CN107402180B - Glue bonding strength measuring device - Google Patents
Glue bonding strength measuring device Download PDFInfo
- Publication number
- CN107402180B CN107402180B CN201710482614.1A CN201710482614A CN107402180B CN 107402180 B CN107402180 B CN 107402180B CN 201710482614 A CN201710482614 A CN 201710482614A CN 107402180 B CN107402180 B CN 107402180B
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- China
- Prior art keywords
- adhesive
- bonding
- glue
- rod
- cover
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
Abstract
The invention discloses a device for measuring the adhesive strength of glue, which comprises an adhesive rod, an adhesive cover sleeved on the adhesive rod and a force-applying clamp; the adhesive rod is provided with a base plate, and the adhesive cover is adhered to the base plate; during measurement, the adhesive rod and the adhesive cover which are sleeved together are installed in the seat cylinder, one end of the seat cylinder is in contact with the clamping surface of the force application clamp, the adhesive rod extends into a dynamometer probe of the dynamometer, one end of the dynamometer probe is in contact with the adhesive rod, and the other end of the dynamometer probe is in contact with the clamping surface of the force application clamp. The method can quantitatively measure the bonding strength corresponding to different glue thicknesses, and provides a guidance basis for engineering application. The invention has the advantages of convenient processing, simple use and accurate obtained numerical value.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a device for measuring adhesive strength of glue.
[ background of the invention ]
When the thickness of the glue is changed, the bonding strength is also changed. In practical engineering applications, the adhesive strength corresponding to different glue thicknesses needs to be known so as to select the optimal glue thickness, but no corresponding measuring device exists at present.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art and provide a glue bonding strength measuring device which can quantitatively measure the bonding strength corresponding to different glue thicknesses and provide a guide basis for engineering application.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a glue bonding strength measuring device comprises a bonding rod, a bonding cover sleeved on the bonding rod and a force-applying clamp; the adhesive rod is provided with a base plate, and the adhesive cover is adhered to the base plate; during measurement, the adhesive rod and the adhesive cover which are sleeved together are installed in the seat cylinder, one end of the seat cylinder is in contact with the clamping surface of the force application clamp, the adhesive rod extends into a dynamometer probe of the dynamometer, one end of the dynamometer probe is in contact with the adhesive rod, and the other end of the dynamometer probe is in contact with the clamping surface of the force application clamp.
The invention further improves the following steps:
the chassis is provided with an adhesive surface and a reference surface, the diameter of the reference surface is smaller than that of the adhesive surface, and the height of the reference surface is larger than that of the adhesive surface; a groove for preventing the glue from polluting the reference surface is formed between the reference surface and the bonding surface.
When the glue is coated, the glue is coated on the bonding surface, and the thickness of the glue layer is equal to the height difference between the reference surface and the bonding surface.
The top end of the adhesive rod is provided with a fixing nut, and the adhesive cover is tightly attached to the reference surface of the adhesive rod through the fixing nut.
The bonding cover is fixedly connected with the bottom barrel through screws.
A gap is reserved between the bottom surface of the bottom cylinder and the bottom surface of the bonding rod.
Compared with the prior art, the invention has the following beneficial effects:
the invention is composed of a fixed nut, a bonding cover, a plurality of bonding rods, a seat cylinder, a force-applying clamp, a dynamometer and the like. The bonding rods are provided with bonding surfaces and reference surfaces, and the bonding surfaces and the reference surfaces of different bonding rods have different height differences. And coating glue on the bonding surfaces of different bonding rods, and tightly covering the reference surface of the bonding rod by using a fixing nut, wherein the thickness of the glue is equal to the height difference of the different bonding rods. And after the glue is completely cured, taking down the fixing nut, plugging one end of the bonding rod into the seat cylinder, connecting the other end of the bonding rod to the dynamometer probe, and clamping the seat cylinder and the dynamometer probe by using a clamp. The force is applied with the clamp until the bond bar is separated from the bond cap and the maximum peak value read from the force gauge is the bond force. Different bonding rods can obtain different bonding forces, and the bonding strength of the glue can be obtained by dividing the bonding force by the area of the bonding surface. The method can quantitatively measure the bonding strength corresponding to different glue thicknesses, and provides a guidance basis for engineering application. The invention has the advantages of convenient processing, simple use and accurate obtained numerical value.
[ description of the drawings ]
FIG. 1 is a schematic illustration of use in measuring intensity;
FIG. 2 is an exploded schematic view;
FIG. 3 is a schematic view of the installation wherein (a) is a sectional view and (b) is an isometric view;
FIG. 4 is a schematic illustration of a bond bar, wherein (a) is a cross-sectional view and (b) is an isometric view;
figure 5 is a schematic view of the mounting of a dynamometer probe.
In the drawings, 1-a fixing nut; 2-bonding a cover; 3-screws; 4-sticking the pole; 5-a seat cylinder; 7-a force gauge; 8-dynamometer probe; 9-a force applicable clamp; 10-a bond bar datum plane; 11-adhesive rod adhesive face.
[ detailed description ] embodiments
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 2 and 4, the glue bonding strength measuring device of the invention comprises a bonding rod 4, a bonding cover 2 is sleeved on the bonding rod 4, and glue to be measured is uniformly coated between the bonding rod 4 and the bonding cover 2; the adhesive stick 4 is provided with an adhesive surface 11 and a reference surface 10, which are separated by a groove. The invention has a plurality of adhesive bars 4, and the adhesive surfaces 11 of different adhesive bars and the reference surface 10 have different height differences. The glue to be measured is uniformly coated on the bonding surface 11, and the glue cannot pollute the reference surface 10 due to the existence of the grooves.
As shown in fig. 2, 3 and 4, the bonding cap 2 is fitted over the bonding bar 4, and the fixing nut 1 is mounted so that the bonding cap 2 is closely attached to the reference surface 10 of the bonding bar 4. The glue thickness is equal to the height difference of the different adhesive rods 4. And after the glue is completely cured, taking down the fixing nut 1, plugging the bonding rod 4 into the seat cylinder 5, and fixing by using the screw 3. A gap is reserved between the bottom surface of the adhesive rod 4 and the bottom surface of the seat barrel 5.
As shown in fig. 1 and 5, one end of the adhesive rod 4 is attached to the dynamometer probe 8, leaving a gap between the dynamometer probe 8 and the adhesive cap 2. The cartridge 5 and dynamometer probe 8 are held by a forceable clamp 9. The force is applied by the forceable clamp 9 until the glue stick 4 is separated from the glue cap 2, and the maximum peak value read from the force gauge 7 is the glue force. Different adhesive force can be obtained by different adhesive rods 4, and the adhesive strength of the glue can be obtained by dividing the area of the adhesive surface 11.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (5)
1. The device for measuring the bonding strength of the glue is characterized by comprising a bonding rod (4), a bonding cover (2) sleeved on the bonding rod (4) and a force-applying clamp (9); the adhesive rod (4) is provided with a chassis, and the adhesive cover (2) is adhered to the chassis; during measurement, the adhesive rod (4) and the adhesive cover (2) which are sleeved together are arranged in the seat cylinder (5), one end of the seat cylinder (5) is contacted with the clamping surface of the force application clamp (9), the adhesive rod (4) extends into a dynamometer probe (8) of the dynamometer (7), one end of the dynamometer probe (8) is contacted with the adhesive rod (4), and the other end of the dynamometer probe is contacted with the clamping surface of the force application clamp (9);
the chassis is provided with an adhesive surface (11) and a reference surface (10), the diameter of the reference surface (10) is smaller than that of the adhesive surface (11), the height of the reference surface (10) is larger than that of the adhesive surface (11), and different height differences exist between the adhesive surfaces (11) and the reference surfaces (10) of different adhesive rods; a groove for preventing glue from polluting the reference surface (10) is formed between the reference surface (10) and the bonding surface (11).
2. Glue bond strength measuring device according to claim 1, characterized in that when applying glue, the glue is applied to the bonding surface (11) with a glue layer thickness equal to the difference in height between the reference surface (10) and the bonding surface (11).
3. The glue bonding strength measuring device according to claim 2, characterized in that the top end of the bonding rod (4) is provided with a fixing nut (1), and the bonding cover (2) is tightly attached to the reference surface (10) of the bonding rod (4) through the fixing nut (1).
4. The glue bonding strength measuring device according to claim 3, characterized in that the bonding cover (2) is fixedly connected with the bottom cylinder (5) through screws (3).
5. The glue bond strength measuring device according to claim 4, characterized in that a gap is left between the bottom surface of the bottom cylinder (5) and the bottom surface of the bonding rod (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710482614.1A CN107402180B (en) | 2017-06-22 | 2017-06-22 | Glue bonding strength measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710482614.1A CN107402180B (en) | 2017-06-22 | 2017-06-22 | Glue bonding strength measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107402180A CN107402180A (en) | 2017-11-28 |
| CN107402180B true CN107402180B (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710482614.1A Active CN107402180B (en) | 2017-06-22 | 2017-06-22 | Glue bonding strength measuring device |
Country Status (1)
| Country | Link |
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| CN (1) | CN107402180B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535182B (en) * | 2018-05-24 | 2020-09-01 | Oppo广东移动通信有限公司 | Dispensing test tool and test method thereof |
| CN108645752B (en) * | 2018-05-24 | 2021-03-09 | Oppo广东移动通信有限公司 | Dispensing test tool and test method thereof |
| CN109632635B (en) * | 2019-02-28 | 2021-06-22 | 常州工学院 | Boneless coil bonding force automatic testing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2753532A1 (en) * | 1996-09-17 | 1998-03-20 | Smurfit Cellulose Du Pin | Testing of glued strength of carton or packaging side wall |
| US5961766A (en) * | 1998-04-17 | 1999-10-05 | Avery Dennison Corporation | Method for selecting a substrate intended for use in a cutting operation |
| CN103033471A (en) * | 2012-12-28 | 2013-04-10 | 成都豪能科技股份有限公司 | Detection method and detector for bonding strength of materials |
| CN203132975U (en) * | 2013-02-07 | 2013-08-14 | 东华大学 | Biological tissue clamp for testing adhesive power of biological tissue adhesion material |
| CN204789288U (en) * | 2015-05-29 | 2015-11-18 | 中国人民解放军第五七二一工厂 | Special fixture from pressure test is pulled in gluing agent |
| CN105651688A (en) * | 2014-11-15 | 2016-06-08 | 西安志越机电科技有限公司 | A bonding strength testing device for adhesive materials |
-
2017
- 2017-06-22 CN CN201710482614.1A patent/CN107402180B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2753532A1 (en) * | 1996-09-17 | 1998-03-20 | Smurfit Cellulose Du Pin | Testing of glued strength of carton or packaging side wall |
| US5961766A (en) * | 1998-04-17 | 1999-10-05 | Avery Dennison Corporation | Method for selecting a substrate intended for use in a cutting operation |
| CN103033471A (en) * | 2012-12-28 | 2013-04-10 | 成都豪能科技股份有限公司 | Detection method and detector for bonding strength of materials |
| CN203132975U (en) * | 2013-02-07 | 2013-08-14 | 东华大学 | Biological tissue clamp for testing adhesive power of biological tissue adhesion material |
| CN105651688A (en) * | 2014-11-15 | 2016-06-08 | 西安志越机电科技有限公司 | A bonding strength testing device for adhesive materials |
| CN204789288U (en) * | 2015-05-29 | 2015-11-18 | 中国人民解放军第五七二一工厂 | Special fixture from pressure test is pulled in gluing agent |
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| Publication number | Publication date |
|---|---|
| CN107402180A (en) | 2017-11-28 |
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