CN111208147A - Stitch detection method, device and system - Google Patents
Stitch detection method, device and system Download PDFInfo
- Publication number
- CN111208147A CN111208147A CN202010030387.0A CN202010030387A CN111208147A CN 111208147 A CN111208147 A CN 111208147A CN 202010030387 A CN202010030387 A CN 202010030387A CN 111208147 A CN111208147 A CN 111208147A
- Authority
- CN
- China
- Prior art keywords
- pin
- pins
- vertex position
- detection
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
Abstract
The application belongs to the technical field of stitch detection, and provides a stitch detection method, a device and a system, wherein the method comprises the following steps: acquiring an image to be detected obtained by shooting a plurality of pins of an electronic device by the shooting device, and determining the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. According to the embodiment of the application, the deviation of the pins of the electronic device and the bad phenomena that the pins are too long or too short are detected at low cost through the light source, the shooting device and the detection device, and the problems that the pin detection cost is high and the operation is complex are solved.
Description
Technical Field
The invention belongs to the technical field of pin detection of electronic devices, and particularly relates to a pin detection method, device and system.
Background
In the manufacturing process of an electronic device with pins, such as a connector, the poor conditions of deflection and overlong and too short easily occur to the external pins, the existing machine vision detection scheme uses two cameras for detection, one camera uses a telecentric lens to shoot from top to bottom under the condition that the pins of the electronic device are vertically and upwards placed, whether the tops of the pins deviate or not is confirmed, and the other camera horizontally shoots and confirms the lengths of the pins. In addition, the existing common scheme also frequently uses a binocular 3D imaging technology or a laser 3D imaging technology, and whether the stitch is a good product or not is judged after the stitch 3D information is acquired.
However, the existing double-camera inspection scheme is high in complexity and cost, detection can be completed only by two groups of light sources of two cameras, and if pins are dense, the problem that the pins are mutually shielded easily occurs during horizontal shooting. And the 3D detection scheme also has the problems of high scheme complexity and high cost, wherein the laser 3D scheme also needs to be matched with a movable tray to realize scanning of the detected object in uniform motion.
Disclosure of Invention
In view of this, embodiments of the present invention provide a method, an apparatus, and a system for detecting a pin, so as to solve the problems of high pin detection cost and complex operation.
A first aspect of an embodiment of the present invention provides a pin detection method, including:
acquiring an image to be detected obtained by shooting a plurality of pins of an electronic device by the shooting device, and determining the vertex position of each pin in the image to be detected;
comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin;
and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad.
In an implementation example, the comparing the position of each pin vertex with the corresponding preset standard pin vertex position includes:
and comparing the vertex position of each pin with the vertex position of a corresponding pin in the vertex image of the standard pin.
In one embodiment, the determining the vertex position of each pin in the image to be detected includes:
performing binarization processing on the shot image to be detected to highlight the pin vertex;
and determining the vertex position of each pin in the processed image to be detected according to a preset brightness threshold value.
In one embodiment, after comparing the vertex position of each pin with the corresponding preset standard pin vertex position, the method further includes:
and if the offset of the vertex position of any pin does not exceed a preset threshold value, determining that the detection result of the pin is a good product.
A second aspect of an embodiment of the present invention provides a pin detection system, including: the device comprises a light source, a shooting device and a detection device; wherein the content of the first and second substances,
the light source irradiates a plurality of pins which are arranged upwards in the electronic device;
the shooting device which is arranged above the pins in an inclined mode and opposite to the light source shoots the pins;
the detection apparatus implements the pin detection method of the first aspect.
In one example, the light source illuminating a plurality of pins disposed upwardly in the electronic device comprises:
the light source provides incident light to irradiate the plurality of pins which are placed upwards, so that the incident light is reflected by the plurality of pins and then enters the shooting device.
In one embodiment, the photographing device disposed obliquely above the pins and opposite to the light source photographs the pins, and the photographing device includes:
and the shooting device which is arranged above the pins in an inclined manner and is opposite to the light source shoots the reflected light at the top points of the pins.
A third aspect of the embodiments of the present invention provides a pin detection apparatus, including:
the position determining module is used for acquiring an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by the shooting device, and determining the vertex position of each pin in the image to be detected;
the position comparison module is used for comparing the vertex position of each pin with the vertex position of a preset standard pin;
the first detection result determining module is used for determining that the detection result of any pin is bad if the offset of the vertex position of the pin exceeds a preset threshold.
In one implementation example, the detection apparatus further comprises:
and the second detection result determining module is used for determining that the detection result of any pin is a good product if the offset of the vertex position of the pin does not exceed the preset threshold.
A fourth aspect of an embodiment of the present invention provides a detection apparatus, including: a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the method of pin detection in the first aspect when executing the computer program.
According to the pin detection method, the device and the system provided by the embodiment of the invention, a plurality of pins vertically and upwards placed in an electronic device are irradiated by the light source; the plurality of pins are shot by the shooting device which is arranged above the pins in an inclined mode and opposite to the light source, so that the pins of the electronic device are completely shot by the shooting device, and shielding caused by the fact that the pins are too dense is avoided; the detection device acquires an image to be detected shot by the shooting device and determines the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. The deviation of the pins of the electronic device and the bad phenomena of overlong or overlong short pins are detected at low cost through the light source, the shooting device and the detection device, the detection device compares the top point position of each pin in the shot image to be detected with the corresponding preset standard pin top point position, when the deviation amount of the top point position of each pin exceeds a preset threshold value, the position deviation amount is determined to exceed the preset threshold value, then the detection result of the pin top is determined to be bad, and therefore the bad pins are simply and quickly detected.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a pin detection method according to an embodiment of the present invention;
fig. 2 is a binarized image to be detected according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a stitch detection system according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a stitch detection device according to a third embodiment of the present invention;
fig. 5 is a schematic structural diagram of a detection apparatus according to a fourth embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "comprises" and "comprising," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, or system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. Furthermore, the terms "first," "second," and "third," etc. are used to distinguish between different objects and are not used to describe a particular order.
Example one
Fig. 1 is a schematic flow chart of a stitch detection method according to an embodiment of the present invention. The method can be executed by a detection device, and the detection device can be a server, an intelligent terminal, a tablet or a PC (personal computer) and the like; in the embodiment of the present invention, a detection apparatus is used as an execution subject, and the method specifically includes the following steps:
s110, acquiring an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by a shooting device, and determining the vertex position of each pin in the image to be detected;
in order to detect the pin condition of the electronic device, the detection device needs to acquire an image to be detected, which is obtained by shooting a plurality of pins of the electronic device by the shooting device, for analysis under the condition that the plurality of pins of the electronic device are vertically placed upwards. Optionally, when the shooting device shoots the plurality of pins of the electronic device, the plurality of pins of the electronic device can be irradiated by one light source for obtaining a clear image, and the light source can be arranged above the pins of the electronic device. The shooting device can be arranged above the pins in a tilted mode and is arranged opposite to the light source providing illumination to shoot the pins, so that reflected light of vertexes of the pins can be received better, and clear images to be detected without pins being blocked can be obtained.
After the detection device obtains the image to be detected, whether each stitch has the undesirable phenomena of deviation, overlength, overshort and the like is judged according to the vertex position of each stitch in the image to be detected. The detection device can determine the vertex position of each pin in the image to be detected through an image recognition algorithm.
In one embodiment, the specific process of the detection apparatus determining the vertex position of each pin in the image to be detected may be: performing binarization processing on the shot image to be detected to highlight the pin vertex; and determining the vertex position of each pin in the processed image to be detected according to a preset brightness threshold value.
Since the apex of each pin of the electronic device just produced is not oxidized, the light reflectivity of the cut at the apex is high. The vertex reflects the light when the light source provides the light to the pins to be detected, so that the brightness of the vertex of each pin on the image to be detected, which is obtained by shooting the pins by the shooting device, is higher than that of the electronic device body under the light irradiation, and the vertex position of each pin can be determined from the image to be detected according to the gray value (brightness) of the image. Specifically, binarization processing is carried out on a shot image to be detected, and pin vertexes in the image are highlighted. As shown in fig. 2, the image to be detected after binarization is provided in the first embodiment. And then searching a region with the gray value larger than the preset gray threshold value, namely the brightness larger than the brightness threshold value, from the processed image to be detected through an image recognition algorithm according to the preset gray threshold value of the brightness threshold value, so as to determine the vertex of each stitch in the image to be detected and calculate the position of the vertex of each stitch in the image to be detected, namely the vertex position.
S120, comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin;
when any pin of the electronic device has undesirable phenomena of deviation, overlong or overlong, and the like, the vertex position of the pin in the image to be detected has larger deviation compared with the vertex positions of other normal pins. After the detection device determines the vertex position of each pin on the image to be detected, the vertex position of each pin on the image to be detected can be compared with the corresponding vertex position of the preset standard pin, and the offset of the positions is calculated, so that the pins with bad phenomena are detected.
In an embodiment, the vertex position of each pin is compared with the vertex position of the corresponding standard pin, and the specific process may be as follows: and comparing the vertex position of each pin with the vertex position of a corresponding pin in the vertex image of the standard pin.
Specifically, in order to make the detection result of the pins more accurate, a standard electronic device with the same specification as the electronic device to be detected and having no defects in the pins can be prepared in advance. Under the same shooting condition, the pins of the standard electronic device can be shot by the shooting device to obtain the vertex image of the standard pins. After the detection device determines the vertex position of each pin in the standard pin vertex image through the same processing method, the detection device compares the vertex position of each pin to be detected in the image to be detected with the vertex position of a corresponding pin in the standard pin vertex image, and calculates the offset between the two vertex positions.
S130, if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad;
the offset threshold value obtained by comparing the vertex position of the pin with the standard vertex position can be preset according to the maximum error range of the pin allowed to have offset and length deviation when the pin is good. Therefore, after the detection device calculates the offset between the vertex position of each pin to be detected in the image to be detected and the vertex position of a corresponding pin in the standard pin vertex image, whether the pin has the adverse phenomena of offset, overlength and the like can be detected by judging whether the offset of the vertex position of each pin exceeds a preset threshold value. If the deviation amount of the vertex position of any pin on the image to be detected exceeds the preset threshold value, the pin can be judged not to be in accordance with the non-defective standard, the detection result of the pin is determined to be bad, and the bad phenomena of deviation, overlong or over-short and the like can exist. The detection device judges the offset of the vertex position of each pin on the image to be detected, and the detection of all pins on the electronic device is simply and quickly realized.
In an implementation example, if the offset of the vertex position of any pin does not exceed a preset threshold, the detection result of the pin is determined to be good. Specifically, when the detection device detects that the offset of the vertex position of any pin on the image to be detected does not exceed the preset threshold, the pin can be judged to meet the non-defective standard, and the detection result of the pin is determined to be a non-defective product.
According to the pin detection method provided by the embodiment of the invention, a plurality of pins vertically and upwards placed in an electronic device are irradiated by a light source; the plurality of pins are shot by the shooting device which is arranged above the pins in an inclined mode and opposite to the light source, so that the pins of the electronic device are completely shot by the shooting device, and shielding caused by the fact that the pins are too dense is avoided; the detection device acquires an image to be detected shot by the shooting device and determines the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. The deviation of the pins of the electronic device and the bad phenomena of overlong or overlong short pins are detected at low cost through the light source, the shooting device and the detection device, the detection device compares the top point position of each pin in the shot image to be detected with the corresponding preset standard pin top point position, when the deviation amount of the top point position of each pin exceeds a preset threshold value, the position deviation amount is determined to exceed the preset threshold value, then the detection result of the pin top is determined to be bad, and therefore the bad pins are simply and quickly detected.
Example two
Fig. 3 is a schematic diagram illustrating the result of the pin detection system according to the second embodiment of the present invention. On the basis of the first embodiment, the present embodiment further provides a pin detection system, including: a light source 10, a photographing device 20, and a detection device 30; wherein the content of the first and second substances,
the light source irradiates a plurality of pins vertically and upwards placed in the electronic device;
the shooting device which is arranged above the pins in an inclined mode and opposite to the light source shoots the pins;
the detection device executes the pin detection method in the first embodiment.
Specifically, the pin detection system comprises a light source 10, a camera 20 and a detection device 30 for detecting pins of the electronic device. In the case where the pins of the electronic device are placed vertically upward, the light source 10 illuminates the pins placed vertically upward. In one embodiment, the light source 10 provides incident light to illuminate the pins disposed upward, so that the incident light is reflected by the pins and then enters the camera 20. Because each stitch cutting angle of electronic device is different, because stitch cutting angle is different, and the camera position is fixed, consequently the light source need have more area, just can adapt to more cutting angles (stitch summit will get bright stitch summit with the direct reflection of light source light to the camera), because the light source area is great difficult to install and arrange, consequently adopts the mode that the light source kept close to the illumination, adapts to the different cutting face in stitch summit. Optionally, the light source 10 provides incident light obliquely downward at about 45 degrees to illuminate the pins vertically upward.
In order to receive the reflected light from the vertex of the pin as much as possible, the photographing device 20 may be disposed obliquely above the pin of the electronic device and opposite to the light source 10 to photograph the pin. In one embodiment, the photographing device 20 disposed obliquely above the pins and opposite to the light source photographs the reflected light of the apexes of the pins. Alternatively, the photographing device may be an image photographing device such as a camera. The shooting device 20 is connected to the detection device 30, and sends the shot image to be detected to the detection device 30.
The detection device 30 obtains an image to be detected obtained by shooting a plurality of pins of the electronic device by the shooting device 20, and determines the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. And if the offset of the vertex position of any pin does not exceed a preset threshold value, determining that the detection result of the pin is a good product.
According to the pin detection system provided by the embodiment of the invention, a plurality of pins vertically and upwards placed in an electronic device are irradiated by the light source; the plurality of pins are shot by the shooting device which is arranged above the pins in an inclined mode and opposite to the light source, so that the pins of the electronic device are completely shot by the shooting device, and shielding caused by the fact that the pins are too dense is avoided; the detection device acquires an image to be detected shot by the shooting device and determines the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. The deviation of the pins of the electronic device and the bad phenomena of overlong or overlong short pins are detected at low cost through the light source, the shooting device and the detection device, the detection device compares the top point position of each pin in the shot image to be detected with the corresponding preset standard pin top point position, when the deviation amount of the top point position of each pin exceeds a preset threshold value, the position deviation amount is determined to exceed the preset threshold value, then the detection result of the pin top is determined to be bad, and therefore the bad pins are simply and quickly detected.
EXAMPLE III
Fig. 4 shows a pin detection apparatus provided in a third embodiment of the present invention. On the basis of the first embodiment, the embodiment of the present invention further provides a pin detection apparatus 4, which includes:
the position determining module 401 is configured to obtain an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by a shooting device, and determine a vertex position of each pin in the image to be detected;
in one embodiment, in determining the vertex position of each pin in the image to be detected, the position determining module 401 includes:
the image processing unit is used for performing binarization processing on the shot image to be detected to highlight the pin vertex;
and the vertex position determining unit is used for determining the vertex position of each pin in the processed image to be detected according to the preset brightness threshold value.
A position comparison module 402, configured to compare the vertex position of each pin with a preset standard pin vertex position;
in one embodiment, when comparing the vertex position of each pin with the preset standard pin vertex position, the position comparison module 402 includes:
and the position comparison unit is used for comparing the vertex position of each pin with the vertex position of a corresponding pin in the vertex image of the standard pin.
The first detection result determining module 403 is configured to determine that the detection result of any pin is bad if the offset of the vertex position of the pin exceeds a preset threshold.
In one implementation example, the detection apparatus further comprises:
and the second detection result determining module is used for determining that the detection result of any pin is a good product if the offset of the vertex position of the pin does not exceed the preset threshold.
According to the pin detection device provided by the embodiment of the invention, the plurality of pins vertically and upwards placed in the electronic device are irradiated by the light source; the plurality of pins are shot by the shooting device which is arranged above the pins in an inclined mode and opposite to the light source, so that the pins of the electronic device are completely shot by the shooting device, and shielding caused by the fact that the pins are too dense is avoided; the detection device acquires an image to be detected shot by the shooting device and determines the vertex position of each pin in the image to be detected; comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin; and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad. The deviation of the pins of the electronic device and the bad phenomena of overlong or overlong short pins are detected at low cost through the light source, the shooting device and the detection device, the detection device compares the top point position of each pin in the shot image to be detected with the corresponding preset standard pin top point position, when the deviation amount of the top point position of each pin exceeds a preset threshold value, the position deviation amount is determined to exceed the preset threshold value, then the detection result of the pin top is determined to be bad, and therefore the bad pins are simply and quickly detected.
Example four
Fig. 5 is a schematic structural diagram of a detection apparatus according to a fourth embodiment of the present invention. The detection device 5 includes: a processor 51, a memory 52 and a computer program 53 stored in said memory 52 and executable on said processor 51, such as a program for a stitch detection method. The processor 51 implements the steps of the above-mentioned stitch detection method embodiments, such as the steps S110 to S130 shown in fig. 1, when executing the computer program 53.
Illustratively, the computer program 53 may be partitioned into one or more modules that are stored in the memory 52 and executed by the processor 51 to accomplish the present application. The one or more modules may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution of the computer program 53 in the detection apparatus. For example, the computer program 53 may be divided into a position determination module, a position comparison module and a first detection result determination module, and each module has the following specific functions:
the position determining module is used for acquiring an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by the shooting device, and determining the vertex position of each pin in the image to be detected;
the position comparison module is used for comparing the vertex position of each pin with the vertex position of a preset standard pin;
the first detection result determining module is used for determining that the detection result of any pin is bad if the offset of the vertex position of the pin exceeds a preset threshold.
The detection means may include, but are not limited to, a processor 51, a memory 52 and a computer program 53 stored in the memory 52. It will be appreciated by those skilled in the art that fig. 5 is merely an example of a detection apparatus and does not constitute a limitation of the detection apparatus, and may include more or less components than those shown, or combine some components, or different components, for example, the apparatus may also include input and output devices, network access devices, buses, etc.
The Processor 51 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 52 may be an internal storage unit of the control device, such as a hard disk or a memory of the detection device. The memory 52 may also be an external storage device, such as a plug-in hard disk provided on the detection apparatus, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like. Further, the memory 52 may also include both an internal memory unit and an external memory device of the smart door lock. The memory 52 is used for storing the computer program and other programs and data required for the stitch detection method. The memory 52 may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other ways. For example, the above-described embodiments of the apparatus/terminal device are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The integrated modules/units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method embodiments may be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A stitch detection method, comprising:
acquiring an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by a shooting device, and determining the vertex position of each pin in the image to be detected;
comparing the vertex position of each pin with the corresponding vertex position of a preset standard pin;
and if the offset of the vertex position of any pin exceeds a preset threshold, determining that the detection result of the pin is bad.
2. The pin detection method of claim 1, wherein comparing the position of each pin vertex with the corresponding position of a preset standard pin vertex comprises:
and comparing the vertex position of each pin with the vertex position of a corresponding pin in the vertex image of the standard pin.
3. The pin detection method as claimed in claim 1 or 2, wherein said determining the vertex position of each pin in the image to be detected comprises:
performing binarization processing on the shot image to be detected to highlight the pin vertex;
and determining the vertex position of each pin in the processed image to be detected according to a preset brightness threshold value.
4. The method as claimed in claim 3, wherein after comparing the vertex position of each pin with the corresponding vertex position of the standard pin, the method further comprises:
and if the offset of the vertex position of any pin does not exceed the preset threshold, determining that the detection result of the pin is a good product.
5. A stitch detection system is characterized by comprising a light source, a shooting device and a detection device; wherein the content of the first and second substances,
the light source irradiates a plurality of pins which are arranged upwards in the electronic device;
the shooting device which is arranged above the pins in an inclined mode and opposite to the light source shoots the pins;
the detection device performs the stitch detection method according to any one of claims 1 to 4.
6. The pin detection system of claim 5 wherein the light source illuminating the upwardly disposed pins of the electronic device comprises:
the light source provides incident light to irradiate the plurality of pins which are placed upwards, so that the incident light is reflected by the plurality of pins and then enters the shooting device.
7. The pin detection system of claim 5, wherein the photographing device disposed obliquely above the pins and opposite to the light source photographs the pins, and comprises:
and the shooting device which is arranged above the pins in an inclined manner and is opposite to the light source shoots the reflected light at the top points of the pins.
8. A stitch detection device, comprising:
the position determining module is used for acquiring an image to be detected, which is obtained by shooting a plurality of pins of an electronic device by a shooting device, and determining the vertex position of each pin in the image to be detected;
the position comparison module is used for comparing the vertex position of each pin with the vertex position of a preset standard pin;
the first detection result determining module is used for determining that the detection result of any pin is bad if the offset of the vertex position of the pin exceeds a preset threshold.
9. The stitch detection device as recited in claim 8, further comprising:
and the second detection result determining module is used for determining that the detection result of any pin is a good product if the offset of the vertex position of the pin does not exceed the preset threshold.
10. A detection device, characterized by comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the pin detection method according to any one of claims 1 to 4 when executing the computer program.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010030387.0A CN111208147A (en) | 2020-01-13 | 2020-01-13 | Stitch detection method, device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010030387.0A CN111208147A (en) | 2020-01-13 | 2020-01-13 | Stitch detection method, device and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111208147A true CN111208147A (en) | 2020-05-29 |
Family
ID=70783220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010030387.0A Pending CN111208147A (en) | 2020-01-13 | 2020-01-13 | Stitch detection method, device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111208147A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112730453A (en) * | 2020-12-22 | 2021-04-30 | 华南理工大学 | Bottom visual inspection device after multi-pin component pin insertion |
| CN112730424A (en) * | 2020-12-11 | 2021-04-30 | 上海大学 | Aviation plug pin defect detection device and method |
| CN112763942A (en) * | 2020-12-11 | 2021-05-07 | 上海大学 | Aviation plug abnormal pin detection device |
| CN112819764A (en) * | 2021-01-25 | 2021-05-18 | 湖南省计量检测研究院 | Method for detecting electrode position of membrane electrode MEA (membrane electrode assembly) of stacked fuel cell |
| CN113295617A (en) * | 2021-05-18 | 2021-08-24 | 广州慧炬智能科技有限公司 | Multi-target offset detection method without reference point |
| CN115684015A (en) * | 2022-11-01 | 2023-02-03 | 江苏芯缘半导体有限公司 | Chip appearance detection mechanism |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150330884A1 (en) * | 2014-05-16 | 2015-11-19 | Donald J. Spinella | Peeling apparatus and method for separating welded layers |
| CN105303573A (en) * | 2015-10-26 | 2016-02-03 | 广州视源电子科技股份有限公司 | Method and system of pin detection of gold needle elements |
| CN105717136A (en) * | 2016-01-28 | 2016-06-29 | 浙江工业大学 | Pin inclination defect detecting method based on machine vision |
| CN108269255A (en) * | 2018-01-26 | 2018-07-10 | 上海文什数据科技有限公司 | A kind of electric connector detection device and method based on machine vision |
| CN110187534A (en) * | 2019-06-18 | 2019-08-30 | 深圳市全洲自动化设备有限公司 | A kind of method and system of AOI test-based examination LCD product stitch deviation |
| CN110619629A (en) * | 2019-09-10 | 2019-12-27 | 苏州浪潮智能科技有限公司 | CPU socket detection method and equipment |
| CN112730424A (en) * | 2020-12-11 | 2021-04-30 | 上海大学 | Aviation plug pin defect detection device and method |
-
2020
- 2020-01-13 CN CN202010030387.0A patent/CN111208147A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150330884A1 (en) * | 2014-05-16 | 2015-11-19 | Donald J. Spinella | Peeling apparatus and method for separating welded layers |
| CN105303573A (en) * | 2015-10-26 | 2016-02-03 | 广州视源电子科技股份有限公司 | Method and system of pin detection of gold needle elements |
| CN105717136A (en) * | 2016-01-28 | 2016-06-29 | 浙江工业大学 | Pin inclination defect detecting method based on machine vision |
| CN108269255A (en) * | 2018-01-26 | 2018-07-10 | 上海文什数据科技有限公司 | A kind of electric connector detection device and method based on machine vision |
| CN110187534A (en) * | 2019-06-18 | 2019-08-30 | 深圳市全洲自动化设备有限公司 | A kind of method and system of AOI test-based examination LCD product stitch deviation |
| CN110619629A (en) * | 2019-09-10 | 2019-12-27 | 苏州浪潮智能科技有限公司 | CPU socket detection method and equipment |
| CN112730424A (en) * | 2020-12-11 | 2021-04-30 | 上海大学 | Aviation plug pin defect detection device and method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112730424A (en) * | 2020-12-11 | 2021-04-30 | 上海大学 | Aviation plug pin defect detection device and method |
| CN112763942A (en) * | 2020-12-11 | 2021-05-07 | 上海大学 | Aviation plug abnormal pin detection device |
| CN112730453A (en) * | 2020-12-22 | 2021-04-30 | 华南理工大学 | Bottom visual inspection device after multi-pin component pin insertion |
| CN112730453B (en) * | 2020-12-22 | 2022-07-26 | 华南理工大学 | Bottom visual inspection device after multi-pin element pin insertion |
| CN112819764A (en) * | 2021-01-25 | 2021-05-18 | 湖南省计量检测研究院 | Method for detecting electrode position of membrane electrode MEA (membrane electrode assembly) of stacked fuel cell |
| CN112819764B (en) * | 2021-01-25 | 2022-07-19 | 湖南省计量检测研究院 | Method for detecting electrode position of membrane electrode MEA (membrane electrode assembly) of stacked fuel cell |
| CN113295617A (en) * | 2021-05-18 | 2021-08-24 | 广州慧炬智能科技有限公司 | Multi-target offset detection method without reference point |
| CN115684015A (en) * | 2022-11-01 | 2023-02-03 | 江苏芯缘半导体有限公司 | Chip appearance detection mechanism |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111208147A (en) | Stitch detection method, device and system | |
| CN110441323B (en) | Product surface polishing method and system | |
| EP0195161B1 (en) | Apparatus for automatically inspecting objects and identifying or recognizing known and unknown portions thereof, including defects and the like and method | |
| US8139117B2 (en) | Image quality analysis with test pattern | |
| CN101464418A (en) | Flaw detection method and apparatus | |
| CN110473165A (en) | A kind of welding quality of circuit board detection method and device | |
| CN108918093B (en) | Optical filter mirror surface defect detection method and device and terminal equipment | |
| CN108827597B (en) | Light spot uniformity detection method and detection system of structured light projector | |
| CN109191516B (en) | Rotation correction method and device of structured light module and readable storage medium | |
| CN111353992B (en) | Agricultural product defect detection method and system based on textural features | |
| CN115100104A (en) | Defect detection method, device and equipment for glass ink area and readable storage medium | |
| CN102483380B (en) | Illumination/image-pickup system for surface inspection and data structure | |
| CN117309892B (en) | Defect detection method, device and system for blue film of battery and light source controller | |
| CN113052754A (en) | Method and device for blurring picture background | |
| JP2017166957A (en) | Defect detection device, defect detection method and program | |
| JP2002257736A (en) | Method and device for inspecting end face of honeycomb structure | |
| CN117252861A (en) | Method, device and system for detecting wafer surface defects | |
| CN110502966B (en) | Classified information acquisition equipment, method and storage device for packages | |
| CN114693626A (en) | Method and device for detecting chip surface defects and computer readable storage medium | |
| CN111351754A (en) | Bottle bottom defect detection system and method | |
| CN111566438B (en) | Image acquisition method and system | |
| CN110441315B (en) | Electronic component testing apparatus and method | |
| CN108827594B (en) | Analytical force detection method and detection system of structured light projector | |
| JP2017166956A (en) | Defect detection device detection method and program | |
| JPH10141925A (en) | Appearance inspection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200529 |
|
| RJ01 | Rejection of invention patent application after publication |