CN107588999B - A pressurization solidification equipment for preparing coating tensile bonding strength sample - Google Patents
A pressurization solidification equipment for preparing coating tensile bonding strength sample Download PDFInfo
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- CN107588999B CN107588999B CN201710727691.9A CN201710727691A CN107588999B CN 107588999 B CN107588999 B CN 107588999B CN 201710727691 A CN201710727691 A CN 201710727691A CN 107588999 B CN107588999 B CN 107588999B
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Abstract
The invention relates to a pressurizing and curing device for preparing a coating tensile bonding strength sample, which comprises a lower end cover, wherein a plurality of vertical slide rails are fixed on the lower end cover, the top ends of the slide rails are fixed through an upper end cover, a vertical first threaded hole is formed in the upper end cover, a stress application screw rod penetrating through the first threaded hole is further arranged on the upper end cover, an upper stress application plate is arranged below the stress application screw rod, a plurality of first clamps integrally connected with the upper stress application plate are arranged on the upper stress application plate, the first clamps are respectively sleeved on the slide rails in a sliding manner, and fastening bolts are arranged on the opening side of the first clamps; and a detachable pressure sensor is arranged between the upper stress application plate and the stress application screw rod. The device can accurately provide loading pressure, the bolt is fastened through the upper stress plate, the pressure sensor can be conveniently removed when the sample reaches the preset pressure, and the problem that the pressure sensor cannot enter a high-temperature oven is solved.
Description
Technical Field
The invention belongs to the field of machinery, and particularly relates to a pressurizing and curing device for preparing a coating tensile bonding strength sample.
Background
In the existing supersonic flame spraying coating tensile bonding strength test, an epoxy resin adhesive pressurization high-temperature curing device adopts a double-support-rod structure, the device is easy to deform in the sample pressurization process to influence the pressurization stability of a sample, the pressure loading mode comprises weight pressurization and screw pressurization, the weight pressurization needs dozens of kilograms of weights, the weight loading and the process of entering a drying oven are very laborious, the screw pressurization can only rotate the screw by feeling due to the fact that a force measuring mechanism does not have a force measuring mechanism, the magnitude of the pressurization has no accurate numerical value, a sleeve is used for controlling the surface displacement of the sample, and the sleeve is removed in a turning mode after the glue solution of the sample is cured. Summary the prior art has the place that several aspects are not enough, and first no pressure measurement device, second the structure of sample face displacement clamp is unreasonable, uses at every turn and all needs to use the lathe car to fall, can not recycle.
Disclosure of Invention
The invention aims to provide a pressurizing and curing device for preparing a coating tensile bonding strength sample aiming at the defects of the prior art, so as to solve the problem that the curing pressure is uncertain in the sample pressurizing and bonding process and improve the success rate of a tensile bonding strength test.
In order to solve the technical problems, the technical scheme of the invention is as follows: the pressurizing and curing device for preparing the coating tensile bonding strength sample comprises a lower end cover, wherein a plurality of vertical slide rails are fixed on the lower end cover, the top ends of the slide rails are fixed through an upper end cover, a vertical first threaded hole is formed in the upper end cover, a stress application screw rod penetrating through the first threaded hole is further arranged on the upper end cover, an upper stress application plate is arranged below the stress application screw rod, a plurality of first clamps integrally connected with the upper stress application plate are arranged on the upper stress application plate, the first clamps are respectively sleeved on the slide rails in a sliding mode, and fastening bolts are arranged on the opening side of each first clamp; and a detachable pressure sensor is arranged between the upper stress application plate and the stress application screw rod.
By adopting the structural design, the pressure sensor and the display can measure the pressure in real time in the process of preparing the sample; after the stressing screw rod is screwed down and the stress is applied to a preset value, each fastening bolt can be screwed down, and the upper stressing plate is tightly fixed on the sliding rail, so that the pressure sensor can be taken out under the condition of keeping the pressure, and the epoxy resin adhesive can be cured at high temperature in the oven.
Furthermore, a lower force application mechanism is arranged at the top of the lower end cover.
Furthermore, the lower force applying mechanism comprises a pressure spring arranged on the lower end cover, and the top of the pressure spring is provided with a lower force applying plate capable of sliding upwards or downwards relative to each sliding rail. The design parameters of the spring ensure that the device is easily loaded to a preset pressure value, and the expansion deformation of the device can be ignored relative to the large deformation of the spring when the device is placed in a high-temperature oven, so that the stability of the sample loading pressure is ensured.
Furthermore, a first positioning through hole is formed in the lower stress application plate so as to facilitate positioning of the sample in the device.
Furthermore, a vertical conical force application bolt is fixed at the bottom of the upper force application plate, and is in point-surface contact, so that the force application uniformity is ensured.
Further, the pressure display is further included and is electrically connected with the pressure sensor.
Further, the quantity of slide rail is 3, 3 slide rails are regular triangle distribution, and 3 slide rails (vaulting pole structure) can guarantee axiality and stability among the sample bonding process.
Further, the device also comprises a hollow stressing nut which is arranged between the sample and the conical stressing bolt.
The samples prepared with the apparatus of the present invention generally comprised a coated substrate block and a coating loading block bonded by an epoxy glue. Preferably, the bonding is provided with an anti-displacement clamp.
The device can accurately provide loading pressure, air bubbles in the glue solution with too low pressure cannot be fully discharged, the glue solution, the coating block and the loading block cannot be fully attached, the glue solution between the substrate block and the loading block is excessively extruded due to too high pressure, the strength of the glue solution after being cured is not high in the two conditions, through analysis of a large amount of test data, the strength of a cylindrical sample with the diameter of 25mm is the highest when the curing pressure value of the epoxy resin E-7 glue is 33Kgf, and the device provides pressure regulation and pressure measurement guarantee for scientific research and test. Through last gusset fastening bolt, pressure sensor can be conveniently removed when the sample reaches predetermined pressure, the problem that pressure sensor can not get into the high temperature oven is solved.
In addition, the surface displacement control of the past sample uses a sleeve, and the sleeve needs to be removed by turning after the glue solution of the sample is cured, so that a large amount of manpower and material resources are wasted.
Drawings
Fig. 1 is a schematic structural view of a conventional press curing apparatus.
Fig. 2 is a schematic structural view of a press curing apparatus according to a first embodiment of the present invention.
Fig. 3 is a plan view (upper) and a front view (lower) of the lower cap of the first embodiment of the present invention.
Fig. 4 is a plan view (upper) and a front view (lower) of a lower gusset of a first embodiment of the present invention.
Fig. 5 is a plan view (upper left), a side view (upper right), and a front view (lower) of an upper gusset of the first embodiment of the present invention.
Fig. 6 is a plan view (upper) and a front view (lower) of the upper end cap according to the first embodiment of the present invention.
Fig. 7 is a schematic structural view of a hollow force nut according to a first embodiment of the present invention.
Fig. 8 is a schematic structural view of a positioning bolt according to a first embodiment of the present invention.
Fig. 9 is a schematic structural view of a tapered force-applying bolt according to a first embodiment of the present invention.
Fig. 10 is a schematic structural view of a stressing screw according to a first embodiment of the present invention.
Fig. 11 is a schematic structural view of a slide rail according to a first embodiment of the present invention.
Fig. 12 is a top (upper) and front (lower) view of the anti-face shift clip of the first embodiment of the present invention.
Fig. 13 is a schematic structural view of a compression spring according to a first embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to fig. 2 to 13 in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. For convenience of description, the words "upper", "lower", "left" and "right" in the following description are used only to indicate the correspondence between the upper, lower, left and right directions of the drawings themselves, and do not limit the structure.
Fig. 2 is a schematic structural view of a press curing apparatus according to a first embodiment of the present invention. Specifically, the pressurizing and curing device for preparing the coating tensile bonding strength sample comprises a lower end cover 16, wherein 3 vertical slide rails 11 are fixed on the lower end cover 16, the 3 slide rails 11 are distributed in a regular triangle shape, the top ends of the 3 slide rails 11 are fixed through an upper end cover 2, a vertical first threaded hole 201 is formed in the upper end cover 2, a stress application screw 1 penetrating through the first threaded hole 201 is further arranged on the upper end cover 2, an upper stress application plate 4 is arranged below the stress application screw 1, a plurality of first hoops 401 integrally connected with the upper stress application plate 4 are arranged on the upper stress application plate 4, the plurality of first hoops 401 are respectively sleeved on the slide rails 11 in a sliding mode, and fastening bolts 5 are arranged on the opening side of each first hoop 401; and a detachable pressure sensor 3 is arranged between the upper stress application plate 4 and the stress application screw rod 1. Specifically, the pressure sensor 3 may be disposed on the upper surface of the upper forcing plate 4, and the bottom end of the forcing screw 1 contacts the top surface of the pressure sensor 3 when pressure is applied.
The top of the lower end cover 16 is provided with a lower force applying mechanism, the lower force applying mechanism comprises a pressure spring 14 arranged on the lower end cover 16, and the top of the pressure spring 14 is provided with a lower force applying plate 13 capable of sliding upwards or downwards relative to each sliding rail 11.
The lower gusset 13 is provided with a first positioning through hole 1301.
And a vertical conical stressing bolt 6 is fixed at the bottom of the upper stressing plate 4, and the conical stressing bolt 6 is arranged right opposite to the first positioning hole 1301. Preferably, the upper end of the conical stressing bolt 6 is in threaded connection with the upper stressing plate 4.
And a pressure display 15, wherein the pressure display 15 is electrically connected with the pressure sensor 3.
The procedure for preparing a sample using the pressure fixing apparatus of the present embodiment is as follows: coating a coating loading block 8 and a coating substrate block 10 with glue (epoxy resin glue) and then butting, and sleeving a surface displacement prevention clamp 9 at the butting position; the upper end of the coating loading block 8 is screwed with a hollow stress application nut 7, and the lower end of the coating machine block 10 is screwed with a positioning bolt 12; inserting the sample and the positioning bolt 12 into the first positioning through hole 1301, so that the sample stands in the device, and rotating the stress application screw 1 to gradually apply pressure; and (3) screwing each fastening bolt 5 when the numerical value of the pressure display 15 reaches a preset value, loosening the stressing bolt 1, taking out the pressure sensor 3, putting the device into a 100 ℃ oven, preserving the temperature for 3 hours, curing the glue solution, taking down the sample after curing, and finishing sample preparation.
The foregoing examples are set forth to illustrate the present invention more clearly and are not to be construed as limiting the scope of the invention, which is defined in the appended claims to which the invention pertains, as modified in all equivalent forms, by those skilled in the art after reading the present invention.
Claims (6)
1. The pressurizing and curing device for preparing the coating tensile bonding strength sample comprises a lower end cover (16) and is characterized in that a plurality of vertical slide rails (11) are fixed on the lower end cover (16), the top ends of the slide rails (11) are fixed through an upper end cover (2), a vertical first threaded hole (201) is formed in the upper end cover (2), a stress application screw (1) penetrating through the first threaded hole (201) is further arranged on the upper end cover (2), an upper stress application plate (4) is arranged below the stress application screw (1), a plurality of first hoops (401) integrally connected with the upper stress application plate (4) are arranged on the upper stress application plate (4), the first hoops (401) are respectively sleeved on the slide rails (11) in a sliding mode, and fastening bolts (5) are arranged on the opening side of the first hoops (401); a detachable pressure sensor (3) is arranged between the upper stress application plate (4) and the stress application screw (1); the pressure sensor is characterized by further comprising a pressure display (15), wherein the pressure display (15) is electrically connected with the pressure sensor (3).
2. The press curing apparatus for preparing the coated tensile bond strength test specimen according to the claim 1, wherein the lower end cap (16) is provided with a lower stress mechanism on the top.
3. The press curing device for preparing the coated tensile bonding strength test specimen according to the claim 2, wherein the lower forcing mechanism comprises a pressure spring (14) arranged on a lower end cover (16), and the top of the pressure spring (14) is provided with a lower forcing plate (13) capable of sliding upwards or downwards relative to each sliding rail (11).
4. The press curing apparatus for preparing a coated tensile bond strength test specimen according to claim 3, wherein the lower gusset (13) is provided with a first positioning through hole (1301).
5. The press curing device for preparing the coated tensile bonding strength test specimen according to the claim 1, wherein the bottom of the upper stress plate (4) is fixed with a vertical conical stress bolt (6).
6. The press curing device for preparing the coating tensile bonding strength test sample according to any one of claims 1 to 5, wherein the number of the slide rails (11) is 3, and the 3 slide rails (11) are distributed in a regular triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710727691.9A CN107588999B (en) | 2017-08-23 | 2017-08-23 | A pressurization solidification equipment for preparing coating tensile bonding strength sample |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710727691.9A CN107588999B (en) | 2017-08-23 | 2017-08-23 | A pressurization solidification equipment for preparing coating tensile bonding strength sample |
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| CN107588999A CN107588999A (en) | 2018-01-16 |
| CN107588999B true CN107588999B (en) | 2021-02-26 |
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| CN201710727691.9A Active CN107588999B (en) | 2017-08-23 | 2017-08-23 | A pressurization solidification equipment for preparing coating tensile bonding strength sample |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109342141B (en) * | 2018-10-30 | 2021-09-14 | 苏州迈拓金属检测服务有限公司 | Bonding method for spray coating binding force sample |
| CN110082150A (en) * | 2019-05-30 | 2019-08-02 | 洛阳理工学院 | A kind of Construction of Civil Engineering sampling and measuring device and its measurement method |
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| CN1912576A (en) * | 2005-08-12 | 2007-02-14 | 山东大学 | Detection method and device for thick coating adhesion force |
| CN203216795U (en) * | 2013-04-25 | 2013-09-25 | 无锡市福莱达石油机械有限公司 | Bonding fixture for testing bonding strength of thermal spraying coating |
| CN105466744A (en) * | 2015-12-30 | 2016-04-06 | 银邦金属复合材料股份有限公司 | Sample bonding die and method |
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| JP2561220B2 (en) * | 1994-02-25 | 1996-12-04 | ニッケン株式会社 | Specimen preparation equipment for asphalt mixture |
| EP1390466A4 (en) * | 2001-04-26 | 2010-07-28 | Pressure Biosciences Inc | Multichamber device and uses thereof for processing of biological samples |
| CN2886545Y (en) * | 2006-03-16 | 2007-04-04 | 上海交通大学 | Clamp for centering bonding of surface coating dual tension member |
| CN202362186U (en) * | 2011-12-14 | 2012-08-01 | 中国航空工业集团公司北京航空材料研究院 | Adhesion device for thermal spraying bonding strength sample |
| CN205246438U (en) * | 2015-12-15 | 2016-05-18 | 唐山学院 | Anchor clamps are used in test of coating bonding strength |
| CN105738174A (en) * | 2016-02-25 | 2016-07-06 | 哈尔滨飞机工业集团有限责任公司 | Manufacturing method of test sheet for adhesive floating and stripping test |
| CN205449658U (en) * | 2016-03-14 | 2016-08-10 | 北京中机联供非晶科技股份有限公司 | Bonding fixture for testing bonding strength of thermal spraying coating |
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| CN1912576A (en) * | 2005-08-12 | 2007-02-14 | 山东大学 | Detection method and device for thick coating adhesion force |
| CN203216795U (en) * | 2013-04-25 | 2013-09-25 | 无锡市福莱达石油机械有限公司 | Bonding fixture for testing bonding strength of thermal spraying coating |
| CN105466744A (en) * | 2015-12-30 | 2016-04-06 | 银邦金属复合材料股份有限公司 | Sample bonding die and method |
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