CN111205743B - High-temperature-resistant electromagnetic wave absorbing coating, coating and preparation method and application thereof - Google Patents
High-temperature-resistant electromagnetic wave absorbing coating, coating and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a high-temperature-resistant electromagnetic wave absorbing coating, a coating, and a preparation method and application thereof. The high-temperature-resistant electromagnetic wave absorbing coating comprises the following components in percentage by mass: 20-40wt% of organic resin, 5-25wt% of water, 5-10wt% of microporous wave-absorbing filler, 10-30wt% of pigment filler, 1-5wt% of anti-settling agent, 0.1-3wt% of dispersing agent and 0.1-2wt% of flatting agent; the microporous wave-absorbing filler is obtained by reacting a wave-absorbing substance, glass powder, metal powder and/or metal oxide powder and a silane coupling agent. The microporous wave-absorbing filler is prepared by sintering and coating a low-melting-point glass substance with a wave-absorbing material, the double wave-absorbing function is completed through physical wave absorption and structural design, the wave-absorbing efficiency of the material is improved, meanwhile, the wave-absorbing coating and the coating provided by the invention have a good absorbing effect on microwaves within a frequency range of 2-18GHz, and the microporous wave-absorbing filler is simple in preparation method, low in cost, good in high-temperature resistance and wave-absorbing performance and wide in application prospect.
Description
Technical Field
The invention belongs to the technical field of wave-absorbing materials, and particularly relates to a high-temperature-resistant electromagnetic wave-absorbing coating, a coating, and a preparation method and application thereof.
Background
With the continuous progress and the rapid development of scientific technology, electronic products are used more and more widely, great convenience is brought to people, meanwhile, great trouble is brought to people, and after atmospheric pollution, water pollution, soil pollution, noise pollution and the like, electromagnetic wave pollution gradually becomes one of the pollutions which have great influence on the production and the life of people. The electromagnetic wave pollution not only can affect the physical and psychological health of people, but also can affect the normal use of some equipment. Therefore, the development of anti-electromagnetic interference substances and the development and application of wave-absorbing coatings also become one of the hot spots of the current research.
At present, the wave-absorbing coating researched by people mainly focuses on the absorption or reflection of electromagnetic waves under normal temperature or low temperature conditions, and the generation of the electromagnetic waves in many life and industrial production is frequently generated in the process of high-temperature radiation, for example, in the fields of engines, aircrafts, high-temperature furnaces and the like, so that the requirement on the high-temperature resistant wave-absorbing coating is obvious. Patent CN110171834A discloses a HoFeB/Fe3O4The patent prepares a HoFeB alloy powder and mixes it with Fe3O4And mixing the powder to prepare the composite wave-absorbing material. Patent CN109049913A discloses a high-temperature resistant radar wave-absorbing material based on a double-layer metamaterial and a preparation method thereof, wherein the wave-absorbing material disclosed in the patent is a wave-absorbing material with a double-layer structure consisting of an inner dielectric layer and an outer dielectric layer. How to provide a high-temperature wave-absorbing material with high efficiency and wide application is an urgent problem to be solved.
Disclosure of Invention
The invention mainly aims to provide a high-temperature-resistant electromagnetic wave absorbing coating, a coating, and a preparation method and application thereof, so as to overcome the defects of the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention comprises the following steps:
the embodiment of the invention provides a high-temperature-resistant electromagnetic wave absorbing coating which comprises the following components in percentage by mass: 20-40wt% of organic resin, 5-25wt% of water, 5-10wt% of microporous wave-absorbing filler, 10-30wt% of pigment filler, 1-5wt% of anti-settling agent, 0.1-3wt% of dispersing agent and 0.1-2wt% of flatting agent; the microporous wave-absorbing filler is obtained by reacting a wave-absorbing substance, glass powder, metal powder and/or metal oxide powder and a silane coupling agent.
The embodiment of the invention also provides a preparation method of the high-temperature-resistant electromagnetic wave absorbing coating, which comprises the following steps:
and sequentially adding the dispersing agent, the pigment filler, the dispersing agent and the anti-settling agent into water, mixing and stirring for 20-40min, and then sequentially adding the microporous wave-absorbing filler, the organic silicon modified resin and the flatting agent into the mixed solution, mixing and stirring for 1-2h to prepare the high-temperature-resistant electromagnetic wave-absorbing coating.
The embodiment of the invention also provides a high-temperature-resistant electromagnetic wave absorbing coating which is formed by the high-temperature-resistant electromagnetic wave absorbing coating.
Further, the thickness of the high-temperature resistant electromagnetic wave absorbing coating is 50-200 μm.
The embodiment of the invention also provides a preparation method of the high-temperature-resistant electromagnetic wave absorbing coating, which comprises the following steps:
providing the high-temperature-resistant electromagnetic wave absorbing coating;
and applying the coating on the surface of the base material, and drying to form the high-temperature-resistant electromagnetic wave absorbing coating.
The embodiment of the invention also provides the application of the high-temperature resistant electromagnetic wave absorbing coating or the high-temperature resistant electromagnetic wave absorbing coating in the fields of electronic and electric equipment, household appliances and industrial furnaces; preferably, the surface wave-absorbing protection containing the glass base material is applied to household appliances, industrial furnaces and the like.
Compared with the prior art, the invention has the beneficial effects that: the invention coats the wave-absorbing material in the non-transparent non-closed microcapsule formed by glass material and metal or metal oxide, and the micro-capsule content and the capsule are combined to form the macroscopic micropore wave-absorbing filler. When the electromagnetic wave is emitted to the surface of the coating, the wave-absorbing coating prepared by the filler keeps the smoothness of the surface of a glass substance on the one hand and can partially reflect the electromagnetic wave emitted to the surface back; on the other hand, the glass is non-transparent due to the metal or the metal oxide, and can further play a role in reflecting and blocking electromagnetic waves, and after a part of the electromagnetic waves penetrating through the smooth glass capsule wall enter the capsule, the part of the electromagnetic waves are absorbed by the wave-absorbing substance coated in the capsule, so that most of the electromagnetic waves can be effectively reflected or absorbed through further structural design, and the electromagnetic waves are more effectively blocked from penetrating through the whole coating. In addition, when the technology is applied to the surfaces containing glass substrates in the electrical industry, particularly household appliances, industrial furnaces and the like, the coating can be firmly combined with the surface containing the silicon substrates through the action of the contained organic silicon resin or the contained glass substances, the coating cannot be cracked and separated from the surface of the substrate (the adjustment effect of the silicon-containing substances) due to different thermal expansion coefficients when the temperature change amplitude is large, and meanwhile, the damage of radiation waves to the health of people working around can be effectively prevented.
Detailed Description
In view of the defects of the prior art, the inventor of the present invention has long studied and largely practiced to propose the technical solution of the present invention, which will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One aspect of the embodiment of the invention provides a high-temperature-resistant electromagnetic wave absorbing coating, which comprises the following components in percentage by mass: 20-40wt% of organic resin, 5-25wt% of water, 5-10wt% of microporous wave-absorbing filler, 10-30wt% of pigment filler, 1-5wt% of anti-settling agent, 0.1-3wt% of dispersing agent and 0.1-2wt% of flatting agent; the microporous wave-absorbing filler is obtained by reacting a wave-absorbing substance, glass powder, metal powder and/or metal oxide powder and a silane coupling agent.
In some more specific embodiments, the wave-absorbing material includes any one or a combination of two or more of carbonyl iron, ferroferric oxide, graphene and silicon carbide, but is not limited thereto; preferably, the mixture of ferroferric oxide and silicon carbide and the mixture of carbonyl iron and graphene are selected.
Furthermore, the glass powder is low-melting-point lead-free glass powder.
Furthermore, the melting point of the glass powder is 450-650 ℃, and the particle size is 200-300 meshes.
Further, the metal powder and/or metal oxide powder includes any one or a combination of two or more of iron powder, copper powder, aluminum powder, manganese dioxide, zirconium dioxide, aluminum oxide, and zinc oxide, and is not limited thereto.
Further, the group contained in the silane coupling agent includes any one or a combination of two or more of an alkoxy group, an acetoxy group, a halogen, an amino group, an epoxy group, and a vinyl group, and is not limited thereto.
Further, the silane coupling agent includes any one or a combination of two or more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β -methoxyethoxy) silane, and isobutyltriethoxysilane, without being limited thereto.
In some more specific embodiments, the organic resin is a silicone modified resin, and is not limited thereto.
Further, the silicone-modified resin includes any one or a combination of two or more of silicone-modified epoxy resin, silicone-modified polyurethane resin, silicone-modified amino resin, silicone-modified phenolic resin, and silicone-modified acrylic resin, and is not limited thereto.
In some more specific embodiments, the pigment and filler includes any one or a combination of two or more of titanium dioxide, carbon black, calcium carbonate, talc and iron oxide red, but is not limited thereto.
Further, the anti-settling agent comprises any one or a combination of more than two of magnesium aluminum silicate, KYC-426, fumed silica and W-601 polyamide anti-settling agent, and is not limited by the above.
Further, the dispersant includes any one or a combination of two or more of BYK-190, bayer 0451, and EFKA-4310, and is not limited thereto.
Further, the leveling agent includes any one of a polyether modified polydimethylsiloxane-series leveling agent, a polyester modified polydimethylsiloxane-series leveling agent, or a combination of two of them, and is not limited thereto.
Further, the polyether modified polydimethylsiloxane series leveling agent includes any one or a combination of two of BYK333 and EL-2517, and is not limited thereto.
Further, the polyester modified polydimethylsiloxane series leveling agent comprises any one or a combination of more than two of BYK310, DH-4310 and BYK-3460, and is not limited thereto.
In another aspect, an embodiment of the present invention further provides a preparation method of the high temperature resistant electromagnetic wave absorbing coating, including:
and sequentially adding the dispersing agent, the pigment filler, the dispersing agent and the anti-settling agent into water, mixing and stirring for 20-40min, and then sequentially adding the microporous wave-absorbing filler, the organic silicon modified resin and the flatting agent into the mixed solution, mixing and stirring for 1-2h to prepare the high-temperature-resistant electromagnetic wave-absorbing coating.
In some more specific embodiments, the preparation method of the microporous wave-absorbing filler comprises the following steps:
mixing and stirring the wave absorbing substance and the silane coupling agent solution for 10-30min to form a first mixture, and simultaneously mixing glass powder and metal powder and/or metal oxide powder to form mixed powder;
spraying the obtained first mixture into spraying equipment, and simultaneously inputting the obtained mixed powder into the spraying equipment to obtain a spraying mixture;
and calcining and grinding the obtained spray mixture to obtain the microporous wave-absorbing filler.
Furthermore, the mass ratio of the wave-absorbing substance to the silane coupling agent is 1:2-1: 10.
Further, the concentration of the silane coupling agent solution is 3 to 10 wt%.
Furthermore, when the wave absorbing material is a mixture of ferroferric oxide and silicon carbide, the mass ratio of the ferroferric oxide to the silicon carbide is 10:1-1: 1.
Furthermore, when the wave absorbing material is a mixture of carbonyl iron and graphene, the mass ratio of the carbonyl iron to the graphene is 10:1-1: 1.
Further, the mass ratio of the glass powder to the metal powder and/or the metal oxide powder is 2:1-1: 2.
Further, the mass ratio of the first mixture to the mixed powder is 1:1-5: 1.
In some more specific embodiments, the method further comprises: the obtained spray mixture was subjected to a drying treatment.
Further, the temperature of the drying treatment is 105-120 ℃, and the time is 20-40 min.
Further, the temperature of the calcination treatment is 500-700 ℃, and the time is 30-60 min.
Further, the microporous wave-absorbing filler after grinding treatment is 400-800 meshes.
The embodiment of the invention also provides a high-temperature-resistant electromagnetic wave absorbing coating, which is formed by the high-temperature-resistant electromagnetic wave absorbing coating.
Furthermore, the coating has a good absorption effect on microwaves within the frequency range of 2-18 GHz.
Further, the thickness of the high-temperature resistant electromagnetic wave absorbing coating is 50-200 μm.
In another aspect of the embodiments of the present invention, a preparation method of the foregoing high temperature resistant electromagnetic wave absorbing coating is further provided, which includes:
providing the high-temperature resistant electromagnetic wave absorbing coating;
and applying the coating on the surface of the base material, and drying to form the high-temperature-resistant electromagnetic wave absorbing coating.
Further, the substrate includes any one or a combination of two or more of glass, metal, and alloy materials, and is not limited thereto.
The other aspect of the embodiment of the invention also provides the application of the high-temperature resistant electromagnetic wave absorbing coating or the high-temperature resistant electromagnetic wave absorbing coating in the fields of electronic and electric equipment, household appliances and industrial furnaces; preferably, the surface wave-absorbing protection containing the glass base material is applied to household appliances, industrial furnaces and the like.
The technical solution of the present invention is further described in detail with reference to several preferred embodiments, which are implemented on the premise of the technical solution of the present invention, and detailed embodiments and specific operation procedures are given, but the scope of the present invention is not limited to the following embodiments.
The experimental materials used in the examples used below were all available from conventional biochemical reagents companies, unless otherwise specified.
Example 1
1. Preparation of microporous wave-absorbing filler
(1) Putting ferroferric oxide and silicon carbide into a stirrer according to the mass ratio of 1:1, adding 2wt% of vinyl triethoxy silicon solution according to the weight ratio of 1:10, and stirring for 10min to fully wet the mixed powder;
(2) fully mixing lead-free glass powder with the melting point of 450 ℃ and the granularity of 200 meshes with copper powder according to the mass ratio of 2: 1;
(3) spraying the solution fully stirred in the step (1) into a spray tower, and simultaneously blowing the mixed powder in the step (2) into the spray tower, wherein the liquid-solid mass ratio of the solution obtained in the step (1) to the mixed powder in the step (2) is 1:1, collecting a spraying mixture, and drying at 110 ℃ for 30 min;
(4) and (4) calcining the dried mixed powder in the step (3) at 500 ℃, cooling the calcined product to room temperature, and grinding the calcined product to the granularity of 400 meshes to obtain the microporous wave-absorbing filler.
2. Preparation of high-temperature resistant electromagnetic wave absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly (5 wt%) is added into a reaction kettle, then titanium dioxide (10 wt%) and dispersant BYK-190(0.1 wt%) and anti-settling agent magnesium aluminum silicate (1 wt%) are sequentially added into the reaction kettle, and fully stirred for 30 min;
(2) then, the microporous wave-absorbing filler (5 wt%), the organic silicon modified epoxy resin (20 wt%) and the leveling agent BYK333(0.1 wt%) are sequentially added, and the mixture is stirred for 1 hour to obtain the high-temperature-resistant electromagnetic wave-absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Example 2
1. Preparation of microporous wave-absorbing filler
(1) Putting ferroferric oxide and silicon carbide into a stirrer according to the mass ratio of 3:1, adding 4 wt% of vinyl trimethoxy silane solution according to the weight ratio of 1:8, and stirring for 20min to fully wet the mixed powder;
(2) fully mixing lead-free glass powder with the melting point of 500 ℃ and the granularity of 200 meshes with iron powder according to the mass ratio of 1.5: 1;
(3) spraying the solution fully stirred in the step (1) into a spray tower, and simultaneously blowing the mixed powder in the step (2) into the spray tower, wherein the liquid-solid mass ratio of the solution obtained in the step (1) to the mixed powder in the step (2) is 2:1, collecting a spraying mixture, and drying at 110 ℃ for 30 min;
(4) and (4) calcining the dried mixed powder in the step (3) at 550 ℃, cooling the calcined product to room temperature, and grinding the calcined product to the granularity of 500 meshes to obtain the microporous wave-absorbing filler.
2. Preparation of high-temperature resistant electromagnetic wave absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 10wt% of water into a reaction kettle, then sequentially adding a mixture (15 wt%) of titanium dioxide and talcum powder in a mass ratio of 1:1, a dispersant Bayer 0451(0.5 wt%), and an anti-settling agent KYC-426(2 wt%) into the reaction kettle, and fully stirring for 30 min;
(2) then sequentially adding the microporous wave-absorbing filler (6 wt%), the organic silicon modified polyurethane resin (25 wt%), the leveling agent EL-2517(0.5 wt%), and stirring for 1h to obtain the high-temperature-resistant electromagnetic wave-absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Example 3
(1) Putting ferroferric oxide and silicon carbide into a stirrer according to the mass ratio of 5:1, adding 6 wt% of vinyl tri (beta-methoxyethoxy) silane solution according to the weight ratio of 1:6, and stirring for 20min to fully wet the mixed powder;
(2) fully mixing the lead-free glass powder with the melting point of 550 ℃ and the granularity of 250 meshes with the aluminum powder according to the mass ratio of 1: 1;
(3) spraying the solution fully stirred in the step (1) into a spray tower, and simultaneously blowing the mixed powder in the step (2) into the spray tower, wherein the liquid-solid mass ratio of the solution obtained in the step (1) to the mixed powder in the step (2) is 3:1, collecting a spraying mixture, and drying at 110 ℃ for 30 min;
(4) and (4) calcining the dried mixed powder in the step (3) at 600 ℃, cooling the calcined product to room temperature, and grinding to 600-mesh granularity to obtain the microporous wave-absorbing filler.
2. Preparation of high-temperature resistant electromagnetic wave absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 15 wt% of water into a reaction kettle, then sequentially adding a mixture (20 wt%) of titanium dioxide and calcium carbonate with the mass ratio of 1:1, 1 wt% of a dispersing agent EFKA-4310 and 3wt% of anti-settling agent fumed silica into the reaction kettle, and fully stirring for 30 min;
(2) then, microporous wave-absorbing filler (7 wt%), organic silicon modified amino resin (30 wt%) and leveling agent BYK310(1 wt%) are added in sequence, and the mixture is stirred for 1.5 hours to obtain the high-temperature-resistant electromagnetic wave-absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Example 4
(1) Putting carbonyl iron powder and graphene into a stirrer according to the mass ratio of 10:1, adding 8 wt% of isobutyl triethoxysilane solution according to the weight ratio of 1:4, and stirring for 30min to fully wet the mixed powder;
(2) fully mixing lead-free glass powder with the melting point of 600 ℃ and the granularity of 250 meshes with a mixture of aluminum powder and manganese dioxide (the mass ratio of the aluminum powder to the manganese dioxide is 1:1) according to the mass ratio of 1: 1;
(3) spraying the solution fully stirred in the step (1) into a spray tower, and simultaneously blowing the mixed powder in the step (2) into the spray tower, wherein the liquid-solid mass ratio of the solution obtained in the step (1) to the mixed powder in the step (2) is 4:1, collecting a spraying mixture, and drying at 110 ℃ for 30 min;
(4) and (4) calcining the dried mixed powder in the step (3) at 650 ℃, cooling the calcined product to room temperature, and grinding to 600-mesh granularity to obtain the microporous wave-absorbing filler.
2. Preparation of high-temperature resistant electromagnetic wave absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 20 wt% of water into a reaction kettle, then sequentially adding a mixture (25 wt%) of titanium dioxide and iron oxide red with the mass ratio of 1:1, a dispersant BYK-190(2 wt%), and an anti-settling agent W-601 polyamide anti-settling agent (4 wt%) into the reaction kettle, and fully stirring for 30 min;
(2) then, the microporous wave-absorbing filler (8 wt%), the organic silicon modified phenolic resin (35 wt%), the leveling agent DH-4310(1 wt%) are added in sequence, and the high-temperature resistant electromagnetic wave-absorbing coating is obtained after stirring for 1.5 h. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Example 5
(1) Putting carbonyl iron powder and graphene into a stirrer according to the mass ratio of 8:1, adding 10wt% of vinyl triethoxysilane solution according to the weight ratio of 1:2, and stirring for 30min to fully wet the mixed powder;
(2) fully mixing lead-free glass powder with the melting point of 650 ℃ and the granularity of 300 meshes with a mixture of copper powder and zinc oxide (the mass ratio of the copper powder to the zinc oxide is 1:1) according to the mass ratio of 1: 2;
(3) spraying the solution fully stirred in the step (1) into a spray tower, and simultaneously blowing the mixed powder in the step (2) into the spray tower, wherein the liquid-solid mass ratio of the solution obtained in the step (1) to the mixed powder in the step (2) is 5:1, collecting a spraying mixture, and drying at 110 ℃ for 30 min;
(4) and (4) calcining the dried mixed powder in the step (3) at 650 ℃, cooling the calcined product to room temperature, and grinding to 600-mesh granularity to obtain the microporous wave-absorbing filler.
2. Preparation of high-temperature resistant electromagnetic wave absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 25wt% of water into a reaction kettle, then sequentially adding a mixture (30 wt%) of titanium dioxide and carbon black in a mass ratio of 1:1, a dispersant EFKA-4310(3 wt%), and an anti-settling agent KYC-426(5 wt%) into the reaction kettle, and fully stirring for 30 min;
(2) then sequentially adding 10wt% of microporous wave-absorbing filler, 40wt% of organic silicon modified acrylic resin and 2wt% of leveling agent BYK-346, and stirring for 2 hours to obtain the high-temperature-resistant electromagnetic wave-absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Comparative example 1
Preparation of high temperature wave-absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 25% of water into a reaction kettle, then sequentially adding a mixture of 30% of titanium dioxide and carbon black in a ratio of 1:1, 3% of dispersing agent EFKA-4310 and 5% of anti-settling agent KYC-426 into the reaction kettle, and fully stirring for 30 min.
(2) And then sequentially adding a mixture (10 wt%) of carbonyl iron powder and graphene in a mass ratio of 8:1, an organic silicon modified acrylic resin (40 wt%), a flatting agent BYK-346(2 wt%), and stirring for 2 hours to obtain the high-temperature wave-absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Comparative example 2
Preparation of high temperature wave-absorbing coating (the following proportion is calculated according to the total formula mass percentage)
(1) Firstly, adding 10wt% of water into a reaction kettle, then sequentially adding a mixture (15 wt%) of titanium dioxide and talcum powder with the mass ratio of 1:1, a dispersant Bayer 0451(0.5 wt%), and an anti-settling agent KYC-426(2 wt%) into the reaction kettle, and fully stirring for 30 min.
(2) And then sequentially adding a mixture (6 wt%) of ferroferric oxide and silicon carbide in a mass ratio of 3:1, an organic silicon modified polyurethane resin (25 wt%), a leveling agent EL-2517(0.5 wt%), and stirring for 1h to obtain the high-temperature-resistant electromagnetic wave absorbing coating. The wave-absorbing coating is coated on the same base material surface, dried and cured, and then the wave-absorbing performance is tested, and the reflection loss at the peak value is shown in table 1.
Table 1 wave-absorbing coating wave-absorbing performance results
From table 1, it can be derived: the reflection loss of the wave-absorbing coating prepared in the embodiment 1-5 provided by the invention under the working temperature (225-330 ℃) environment is superior to that of the wave-absorbing coating prepared in the comparative example 1-2.
In addition, the inventors of the present invention have also made experiments with other materials, process operations, and process conditions described in the present specification with reference to the above examples, and have obtained preferable results.
The aspects, embodiments, features and examples of the present invention should be considered as illustrative in all respects and not intended to be limiting of the invention, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
The use of headings and chapters in this disclosure is not meant to limit the disclosure; each section may apply to any aspect, embodiment, or feature of the disclosure.
Throughout this specification, where a composition is described as having, containing, or comprising specific components or where a process is described as having, containing, or comprising specific process steps, it is contemplated that the composition of the present teachings also consist essentially of, or consist of, the recited components, and the process of the present teachings also consist essentially of, or consist of, the recited process steps.
It should be understood that the order of steps or the order in which particular actions are performed is not critical, so long as the teachings of the invention remain operable. Further, two or more steps or actions may be performed simultaneously.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Claims (29)
1. The high-temperature-resistant electromagnetic wave absorbing coating is characterized by comprising the following components in percentage by mass: 20-40wt% of organic resin, 5-25wt% of water, 5-10wt% of microporous wave-absorbing filler, 10-30wt% of pigment filler, 1-5wt% of anti-settling agent, 0.1-3wt% of dispersing agent and 0.1-2wt% of flatting agent;
the preparation method of the microporous wave-absorbing filler comprises the following steps:
mixing and stirring the wave absorbing substance and the silane coupling agent solution for 10-30min to form a first mixture, and simultaneously mixing glass powder and metal powder and/or metal oxide powder to form mixed powder;
spraying the obtained first mixture into spraying equipment, and simultaneously blowing the obtained mixed powder into the spraying equipment to obtain a spraying mixture;
calcining and grinding the obtained spray mixture to obtain the microporous wave-absorbing filler;
the wave absorbing material is selected from any one or combination of more than two of carbonyl iron, ferroferric oxide, graphene and silicon carbide.
2. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the wave absorbing material is selected from a mixture of ferroferric oxide and silicon carbide and/or a mixture of carbonyl iron and graphene.
3. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the glass powder is low-melting point lead-free glass powder; the melting point of the glass powder is 450-650 ℃, and the particle size is 200-300 meshes.
4. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the metal powder and/or the metal oxide powder is selected from any one or the combination of more than two of iron powder, copper powder, aluminum powder, manganese dioxide, zirconium dioxide, aluminum oxide and zinc oxide.
5. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the silane coupling agent contains one or more groups selected from alkoxy, acetoxy, halogen, amino, epoxy and vinyl.
6. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 5, characterized in that: the silane coupling agent is selected from any one or the combination of more than two of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri (beta-methoxyethoxy) silane and isobutyl triethoxy silicon.
7. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the organic resin is organic silicon modified resin; the organic silicon modified resin is selected from any one or the combination of more than two of organic silicon modified epoxy resin, organic silicon modified polyurethane resin, organic silicon modified amino resin, organic silicon modified phenolic resin and organic silicon modified acrylic resin.
8. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the pigment and filler is selected from any one or the combination of more than two of titanium dioxide, carbon black, calcium carbonate, talcum powder and iron oxide red.
9. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the anti-settling agent is any one or the combination of more than two of magnesium aluminum silicate, KYC-426, fumed silica and W-601 polyamide anti-settling agent.
10. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 1, characterized in that: the dispersant is selected from any one or the combination of more than two of BYK-190, Bayer 0451 and EFKA-4310; the leveling agent is selected from polyether modified polydimethylsiloxane series leveling agents and/or polyester modified polydimethylsiloxane series leveling agents.
11. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 10, characterized in that: the polyether modified polydimethylsiloxane series leveling agent is selected from BYK333 and/or EL-2517.
12. The high-temperature-resistant electromagnetic wave absorbing coating according to claim 10, characterized in that: the polyester modified polydimethylsiloxane series leveling agent is selected from any one or the combination of more than two of BYK310, DH-4310 and BYK-3460.
13. The preparation method of the high temperature resistant electromagnetic wave absorbing coating of any one of claims 1 to 12, characterized by comprising:
mixing and stirring the wave absorbing substance and the silane coupling agent solution for 10-30min to form a first mixture, and simultaneously mixing glass powder and metal powder and/or metal oxide powder to form mixed powder; spraying the obtained first mixture into spraying equipment, and simultaneously blowing the obtained mixed powder into the spraying equipment to obtain a spraying mixture; then calcining and grinding the obtained spray mixture to obtain the microporous wave-absorbing filler;
and sequentially adding the dispersing agent, the pigment filler and the anti-settling agent into water, mixing and stirring for 20-40min, and then sequentially adding the microporous wave-absorbing filler, the organic silicon modified resin and the flatting agent into the mixed solution, mixing and stirring for 1-2h to prepare the high-temperature-resistant electromagnetic wave-absorbing coating.
14. The preparation method according to claim 13, wherein the mass ratio of the wave-absorbing substance to the silane coupling agent contained in the silane coupling agent solution is 1:2 to 1: 10.
15. The production method according to claim 14, wherein the silane coupling agent solution is at a concentration of 3 to 10 wt%.
16. The preparation method according to claim 14, wherein when the wave-absorbing substance is a mixture of ferroferric oxide and silicon carbide, the mass ratio of the ferroferric oxide to the silicon carbide is 10:1-1: 1.
17. The preparation method according to claim 14, wherein when the wave-absorbing substance is a mixture of carbonyl iron and graphene, the mass ratio of the carbonyl iron to the graphene is 10:1-1: 1.
18. The production method according to claim 13, wherein the mass ratio of the glass frit to the metal powder and/or the metal oxide powder is 2:1 to 1: 2.
19. The preparation method according to claim 13, wherein the mass ratio of the first mixture to the mixed powder is 1:1 to 5: 1.
20. The method of claim 13, further comprising: the obtained spray mixture was subjected to a drying treatment.
21. The method as claimed in claim 20, wherein the drying treatment is carried out at a temperature of 105 ℃ and a temperature of 120 ℃ for 20-40 min.
22. The method as claimed in claim 13, wherein the calcination treatment is carried out at a temperature of 500-700 ℃ for a period of 30-60 min.
23. The preparation method according to claim 13, wherein the microporous wave-absorbing filler after grinding treatment is 400-800 mesh.
24. A high temperature resistant electromagnetic wave absorbing coating is characterized in that: formed by the high temperature resistant electromagnetic wave absorbing coating of any one of claims 1 to 12.
25. The high temperature resistant electromagnetic wave absorbing coating of claim 24, wherein the thickness of the high temperature resistant electromagnetic wave absorbing coating is 50-200 μm.
26. The method for preparing the high-temperature resistant electromagnetic wave absorbing coating of claim 24 or 25, characterized by comprising:
providing the high temperature resistant electromagnetic wave absorbing coating of any one of claims 1 to 12;
and applying the coating on the surface of the base material, and drying to form the high-temperature-resistant electromagnetic wave absorbing coating.
27. The method according to claim 26, wherein the substrate is selected from any one of glass and metal or a combination of two or more of glass and metal.
28. Use of the high temperature resistant electromagnetic wave absorbing coating of any one of claims 1 to 12 or the high temperature resistant electromagnetic wave absorbing coating of any one of claims 24 to 25 in the fields of electronic and electrical equipment, household appliances and industrial furnaces.
29. The use according to claim 28, wherein the use is the use of wave-absorbing protection of surfaces of household appliances and industrial furnaces.
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