CN111211147B - 柔性显示装置 - Google Patents
柔性显示装置 Download PDFInfo
- Publication number
- CN111211147B CN111211147B CN201911111749.2A CN201911111749A CN111211147B CN 111211147 B CN111211147 B CN 111211147B CN 201911111749 A CN201911111749 A CN 201911111749A CN 111211147 B CN111211147 B CN 111211147B
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- display device
- layer
- flexible display
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- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
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- 125000006850 spacer group Chemical group 0.000 claims description 6
- 230000032798 delamination Effects 0.000 abstract description 11
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- 239000010410 layer Substances 0.000 description 103
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- 239000010409 thin film Substances 0.000 description 6
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
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- 229910052760 oxygen Inorganic materials 0.000 description 3
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- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0145003 | 2018-11-22 | ||
| KR1020180145003A KR102607212B1 (ko) | 2018-11-22 | 2018-11-22 | 플렉서블 표시장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111211147A CN111211147A (zh) | 2020-05-29 |
| CN111211147B true CN111211147B (zh) | 2024-04-12 |
Family
ID=70771323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911111749.2A Active CN111211147B (zh) | 2018-11-22 | 2019-11-14 | 柔性显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11456430B2 (ko) |
| KR (1) | KR102607212B1 (ko) |
| CN (1) | CN111211147B (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110610972B (zh) * | 2019-09-19 | 2022-06-03 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法、显示装置 |
| CN111106259B (zh) * | 2019-12-04 | 2021-01-15 | 武汉华星光电半导体显示技术有限公司 | 可弯折有机发光二极管显示面板及有机发光二极管显示屏 |
| KR20220033611A (ko) * | 2020-09-08 | 2022-03-17 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20220088107A (ko) * | 2020-12-18 | 2022-06-27 | 엘지디스플레이 주식회사 | 표시 장치 |
| KR20220097581A (ko) * | 2020-12-30 | 2022-07-08 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20230063925A (ko) * | 2021-10-29 | 2023-05-10 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20230101185A (ko) * | 2021-12-29 | 2023-07-06 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794631A (zh) * | 2012-10-31 | 2014-05-14 | 乐金显示有限公司 | 柔性有机电致发光装置及其制造方法 |
| CN104241550A (zh) * | 2014-08-05 | 2014-12-24 | 京东方科技集团股份有限公司 | Oled显示装置及其封装方法 |
| KR20160053356A (ko) * | 2014-11-03 | 2016-05-13 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
| EP3217265A1 (en) * | 2016-03-11 | 2017-09-13 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
| CN107230694A (zh) * | 2016-03-24 | 2017-10-03 | 三星显示有限公司 | 有机发光显示设备 |
| CN108269833A (zh) * | 2016-12-30 | 2018-07-10 | 乐金显示有限公司 | 有机发光显示装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101888441B1 (ko) | 2011-12-29 | 2018-08-17 | 엘지디스플레이 주식회사 | 플렉서블 유기 발광 표시 장치 |
| KR101801913B1 (ko) * | 2012-03-23 | 2017-11-28 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치와, 이의 제조 방법 |
| KR102280162B1 (ko) * | 2014-08-31 | 2021-07-20 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 패널 |
| KR102317393B1 (ko) * | 2014-10-17 | 2021-10-25 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| KR102317396B1 (ko) * | 2014-11-07 | 2021-10-25 | 엘지디스플레이 주식회사 | 플렉서블 유기 발광 표시 장치 및 이의 제조 방법 |
| US10347702B2 (en) * | 2014-10-22 | 2019-07-09 | Lg Display Co., Ltd. | Flexible thin film transistor substrate and flexible organic light emitting display device |
| US9490312B2 (en) * | 2014-12-22 | 2016-11-08 | Lg Display Co., Ltd. | Organic light emitting diode display device with flexible printed circuit film |
| KR102517448B1 (ko) * | 2015-12-31 | 2023-04-03 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
| KR102515628B1 (ko) * | 2015-12-31 | 2023-03-29 | 엘지디스플레이 주식회사 | 유기 발광 표시 패널 |
| KR102615113B1 (ko) * | 2016-05-10 | 2023-12-19 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치 |
| KR102545553B1 (ko) * | 2016-05-13 | 2023-06-20 | 엘지디스플레이 주식회사 | 플렉서블 유기전계발광표시 장치 |
| KR102444046B1 (ko) * | 2016-05-13 | 2022-09-16 | 엘지디스플레이 주식회사 | 플렉서블 유기전계발광표시 장치 |
| CN106384789B (zh) * | 2016-10-31 | 2018-04-03 | 武汉华星光电技术有限公司 | Oled封装结构与oled封装方法 |
| US10211416B2 (en) * | 2016-12-28 | 2019-02-19 | Shanghai Tianma AM-OLED Co., Ltd. | Flexible display panel, fabrication method, and flexible display apparatus |
| KR102604310B1 (ko) * | 2016-12-30 | 2023-11-20 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN108847451A (zh) * | 2018-06-12 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | 一种柔性oled器件及其制备方法 |
-
2018
- 2018-11-22 KR KR1020180145003A patent/KR102607212B1/ko active IP Right Grant
-
2019
- 2019-11-08 US US16/678,877 patent/US11456430B2/en active Active
- 2019-11-14 CN CN201911111749.2A patent/CN111211147B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794631A (zh) * | 2012-10-31 | 2014-05-14 | 乐金显示有限公司 | 柔性有机电致发光装置及其制造方法 |
| CN104241550A (zh) * | 2014-08-05 | 2014-12-24 | 京东方科技集团股份有限公司 | Oled显示装置及其封装方法 |
| KR20160053356A (ko) * | 2014-11-03 | 2016-05-13 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
| EP3217265A1 (en) * | 2016-03-11 | 2017-09-13 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
| CN107230694A (zh) * | 2016-03-24 | 2017-10-03 | 三星显示有限公司 | 有机发光显示设备 |
| CN108269833A (zh) * | 2016-12-30 | 2018-07-10 | 乐金显示有限公司 | 有机发光显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20200168823A1 (en) | 2020-05-28 |
| KR20200059814A (ko) | 2020-05-29 |
| US11456430B2 (en) | 2022-09-27 |
| KR102607212B1 (ko) | 2023-11-28 |
| CN111211147A (zh) | 2020-05-29 |
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