CN113429881A - Wave-absorbing coating composition, wave-absorbing coating, preparation method and application of wave-absorbing coating, and wave-absorbing coating - Google Patents
Wave-absorbing coating composition, wave-absorbing coating, preparation method and application of wave-absorbing coating, and wave-absorbing coating Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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Abstract
The invention relates to the technical field of coatings, in particular to a wave-absorbing coating composition, a wave-absorbing coating, a preparation method and application thereof, and a wave-absorbing coating, wherein the coating composition contains the following components which are respectively independently stored or are mixed and stored: epoxy modified organic silicon resin, polyether modified polysilazane, modified silicone oil, a wave absorbing agent and a solvent. The wave-absorbing coating prepared from the wave-absorbing coating composition provided by the invention has the advantages of easiness in cleaning, high hardness and good adhesiveness; in particular, the coating can also improve the efficiency of converting microwave energy into heat, for the purpose of rapid heat absorption and heat transfer.
Description
Technical Field
The invention relates to the technical field of coatings, in particular to a wave-absorbing coating composition, a wave-absorbing coating, a preparation method and application thereof, and a wave-absorbing coating.
Background
The easy-to-clean coating has the characteristics of hydrophobicity, oleophobicity, pollution resistance and the like on the surface, and has wide application prospect in the industries of household appliances, bathrooms, automobiles, buildings and the like. The easy-to-clean coating has low surface energy, has a high wetting angle for water and oil, is difficult to adhere to the surface, is not firm even if adhered, and is easy to fall off under the action of self weight or external force.
At present, the easy-to-clean coating mainly comprises coating systems such as organosilicon, fluorine-containing low-surface-energy coating, fluorine-silicon resin and the like. However, the existing easy-to-clean coating technology does not reach the level expected by the market, the stability of partial products on the market is poor, the oleophobic effect is gradually lost in the using process, and the problems of low coating hardness, poor wear resistance and the like can occur.
Most of wave-absorbing materials adopted by baking trays of existing microwave ovens or microwave ovens are prepared by mixing and dispersing wave-absorbing powder in resin, and curing the powder on the surface of a metal or ceramic tray at high temperature to form a wave-absorbing material layer, so that the baking tray absorbs microwave energy and then bakes and bakes food.
However, the thick and heavy wave-absorbing material is not favorable for the appearance design of the product and the use experience of the user. Especially for baking trays with special shapes or structures, thicker coatings cannot meet the use requirements, and the problems of poor adhesive capacity, high cost, low heat absorption and heat transfer efficiency and the like are also generated.
Disclosure of Invention
The invention aims to solve the problems that the surface of a material for the household appliance is difficult to clean, the coating hardness is low, the wear resistance is poor, and the heat absorption and heat transfer efficiency is low in the prior art.
In order to achieve the above object, a first aspect of the present invention provides a wave-absorbing coating composition, which comprises the following components stored independently or in a mixture of two or more of them: epoxy modified organic silicon resin, polyether modified polysilazane, modified silicone oil, a wave absorbing agent and a solvent;
based on the total mass of the coating composition, the content of the epoxy modified silicone resin is 10-40 mass%, the content of the polyether modified polysilazane is 5-20 mass%, the content of the modified silicone oil is 0.05-0.5 mass%, the content of the wave absorbing agent is 1-5 mass%, and the content of the solvent is 34.9-82.95 mass%;
wherein the structural general formula of the polyether modified polysilazane is F (C)xF2xO)mCyF2y-CzH2z-(R1Si-NR2)nIn the formula, x, y andeach z is independently selected from an integer from 1 to 10; m and n are each independently selected from integers of 1-100; r1And R2Each independently selected from hydrogen and C1-20Alkyl of (C)2-20Alkenyl of, C6-20Aryl of (C)1-20Alkoxy group of (C)1-20alkyl-NH-.
In a second aspect, the present invention provides a method for preparing a wave-absorbing coating, comprising: mixing the components of the wave-absorbing coating composition of the first aspect.
In a third aspect, the invention provides a wave-absorbing coating prepared by the method of the second aspect.
In a fourth aspect, the invention provides the application of the wave-absorbing coating in the third aspect in household appliances, bathrooms or automobiles.
The fifth aspect of the invention provides the application of the wave-absorbing coating in the third aspect in kitchen appliances.
The sixth aspect of the invention provides a wave-absorbing coating, which is obtained by spraying the wave-absorbing coating of the third aspect on the surface of a substrate, and then drying and curing the coating in sequence.
Compared with the existing coating technology, the wave-absorbing coating composition and the wave-absorbing coating provided by the invention have the following advantages:
the wave-absorbing coating prepared from the wave-absorbing coating composition provided by the invention has the advantages of easiness in cleaning, high hardness and good adhesiveness; particularly, the coating is applied to a microwave oven or a microwave oven, and the efficiency of converting microwave energy into heat can be improved, so that the aims of quickly absorbing and transferring heat are fulfilled.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Detailed Description
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
It should be noted that, in various aspects of the present invention, the present invention is described only once in one aspect thereof without repeated description with respect to the same components in the aspects, and those skilled in the art should not be construed as limiting the present invention.
In the case where no explanation is given to the contrary, the room temperature in the present invention is 25. + -. 2 ℃.
Said C is1-20The alkyl group of (A) means an alkyl group having a total number of carbon atoms of 1 to 20, and includes straight-chain alkyl groups and branched-chain alkyl groups, and may be, for example, C1、C2、C3、C4、C5、C6、C7、C8、C9、C10、C11、C12、C13、C14、C15、C16、C17、C18、C19Or C20Alkyl group of (1). "C1-10The alkyl group of (1) has a similar explanation to this, only the total number of carbon atoms is different.
Said C is2-20The alkenyl group means an alkenyl group having 2 to 20 carbon atoms in total, and includes a straight-chain alkenyl group and a branched-chain alkenyl group, and may be, for example, C2、C3、C4、C5、C6、C7、C8、C9、C10、C11、C12、C13、C14、C15、C16、C17、C18、C19Or C20Alkenyl groups of (a). "C2-10The "alkenyl group" has similar explanations as above, only the total number of carbon atoms is different.
Said C is6-20The aryl group of (2) means an aryl group having 6 to 20 carbon atoms in total, and may be, for example, a phenyl group, an alkyl-substituted phenyl group, a naphthyl group, an alkyl-substituted naphthyl group, a biphenyl group, an alkyl-substituted biphenyl group or the like. "C6-12The aryl group of (1) has a similar interpretation to this, only differing in the total number of carbon atoms.
Said C is1-20The alkoxy group (C) means an alkoxy group having 1 to 20 carbon atoms in total, and may be, for example, C1、C2、C3、C4、C5、C6、C7、C8、C9、C10、C11、C12、C13、C14、C15、C16、C17、C18、C19Or C20Alkoxy group of (2). "C1-10The "alkoxy group" of (a) has a similar explanation to this, only the total number of carbon atoms is different.
Said C is1-20alkyl-NH-means: one substituent on N is C1-20Alkyl, illustratively, C1-20alkyl-NH-may be, for example, CH3-NH-, the "CH3"may be substituted by C1-20Any group of alkyl groups. "C1-10alkyl-NH- "has a similar interpretation, only differing in the total number of carbon atoms.
As described above, the first aspect of the present invention provides a wave-absorbing coating composition, which contains the following components stored independently or in a mixture of two or more of them: epoxy modified organic silicon resin, polyether modified polysilazane, modified silicone oil, a wave absorbing agent and a solvent;
based on the total mass of the coating composition, the content of the epoxy modified silicone resin is 10-40 mass%, the content of the polyether modified polysilazane is 5-20 mass%, the content of the modified silicone oil is 0.05-0.5 mass%, the content of the wave absorbing agent is 1-5 mass%, and the content of the solvent is 34.9-82.95 mass%;
wherein the structural general formula of the polyether modified polysilazane is F (C)xF2xO)mCyF2y-CzH2z-(R1Si-NR2)nWherein x, y and z are each independently selected from integers of 1 to 10; m and n are each independently selected from integers of 1-100; r1And R2Each independently selected from hydrogen and C1-20Alkyl of (C)2-20Alkenyl of, C6-20Aryl of (C)1-20Alkyl of (2)Oxy radical, C1-20alkyl-NH-.
Preferably, the content of the epoxy-modified silicone resin is 10 to 30 mass%, the content of the polyether-modified polysilazane is 5 to 10 mass%, the content of the modified silicone oil is 0.05 to 0.2 mass%, the content of the wave absorbing agent is 2 to 5 mass%, and the content of the solvent is 54.8 to 82.95 mass%, based on the total mass of the coating composition.
Under the preferred embodiment, the inventor finds that the wave-absorbing coating with better hydrophobic and oleophobic effects can be obtained.
Preferably, the epoxy-modified silicone resin is an epoxy-modified polysiloxane resin. In this preferred embodiment, the inventors have found that a more rigid and more adherent absorbing coating can be obtained.
Preferably, in the structural general formula of the polyether modified polysilazane, R is1And R2Each independently selected from hydrogen and C1-10Alkyl of (C)2-10Alkenyl of, C6-12Aryl of (C)1-10Alkoxy group of (C)1-10alkyl-NH-.
Preferably, the molecular weight of the polyether modified polysilazane is 100-1000; preferably 500-.
More preferably, the polyether modified polysilazane is a polyether modified polysilazane available from Guangzhou Honghai chemical technology, Inc. In this preferred embodiment, the inventors have found that the present invention enables a more easily cleaned wave absorbing coating to be obtained.
Preferably, the modified silicone oil is selected from at least one of methyl silicone oil, vinyl silicone oil, methyl hydrogen-containing silicone oil, methyl fluorosilicone oil, methyl phenyl silicone oil, polyether modified silicone oil and amino modified silicone oil.
Preferably, the modified silicone oil is selected from at least one of methyl silicone oil, vinyl silicone oil and methyl hydrogen-containing silicone oil. Under the preferred embodiment, the wave-absorbing coating with better hydrophobic and oleophobic effects and better adhesion can be obtained.
Preferably, the wave absorbing agent is selected from at least one of graphite, nano silicon carbide and nano silicon nitride.
Preferably, the average particle size of the nano silicon carbide is 10 to 100 nm.
Preferably, the average particle size of the nano silicon nitride is 20-80 nm.
More preferably, the wave absorbing agent is a mixture of graphite and nano silicon carbide, wherein the content mass ratio of the graphite to the nano silicon carbide is 1:4 to 4: 1. In this preferred embodiment, the inventors have found that a more efficient heat absorbing and transferring coating is obtained.
Preferably, the solvent is selected from at least one of n-hexane, n-octane, n-decane, chloroform, dichloromethane, dichloroethylene, diethyl ether, petroleum ether, toluene, xylene, m-ditrifluorotoluene, acetone, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, diethylene glycol dimethyl ether, hydrofluoroether DA308, perfluoroheptane, perfluoromethylcyclohexane, tetrahydrofuran, and propylene glycol monomethyl ether acetate.
More preferably, the solvent is at least one selected from n-hexane, petroleum ether, toluene, xylene, acetone, ethyl acetate, butyl acetate.
As mentioned above, a second aspect of the present invention provides a method of preparing a wave-absorbing coating, the method comprising: mixing the components of the wave-absorbing coating composition of the first aspect.
Preferably, the operation of mixing the components in the wave-absorbing coating composition comprises the following steps:
(1) in the presence of a solvent, carrying out a first contact reaction on each component in a composition A to obtain a diluent, wherein the composition A contains epoxy modified organic silicon resin and modified silicone oil;
(2) and carrying out a second contact reaction on the diluent and each component in the composition B to obtain the wave-absorbing coating, wherein the composition B contains polyether modified polysilazane and a wave-absorbing agent.
Preferably, in step (1), the conditions of the first contact reaction at least satisfy: the stirring speed is 400-1200rpm, the temperature is 20-40 ℃, and the time is 5-60 min.
More preferably, in step (1), the conditions of the first contact reaction at least satisfy: the stirring speed is 500-1000rpm, the temperature is 23-25 ℃, and the time is 15-30 min.
Preferably, in step (2), the conditions of the second contact reaction at least satisfy: the stirring speed is 600-2500rpm, the temperature is 20-40 ℃, and the time is 5-60 min.
More preferably, in step (2), the conditions of the second contact reaction at least satisfy: the stirring speed is 1000-2000rpm, the temperature is 23-25 ℃, and the time is 15-25 min.
As mentioned above, a third aspect of the present invention provides a wave-absorbing coating produced by the method of the second aspect.
As mentioned above, a fourth aspect of the present invention provides the use of the wave-absorbing coating of the third aspect in household appliances, bathroom fixtures or automobiles.
As mentioned above, the fifth aspect of the present invention provides the use of the wave-absorbing coating of the third aspect in kitchen appliances.
As mentioned above, the sixth aspect of the present invention provides a wave-absorbing coating, which is obtained by spraying the wave-absorbing coating of the third aspect on the surface of a substrate, and then drying and curing the coating in sequence.
Preferably, the substrate is a ceramic substrate.
Preferably, the thickness of the coating is 0.1-100 μm, preferably 1-20 μm.
Preferably, the drying conditions at least satisfy: the temperature is 20-40 ℃ and the time is 0.5-2 h.
More preferably, the drying conditions at least satisfy: the temperature is 23-25 ℃ and the time is 0.5-1 h.
Preferably, the curing conditions at least satisfy: the temperature is 80-250 ℃ and the time is 0.5-5 h.
More preferably, the curing conditions at least satisfy: the temperature is 120 ℃ and 180 ℃, and the time is 0.5-2 h.
The present invention will be described in detail below by way of examples.
In the following examples, unless otherwise specified, the laboratory instruments and raw materials are commercially available.
Laboratory apparatus
Full-automatic water contact angle tester: BLD-D1, Bolede instruments, Inc. Dongguan;
spraying an instrument: w-71 spray gun, Japan rock field company, spraying distance 200(mm), nozzle caliber 0.8mm, air pressure 0.3 Mpa.
Raw materials
Epoxy modified silicone resin: the molecular weight of the epoxy modified polysiloxane resin is 2000, and the trademark is SH-023, Shenzhen Jipeng company;
polyether modified polysilazane: the molecular weight is 900, the mark is F350, and the Guangzhou Honghai chemical technology company is limited;
modified silicone oil: methyl silicone oil, new four seas chemical corporation, Hubei;
modified silicone oil: methyl hydrogen silicone oil, new four seas chemical corporation, Hubei;
modified silicone oil: vinyl silicone oil, new four seas chemical corporation, Hubei;
modified silicone oil: methyl phenyl silicone oil, new four seas chemical corporation, Hubei;
modified silicone oil: methyl fluorosilicone oil, new four seas chemical industries, inc;
wave absorber: nano silicon carbide with an average particle size of 40nm, Beijing Deke island gold Tech Co., Ltd;
wave absorber: nano silicon nitride with an average particle size of 20nm, Beijing Deke island gold Tech Co., Ltd;
wave absorber: graphite, average particle size 100nm, Beijing Deke island gold technologies, Inc.;
solvent: toluene, dennam yuno chemical co;
solvent: xylene, denna yuno chemical ltd;
solvent: ethyl acetate, denno chemical ltd, denna;
solvent: n-hexane, denuo chemical ltd, dennan;
solvent: butyl acetate, deno chemical ltd, denna;
solvent: petroleum ether, jonan yuno chemical ltd;
solvent: acetone, jonan yuno chemical ltd;
matrix: ceramic substrates, available from the national institute of refractories, Inc., Shanshan.
The amounts of the components in the following examples are all expressed in mass% based on the total mass of the coating composition.
In the following examples, the performance test methods involved are as follows:
1. water contact Angle test
The water contact angle is tested by adopting a full-automatic water contact angle tester.
2. Hardness test
The hardness was tested according to the national standard GB/T6739-2009.
3. Adhesion Performance test
The adhesion properties were tested according to the national standard GB/T9286-1998.
Example 1
This example illustrates that the wave-absorbing coating composition of the present invention is prepared according to the formulation and process parameters in table 1, and by the following method.
The method for preparing the wave-absorbing coating comprises the following steps:
(1) adding epoxy modified polysiloxane resin, methyl silicone oil and toluene into a beaker, and stirring at room temperature at 500rpm for 15min to obtain a diluent;
(2) and adding the diluent, polyether modified polysilazane, nano silicon carbide and graphite into a beaker, and stirring at the room temperature at 1000rpm for 20min to obtain the wave-absorbing coating.
And (2) coating the wave-absorbing coating on the surface of the ceramic matrix by spraying by using a spraying instrument to form a coating layer, drying the ceramic matrix with the coating layer at room temperature for 1h, and then putting the ceramic matrix with the coating layer into an oven with the temperature of 120 ℃ for curing for 2h to obtain the wave-absorbing coating S1.
The rest of the examples are carried out by the same procedure as in example 1, except that the wave-absorbing coating composition formulation and the process parameters are different, without specific reference, as shown in table 1.
Comparative example 1
This comparative example was carried out using a procedure similar to that of example 1, except that: the formulation does not contain polyether modified polysilazane, see in particular table 1.
Comparative example 2
This comparative example was carried out using a procedure similar to that of example 1, except that: in the formula, the fluorosilicone resin with equal mass is adopted to replace epoxy modified organic silicon resin.
Comparative example 3
This comparative example was carried out using a procedure similar to that of example 1, except that: in the formula, fluorine modified polysilazane with equal mass is adopted to replace polyether modified polysilazane.
Comparative example 4
This comparative example was carried out using a procedure similar to that of example 1, except that: the formula does not contain nano silicon carbide, nano silicon nitride and graphite, and the specific reference is made to table 1.
TABLE 1
Table 1 (continuation watch)
The performance of the wave-absorbing coating obtained in each example is measured by the test method, and specific results are shown in table 2.
TABLE 2
The results show that the wave-absorbing coating prepared from the wave-absorbing coating composition provided by the invention has the advantages of easiness in cleaning, high hardness and good adhesiveness; in particular, the coating can also improve the efficiency of converting microwave energy into heat, for the purpose of rapid heat absorption and heat transfer.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (19)
1. The wave-absorbing coating composition is characterized by comprising the following components which are stored independently or in a mixed manner: epoxy modified organic silicon resin, polyether modified polysilazane, modified silicone oil, a wave absorbing agent and a solvent;
based on the total mass of the coating composition, the content of the epoxy modified silicone resin is 10-40 mass%, the content of the polyether modified polysilazane is 5-20 mass%, the content of the modified silicone oil is 0.05-0.5 mass%, the content of the wave absorbing agent is 1-5 mass%, and the content of the solvent is 34.9-82.95 mass%;
wherein the structural general formula of the polyether modified polysilazane is F (C)xF2xO)mCyF2y-CzH2z-(R1Si-NR2)nWherein x, y and z are each independently selected from integers of 1 to 10; m and n are each independently selected from integers of 1-100; r1And R2Each independently selected from hydrogen and C1-20Alkyl of (C)2-20Alkenyl of, C6-20Aryl of (C)1-20Alkoxy group of (C)1-20alkyl-NH-.
2. The wave-absorbing coating composition according to claim 1, wherein the content of the epoxy-modified silicone resin is 10 to 30 mass%, the content of the polyether-modified polysilazane is 5 to 10 mass%, the content of the modified silicone oil is 0.05 to 0.2 mass%, the content of the wave-absorbing agent is 2 to 5 mass%, and the content of the solvent is 54.8 to 82.95 mass%, based on the total mass of the coating composition.
3. The wave-absorbing coating composition according to claim 1 or 2, wherein the epoxy-modified silicone resin is an epoxy-modified polysiloxane resin.
4. The wave-absorbing coating composition according to any one of claims 1 to 3, wherein R in the structural general formula of the polyether modified polysilazane is1And R2Each independently selected from hydrogen and C1-10Alkyl of (C)2-10Alkenyl of, C6-12Aryl of (C)1-10Alkoxy group of (C)1-10alkyl-NH-.
5. The wave absorbing coating composition of any one of claims 1 to 4, wherein the weight average molecular weight of the polyether modified polysilazane is 100-1000; preferably 500-.
6. The wave-absorbing coating composition according to any one of claims 1 to 5, wherein the modified silicone oil is at least one selected from methyl silicone oil, vinyl silicone oil, methyl hydrogen-containing silicone oil, methyl fluorosilicone oil, methyl phenyl silicone oil, polyether modified silicone oil and amino modified silicone oil.
7. The wave-absorbing coating composition according to any one of claims 1 to 6, wherein the wave-absorbing agent is at least one selected from graphite, nano silicon carbide and nano silicon nitride;
preferably, the average grain diameter of the nano silicon carbide is 10-100 nm;
preferably, the average particle size of the nano silicon nitride is 20-80 nm.
8. The wave absorbing coating composition according to any one of claims 1-7 wherein the solvent is selected from at least one of n-hexane, n-octane, n-decane, chloroform, dichloromethane, dichloroethylene, diethyl ether, petroleum ether, toluene, xylene, m-ditrifluorotoluene, acetone, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, diethylene glycol dimethyl ether, hydrofluoroether DA308, perfluoroheptane, perfluoromethylcyclohexane, tetrahydrofuran and propylene glycol monomethyl ether acetate;
preferably, the solvent is at least one selected from n-hexane, petroleum ether, toluene, xylene, acetone, ethyl acetate and butyl acetate.
9. A method for preparing a wave-absorbing coating, comprising: mixing the components of the wave-absorbing coating composition according to any one of claims 1 to 8.
10. A method in accordance with claim 9 wherein mixing the components of the wave absorbing coating composition comprises the steps of:
(1) in the presence of a solvent, carrying out a first contact reaction on each component in a composition A to obtain a diluent, wherein the composition A contains epoxy modified organic silicon resin and modified silicone oil;
(2) and carrying out a second contact reaction on the diluent and each component in the composition B to obtain the wave-absorbing coating, wherein the composition B contains polyether modified polysilazane and a wave-absorbing agent.
11. The process according to claim 9 or 10, wherein in step (1), the conditions of the first contact reaction at least satisfy: the stirring speed is 400-1200rpm, the temperature is 20-40 ℃, and the time is 5-60 min;
preferably, in step (1), the conditions of the first contact reaction at least satisfy: the stirring speed is 500-1000rpm, the temperature is 23-25 ℃, and the time is 15-30 min.
12. The method according to any one of claims 9 to 11, wherein in step (2), the conditions of the second contact reaction at least satisfy: the stirring speed is 600-2500rpm, the temperature is 20-40 ℃, and the time is 5-60 min;
preferably, in step (2), the conditions of the second contact reaction at least satisfy: the stirring speed is 1000-2000rpm, the temperature is 23-25 ℃, and the time is 15-25 min.
13. A wave-absorbing coating obtainable by the method of any one of claims 9 to 12.
14. Use of the wave absorbing coating of claim 13 in household appliances, sanitary ware or automobiles.
15. Use of the wave absorbing coating of claim 13 in kitchen appliances.
16. A wave-absorbing coating, characterized in that the coating is obtained by spraying the wave-absorbing coating of claim 13 on the surface of a substrate, and then drying and curing the coating in sequence.
17. The wave absorbing coating of claim 16, wherein the substrate is a ceramic substrate;
preferably, the thickness of the coating is 0.1-100 μm, preferably 1-20 μm.
18. The wave absorbing coating of claim 16 or 17, wherein the drying conditions are at least: the temperature is 20-40 ℃, and the time is 0.5-2 h;
preferably, the drying conditions at least satisfy: the temperature is 23-25 ℃ and the time is 0.5-1 h.
19. The wave-absorbing coating according to any one of claims 16 to 18 wherein the curing conditions are at least: the temperature is 80-250 ℃ and the time is 0.5-5 h;
preferably, the curing conditions at least satisfy: the temperature is 120 ℃ and 180 ℃, and the time is 0.5-2 h.
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