CN111239043A - Drawing clamp for solder bonding strength test - Google Patents
Drawing clamp for solder bonding strength test Download PDFInfo
- Publication number
- CN111239043A CN111239043A CN202010132473.2A CN202010132473A CN111239043A CN 111239043 A CN111239043 A CN 111239043A CN 202010132473 A CN202010132473 A CN 202010132473A CN 111239043 A CN111239043 A CN 111239043A
- Authority
- CN
- China
- Prior art keywords
- solder
- clamp
- lower clamp
- seat
- solder bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
Abstract
The invention belongs to the field of material bonding strength tests, and discloses a drawing clamp for a solder bonding strength test, wherein an upper clamp part comprises an upper clamp seat, a clamp connecting piece and a solder bonding disc; the upper clamp seat is fixedly connected with the upper clamp and is connected with the solder bonding disc through a clamp connecting piece; the lower clamp part comprises a pressure plate and a lower clamp seat; the pressure plate is arranged on the upper part of the lower clamp seat through a fastening screw and is fixed on the lower clamp together with the lower clamp seat; the base plate is pressed and fixed between the pressing plate and the lower clamp seat; the center of the pressure plate is provided with a through hole which exposes the solder on the substrate; the area of the solder bonding pad is close to the spreading area of the solder so as to bond the solder and ensure that the stress of the solder is uniform in the test process. The invention utilizes the small-area solder bonding plate to be adaptive to the welding point, and the large-area pressure plate to fix the substrate, so that the solder is uniformly stressed and can be completely separated from the substrate in the bonding strength test process, and the test stability and the data reliability are improved.
Description
Technical Field
The invention belongs to the field of infrared spectrum application, and particularly relates to an environment loading device for a dynamic infrared spectrum technology.
Background
The adhesion strength test can measure the adhesion force on a unit adhesion surface, the test of the adhesion strength of the solder and the substrate is an important index for measuring the welding reliability of materials, and the adhesion strength clamp is the most basic and important component of the adhesion strength test. The common drawing clamp has the main structure that the two parallel bonding plates are respectively glued and fixed with the solder and the substrate, and the bonding plates are easily separated from the bonding surface of a sample in the drawing process, so that the bonding strength between the solder and the substrate cannot be accurately obtained; because the contact area of solder joint and bonding board is less, be difficult for gluing, and the uneven condition of atress when can taking place to draw leads to remaining the solder on the base plate after solder and base plate separation, influences the test data reliability. Therefore, it is necessary to design and develop a new jig for solder adhesion strength test, which can fix the substrate to the adhesive sheet and completely separate the solder joint from the substrate during the test.
Disclosure of Invention
The invention aims to solve the technical problem that the common drawing clamp influences the accuracy of the bonding strength test data, and provides the drawing clamp for the solder bonding strength test.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a drawing clamp for a solder bonding strength test is divided into an upper clamp part and a lower clamp part; the upper clamp part comprises an upper clamp seat, a clamp connecting piece and a solder bonding disc; the upper clamp seat is fixedly connected with an upper clamp and is connected with the solder bonding disc through the clamp connecting piece;
the lower clamp part comprises a pressing plate and a lower clamp seat; the pressure plate is arranged on the upper part of the lower clamp seat through a fastening screw and is fixed on a lower clamp together with the lower clamp seat; a fixed substrate is pressed and fixed between the pressing disc and the lower clamp seat; the center of the pressure plate is provided with a through hole which exposes the solder on the substrate;
the through hole of the pressure plate can accommodate the solder bonding plate, and the area of the solder bonding plate is close to the tiled area of the solder so as to bond the solder and ensure that the stress of the solder is uniform in the test process.
Furthermore, one end of the clamp connecting piece is provided with an external thread, and the clamp connecting piece is matched and connected with a threaded hole arranged in the center of the upper clamp seat through the external thread; and one end of the clamp connecting piece is provided with an internal thread, and the clamp connecting piece is matched and connected with a convex threaded column arranged on the top surface of the solder bonding disc through the internal thread.
Further, the bottom surface of the solder bonding pad is a flat surface.
The invention has the beneficial effects that:
the drawing clamp for the solder bonding strength test is divided into an upper clamp part and a lower clamp part, wherein the upper clamp part is designed in a separated mode, so that the solder can be conveniently glued; the area of the solder bonding plate is close to the tiled area of the solder, so that the welding spot can be completely glued on the solder bonding plate, and the solder is uniformly stressed in the test process; the lower clamp part is provided with a pressure plate, the substrate and the lower clamp seat are fixed through screws, the substrate and the lower clamp part cannot be separated in the test process, and the substrate and the lower clamp part can be conveniently taken down for subsequent analysis after the test is finished.
Drawings
FIG. 1 is a schematic structural view of a drawing jig provided in an embodiment in which an upper jig portion and a lower jig portion are separated;
FIG. 2 is a schematic structural view of bonding of an upper clamp portion and a lower clamp portion of a drawing clamp provided by an embodiment;
FIG. 3 is a schematic structural view of a sample in the example;
fig. 4 is a top view of fig. 3.
In the above figures: 1: an upper clamp seat; 2: a clamp connection member; 3: a solder-bonding pad; 4: a platen; 5: fastening the threaded hole; 6: a lower clamp base; 7: welding flux; 8: a substrate.
Detailed Description
In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings:
as shown in fig. 1 and 2, the present embodiment provides a drawing jig for solder bonding strength test, which is divided into an upper jig part including an upper jig base 1, a jig connecting member 2 and a solder bonding pad 3, and a lower jig part including a platen 4 and a lower jig base 6.
Go up anchor clamps seat 1 and be equipped with the discoid structure of screw hole for the center, discoid structure is equipped with the screw hole of circumference equipartition, and the fastening screw of accessible installation in the screw hole is fixed in anchor clamps. The clamp connecting piece 2 is a cylindrical structure with inner and outer threads at two ends respectively, and an outer thread at one end is used for being matched and connected with a threaded hole of the upper clamp seat 1; the other end is an internal thread which is used for being matched and connected with the convex thread column of the solder bonding disc 3. The solder bonding disc 3 is of a disc-shaped structure, and a raised threaded column is arranged at the center of one surface of the solder bonding disc and is used for being matched and connected with the internal thread of the clamp connecting piece 2; the other side of the solder-bonding pad 3 is a flat surface for bonding the solder 7. The area of the solder bonding pad 3 is close to the tiled area of the solder 7, so that the solder 7 can be completely bonded on the solder bonding pad 3, and the uniform stress of the solder 7 in the test process is ensured.
The pressure plate 4 is a disc-shaped structure provided with a through hole at the center, the size of the through hole is larger than that of the solder 7, so that the solder 7 is exposed, and the solder bonding plate 3 is sufficiently accommodated to be adhesively fixed with the solder 7; the pressure plate 4 is also provided with four fastening threaded holes 5 which are uniformly distributed on the circumference. Lower anchor clamps seat 6 is discoid structure, and it is equipped with four fastening screw hole 5 of circumference equipartition, and fastening screw hole 5 of lower anchor clamps seat 6 sets up with 5 one-to-one of fastening screw hole of pressure disk 4, and fastening screw accessible fastening screw hole 5 is fixed in lower anchor clamps in the lump with pressure disk 4 and lower anchor clamps seat 6.
The base plate 8 is arranged in the middle of the pressure plate 4 and the lower clamp seat 6, and the fastening screw is screwed through the fastening threaded hole 5, so that the pressure plate 4 and the lower clamp seat 6 are used for fastening the fixed base plate 8, the base plate 8 and the lower clamp part are not separated in the test process, and the rear part is conveniently taken down for subsequent analysis after the test is finished.
As shown in fig. 3 and 4, the solder 7 in the sample is soldered to the substrate 8. During testing, the solder bonding disc 3 and the solder 7 are fixed in an adhesive manner, the upper clamp part is assembled on a mechanical testing machine through the upper clamp seat 1, the substrate 8 is placed between the pressure plate 4 and the lower clamp seat 6, and the fastening screw is screwed down to fix the substrate 8; the lower clamp part is assembled on the mechanical testing machine through the lower clamp seat 6. The test software is opened, and after the scheme is set to start the test, the upper clamp part drives the solder 7 which is fixed by gluing to be separated from the substrate 8.
Although the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and those skilled in the art can make various changes and modifications within the spirit and scope of the present invention without departing from the spirit and scope of the appended claims.
Claims (3)
1. A drawing clamp for a solder bonding strength test is divided into an upper clamp part and a lower clamp part; the welding fixture is characterized in that the upper fixture part comprises an upper fixture seat, a fixture connecting piece and a welding flux bonding disc; the upper clamp seat is fixedly connected with an upper clamp and is connected with the solder bonding disc through the clamp connecting piece;
the lower clamp part comprises a pressing plate and a lower clamp seat; the pressure plate is arranged on the upper part of the lower clamp seat through a fastening screw and is fixed on a lower clamp together with the lower clamp seat; a fixed substrate is pressed and fixed between the pressing disc and the lower clamp seat; the center of the pressure plate is provided with a through hole which exposes the solder on the substrate;
the through hole of the pressure plate can accommodate the solder bonding plate, and the area of the solder bonding plate is close to the tiled area of the solder so as to bond the solder and ensure that the stress of the solder is uniform in the test process.
2. The drawing clamp for the solder bonding strength test is characterized in that one end of the clamp connecting piece is provided with an external thread, and the external thread is matched and connected with a threaded hole arranged at the center of the upper clamp seat; and one end of the clamp connecting piece is provided with an internal thread, and the clamp connecting piece is matched and connected with a convex threaded column arranged on the top surface of the solder bonding disc through the internal thread.
3. The drawing jig for solder joint strength test as claimed in claim 1, wherein the bottom surface of the solder bonding pad is a flat surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010132473.2A CN111239043A (en) | 2020-02-29 | 2020-02-29 | Drawing clamp for solder bonding strength test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010132473.2A CN111239043A (en) | 2020-02-29 | 2020-02-29 | Drawing clamp for solder bonding strength test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111239043A true CN111239043A (en) | 2020-06-05 |
Family
ID=70868155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010132473.2A Pending CN111239043A (en) | 2020-02-29 | 2020-02-29 | Drawing clamp for solder bonding strength test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111239043A (en) |
-
2020
- 2020-02-29 CN CN202010132473.2A patent/CN111239043A/en active Pending
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