach the preset aging target value, repeating the step 3 and the step 4 until the charge dissipation is finished and the resistance value of the heating resistor is stable;
and 6, repeating the steps 2-5, and carrying out aging treatment on the next heating resistor body in the thick-film heating resistor substrate until the aging treatment on all the heating resistor bodies in the thick-film heating resistor substrate is completed.
3. The method for rapidly aging the thick film heating resistor according to claim 2, wherein: in the step 1, the heating table is heated to a preset temperature at a constant temperature by a heating module, and the preset temperature is 25-400 ℃.
4. The method for rapidly aging the thick film heating resistor according to claim 2, wherein: in the step 3, the positive level pulse and the negative level pulse generated by the electric pulse generation module form a group, the pulse width of the group is 10ns to 1ms, the frequency is 1KHz to 10MHz, and each application is to apply the group of electric pulses to the heating resistor body in the step 2 through the probe module.
5. The method for rapidly aging the thick film heating resistor according to claim 4, wherein: in said step 3, the level value of the electric pulse may be controlled at 0-36V.
6. The method for rapidly aging the thick film heating resistor according to claim 5, wherein: in step 3, the number of cycles of the electric pulse can be controlled to be 1-10 times.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010213773.3A CN111251724B (en) | 2020-03-24 | 2020-03-24 | Quick aging device and aging method for thick film heating resistor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010213773.3A CN111251724B (en) | 2020-03-24 | 2020-03-24 | Quick aging device and aging method for thick film heating resistor |
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| CN111251724A true CN111251724A (en) | 2020-06-09 |
| CN111251724B CN111251724B (en) | 2023-07-25 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02286356A (en) * | 1989-04-28 | 1990-11-26 | Hitachi Ltd | Trimming apparatus for heat-sensitive head |
| JPH03261564A (en) * | 1990-03-09 | 1991-11-21 | Fuji Xerox Co Ltd | Thermal head and manufacture thereof |
| JPH04164655A (en) * | 1990-05-31 | 1992-06-10 | Kyocera Corp | Method for trimming resistors of thin-film thermal head |
| CN202764430U (en) * | 2012-08-18 | 2013-03-06 | 山东华菱电子有限公司 | Thermal printing head |
| CN103381711A (en) * | 2012-05-04 | 2013-11-06 | 山东华菱电子有限公司 | Method and device for thermal printing head resistor repair |
| CN207875161U (en) * | 2017-12-07 | 2018-09-18 | 山东华菱电子股份有限公司 | A kind of thermal printing head repaiies resistance device |
| CN108944064A (en) * | 2018-06-07 | 2018-12-07 | 广州四为科技有限公司 | The method of device for adjusting and measuring, commissioning thermal head resistance value |
| CN211994719U (en) * | 2020-03-24 | 2020-11-24 | 山东华菱电子股份有限公司 | Thick film heating resistor rapid aging device |
-
2020
- 2020-03-24 CN CN202010213773.3A patent/CN111251724B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02286356A (en) * | 1989-04-28 | 1990-11-26 | Hitachi Ltd | Trimming apparatus for heat-sensitive head |
| JPH03261564A (en) * | 1990-03-09 | 1991-11-21 | Fuji Xerox Co Ltd | Thermal head and manufacture thereof |
| JPH04164655A (en) * | 1990-05-31 | 1992-06-10 | Kyocera Corp | Method for trimming resistors of thin-film thermal head |
| CN103381711A (en) * | 2012-05-04 | 2013-11-06 | 山东华菱电子有限公司 | Method and device for thermal printing head resistor repair |
| CN202764430U (en) * | 2012-08-18 | 2013-03-06 | 山东华菱电子有限公司 | Thermal printing head |
| CN207875161U (en) * | 2017-12-07 | 2018-09-18 | 山东华菱电子股份有限公司 | A kind of thermal printing head repaiies resistance device |
| CN108944064A (en) * | 2018-06-07 | 2018-12-07 | 广州四为科技有限公司 | The method of device for adjusting and measuring, commissioning thermal head resistance value |
| CN211994719U (en) * | 2020-03-24 | 2020-11-24 | 山东华菱电子股份有限公司 | Thick film heating resistor rapid aging device |
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| CN111251724B (en) | 2023-07-25 |
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