CN111192953B - Light emitting diode package - Google Patents
Light emitting diode package Download PDFInfo
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- CN111192953B CN111192953B CN202010022604.1A CN202010022604A CN111192953B CN 111192953 B CN111192953 B CN 111192953B CN 202010022604 A CN202010022604 A CN 202010022604A CN 111192953 B CN111192953 B CN 111192953B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A light emitting diode package, comprising: a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled with at least one of the first fastening part and the second fastening part and provided in the through hole; and a terminal insulating part provided in the through hole and covering an inner circumferential surface of the through hole so as to separate the substrate and the core, the through hole having an inclined surface inclined with respect to the front surface.
Description
The application relates to a division application of a light-emitting diode package, which has the application date of 2018, 09 and 17, the application number of 201880040215.2 and the name of 'light-emitting diode package'.
Technical Field
The present application relates to a light emitting diode package, and more particularly, to a light emitting diode package in which a plurality of light emitting diode chips are packaged on a substrate.
Background
A light emitting diode is an inorganic semiconductor element that emits light generated by recombination of electrons and holes. The LED has the advantages of environmental protection, low voltage, long service life, low price and the like. Further, the ultraviolet light emitting diode among the light emitting diodes may be used as ultraviolet hardening, sterilization, a white light source, a medical field, an accessory for equipment, and the like. In particular, a hardening apparatus using ultraviolet rays uses a chemical reaction principle of hardening by irradiating ultraviolet rays to a hardening object, such as a paint or the like applied to a product surface, and is widely used in various technical fields such as semiconductors, electronics, medical treatment, communication, and the like.
Disclosure of Invention
The present invention is directed to a light emitting diode package having improved light emitting efficiency and reduced defect reliability.
The invention provides a light emitting diode package, which comprises: a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled with at least one of the first fastening part and the second fastening part and provided in the through hole; and a terminal insulating part provided in the through hole and covering an inner circumferential surface of the through hole so as to separate the substrate and the core, the through hole having an inclined surface inclined with respect to the front surface.
The light emitting diode package of an embodiment of the present invention includes: a substrate having a through hole formed by removing a portion of the substrate; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled with at least one of the first fastening part and the second fastening part and provided in the through hole; and a terminal insulating part provided in the through hole and covering an inner peripheral surface of the through hole. The core is spaced apart from the substrate via the terminal insulating portion.
In an embodiment of the present invention, the light emitting diode package may further include: and a terminal insulating part provided in the through hole and covering an inner peripheral surface of the through hole, wherein the core is spaced apart from the substrate via the terminal insulating part.
In an embodiment of the present invention, the through hole may penetrate through a front surface and a back surface of the substrate.
In an embodiment of the present invention, the first terminal may have a first fastening hole to which the first fastening member is coupled, and the second terminal and the core may have a second fastening hole to which the second fastening member is coupled.
In an embodiment of the present invention, the first fastening member and the second fastening member may be bolts, and the core may be screw-coupled with at least one of the first fastening member and the second fastening member. The core may be composed of metal.
In an embodiment of the present invention, the core may include: a first surface corresponding to a front surface of the substrate; a second surface corresponding to the back surface of the substrate; and a third surface facing the inner peripheral surface of the through hole, wherein the terminal insulating portion may be provided between the third surface and the inner peripheral surface of the through hole.
In an embodiment of the present invention, the terminal insulating portion may cover the first surface of the core, and the second surface of the core may be substantially the same surface as the back surface of the substrate.
In an embodiment of the present invention, the light emitting diode package may further include: and a heat sink provided on the back surface of the substrate and the second surface of the core. The heat sink may be made of metal.
In an embodiment of the present invention, the terminal insulating portion may cover the second face of the core, and the first face of the core may be substantially the same face as the front face of the substrate.
In an embodiment of the present invention, the terminal insulating part may seal one side of the through hole.
In one embodiment of the present invention, the terminal insulating portion may cover all of the first face, the second face, and the third face of the core.
In an embodiment of the present invention, at least a part of the inner peripheral surface constituting the through hole may be provided as an inclined surface inclined with respect to at least one of the front surface and the back surface.
In an embodiment of the present invention, the inclined surface of the substrate may have a roughness different from that of at least one of the front surface and the back surface of the substrate.
In an embodiment of the present invention, the first fastening member may be a bolt, and the first fastening member may be screw-coupled with the first terminal and the base plate.
In an embodiment of the present invention, the light emitting diode package may further include: and a first insulating film provided between the substrate and the first and second terminals.
In an embodiment of the present invention, the light emitting diode package may further include: the first bonding pad is connected with the first terminal, the second bonding pad is connected with the second terminal, the light emitting diode chip is packaged in a region provided with the first bonding pad and is electrically connected with the first bonding pad and the second bonding pad, and the first bonding pad is provided as a whole which is not separated from the substrate.
In an embodiment of the present invention, the first pad may protrude from the front surface of the substrate. Here, the height of the top surface of the first pad from the front surface of the substrate may be substantially the same as the height of the top surface of the second pad. In addition, in an embodiment of the present invention, a height of a top surface of the light emitting diode chip from a front surface of the substrate may be higher than a height of a top surface of the second pad. Here, the light emitting diode chip may emit ultraviolet rays.
According to the present invention, there is provided a light emitting diode package capable of improving light emitting efficiency while preventing defects at the time of connection and disconnection with an external terminal, which can be applied according to various shapes and areas.
Drawings
Fig. 1 is a perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 2 is an exploded perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 3 is a rear perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 4 is a top view illustrating a substrate included in a light emitting diode package according to an embodiment of the present invention.
Fig. 5 is a top view illustrating a light emitting diode package of an embodiment of the present invention.
Fig. 6a is a sectional view taken along the sectional line A-A ' of fig. 5, fig. 6B is a sectional view taken along the sectional line B-B ' of fig. 5, and fig. 6C is a sectional view taken along the sectional line C-C '. In addition, fig. 6D is a sectional view taken along the line D-D 'of fig. 5, and fig. 6E is a sectional view taken along the line E-E' of fig. 5.
Fig. 7a to 7g are sectional views for explaining that a bolt for connecting an external power connection part is incorporated in a light emitting diode package according to an embodiment of the present invention, and are sectional views corresponding to the C-C' line of fig. 5.
Fig. 8 is a view showing a light emitting diode package according to an embodiment of the present invention, and is an embodiment in which the overall shape is rectangular.
Fig. 9a and 9b are plan views illustrating light emitting diode packages respectively arranged to have different horizontal and vertical ratios from each other.
Detailed Description
While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and are herein described in detail. However, the present invention is not limited to the specific embodiments disclosed, but is to be understood to include all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
Fig. 1 is a perspective view illustrating a light emitting diode package of an embodiment of the present invention, fig. 2 is an exploded perspective view illustrating the light emitting diode package of the embodiment of the present invention, fig. 3 is a rear perspective view illustrating the light emitting diode package of the embodiment of the present invention, and fig. 4 is a top view illustrating a substrate included in the light emitting diode package of the embodiment of the present invention.
Referring to fig. 1 to 4, a light emitting diode package 100 according to an embodiment of the present invention includes a substrate 110, a light emitting diode chip 120, a reflector 130, and a lens 160. In addition, the light emitting diode package may further include a first element and a second element.
The substrate 110 is used for packaging one or more light emitting diode chips 120 thereon.
The substrate 110 may include wiring, pads, terminals, and the like for connecting one or more light emitting diode chips 120 and/or the first element D1 and the second element D2 to an external power source, an external wiring, and the like. In an embodiment of the present invention, a first pad 111a and a second pad 111b are formed on the substrate 110 for connecting to more than one led chip 120. The first pad 111a may provide a location overlapping the light emitting diode chip 120 in a region where the light emitting diode chip 120 is provided, i.e., in a top view. The second pad 111b is disposed adjacent to the light emitting diode chip 120. The light emitting diode chip 120 is electrically connected to a first pad (negative electrode) 111a and a second pad (positive electrode) 111b formed on the substrate 110. A third pad 111c and a fourth pad 111D for packaging the first and second elements D1 and D2 may be provided at the substrate 110.
The first pads 111a are arranged to package the light emitting diode chips 120, and may be formed in the same number as the number of the light emitting diode chips 120 packaged on the substrate 110. In the present embodiment, as shown in fig. 2 and 4, the first pads 111a may be formed in nine. The plurality of first pads 111a may be regularly arranged in rows and columns. Also, the light emitting diode chip 120 may be packaged on the respective first pads 111a.
The second pads 111b may be disposed outside the plurality of first pads 111a. The second pads 111b may be arranged in plurality, for example, four second pads 111b may be arranged outside the first pads 111a so as to surround the plurality of first pads 111a.
The light emitting diode chip is disposed on the first pad 111a, and is electrically connected to the first pad. The light emitting diode chip may also be electrically connected to the second pad 111b through a wire W. Although not shown, the light emitting diode chip 120 may include a first contact electrode, a light emitting layer, and a second contact electrode. The light emitting layer may include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The first conductivity type and the second conductivity type are of opposite polarity to each other, the second conductivity type being p when the first conductivity type is n-type and the second conductivity type being n-type when the first conductivity type is p-type. The first contact electrode may be connected to one of the first pad 111a and the second pad 111b, and the second contact electrode may be connected to the remaining one of the first pad 111a and the second pad 111b, whereby one of the first contact electrode and the second contact electrode becomes a negative electrode, and the remaining one of the first contact electrode and the second contact electrode becomes a positive electrode.
The light emitting diode chip 120 may be supplied with power through the first and second pads 111a and 111b, and emit light. The light emitted from the light emitting diode chip 120 is ultraviolet, visible light, infrared, or the like, but is not limited thereto, and light of various wavelengths may be emitted depending on the material and structure of the light emitting layer. In an embodiment of the present invention, the light emitted by the led chip 120 may be ultraviolet.
As shown in fig. 4, the outer eight light emitting diode chips 120 among the nine light emitting diode chips respectively arranged on the first pads 111a are electrically connected to the adjacent second pads 111b by wires W, respectively, and the light emitting diode chip 120 arranged in the center is electrically connected to the second pads 111b arranged on both sides by wires W, respectively.
In an embodiment of the present invention, the number of the light emitting diode chips 120, the number of the first pads 111a and the second pads 111b are not limited thereto, and may be composed of various numbers.
In the present embodiment, a first terminal 113a and a second terminal 113b may be provided on the substrate 110 for connecting an external power source to the first pad 111a and the second pad 111b, and terminals T1, T2 for connecting the element connector DC may be formed on the substrate 110 for supplying power to the first element D1 and the second element D2.
The first terminal 113a and the second terminal 113b are disposed on one side of the substrate 110, and are provided for supplying power to the light emitting diode chip 120. The first terminal 113a and the second terminal 113b may be electrically connected to external power supply connection parts such as the first crimp terminal Pa and the second crimp terminal Pb. In the present embodiment, the first terminal 113a may be electrically connected with the first pad 111a through the body 110a of the substrate 110. The second terminal 113b may be electrically connected to the second pad 111b through a conductive wiring formed on the substrate 110 such as a wiring formed on a printed circuit board.
In the present embodiment, the first terminal 113a and the second terminal 113b are made of a conductive material. For example, the first terminal 113a and the second terminal 113b may be composed of a metal, which may include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, an alloy thereof, and the like. The first terminal 113a and the second terminal 113b may be formed of a single layer film or a multilayer film, and for example, the first terminal 113a and the second terminal 113b may be formed of Ni/Au, ni/Ag, ni/Pd/Au, or the like.
In the present embodiment, the substrate 110 may form the first fastening holes Ca and the second fastening holes Cb at positions where the first terminals 113a and the second terminals 113b are arranged, respectively. The first fastening member BT1 and the second fastening member BT2 may be inserted into the first fastening hole Ca and the second fastening hole Cb, respectively, to be coupled, and for this purpose, threads may be formed on the inner side wall. The first fastening holes Ca and the second fastening holes Cb may be formed to penetrate the substrate 110, respectively. The connection structure of the first and second terminals 113a and 113b and the first and second fastening members BT1 and BT2 will be described later.
Then, first and second substrate holes 119a and 119b may be formed at the substrate 110, respectively. Then, the first substrate hole 119a and the second substrate hole 119b may be formed in two or more pieces, respectively. The first substrate hole 119a is formed to be able to fasten the fastening member BT so as to more firmly bond the substrate 110 and the reflector 130 when the reflector 130 is bonded over the substrate 110. At this time, the fastening member BT may be a bolt, and a screw thread T for fastening the fastening member B inside the first substrate hole 119a may be formed.
The second substrate hole 119b is formed for the fastening member BT to pass through so that the light emitting diode package 100 of the present embodiment can be coupled to an external device. At this time, the second substrate hole 119b may be internally threaded as in the first substrate hole 119a, if necessary.
In the present embodiment, as shown in fig. 2 and 3, the first substrate hole 119a and the second substrate hole 119b may have a shape penetrating from the top surface to the bottom surface of the substrate 110, respectively. Then, the second substrate hole 119b is shown to have a relatively wider diameter than the first substrate hole 119a, but may be different as desired.
On the substrate 110, in order to supply external power to the second element D2, element connectors DC may be incorporated at the third terminal T1 and the fourth terminal T2. At this time, when the element connector DC is combined with the third terminal T1 and the fourth terminal T2, the height of the element connector DC may be smaller than the thickness of the reflector 130. Thus, interference generated when the light emitting diode package 100 is coupled to an external device due to the component connector DC can be minimized, and the distance of light emitted from the light emitting diode chip 120 to the object can be reduced.
The light emitting diode chip 120 is packaged over the first pad 111a formed over the substrate 110, and the light emitting diode chip 120 and the first pad 111a are electrically connected. As described above, the light emitting diode chip 120 may be disposed in plurality and may be respectively packaged over the plurality of first pads 111a. In addition, the light emitting diode chips 120 may be bonded to the first pads 111a through heat-resistant conductive pastes (e.g., ag pastes), respectively. At this time, as the plurality of light emitting diode chips 120 are respectively arranged on the plurality of first pads 111a, the plurality of light emitting diode chips 120 may be positioned at accurate positions on the plurality of first pads 111a.
The reflector 130 reflects light emitted from the one or more light emitting diode chips 120 packaged in the substrate 110. The reflector 130 is coupled over the substrate 110, and an opening 131 may be formed in the center to expose the light emitting diode chip 120 and the second pad 111b, which are packaged on the first pad 111a. The planar shape of the opening 131 may be a quadrangle, but may be deformed into various shapes according to the shape of the packaged light emitting diode chip 120.
Then, a lens 160 may be mounted at a position where the opening 131 of the reflector 130 is formed. For this, a mounting groove 133 may be formed above the opening 131, and the mounting groove 133 may have a step with the top surface of the reflector 130.
In addition, one or more first fastening holes 137a and one or more second fastening holes 137b penetrating the top and bottom surfaces may be formed at the reflector 130. The first fastening holes 137a and the second fastening holes 137b may be formed at positions corresponding to the first substrate holes 119a and the second substrate holes 119b, respectively, and may have the same diameters as the first substrate holes 119a and the second substrate holes 119b, respectively. That is, when the reflector 130 is coupled to the substrate 110, the first fastening hole 137a can be located at the same position as the first substrate hole 119a, and the second fastening hole 137b can be located at the same position as the second substrate hole 119 b. At this time, as shown in the drawing, the top surface of the reflector 130 may have a certain area capable of forming the first fastening hole 137a and the second fastening hole 137b.
Then, as shown in fig. 1 and 2, the reflector 130 may form a protection groove 135 at one side. The protection groove 135 may have a shape in which a part of the outer side surface of the reflector 130 is recessed toward the opening 131 side. That is, the protection groove 135 may be formed between shapes in which both ends of the outer side surface of the reflector 130 protrude. When the reflector 130 is disposed on the substrate 110, the first and second elements D1 and D2 encapsulated in the substrate 110 are disposed in the protection groove 135 of the reflector 130, whereby the reflector 130 may surround at least a portion of the first and second elements D1 and D2 to protect them from external influences.
In the present embodiment, the reflector 130 plays a role of emitting light emitted from the light emitting diode chip 120 disposed inside the opening 131 upward, and plays a role of protecting the light emitting diode chip 120 disposed inside the opening 131.
In addition, the reflector 130 may include a metal, and heat generated in the light emitting diode chip 120 may be transferred to the reflector 130 again through the substrate 110 to radiate heat to the outside.
Then, the reflector 130 may be coated on the surface using an anodic oxidation process, whereby the outer surface of the reflector 130 may be black.
The lens 160 is inserted into the mounting groove 133 formed in the reflector 130 to be coupled with the reflector 130. Thus, the lens 160 may have a wider area than the opening 131. In addition, the top surface of the lens 160 may have a flat shape, but is not limited thereto. The lens 160 may be made of glass or the like, and one or more kinds of fluorescent materials are distributed inside.
The light emitting diode package may be connected to an external power source using a first crimp terminal and a second crimp terminal. As shown in fig. 2, in a state where the first and second crimp terminals Pa and Pb are in electrical contact with the first and second terminals 113a and 113b, respectively, the first and second fastening members penetrate the first and second crimp terminals Pa and Pb and are coupled to the first and second fastening holes Ca and Cb, respectively, whereby the first and second crimp terminals Pa and Pb can be coupled to the first and second terminals 113a and 113b.
The first crimp terminal Pa and the second crimp terminal Pb may include conductive metals, and each may have a hole formed on one side through which the first fastening member and the second fastening member pass. Then, the other side of the first crimp terminal Pa and the second crimp terminal Pb may have a hollow tube shape so as to be able to connect an electric wire or the like. Accordingly, the first and second crimp terminals Pa and Pb are coupled to the first and second terminals 113a and 113b, respectively, and external power can be supplied to the light emitting diode chip 120 through the first and second terminals 113a and 113 b.
Fig. 5 is a top view illustrating a light emitting diode package of an embodiment of the present invention. Fig. 6a is a sectional view taken along the line A-A ' of fig. 5, fig. 6B is a sectional view taken along the line B-B ' of fig. 5, and fig. 6C is a sectional view taken along the line C-C ' of fig. 5. In addition, fig. 6D is a sectional view taken along the line D-D 'of fig. 5, and fig. 6E is a sectional view taken along the line E-E' of fig. 5.
Referring to fig. 5, 6a to 6e, the coupling relationship of the substrate 110, the light emitting diode chip 120, the reflector 130, and the lens 160 will be described in more detail.
Fig. 6a is a cross-sectional view of a location where the light emitting diode chip 120 of fig. 5 is arranged. As shown, the substrate 110 includes a main body 110a, a first pad 111a, a second pad 111b, a first insulating portion 115, and a second insulating portion 117.
At least a portion of the body 110a may be composed of a conductive material. The body 110a may be composed of, for example, a metal, which may be copper, iron, nickel, chromium, aluminum, silver, gold, titanium, an alloy thereof, or the like. However, the material of the substrate is not limited thereto, and may be composed of a nonconductive material, and when composed of a nonconductive material, a conductor may be provided on the top surface. As the nonconductive material, ceramics, resins, glass, or a composite material thereof (for example, a composite resin or a mixture of a composite resin and a conductive material) or the like can be used.
The top surface of the body 110a may have a substantially flat face. However, the first pad 111a of the package light emitting diode chip 120 may be formed as a non-separate body with the main body 110 a. For example, the first pad 111a may be provided in a convex shape protruding upward from the top surface of the main body 110 a. When the body 110a is used as the first pad 111a, an external power source may be electrically connected to the body 110a in order to supply power to the first pad 111 a. Further, since the first pad 111a is integrally formed with the main body 110a, even if heat is generated in the light emitting diode chip 120 packaged in the first pad 111a, the heat can be dissipated more rapidly by immediately transferring the heat to the main body 110a through the first pad 111 a.
The first insulating portion 115 covers at least a portion of the top surface of the main body 110a of the substrate 110. In the present embodiment, as shown in fig. 6a, most of the top surface of the main body 110a except for the first pad 111a is covered. Although described later, the first insulating portion 115 is not formed in the first terminal 113a, the first substrate hole 119a, the second substrate hole 119b, and the second fastening hole Cb, except for the first pad 111 a.
The second pad 111b is disposed above the first insulating portion 115 and is disposed at a position spaced apart from a position adjacent to the first pad 111 a. As shown, the second pads 111b may be disposed at both sides of the first pad 111a, respectively, and electrically connected with the light emitting diode chip 120 through the wire W. Here, the second pad 111b may have the same height as the first pad 111 a. The second pad 111b is electrically insulated from the first pad 111a by the first insulating portion 115.
In the present embodiment, the first pad 111a and the second pad 111b are made of a conductive material. For example, the first and second pads 111a and 111b may be composed of a metal, which may include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, alloys thereof, and the like. The first pad 111a and the second pad 111b may be formed of a single layer film or a multilayer film, and for example, the first pad 111a and the second pad 111b may be formed of Ni/Au, ni/Ag, ni/Pd/Au, or the like.
The second insulating portion 117 may cover the first insulating portion 115, and be disposed between the first pad 111a and the second pad 111 b. The second insulating portion 117 is located between the first and second pads 111a and 111b that are adjacently arranged, and can prevent the first and second pads 111a and 111b from being electrically shorted to each other. At this time, the second insulating portion 117 may cover a portion of the first and second pads 111a and 111b, whereby the top surfaces of the first and second pads 111a and 111b are exposed to the outside.
In an embodiment of the present invention, since the first pad 111a is provided to protrude from the main body 110a in a protruding form having the first height h1, the light emitting diode chip 120 is provided at a relatively higher position than the top surface of the main body 110 a. In an embodiment of the present invention, the height of the top surface of the light emitting diode chip 120 from the front surface of the substrate 110 may be higher than the height of the top surface of the second pad 111 b.
In this case, the light emitting diode chip 120 is opened relatively without disposing other components in the side direction. Thus, light emitted from the side of the light emitting diode chip 120 can travel without being blocked by other components. As a result, the light efficiency is improved in the present embodiment. In particular, when the light emitting diode chip 120 emits ultraviolet rays, the pointing angle of the light emitting diode chip emitting ultraviolet rays is a relatively wide case as compared to the light emitting diode chip emitting visible rays. According to an embodiment of the present invention, since a large amount of light is emitted at the side portion due to the wide pointing angle of the light emitting diode chip 120, the light emitted from the side portion can travel without being hindered by other constituent elements, and thus the light efficiency is improved.
In addition, since the first pads 111a are provided in a convex shape, the heights of the second pads 111b and the first pads 111a may be formed to be substantially the same height. The second pad 111b is provided on the main body 110a and the first insulating portion 115. Thereby, the second pad 111b also has a predetermined height, for example, a second height h2 from the top surface of the main body 110 a. However, since the first pad 111a protrudes from the top surface of the body 110a in a convex shape, the first and second heights may be substantially the same. In addition, even if the first height h1 and the second height h2 are different from each other, the difference thereof may be not large. By forming the first pad 111a and the second pad 111b to have substantially the same height, connection with other wirings is easy. In the case of the related art, since the first pad 111a and the second pad 111b are formed to have different heights from each other, it is sometimes necessary to additionally form a bump on the lower side pad. However, in an embodiment of the present invention, pads of the same height as each other can be formed, and thus such a problem can be solved.
A reflector 130 is provided on the second insulating portion 117. The reflector 130 may be disposed on the substrate 110 and coupled to the substrate 110 through the adhesive portion G. The adhesive portion G may be disposed on the reflector 130 and the substrate 110, coated on the whole except the first fastening hole 137a and the second fastening hole 137 b.
As described above, the reflector 130 may be bonded again by the fastening member BT in a state where the bonded portion G is bonded to the substrate 110. At this time, if the reflector 130 is normally disposed on the substrate 110, the first fastening hole 137a of the reflector 130 and the first substrate hole 119a of the substrate 110 are extended to one hole, and the fastening member BT penetrates the first fastening hole 137a and the first substrate hole 119a, so that the reflector 130 can be coupled to the substrate 110 again. The reflector 130 is thus coupled again by the fastening member BT, so that the reflector 130 is prevented from being separated from the substrate 110 even if the adhesion force of the adhesion portion G becomes weak due to the heat generated in the light emitting diode chip 120. At this time, the adhesive portion G may include a substance that transmits heat transmitted through the substrate 110 to the reflector 130 side well.
Then, the lens 160 is provided in the mounting groove 133 of the reflector 130, and at this time, the lens 160 may be coupled to the mounting portion by the adhesive portion G. The lens 160 is provided above the light emitting diode chip 120, and overlaps the light emitting diode chip 120 in a plan view. The lens 160 is made of a material through which light emitted from the light emitting diode chip 120 passes. The lens 160 may be provided in various shapes capable of changing at least a portion of the light path emitted from the light emitting diode chip 120. For example, the pointing angle of the light emitted from the light emitting diode chip 120 may be additionally widened or narrowed.
Here, the adhesive portion G may be coated on the inner bottom surface of the mounting groove 133 of the reflector 130, and the adhesive groove h may be formed on the inner bottom surface of the mounting groove 133 on which the adhesive portion G is coated. Filling the bonding groove h with the bonding portion G can increase the contact area between the bonding portion G and the reflector 130.
Fig. 6b is a sectional view showing positions of the first fastening hole 137a and the second fastening hole 137b where the reflector 130 is formed.
As shown in the drawing, the reflector 130 is coupled to the upper side of the substrate 110 via the adhesive portion G, and the reflector 130 can be coupled to the substrate 110 again by the fastening member BT penetrating the first fastening hole 137a and the first substrate hole 119 a. At this time, terminal insulating portions S may be formed on inner surfaces of the first substrate hole 119a and the second substrate hole 119b formed in the substrate 110, respectively. Thus, the diameters of the first and second substrate holes 119a and 119b may be the same as the diameters of the first and second fastening holes 137a and 137b of the reflector 130, respectively, in a state where the terminal insulating portion S is formed. In addition, threads formed in the first and second substrate holes 119a and 119b may be formed on the terminal insulating portion S.
As described above, by forming the terminal insulating portion S on the inner side surfaces of the first substrate hole 119a and the second substrate hole 119b, even if the fastening member BT is fastened to the first substrate hole 119a and the second substrate hole 119b, the fastening member BT can be electrically insulated from the main body 110a of the substrate 110. Thus, the power applied to the body 110a of the substrate 110 through the first terminal 113a is not applied to the reflector 130 through the fastening member BT made of a metal material. In this case, the fastening member BT is not problematic when it is an insulating material. Here, although not shown separately in the present embodiment, threads may be provided at the fastening member and the insulating portion corresponding thereto so as to enable corresponding mating fastening.
In the present embodiment, although the terminal insulating portion S is shown as being formed on the entire inner side surfaces of the first substrate hole 119a and the second substrate hole 119b of the substrate 110 in the drawings, the terminal insulating portion S may not be formed to the first insulating portion 115 and the second insulating portion 117 as needed. Fig. 6c is a sectional view of a position where the first terminal 113a and the second terminal 113b are arranged. The first terminal 113a and the second terminal 113b may be electrically connected to external power supply connection parts such as the first crimp terminal Pa and the second crimp terminal Pb. In order to connect with the external wiring, a fastening member is provided at the first terminal 113a and the second terminal 113b, and such a fastening member may be provided in a detachable form according to whether or not to connect with the external wiring. In this embodiment, the detachable fastening member may be a bolt having a thread.
Referring to fig. 6c, in order to connect the first terminal 113a to an external power source, a first fastening hole Ca is provided in the main body 110a, the first insulating portion 115, and the first terminal 113a of the substrate.
In the present embodiment, the main body 110a forming part of the first terminal 113a has a shape protruding upward. The first insulating portion 115 is provided on the top surface of the body 110a around the convex shape, and the first terminal 113a is arranged such that a portion of the first insulating portion 115 is in contact with the body 110 a. Thereby, the first terminal 113a may be electrically connected with the protruding portion of the body 110 a.
The first fastening hole Ca protrudes from the front surface of the substrate to penetrate not only the main body 110a but also the first insulating portion 115 and the first terminal 113a. Threads may be formed at an inner surface of the first fastening hole Ca so as to be screw-coupled with a first fastening member (not shown, BT1 of fig. 2). The first fastening member is screwed into the first fastening hole Ca, and simultaneously, the first crimp terminal (not shown, pa of fig. 2) is brought into direct contact with the first terminal 113a. Thereby, the main body 110a, the first terminal 113a, and the crimp terminal are electrically connected.
The first insulating portion 115 is provided on the main body 110a of the portion where the second terminal 113b is formed. In order to connect the second terminal 113b to an external power source, a through hole 150 is provided in which a portion of the main body 110a is removed. The through hole 150 may be provided as a hole recessed from the front surface of the main body 110a toward the rear surface, or may be provided as a hole penetrating the front surface and the rear surface. In one embodiment of the present invention, the through hole 150 is provided as an example to penetrate the front and rear surfaces. A terminal insulating portion S covering the inner peripheral surface of the through hole 150 is provided in the through hole 150. A core 140 is provided inside the terminal insulating part S so as to be spaced apart from the main body 110a through the terminal insulating part S. A second fastening hole Cb is provided in the core 140 to insert and fasten a second fastening member (not shown, BT2 of fig. 2). Threads are formed at the inner surface of the second fastening hole Bb so as to be screw-coupled with the second fastening member.
The second fastening member is screwed into the second fastening hole Cb and simultaneously brings a second crimp terminal (not shown, pb of fig. 2) into direct contact with the second terminal 113 b. Thereby, the second terminal 113b and the second crimp terminal are electrically connected.
The terminal insulating portion S serves to electrically insulate the main body 110a from the second fastening member, and completely separates the core 140 and the second fastening member by completely covering the inner circumferential surface of the through hole 150. The terminal insulating portion S is an insulating material, and the type thereof is not limited as long as it can be firmly adhered to the main body 110a. The terminal insulating portion S may be made of an organic polymer material, for example. In the case of an organic polymer, the adhesive property may be provided, and the core 140 can be firmly fixed to the main body 110a when cured.
The core 140 is provided as an inner core capable of firmly fixing the second fastening part. In the present embodiment, the core 140 may have a cylindrical shape having the second fastening holes Cb inside, having a first face 143 corresponding to the front direction of the main body 110a, a second face 145 corresponding to the rear direction of the substrate, and a third face 141 as outer side faces opposing the main body 110a and contacting each other. The core 140 is provided to have a length corresponding to the thickness of the body 110a. If the distance from the front surface to the rear surface of the main body 110a is the thickness, the length of the cylindrical shape corresponds to the thickness of the main body 110a. In other words, it may be provided that the first face 143 is the same face as the front face of the main body 110a and the second face 145 is the same face as the rear face of the main body 110a. The outer surface of the core 140, that is, the third surface 141 is in direct contact with the terminal insulating portion S.
The core 140 may be composed of a material that wears less even under frequent friction, for example, may be composed of metal. The metal with less wear is not particularly limited in kind, and materials such as copper, iron, nickel, chromium, aluminum, titanium, and alloys thereof can be used. However, the material of the core 140 is not necessarily metal, and may be made of a hard material such as an inorganic composite material or a ceramic.
The core 140, the terminal insulating portion S, and the like described above can be manufactured as follows: after forming the through-hole 150 in the main body 110a and filling a part of the through-hole 150 with a terminal insulating material such as an organic insulating material, the core 140 is disposed, and then the remaining part is additionally filled with the terminal insulating material again and then hardened to form the second fastening hole Cb. At this time, the rear surface portion of the main body 110a may be additionally polished.
Fig. 6D is a cross-sectional view of the position of the third pad 111c in combination with the first element D1.
Referring to fig. 6d, the third pad 111c may be formed to protrude upward from the main body 110a of the substrate 110, like the first pad 111 a. A first insulating portion 115 may be formed at the periphery of the third pad 111c protruding upward so as to cover the top surface of the main body 110a, and a second insulating portion 117 may be formed above the first insulating portion 115 so as to cover a portion of the third pad 111 c.
Fig. 6e is a sectional view of a position where the third terminal T1 and the fourth terminal T2 are formed.
A first insulating portion 115 is disposed on the main body 110a of the substrate 110, and a third terminal T1 and a fourth terminal T2 are disposed on the first insulating portion 115, respectively. The third terminal T1 and the fourth terminal T2 may be respectively arranged to be spaced apart from each other, and the second insulating portion 117 may be arranged between the third terminal T1 and the fourth terminal T2.
The fourth pad 111D of the package second element D2 may have a shape similar to the third terminal T1 and the fourth terminal T2, although not shown in the drawings.
The embodiment of the present invention having the above-described structure has reduced defects compared to the conventional light emitting diode package, thereby providing a light emitting diode package with improved reliability, which will be described below.
In the light emitting diode package, the first terminal and the second terminal are portions connected to the external wiring, and may be connected to or separated from the external wiring by the first fastening member and the second fastening member. That is, the first fastening member and the second fastening member are detachable, and when the external wiring is electrically connected to the first terminal and the second terminal, the external wiring is screwed through the first fastening hole and the second fastening hole, and when the electrical connection is released, the external wiring is separated from the first fastening hole and the second fastening hole.
Thus, the first fastening member and the second fastening member are inserted into the first fastening hole and the second fastening hole by pressure bonding and rotation from the upper direction to the lower direction a plurality of times, and pressure is applied from the first fastening member and the second fastening member to the constituent elements constituting the first fastening hole and the second fastening hole during the pressure bonding rotation.
At this time, the first fastening hole is directly formed in the body 110a, observing a portion of the external wiring connected to the first terminal. Since the base plate is made of a material having high wear resistance, even if the first fastening member is inserted into the first fastening hole while being pressed by the first fastening member, the screw is less worn.
Next, a portion of the external wiring connected to the second terminal is observed, and no core is provided in the related art, and a second fastening hole is provided in the terminal insulating portion. That is, since there is no core at the portion connected to the second terminal, a screw thread is directly formed at the inner wall of the second fastening hole of the terminal insulation portion. In this case, the substance constituting the terminal insulating portion is relatively weak in wear resistance and is liable to be distorted, and thus, when the second fastening member is detached a plurality of times, cracks or distortions are generated in the terminal insulating portion. As a result, there is a defect that the second fastening member cannot be fastened accurately, or that the main body and the second terminal are energized.
However, in an embodiment of the present invention, as described above, since the second fastening hole is formed in the core having strong wear resistance, even if the second fastening member is rotationally inserted into the second fastening hole while being crimped, the abrasion of the screw thread is small. Thus, in the present invention, even when the second fastening member is detached a plurality of times, the defects such as cracking or twisting of the terminal portion, energization between the terminal and the main body, and the like can be prevented, and as a result, the light emitting diode package with high reliability can be provided.
In the above-described embodiment, the connection structure of the second fastening member in the region where the second terminal is formed is described centering on, but in other embodiments of the present invention, the connection structure described above may be employed not only in the second terminal but also in the region where the first terminal is formed within the scope of the concept conforming to the present invention. The connection structure may be used in a region where terminals other than the first terminal and the second terminal are formed. For example, it is understood that in case of thread wear occurring when the base plate and the first fastening member are screw-coupled, a core may also be arranged between the base plate and the first fastening member.
The light emitting diode package of an embodiment of the present invention may provide the connection structure of the second fastening member differently in the region where the second terminal is formed within the scope of the inventive concept. Fig. 7a to 7g are sectional views for explaining the coupling of the fastening member for connecting the external power connection part in the light emitting diode package according to the embodiment of the present invention, and are sectional views corresponding to the line C-C' of fig. 5.
First, referring to fig. 7a, the body 110a may have a first inclined surface 151 for improving adhesion with the terminal insulation part S in a through hole 150 providing a space for fastening with the second fastening member. The first inclined surface 151 is provided between the inner peripheral surface constituting the through hole 150 and the front surface of the main body 110a, and is provided in a shape inclined to the front surface of the main body 110a when viewed in cross section. The first inclined surface 151 may be arranged such that the magnitude of the terminal insulation part S gradually increases as going toward the front direction of the main body 110 a.
The first inclined surface 151 is provided at a portion of the through hole 150, so that the bonding area between the body 110a and the terminal insulating part S increases. This increases the adhesion between the main body 110a and the terminal insulating portion S, and can reduce the separation of the terminal insulating portion S from the main body 110 a.
Referring to fig. 7b and 7c, the inclined surface provided to the through hole 150 may be provided in various shapes and various numbers.
In fig. 7b, in order to improve the adhesion with the terminal insulating part S, the main body 110a may have not only the first inclined surface 151 provided obliquely to the front surface of the substrate but also the second inclined surface 153 provided obliquely to the rear surface of the main body 110 a. By having both the first inclined surface 151 and the second inclined surface 153, the adhesion between the main body 110a and the terminal insulating portion S can be further improved. Here, the second inclined surface 153 may be arranged such that the amplitude of the terminal insulation part S gradually increases as going toward the rear surface direction of the main body 110 a.
Referring to fig. 7c, in order to improve the adhesion with the terminal insulation part S, the body 110a may have a third inclined surface 151 'provided obliquely at the front surface of the body 110a and a fourth inclined surface 153' provided obliquely at the rear surface of the body 110 a. As shown, the third inclined surface 151 'and the fourth inclined surface 153' may be arranged such that the amplitude of the terminal insulation part S gradually decreases as going toward the rear surface direction of the main body 110 a.
The embodiments shown in fig. 7a to 7c may be variously combined with each other within a range not conflicting with the concept of the present invention. For example, the first inclined surface 151 of fig. 7a and the fourth inclined surface 153' of fig. 7c may be combined with each other.
In the above embodiment, the inclined surface is formed in the through hole as a structure for improving the adhesion, but an additional structure for increasing the contact area between the main body and the terminal insulating portion may be further employed. For example, an additional shape such as a groove may be further provided in the through hole.
In addition, although not shown, in the embodiment shown in fig. 7a to 7c, at least a portion of the inner circumferential surface of the through hole 150 and the first to fourth inclined surfaces 151, 153, 151', 153' may have different roughness from each other. The adhesion with the terminal insulating part S is different depending on the inclined surface of the main body 110a and the roughness of the inner peripheral surface of the through hole 150. The roughness of the inner circumferential surface of the through hole 150 and the first to fourth inclined surfaces 151, 153, 151', 153' may be set to various degrees to maximize the adhesive force.
Next, referring to fig. 7d, in order to prevent separation (de-lamination) between the core body 140 and the terminal insulation part S when the second fastening member is fastened to the second fastening hole Cb, a structure to improve adhesion between the terminal insulation part S and the core body 140 may be provided.
In the present embodiment, the first face 143 of the core 140 is provided on substantially the same plane as the front face of the substrate, but the second face 145 is disposed between the front face and the rear face of the main body 110a, in direct contact with the terminal insulation portion S. At this time, in the present embodiment, the second fastening hole Cb is provided to penetrate the core 140 and the terminal insulation portion S, and a screw thread is formed at the terminal insulation portion S in a region where the core 140 is not provided.
Thereby, the core 140 and the terminal insulating portion S are joined in the left-right direction by the third face 141 (i.e., the side face) of the core 140, and simultaneously joined in the up-down direction by the second face 145 of the core 140. The second fastening member is inserted into the second fastening hole Cb while being rotated while being press-fitted, and the light emitting diode package has a strong tolerance against pressure applied by the fastening member in the up-down direction and the left-right direction of the inside of the second fastening hole Cb due to the presence of the core 140.
Next, referring to fig. 7e, the light emitting diode package of the present embodiment may have a structure for preventing separation between the core 140 and the terminal insulation part S, improving adhesion between the insulation part S and the core 140, and additionally radiating heat, as shown in fig. 7 d.
In the present embodiment, the second face 145 of the core 140 is provided on substantially the same plane as the back face of the main body 110a, and the first face 143 is disposed between the front face and the back face of the main body 110a in direct contact with the terminal insulation portion S. Thus, the core 140 and the terminal insulating portion S are joined in the left-right direction by the third face 141 (i.e., the side face) of the core 140, and simultaneously joined in the up-down direction by the first face 143 of the core 140. At this time, in the present embodiment, the second fastening hole Cb is provided to penetrate the core 140 and the terminal insulation portion S, and a screw thread is formed at the terminal insulation portion S in a region where the core 140 is not provided.
In the present embodiment, by disposing the second face 145 of the core 140 on the same plane as the back face of the main body 110a, the second face 145 of the core 140 can be exposed to the outside direction together with the back face of the main body 110 a. In this manner, in the case where a portion of the core 140 is exposed to the outside, when the heat sink is disposed on the back side of the substrate, that is, on the outside of the second face 145 of the core 140, the core 140 may be in direct contact with the heat sink. The heat sink may be made of a material capable of discharging heat well, that is, a material excellent in heat conductivity. The material having excellent thermal conductivity is not particularly limited, and may include a metal. As a result, the heat can be discharged very easily by the core 140 and the heat sink, and defects of the element in the light emitting diode package caused by heat generation can be prevented.
Next, referring to fig. 7e, the light emitting diode package of the present embodiment may change the position of the core 140 to maximize the adhesive force in order to prevent separation between the core 140 and the terminal insulation part S as shown in fig. 7 d. According to the present embodiment, the first face 143, the second face 145, and the third face 141 of the core 140 may all be in contact with the terminal insulation portion S. That is, the core 140 is entirely covered with the terminal insulating portion S except for the inner peripheral surface in the second fastening hole Cb. At this time, in the present embodiment, the second fastening holes Cb are provided to penetrate the core 140 and the terminal insulation portion S, and the screw thread is formed at the terminal insulation portion S in the region where the core 140 is not disposed.
In this case, even in the case where pressure is applied in various directions such as the up-down direction, the left-right direction, and the oblique direction when the second fastening member is fastened to the second fastening hole Cb of the core 140, the pressure can be effectively dispersed, and thus separation of the core 140 and the terminal insulation portion S can be effectively prevented.
Next, referring to fig. 7f, the terminal insulation part S may seal one side of the through hole 150. As shown in the drawing, the terminal insulating part S may have a structure in which the back side of the through hole 150 is closed. With this structure, the terminal insulation part S supports the core 140 more stably than in the case where the second fastening member is fastened through the through hole 150 of the substrate, thereby preventing separation of the core 140 and the terminal insulation part S.
Modes for carrying out the invention
According to an embodiment of the present invention, the light emitting diode package may be manufactured in various types within the scope of conforming to the above concept. For example, as shown in fig. 1, the shape may be substantially square with a horizontal/vertical ratio of approximately 1:1, or may be different from the shape, for example, a rectangular shape with a horizontal/vertical ratio of 1:1 or more.
Fig. 8 shows a light emitting diode package according to an embodiment of the present invention, which shows an embodiment in which the overall shape is rectangular. In this embodiment, in order to avoid repetition, description will be mainly made with points different from the above-described embodiment, and the non-described portions follow the above-described embodiment.
Referring to fig. 8, the light emitting diode package of the embodiment of the present invention includes a substrate 110, a light emitting diode chip 120, a reflector 130, and a lens 160. Here, unlike the light emitting diode package shown in fig. 1, the substrate 110 has a rectangular shape, and the reflector 130 is provided on a part of the substrate 110 in a manner of covering a part of the substrate 110 corresponding to the shape of the substrate 110. The light emitting diode package may further include an additional element. Here, the terminal to which the element is connected may be formed as a part different from the above-described embodiment. For example, in the embodiment shown in FIG. 1, there are two terminals (T1, T2; see FIG. 1) connected to the element, while in the present embodiment one (TM) is shown. In addition, in an embodiment of the present invention, the substrate 110 may provide wirings, pads, terminals, etc. for connecting one or more light emitting diode chips 120 and/or first and second elements with an external power source, external wirings, etc., and the wirings, pads, and terminals may be changed in position corresponding to the rectangular shape.
However, in the present embodiment, the structure between the light emitting diode chip and the first and second pads 111a and 111b, or the connection structure with the external wiring in the first and second terminals 113a and 113b does not deviate from the above-described embodiments.
As shown in fig. 1 and 8, the light emitting diode packages may be selected and arranged in various forms according to the area or size of the region where the light emitting diode packages are required to be packaged, due to the different horizontal/vertical ratios. In addition, when the wiring is connected to an external wiring, various forms can be selected and arranged according to which direction the wiring is led out at which interval.
Fig. 9a and 9b are plan views illustrating light emitting diode packages respectively arranged to have different horizontal and vertical ratios from each other. In fig. 9a and 9b, six light emitting diode packages are arranged in 2×3 rows and columns for convenience of description.
Similar to the light emitting diode package shown in fig. 1, the square-shaped light emitting diode package 100 of substantially the same lateral length L1 and vertical length L2 is arranged in fig. 9a, and the rectangular-shaped light emitting diode package 100' of longer lateral length L1 than vertical length L2 is arranged in fig. 9 b.
Regarding the spacing between the light emitting diode chips emitting light between the light emitting diode packages, it is relatively wide in the case of fig. 9a and relatively narrow in the case of fig. 9b when viewed in the lateral direction. In contrast, with respect to the spacing between the led chips that emit light between the led packages, it is relatively narrow in the case of fig. 9a and relatively wide in the case of fig. 9b when viewed vertically. In addition, the interval between external wirings led out from between the light emitting diode packages may be different according to the positions of the first and second terminals, relatively wide in the case of fig. 9a, and relatively narrow in the case of fig. 9 b.
Thus, the LED package of the present invention can be provided in various horizontal and vertical modes, and can be arranged in various ways according to the application program of the light emitting element. Thereby, the degree of freedom of arrangement of the light emitting diode packages is increased. The light emitting diode package of the present invention is shown to have a quadrangular shape, but is not limited thereto, and may be deformed into various forms such as a triangle or a primitive shape as needed.
As described above, according to an embodiment of the present invention, a light emitting diode package is provided which has high light emitting efficiency while preventing defects in connection with and separation from an external terminal, and the light emitting diode package can be applied according to various shapes and areas.
While the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art or those having ordinary skill in the art that various modifications and variations may be made thereto without departing from the spirit and scope of the present invention as set forth in the appended claims.
Therefore, the technical scope of the present invention is not limited to what is described in the detailed description of the specification, and should be determined by the claims.
Claims (10)
1. A light emitting diode package, comprising:
a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface;
a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member;
a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal;
a core coupled with at least one of the first fastening part and the second fastening part and provided in the through hole; and
a terminal insulating part adhered in the through hole and covering the inner peripheral surface of the through hole, thereby separating the substrate and the core body,
the through hole has an inclined surface inclined with respect to the front surface to increase an adhesion area between the through hole and the terminal insulating portion.
2. The light emitting diode package of claim 1, wherein,
the inclined surface is provided at least one of between an inner peripheral surface constituting the through hole and the front surface and between an inner peripheral surface constituting the through hole and the back surface.
3. The light emitting diode package of claim 2, wherein,
The amplitude of the terminal insulating portion increases as going forward from the portion provided with the inclined surface.
4. The light emitting diode package of claim 2, wherein,
the amplitude of the terminal insulating portion decreases as going forward from the portion provided with the inclined surface.
5. The light emitting diode package of claim 2, wherein,
the terminal insulating portion increases in width from a portion provided with the inclined surface toward the rear surface.
6. The light emitting diode package of claim 2, wherein,
the amplitude of the terminal insulating part is reduced from the part provided with the inclined surface to the back surface direction.
7. The light emitting diode package of claim 1, wherein,
the inner peripheral surface constituting the through hole has a groove.
8. The light emitting diode package of claim 1, wherein the inclined surface is provided in plurality.
9. The light emitting diode package of claim 8, wherein,
at least a part of the inner peripheral surface and the inclined surface constituting the through hole have different roughnesses from each other.
10. The light emitting diode package of claim 1, wherein the inclined surfaces have different shapes from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010022604.1A CN111192953B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0120164 | 2017-09-19 | ||
| KR1020170120164A KR102506588B1 (en) | 2017-09-19 | 2017-09-19 | Light emitting diode package |
| PCT/KR2018/010940 WO2019059602A2 (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
| CN202010022604.1A CN111192953B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
| CN201880040215.2A CN110770922B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880040215.2A Division CN110770922B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111192953A CN111192953A (en) | 2020-05-22 |
| CN111192953B true CN111192953B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880040215.2A Active CN110770922B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
| CN202010022604.1A Active CN111192953B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201880040215.2A Active CN110770922B (en) | 2017-09-19 | 2018-09-17 | Light emitting diode package |
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| Country | Link |
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| KR (1) | KR102506588B1 (en) |
| CN (2) | CN110770922B (en) |
| WO (1) | WO2019059602A2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054110A (en) * | 2000-08-10 | 2002-02-20 | Daito Kinzoku Kk | Metal fitting for external facing plate |
| KR101255671B1 (en) * | 2012-03-08 | 2013-04-17 | 장일호 | Led package module and manufacturing method thereof |
| KR20170030057A (en) * | 2015-09-08 | 2017-03-16 | 서울바이오시스 주식회사 | Light emitting diode package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101210477B1 (en) * | 2010-04-02 | 2012-12-10 | 주식회사 아이에스티 | Light emitting diode package and method of manufacturing the same |
| KR20110126456A (en) * | 2010-05-17 | 2011-11-23 | 삼성엘이디 주식회사 | Light-emitting diode module |
| KR20130127838A (en) * | 2012-05-15 | 2013-11-25 | 삼성전자주식회사 | Light emitting device package |
| KR20150077208A (en) * | 2013-12-27 | 2015-07-07 | 서울바이오시스 주식회사 | Semiconductor device package, light diode package and optical module including the same |
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2017
- 2017-09-19 KR KR1020170120164A patent/KR102506588B1/en active IP Right Grant
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- 2018-09-17 CN CN201880040215.2A patent/CN110770922B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002054110A (en) * | 2000-08-10 | 2002-02-20 | Daito Kinzoku Kk | Metal fitting for external facing plate |
| KR101255671B1 (en) * | 2012-03-08 | 2013-04-17 | 장일호 | Led package module and manufacturing method thereof |
| KR20170030057A (en) * | 2015-09-08 | 2017-03-16 | 서울바이오시스 주식회사 | Light emitting diode package |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019059602A3 (en) | 2019-05-09 |
| CN110770922A (en) | 2020-02-07 |
| KR20190031902A (en) | 2019-03-27 |
| KR102506588B1 (en) | 2023-03-07 |
| WO2019059602A2 (en) | 2019-03-28 |
| CN111192953A (en) | 2020-05-22 |
| CN110770922B (en) | 2023-11-03 |
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