CN111192953A - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

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Publication number
CN111192953A
CN111192953A CN202010022604.1A CN202010022604A CN111192953A CN 111192953 A CN111192953 A CN 111192953A CN 202010022604 A CN202010022604 A CN 202010022604A CN 111192953 A CN111192953 A CN 111192953A
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China
Prior art keywords
terminal
light emitting
emitting diode
substrate
hole
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Granted
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CN202010022604.1A
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Chinese (zh)
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CN111192953B (en
Inventor
朴浚镕
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Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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Priority to CN202010022604.1A priority Critical patent/CN111192953B/en
Publication of CN111192953A publication Critical patent/CN111192953A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting diode package, comprising: a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled to at least one of the first fastening member and the second fastening member and provided in the through hole; and a terminal insulating portion provided in the through hole and covering an inner circumferential surface of the through hole so as to separate the substrate and the core, the through hole having an inclined surface inclined with respect to the front surface.

Description

Light emitting diode package
The application is a divisional application with application date of 09 and 17 in 2018, application number of 201880040215.2 and invention name of 'light emitting diode package'.
Technical Field
The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package in which a plurality of light emitting diode chips are packaged on a substrate.
Background
A light emitting diode is an inorganic semiconductor element that emits light generated by recombination of electrons and holes. The LED has the advantages of environmental protection, low voltage, long service life, low price and the like. Further, ultraviolet light emitting diodes among the light emitting diodes can be used as ultraviolet hardening, sterilization, white light source, medical field, and equipment accessories, etc. In particular, a curing apparatus using ultraviolet rays is widely used in various technical fields such as semiconductors, electronics, medical treatment, and communications, by utilizing the principle of a chemical reaction in which ultraviolet rays are irradiated to a curing object, for example, a paint applied to a surface of a product to be cured.
Disclosure of Invention
The present invention aims to provide a light emitting diode package having reliability with reduced defects while improving light emitting efficiency.
The present invention provides a light emitting diode package, comprising: a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled to at least one of the first fastening member and the second fastening member and provided in the through hole; and a terminal insulating portion provided in the through hole and covering an inner circumferential surface of the through hole so as to separate the substrate and the core, the through hole having an inclined surface inclined with respect to the front surface.
A light emitting diode package according to an embodiment of the present invention includes: a substrate having a through hole formed by removing a portion of the substrate; a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member; a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal; a core coupled to at least one of the first fastening member and the second fastening member and provided in the through hole; and a terminal insulating part provided in the through hole and covering an inner circumferential surface of the through hole. The core is spaced apart from the substrate with the terminal insulating portion interposed therebetween.
In an embodiment of the present invention, the light emitting diode package further includes: and a terminal insulating portion provided in the through hole and covering an inner peripheral surface of the through hole, wherein the core is spaced apart from the substrate with the terminal insulating portion therebetween.
In an embodiment of the present invention, the through hole may penetrate through the front and back surfaces of the substrate.
In an embodiment of the present invention, the first terminal may have a first fastening hole to which a first fastening member is coupled, and the second terminal and the core may have a second fastening hole to which a second fastening member is coupled.
In an embodiment of the present invention, the first fastening member and the second fastening member may be bolts, and the core may be screw-coupled to at least one of the first fastening member and the second fastening member. The core may be made of metal.
In an embodiment of the present invention, the core may include: a first surface corresponding to a front surface of the substrate; a second surface corresponding to the back surface of the substrate; and a third surface opposite to the inner circumferential surface of the through-hole, and the terminal insulating part may be provided between the third surface and the inner circumferential surface of the through-hole.
In an embodiment of the present invention, the terminal insulating portion may cover the first surface of the core, and the second surface of the core and a back surface of the substrate may be substantially the same surface.
In an embodiment of the present invention, the light emitting diode package may further include: and the radiating fins are provided on the back surface of the substrate and the second surface of the core body. The heat sink may be made of metal.
In an embodiment of the present invention, the terminal insulating portion may cover the second surface of the core, and the first surface of the core and a front surface of the substrate may be substantially the same surface.
In an embodiment of the present invention, the terminal insulating part may seal one side of the through hole.
In one embodiment of the present invention, the terminal insulating portion may cover all of the first surface, the second surface, and the third surface of the core.
In an embodiment of the present invention, at least a part of the inner peripheral surface constituting the through hole may be provided as an inclined surface inclined with respect to at least one of the front surface and the rear surface.
In an embodiment of the present invention, the inclined surface of the substrate may have a roughness different from at least one of the front surface and the back surface of the substrate.
In one embodiment of the present invention, the first fastening member may be a bolt, and the first fastening member may be screwed with the first terminal and the base plate.
In an embodiment of the present invention, the light emitting diode package may further include: a first insulating film provided between the substrate and the first and second terminals.
In an embodiment of the present invention, the light emitting diode package may further include: the light emitting diode chip is packaged in an area provided with the first bonding pad and is electrically connected with the first bonding pad and the second bonding pad, and the first bonding pad is provided as a whole body which is not separated from the substrate.
In an embodiment of the present invention, the first pad may protrude from a front surface of the substrate. Here, a height of a top surface of the first pad from a front surface of the substrate may be substantially the same as a height of a top surface of the second pad. In addition, in an embodiment of the present invention, a height of a top surface of the light emitting diode chip from a front surface of the substrate may be higher than a height of a top surface of the second pad. Here, the light emitting diode chip may emit ultraviolet light.
According to the present invention, there is provided a light emitting diode package which can be applied according to various shapes and areas while improving light emitting efficiency and preventing defects at the time of connection and separation with an external terminal.
Drawings
Fig. 1 is a perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 2 is an exploded perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 3 is a rear perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 4 is a plan view illustrating a substrate included in the light emitting diode package of the embodiment of the present invention.
Fig. 5 is a plan view illustrating a light emitting diode package according to an embodiment of the present invention.
Fig. 6a is a sectional view taken along a section line a-a ' of fig. 5, fig. 6B is a sectional view taken along a section line B-B ' of fig. 5, and fig. 6C is a sectional view taken along a section line C-C '. Fig. 6D is a sectional view taken along a cut line D-D 'of fig. 5, and fig. 6E is a sectional view taken along a cut line E-E' of fig. 5.
Fig. 7a to 7g are sectional views for explaining a bolt for connecting an external power supply connection part is combined to the light emitting diode package according to the embodiment of the present invention, and are sectional views corresponding to the line C-C' of fig. 5.
Fig. 8 is a view showing a light emitting diode package according to an embodiment of the present invention, and shows an embodiment in which the overall shape is rectangular.
Fig. 9a and 9b are plan views showing light emitting diode packages arranged in different vertical and horizontal ratios.
Detailed Description
The present invention may be modified in various forms, and specific embodiments are illustrated in the drawings and will be described in detail herein. However, the present invention is not limited to the specific forms disclosed, and it should be understood that the present invention includes all modifications, equivalents, and alternatives included in the spirit and technical scope of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
Fig. 1 is a perspective view illustrating a light emitting diode package according to an embodiment of the present invention, fig. 2 is an exploded perspective view illustrating the light emitting diode package according to the embodiment of the present invention, fig. 3 is a rear perspective view illustrating the light emitting diode package according to the embodiment of the present invention, and fig. 4 is a plan view illustrating a substrate included in the light emitting diode package according to the embodiment of the present invention.
Referring to fig. 1 to 4, a light emitting diode package 100 according to an embodiment of the present invention includes a substrate 110, a light emitting diode chip 120, a reflector 130, and a lens 160. In addition, the light emitting diode package may further include a first element and a second element.
The substrate 110 is used to package more than one light emitting diode chip 120 thereon.
The substrate 110 may include wires, pads, terminals, and the like for connecting one or more light emitting diode chips 120 and/or the first and second elements D1 and D2 to an external power supply, external wires, and the like. In an embodiment of the invention, a first bonding pad 111a and a second bonding pad 111b are formed on the substrate 110 for connecting one or more led chips 120. The first pad 111a may be provided at a region where the light emitting diode chip 120 is provided, i.e., a position overlapping the light emitting diode chip 120 in a plan view. The second pad 111b is disposed adjacent to the light emitting diode chip 120. The light emitting diode chip 120 is electrically connected to a first pad (cathode) 111a and a second pad (anode) 111b formed on the substrate 110. Third and fourth pads 111c and 111D for packaging the first and second elements D1 and D2 may be provided at the substrate 110.
The first pads 111a are arranged to package the light emitting diode chips 120, and may be formed in the same number as the number of the light emitting diode chips 120 packaged on the substrate 110. In the present embodiment, as shown in fig. 2 and 4, the first pads 111a may be formed in nine. The plurality of first pads 111a may be regularly arranged in rows and columns. Also, the light emitting diode chip 120 may be packaged on each of the first pads 111 a.
The second pads 111b may be disposed outside the plurality of first pads 111 a. The second pads 111b may be arranged in plural, for example, four second pads 111b may be arranged outside the first pads 111a, arranged to surround the plural first pads 111 a.
The light emitting diode chip is disposed on the first pad 111a, electrically connected to the first pad. The light emitting diode chip may also be electrically connected to the second pad 111b through a wire W. Although not shown, the led chip 120 may include a first contact electrode, a light emitting layer, and a second contact electrode. The light emitting layer may include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The first conductivity type and the second conductivity type are opposite polarities to each other, the second conductivity type is p when the first conductivity type is n-type, and the second conductivity type is n-type when the first conductivity type is p-type. The first contact electrode may be connected to one of the first pad 111a and the second pad 111b, and the second contact electrode may be connected to the remaining one of the first pad 111a and the second pad 111b, so that one of the first contact electrode and the second contact electrode is a negative electrode and the remaining one of the first contact electrode and the second contact electrode is a positive electrode.
The led chip 120 may be powered through the first pad 111a and the second pad 111b to emit light. The light emitted from the light emitting diode chip 120 is ultraviolet light, visible light, infrared light, or the like, but is not limited thereto, and light having various wavelengths may be emitted depending on the material and structure of the light emitting layer. In an embodiment of the invention, the light emitted from the led chip 120 may be ultraviolet light.
As shown in fig. 4, eight light emitting diode chips 120 on the outer side among the nine light emitting diode chips respectively arranged on the first pads 111a are electrically connected to the adjacent second pads 111b by wires W, respectively, and the light emitting diode chip 120 arranged in the center is electrically connected to the second pads 111b arranged on both sides by wires W, respectively.
In an embodiment of the present invention, the number of the light emitting diode chips 120 and the number of the first pads 111a and the second pads 111b are not limited thereto, and may be configured by various numbers.
In the present embodiment, a first terminal 113a and a second terminal 113b may be provided at the substrate 110 for connecting an external power source at the first pad 111a and the second pad 111b, and terminals T1, T2 for connecting the element connector DC may be formed at the substrate 110 in order to supply power to the first element D1 and the second element D2.
The first terminal 113a and the second terminal 113b are disposed on one side of the substrate 110 and provided to supply power to the light emitting diode chip 120. The first terminal 113a and the second terminal 113b may be electrically connected to an external power supply connection portion such as the first crimp terminal Pa and the second crimp terminal Pb. In the present embodiment, the first terminal 113a may be electrically connected with the first pad 111a through the body 110a of the substrate 110. In addition, the second terminal 113b may be electrically connected to the second pad 111b via a conductive wiring formed on the substrate 110 such as a wiring formed on a printed circuit board.
In the present embodiment, the first terminal 113a and the second terminal 113b are made of a conductive material. For example, the first and second terminals 113a and 113b may be composed of a metal, which may include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, alloys thereof, and the like. The first terminal 113a and the second terminal 113b may be formed of a single-layer film or a multilayer film, and the first terminal 113a and the second terminal 113b may be formed of Ni/Au, Ni/Ag, Ni/Pd/Au, or the like, for example.
In the present embodiment, the base plate 110 may have a first fastening hole Ca and a second fastening hole Cb formed at positions where the first and second terminals 113a and 113b are disposed, respectively. The first and second fastening holes Ca and Cb may be respectively inserted and coupled with the first and second fastening parts BT1 and BT2, and for this, a screw may be formed at an inner sidewall. In addition, the first and second fastening holes Ca and Cb may be formed to penetrate the substrate 110, respectively. The connection structure of the first and second terminals 113a and 113b and the first and second fastening members BT1 and BT2 will be described later.
Then, first substrate hole 119a and second substrate hole 119b may be formed in substrate 110, respectively. Then, two or more first substrate holes 119a and two or more second substrate holes 119b may be formed. The first substrate hole 119a is formed to enable fastening of the fastening member BT so as to more firmly bond the substrate 110 and the reflector 130 when the reflector 130 is bonded over the substrate 110. At this time, the fastening member BT may be a bolt, and a screw thread T for fastening the fastening member B inside the first substrate hole 119a may be formed.
The second substrate hole 119b is formed for the fastening member BT to pass through, so that the light emitting diode package 100 of the present embodiment can be bonded to an external device. In this case, second substrate hole 119b may be internally threaded as in first substrate hole 119a, if necessary.
In the present embodiment, as shown in fig. 2 and 3, first substrate hole 119a and second substrate hole 119b may have a shape penetrating from the top surface to the bottom surface of substrate 110. Second substrate hole 119b is then shown as having a relatively wider diameter than first substrate hole 119a, but may be different as desired.
On the substrate 110, in order to supply an external power to the second element D2, an element connector DC may be coupled at the third terminal T1 and the fourth terminal T2. At this time, when the element connector DC is combined with the third terminal T1 and the fourth terminal T2, the height of the element connector DC may be smaller than the thickness of the reflector 130. Accordingly, interference of the light emitting diode package 100 with an external device due to the component connector DC can be minimized, and the distance of the light emitted from the light emitting diode chip 120 to the object can be reduced.
The light emitting diode chip 120 is packaged over the first pad 111a formed over the substrate 110, and the light emitting diode chip 120 and the first pad 111a are electrically connected. As described above, the light emitting diode chip 120 may be arranged in plural, and may be packaged over the plural first pads 111a, respectively. In addition, the light emitting diode chips 120 may be respectively bonded to the first pads 111a by heat-resistant conductive paste (e.g., Ag paste). At this time, as the plurality of light emitting diode chips 120 are disposed on the plurality of first pads 111a, respectively, the plurality of light emitting diode chips 120 may be located at accurate positions on the plurality of first pads 111 a.
The reflector 130 reflects light emitted from the one or more light emitting diode chips 120 packaged in the substrate 110. The reflector 130 is bonded over the substrate 110, and an opening 131 may be formed at the center to expose the light emitting diode chip 120 and the second pad 111b packaged on the first pad 111 a. The planar shape of the opening 131 may be a quadrangle, but may be modified into various shapes according to the shape of the packaged light emitting diode chip 120.
Then, the lens 160 may be mounted at a position where the opening 131 of the reflector 130 is formed. For this, a mounting groove 133 may be formed above the opening portion 131, and the mounting groove 133 may have a step difference from the top surface of the reflector 130.
In addition, one or more first fastening holes 137a and one or more second fastening holes 137b penetrating the top and bottom surfaces may be formed at the reflector 130. The first fastening hole 137a and the second fastening hole 137b may be formed at positions corresponding to the first substrate hole 119a and the second substrate hole 119b, respectively, and may have the same diameter as the first substrate hole 119a and the second substrate hole 119b, respectively. That is, when reflector 130 is coupled to substrate 110, first fastening holes 137a can be located at the same positions as first substrate holes 119a, and second fastening holes 137b can be located at the same positions as second substrate holes 119 b. At this time, as shown in the drawing, the top surface of the reflector 130 may have a certain area capable of forming the first fastening hole 137a and the second fastening hole 137 b.
Then, as shown in fig. 1 and 2, the reflector 130 may be formed with a protective groove 135 at one side surface. The protective groove 135 may have a shape in which a part of the outer side surface of the reflector 130 is recessed toward the opening 131. That is, the protective groove 135 may be formed between the shapes protruded at both ends of the outer side surface of the reflector 130. When the reflector 130 is provided on the substrate 110, the first element D1 and the second element D2 encapsulated in the substrate 110 are disposed in the protection groove 135 of the reflector 130, whereby the reflector 130 may surround at least a portion of the first element D1 and the second element D2 to protect them from external impact.
In the present embodiment, the reflector 130 functions to emit light emitted from the light emitting diode chip 120 disposed inside the opening 131 upward, and functions to protect the light emitting diode chip 120 disposed inside the opening 131.
In addition, the reflector 130 may include metal, and heat generated in the led chip 120 may be transferred to the reflector 130 through the substrate 110 again to be dissipated to the outside.
Then, the reflector 130 may form a coating film on the surface using an anodic oxidation process, whereby the outer surface of the reflector 130 may be black.
The lens 160 is inserted into the mounting groove 133 formed at the reflector 130 to be coupled with the reflector 130. Thus, the lens 160 may have a wider area than the opening 131. In addition, the top surface of the lens 160 may have a flat shape, but is not limited thereto. The lens 160 may be made of glass or the like, and one or more kinds of phosphors may be distributed inside the lens.
The light emitting diode package may be connected to an external power source using a first crimp terminal and a second crimp terminal. As shown in fig. 2, in a state where the first crimp terminal Pa and the second crimp terminal Pb are in electrical contact with the first terminal 113a and the second terminal 113b, respectively, the first fastening member and the second fastening member penetrate the first crimp terminal Pa and the second crimp terminal Pb, respectively, and are coupled to the first fastening hole Ca and the second fastening hole Cb, respectively, so that the first crimp terminal Pa and the second crimp terminal Pb can be coupled to the first terminal 113a and the second terminal 113 b.
The first crimp terminal Pa and the second crimp terminal Pb may include conductive metal, and holes through which the first fastening member and the second fastening member penetrate are formed in one side of each of the first crimp terminal Pa and the second crimp terminal Pb. Then, the other sides of the first crimp terminal Pa and the second crimp terminal Pb may have a hollow pipe shape so that an electric wire or the like can be connected. Thus, the first crimp terminal Pa and the second crimp terminal Pb are respectively bonded to the first terminal 113a and the second terminal 113b, and the external power can be supplied to the light emitting diode chip 120 through the first terminal 113a and the second terminal 113 b.
Fig. 5 is a plan view illustrating a light emitting diode package according to an embodiment of the present invention. Fig. 6a is a sectional view taken along a section line a-a ' of fig. 5, fig. 6B is a sectional view taken along a section line B-B ' of fig. 5, and fig. 6C is a sectional view taken along a section line C-C ' of fig. 5. Fig. 6D is a sectional view taken along a cut line D-D 'of fig. 5, and fig. 6E is a sectional view taken along a cut line E-E' of fig. 5.
Referring to fig. 5 and 6a to 6e, the combination relationship of the substrate 110, the led chip 120, the reflector 130 and the lens 160 will be described in more detail.
Fig. 6a is a sectional view of a location where the light emitting diode chip 120 of fig. 5 is arranged. As shown, the substrate 110 includes a main body 110a, a first pad 111a, a second pad 111b, a first insulating portion 115, and a second insulating portion 117.
At least a portion of the body 110a may be composed of a conductive material. The body 110a may be made of, for example, a metal, and copper, iron, nickel, chromium, aluminum, silver, gold, titanium, an alloy thereof, or the like may be used. However, the material of the substrate is not limited thereto, and may be composed of a non-conductive material, and when composed of a non-conductive material, an electrical conductor may be provided on the top surface. As the non-conductive material, ceramics, resin, glass, or a composite material thereof (for example, composite resin or a mixed material of composite resin and conductive material) or the like can be used.
The top surface of the body 110a may have a substantially flat surface. However, the first pad 111a packaging the light emitting diode chip 120 may be formed as a non-separate body from the body 110 a. For example, the first pad 111a may be provided in a convex shape protruding upward from the top surface of the body 110 a. When the body 110a is used as the first pad 111a, an external power source may be electrically connected to the body 110a in order to supply power to the first pad 111 a. In addition, since the first pad 111a is formed integrally with the body 110a, even if heat is generated in the light emitting diode chip 120 packaged in the first pad 111a, the heat is immediately transferred to the body 110a through the first pad 111a, and thus the heat can be more rapidly dissipated.
The first insulating portion 115 covers at least a portion of the top surface of the body 110a of the substrate 110. In the present embodiment, as shown in fig. 6a, most of the top surface of the body 110a except the first pad 111a is covered. Note that, although described later, the first insulating portion 115 is not formed in the first terminal 113a, the first substrate hole 119a, the second substrate hole 119b, and the second fastening hole Cb, except for the first pad 111 a.
The second pad 111b is disposed above the first insulating portion 115, and is disposed at a position spaced apart from a position adjacent to the first pad 111 a. As shown, the second pads 111b may be disposed at both sides of the first pad 111a, respectively, and electrically connected to the light emitting diode chip 120 through wires W. Here, the second pad 111b may have the same height as the first pad 111 a. The second pad 111b is electrically insulated from the first pad 111a by the first insulating portion 115.
In the present embodiment, the first pad 111a and the second pad 111b are made of a conductive material. For example, the first and second pads 111a and 111b may be composed of a metal, which may include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, alloys thereof, and the like. The first pad 111a and the second pad 111b may be formed of a single-layer film or a multilayer film, and the first pad 111a and the second pad 111b may be formed of Ni/Au, Ni/Ag, Ni/Pd/Au, or the like, for example.
The second insulating portion 117 may cover the first insulating portion 115, disposed between the first pad 111a and the second pad 111 b. The second insulating portion 117 is located between the first pad 111a and the second pad 111b, which are adjacently arranged, and can prevent the first pad 111a and the second pad 111b from being electrically shorted with each other. At this time, the second insulating portion 117 may cover a portion of the first and second pads 111a and 111b, thereby exposing top surfaces of the first and second pads 111a and 111b to the outside.
In an embodiment of the present invention, since the first pad 111a is provided to protrude from the body 110a in a bump form having the first height h1, the light emitting diode chip 120 is provided at a position relatively higher than the top surface of the body 110 a. In an embodiment of the present invention, a height of the top surface of the light emitting diode chip 120 from the front surface of the substrate 110 may be higher than a height of the top surface of the second pad 111 b.
In this case, the light emitting diode chip 120 is in an open form without other components being arranged relatively in the side direction. Thus, light emitted from the side portion of the light emitting diode chip 120 can travel without being blocked by other components. As a result, the efficiency of light is improved in the present embodiment. In particular, when the light emitting diode chip 120 emits ultraviolet rays, the pointing angle of the light emitting diode chip emitting ultraviolet rays is relatively wider than that of the light emitting diode chip emitting visible rays. According to an embodiment of the present invention, since a large amount of light is emitted also at the side portion due to the wide pointing angle of the light emitting diode chip 120, the light emitted from the side portion can travel without being hindered by other constituent elements, and thus the light efficiency is improved.
In addition, since the first pad 111a is provided in a bump form, the heights of the second pad 111b and the first pad 111a may be formed to be substantially the same height. The second pad 111b is provided on the body 110a and the first insulating portion 115. Thereby, the second pad 111b also has a predetermined height, for example, a second height h2, from the top surface of the body 110 a. However, since the first pad 111a protrudes from the top surface of the body 110a in a convex form, the first height and the second height may be substantially the same. In addition, even if the first height h1 and the second height h2 are different from each other, the difference may not be large. By forming the first pad 111a and the second pad 111b to have substantially the same height, connection with other wirings is facilitated. In the case of the prior art, since the first pad 111a and the second pad 111b are formed to have different heights from each other, it is sometimes necessary to additionally form bumps on the lower side pads. However, in an embodiment of the present invention, pads having the same height as each other can be formed, and thus such a problem can be solved.
The reflector 130 is provided on the second insulating portion 117. The reflector 130 may be disposed on the substrate 110 and coupled to the substrate 110 by an adhesive portion G. The adhesive portion G may be disposed on the reflector 130 and the substrate 110, coated on the whole except for the first fastening hole 137a and the second fastening hole 137 b.
As described above, the reflector 130 can be coupled again by the fastening member BT in a state where the bonded portion G is coupled to the substrate 110. At this time, if the reflector 130 is normally disposed on the substrate 110, the first fastening holes 137a of the reflector 130 and the first substrate holes 119a of the substrate 110 are extended into one hole, and the fastening members BT penetrate the first fastening holes 137a and the first substrate holes 119a, so that the reflector 130 can be coupled to the substrate 110 again. The reason why the reflector 130 is re-coupled by the fastening member BT is to prevent the reflector 130 from being separated from the substrate 110 even if the adhesive force of the adhesive portion G is weakened by heat generated in the light emitting diode chip 120. In this case, the adhesive portion G may include a substance that favorably transfers heat transferred through the substrate 110 to the reflector 130 side.
Then, the lens 160 is disposed in the mounting groove 133 of the reflector 130, and at this time, the lens 160 may be coupled to the mounting portion through the adhesive portion G. The lens 160 is provided above the led chip 120 and overlaps the led chip 120 in a plan view. The lens 160 is made of a material through which light emitted from the light emitting diode chip 120 passes. The lens 160 may be provided in various shapes capable of changing at least a part of the light path emitted from the light emitting diode chip 120. For example, the pointing angle of the light emitted from the light emitting diode chip 120 may be additionally widened or narrowed.
Here, the adhesive portion G may be applied to an inner bottom surface of the mounting groove 133 of the reflector 130, and an adhesive groove h may be formed in the inner bottom surface of the mounting groove 133 to which the adhesive portion G is applied. The bonding groove h is filled with the bonding portion G, and a contact area between the bonding portion G and the reflector 130 can be increased.
Fig. 6b is a sectional view illustrating positions of the first fastening holes 137a and the second fastening holes 137b where the reflectors 130 are formed.
As shown in the drawing, the reflector 130 is coupled to the upper side of the substrate 110 by the adhesive portion G, and the reflector 130 is coupled to the substrate 110 again by the fastening member BT penetrating the first fastening hole 137a and the first substrate hole 119 a. At this time, terminal insulating portions S may be formed on the inner surfaces of first substrate hole 119a and second substrate hole 119b formed in substrate 110. Thus, the diameters of first substrate hole 119a and second substrate hole 119b may be the same as those of first fastening hole 137a and second fastening hole 137b of reflector 130, respectively, in a state where terminal insulating portion S is formed. The screw formed in first substrate hole 119a and second substrate hole 119b may be formed in terminal insulating portion S.
As described above, by forming terminal insulating portion S on the inner side surfaces of first substrate hole 119a and second substrate hole 119b, even if fastening member BT is fastened to first substrate hole 119a and second substrate hole 119b, fastening member BT can be electrically insulated from main body 110a of substrate 110. Thereby, the power applied to the body 110a of the substrate 110 through the first terminal 113a is not applied to the reflector 130 through the fastening member BT of the metal material. In this case, when the fastening member BT is an insulating material, there is no problem. Here, although not separately shown in the present embodiment, a screw thread may be provided at the fastening member and the insulating portion corresponding thereto so as to enable corresponding mating fastening.
In the present embodiment, although the terminal insulating portion S is shown as being formed on the entire inner surface of the first substrate hole 119a and the second substrate hole 119b of the substrate 110, the terminal insulating portion S may not be formed as far as the first insulating portion 115 and the second insulating portion 117 as necessary. Fig. 6c is a sectional view of a position where the first terminal 113a and the second terminal 113b are arranged. The first terminal 113a and the second terminal 113b may be electrically connected to an external power supply connection portion such as the first crimp terminal Pa and the second crimp terminal Pb. In order to connect to the external wiring, a fastening member is provided at the first terminal 113a and the second terminal 113b, and the fastening member may be provided in a detachable form according to whether or not the connection to the external wiring is made. In this embodiment, the detachable fastening member may be a bolt having a thread.
Referring to fig. 6c, in order to connect the first terminal 113a to an external power source, first fastening holes Ca are provided in the body 110a, the first insulating portion 115, and the first terminal 113a of the substrate.
In the present embodiment, the main body 110a forming a portion of the first terminal 113a has a shape convex upward. A first insulating portion 115 is provided on the top surface of the main body 110a around the convex shape, and the first terminal 113a is arranged so that a part of the first insulating portion 115 is in contact with the main body 110 a. Thereby, the first terminal 113a may be electrically connected with the protruding portion of the body 110 a.
The first fastening hole Ca protrudes from the front surface of the substrate to penetrate through the rear surface, not only the main body 110a, but also the first insulating portion 115 and the first terminal 113 a. A screw may be formed at an inner surface of the first fastening hole Ca to be screw-coupled with a first fastening member (not shown, BT1 of fig. 2). The first fastening member is screwed into the first fastening hole Ca, and brings the first crimp terminal (not shown, Pa in fig. 2) into direct contact with the first terminal 113 a. Thereby, the body 110a, the first terminal 113a, and the crimp terminal are electrically connected.
A first insulating portion 115 is provided on the main body 110a forming part of the second terminal 113 b. In order to connect the second terminal 113b with an external power source, a through hole 150 in which a portion of the body 110a is removed is provided. The through-hole 150 may be provided in a form of a hole recessed from the front surface of the body 110a in the back surface direction, or may be provided in a form of penetrating the front surface and the back surface. In one embodiment of the present invention, the through hole 150 is provided to penetrate the front surface and the back surface, as an example. A terminal insulating portion S covering the inner circumferential surface of the through-hole 150 is provided inside the through-hole 150. A core 140 spaced apart from the main body 110a via the terminal insulating portion S is provided inside the terminal insulating portion S. A second fastening hole Cb is provided in the core 140 to insert and fasten a second fastening member (not shown, BT2 of fig. 2). A screw is formed at an inner surface of the second fastening hole Bb to screw-couple the second fastening part.
The second fastening member is screwed into the second fastening hole Cb and brings the second crimp terminal (not shown, Pb in fig. 2) into direct contact with the second terminal 113 b. Thereby, the second terminal 113b and the second crimp terminal are electrically connected.
The terminal insulating portion S is for electrically insulating the body 110a from the second fastening member, and completely separates the core 140 and the second fastening member by completely covering the inner circumferential surface of the through hole 150. The terminal insulating portion S is an insulating material, and is not limited in its kind as long as it can be firmly adhered to the main body 110 a. The terminal insulating portion S may be made of, for example, an organic polymer material. In the case of an organic polymer, the organic polymer may have adhesive properties, and the core 140 may be firmly fixed to the body 110a during curing.
The core 140 is provided as an inner core capable of firmly fixing the second fastening member. In the present embodiment, the core 140 may be a cylindrical shape having the second fastening hole Cb inside, and have a first surface 143 corresponding to a front direction of the body 110a, a second surface 145 corresponding to a rear direction of the substrate, and a third surface 141 as an outer side surface facing the body 110a and contacting each other. The core 140 is provided to a length corresponding to the thickness of the body 110 a. When the distance from the front surface to the back surface of the main body 110a is defined as the thickness, the length of the cylindrical shape corresponds to the thickness of the main body 110 a. In other words, it may be provided that the first face 143 is the same face as the front face of the body 110a, and the second face 145 is the same face as the rear face of the body 110 a. The outer surface of the core 140, i.e., the third surface 141, is in direct contact with the terminal insulating portion S.
The core 140 may be composed of a material that wears little even under frequent rubbing, and for example, may be composed of metal. The kind of the metal having low abrasion is not particularly limited, and materials such as copper, iron, nickel, chromium, aluminum, titanium, and alloys thereof can be used. However, the material of the core 140 is not necessarily metal, and may be made of a hard material such as an inorganic composite material or ceramic.
The core 140, the terminal insulating portion S, and the like described above may be manufactured as follows: after the through-hole 150 is formed in the body 110a, a part of the through-hole 150 is filled with a material for terminal insulation such as an organic insulating material, the core body 140 is arranged, and then the remaining part is additionally filled with the material for terminal insulation again and then hardened to form the second fastening hole Cb. In this case, the rear surface portion of the body 110a may be additionally polished.
Fig. 6D is a cross-sectional view of the location of the third pad 111c bonded to the first element D1.
Referring to fig. 6d, the third pad 111c may be formed by upwardly protruding the body 110a of the substrate 110, like the first pad 111 a. A first insulating portion 115 may be formed at a periphery of the third pad 111c protruding upward so as to cover the top surface of the body 110a, and a second insulating portion 117 may be formed above the first insulating portion 115 so as to cover a portion of the third pad 111 c.
Fig. 6e is a sectional view of positions where the third terminal T1 and the fourth terminal T2 are formed.
A first insulating portion 115 is disposed on the main body 110a of the substrate 110, and a third terminal T1 and a fourth terminal T2 are disposed on the first insulating portion 115, respectively. The third terminal T1 and the fourth terminal T2 may be disposed to be spaced apart from each other, and the second insulating portion 117 may be disposed between the third terminal T1 and the fourth terminal T2.
Further, although not shown, the cross section of the fourth land 111D encapsulating the second element D2 may have a shape like the third terminal T1 and the fourth terminal T2.
The embodiment of the present invention having the above-described structure has reduced defects compared to the conventional light emitting diode package, thereby providing a light emitting diode package with improved reliability, which will be described below.
In the light emitting diode package, the first terminal and the second terminal are portions connected to an external wiring, and may be connected to or separated from the external wiring by the first fastening member and the second fastening member. That is, the first fastening member and the second fastening member are detachable, and when the external wiring is electrically connected to the first terminal and the second terminal, the first fastening hole and the second fastening hole are screwed together, and when the electrical connection is released, the first fastening member and the second fastening member are separated from each other.
In this way, the first fastening member and the second fastening member are inserted into the first fastening hole and the second fastening hole by being pressed and rotated from above to below a plurality of times, and pressure of components constituting the first fastening hole and the second fastening hole is applied from the first fastening member and the second fastening member at the time of pressing and rotation.
At this time, the first fastening hole is directly formed in the body 110a, looking at a portion where the external wiring is connected to the first terminal. Since the base plate is made of a material having high wear resistance, even if the first fastening member is inserted into the first fastening hole by rotation while being pressed, the screw is less worn.
Next, observing a portion where the external wiring is connected to the second terminal, the core is not provided in the related art, and the second fastening hole is provided in the terminal insulating portion. That is, since there is no core in a portion connected to the second terminal, a screw thread is directly formed in an inner wall of the second fastening hole of the terminal insulating part. In this case, the substance constituting the terminal insulating portion is relatively weak in wear resistance and easily twisted, and thus, when the second fastening member is detached a plurality of times, cracks or twists are generated in the terminal insulating portion. As a result, the second fastening member cannot be fastened accurately, or the body and the second terminal are electrified.
However, in one embodiment of the present invention, as described above, since the second fastening hole is formed in the core body having high wear resistance, even if the second fastening member is rotatably inserted into the second fastening hole while being crimped, the wear of the screw thread is small. Thus, in the present invention, even when the second fastening member is detached a plurality of times, defects such as cracks or twists in the terminal portion, and conduction between the terminal and the main body can be prevented, and as a result, a highly reliable light emitting diode package is provided.
In the above-described embodiments, the description has been made centering on the connection structure of the second fastening member in the region where the second terminal is formed, but in other embodiments of the present invention, the connection structure may be employed not only in the second terminal but also in the region where the first terminal is formed within a range conforming to the concept of the present invention. In addition, the connection structure may be employed in a region where terminals other than the first terminal and the second terminal are formed. For example, it is understood that in the case where thread wear occurs when the base plate and the first fastening member are screw-bonded, the core may also be arranged between the base plate and the first fastening member.
The light emitting diode package according to an embodiment of the present invention may provide a connection structure of the second fastening member in a region where the second terminal is formed to be different within the scope of the concept of the present invention. Fig. 7a to 7g are sectional views for explaining a fastening member coupled to a light emitting diode package for connecting an external power supply connection part according to an embodiment of the present invention, and are sectional views corresponding to a line C-C' of fig. 5.
First, referring to fig. 7a, the body 110a may have a first inclined surface 151 for improving adhesion with the terminal insulating part S in the through hole 150 providing a space for fastening with the second fastening member. The first inclined surface 151 is provided between the inner circumferential surface constituting the through hole 150 and the front surface of the main body 110a, and is provided in a shape inclined from the front surface of the main body 110a when viewed in cross section. The first inclined surface 151 may be arranged such that the magnitude of the terminal insulating part S gradually increases as going toward the front direction of the main body 110 a.
The first inclined surface 151 is provided at a portion of the through-hole 150, so that the bonding area between the body 110a and the terminal insulating part S is increased. This increases the adhesion between the main body 110a and the terminal insulating portion S, and reduces the separation of the terminal insulating portion S from the main body 110 a.
Referring to fig. 7b and 7c, the inclined surfaces provided at the through-holes 150 may be provided in various shapes and in various numbers.
As shown in fig. 7b, in order to improve adhesion to the terminal insulating portion S, the main body 110a may include not only the first inclined surface 151 obliquely provided on the front surface of the substrate but also the second inclined surface 153 obliquely provided on the rear surface of the main body 110 a. By having the first inclined surface 151 and the second inclined surface 153 at the same time, the adhesion between the body 110a and the terminal insulating portion S can be further improved. Here, the second inclined surface 153 may be arranged such that the magnitude of the terminal insulating part S gradually increases as going toward the rear surface direction of the main body 110 a.
Referring to fig. 7c, in order to improve adhesion with the terminal insulating part S, the main body 110a may have a third inclined surface 151 'provided to be inclined at the front surface of the main body 110a and a fourth inclined surface 153' provided to be inclined at the rear surface of the main body 110 a. As shown, the third and fourth inclined surfaces 151 'and 153' may be arranged such that the magnitude of the terminal insulating part S gradually decreases as going toward the rear surface direction of the main body 110 a.
The embodiments shown in fig. 7a to 7c may be combined differently from each other within a range not conflicting with the concept of the present invention. For example, the first inclined surface 151 of fig. 7a and the fourth inclined surface 153' of fig. 7c may be combined with each other.
In the above embodiment, the inclined surface is formed in the through hole as a structure for improving the adhesion, but an additional structure for increasing the contact area between the body and the terminal insulating portion may be further employed. For example, an additional shape such as a groove may be further provided inside the through hole.
In addition, although not shown, in the embodiment shown in fig. 7a to 7c, at least a portion of the inner circumferential surface of the through-hole 150 and the first to fourth inclined surfaces 151, 153, 151 ', 153' may have different roughness from each other. The adhesion force with the terminal insulating portion S is different depending on the roughness of the inclined surface of the body 110a and the inner circumferential surface of the through hole 150. The roughness of the inner circumferential surface of the through-hole 150 and the first to fourth inclined surfaces 151, 153, 151 ', 153' may be set to various degrees to maximize the adhesive force.
Next, referring to fig. 7d, in order to prevent separation (de-propagation) between the core body 140 and the terminal insulating portion S when the second fastening member is fastened to the second fastening hole Cb, a structure for improving adhesion between the terminal insulating portion S and the core body 140 may be provided.
In the present embodiment, the first face 143 of the core 140 is provided on substantially the same plane as the front face of the substrate, but the second face 145 is disposed between the front face and the rear face of the main body 110a, in direct contact with the terminal insulating portion S. At this time, in the present embodiment, the second fastening hole Cb is provided to penetrate the core 140 and the terminal insulating portion S, and a screw is formed in the terminal insulating portion S in a region where the core 140 is not provided.
Thus, the core 140 and the terminal insulating portion S are joined in the left-right direction by the third surface 141 (i.e., the side surface) of the core 140, and are joined in the up-down direction by the second surface 145 of the core 140. The second fastening member is rotatably inserted into the second fastening hole Cb while being pressed, and the led package has strong resistance to pressure applied by the fastening member to the inside of the second fastening hole Cb in the up-down direction and to pressure applied by rotation in the left-right direction due to the core 140.
Next, referring to fig. 7e, the light emitting diode package of the present embodiment may have a structure for preventing the separation between the core body 140 and the terminal insulating portion S, improving the adhesive force between the insulating portion S and the core body 140, and a structure for additionally dissipating heat, as shown in fig. 7 d.
In the present embodiment, the second face 145 of the core 140 is provided on substantially the same plane as the rear face of the main body 110a, and the first face 143 is disposed between the front and rear faces of the main body 110a, in direct contact with the terminal insulating portion S. Thus, the core 140 and the terminal insulating portion S are joined in the left-right direction by the third surface 141 (i.e., the side surface) of the core 140, and are joined in the up-down direction by the first surface 143 of the core 140. At this time, in the present embodiment, the second fastening hole Cb is provided to penetrate the core 140 and the terminal insulating portion S, and a screw is formed in the terminal insulating portion S in a region where the core 140 is not provided.
In the present embodiment, by arranging the second face 145 of the core 140 on the same plane as the back face of the main body 110a, the second face 145 of the core 140 can be exposed to the outside direction together with the back face of the main body 110 a. In this manner, in the case where a part of the core 140 is exposed to the outside, when the heat sink is disposed on the back surface side of the substrate, that is, outside the second surface 145 of the core 140, the core 140 can be in direct contact with the heat sink. The heat sink may be made of a material that can discharge heat well, that is, a material having excellent thermal conductivity. The material having excellent thermal conductivity is not particularly limited, and may contain a metal. As a result, heat can be discharged very easily through the core 140 and the heat sink, and defects in the elements in the light emitting diode package due to heat generation can be prevented.
Next, referring to fig. 7e, the light emitting diode package of the present embodiment may change the position of the core body 140 in order to prevent the separation between the core body 140 and the terminal insulating part S as shown in fig. 7d, so as to maximize the adhesive force. According to the present embodiment, the first surface 143, the second surface 145, and the third surface 141 of the core 140 may all be in contact with the terminal insulating portion S. That is, the core 140 is completely covered with the terminal insulating portion S except for the inner circumferential surface in the second fastening hole Cb. At this time, in the present embodiment, the second fastening hole Cb is provided to penetrate the core body 140 and the terminal insulating portion S where a screw is formed in a region where the core body 140 is not arranged.
In this case, even when pressure is applied in various directions such as the up-down direction, the left-right direction, and the oblique direction when the second fastening member is fastened to the second fastening hole Cb of the core body 140, the pressure can be effectively dispersed, and thus the separation of the core body 140 and the terminal insulating part S is effectively prevented.
Next, referring to fig. 7f, the terminal insulating part S may seal one side of the through-hole 150. As shown in the drawing, the terminal insulating part S may have a structure in which the back side of the through hole 150 is closed. With this structure, the terminal insulating portion S supports the core 140 more stably than in the case where the second fastening member is fastened through the through-hole 150 of the substrate, thereby preventing separation of the core 140 and the terminal insulating portion S.
Modes for carrying out the invention
According to an embodiment of the present invention, the light emitting diode package may be manufactured in various types within a range conforming to the above concept. For example, as shown in fig. 1, a substantially square shape having a vertical/horizontal ratio of approximately 1:1 may be provided, or a shape different from this, for example, a rectangular shape having a vertical/horizontal ratio of 1:1 or more may be provided.
Fig. 8 illustrates a light emitting diode package according to an embodiment of the present invention, which illustrates an embodiment having a rectangular overall shape. In the present embodiment, in order to avoid redundancy, description will be mainly made on points different from the above-described embodiment, and parts not described follow the above-described embodiment.
Referring to fig. 8, the light emitting diode package according to the embodiment of the present invention includes a substrate 110, a light emitting diode chip 120, a reflector 130, and a lens 160. Here, unlike the light emitting diode package shown in fig. 1, the substrate 110 has a rectangular shape, and the reflector 130 is provided on a partial region of the substrate 110 so as to cover the partial region of the substrate 110 in accordance with the shape of the substrate 110. The light emitting diode package may further include a supplemental element. Here, the terminal to which the element is connected may be formed in a part different from the above-described embodiment. For example, in the embodiment shown in fig. 1, the terminals connected to the element are two (T1, T2; refer to fig. 1), and one (TM) is shown in the present embodiment. In addition, in an embodiment of the present invention, the substrate 110 may provide wires, pads, terminals, and the like for connecting the one or more light emitting diode chips 120 and/or the first and second elements with an external power source, external wires, and the like, and the wires, pads, and terminals may change positions corresponding to the rectangular shape.
However, in the present embodiment, the structure between the light emitting diode chip and the first and second pads 111a and 111b, or the connection structure with the external wiring in the first and second terminals 113a and 113b does not depart from the above-described embodiment.
As shown in fig. 1 and 8, the light emitting diode packages may be arranged in various forms selected according to the area or size of the region where the light emitting diode packages are required to be packaged, because the light emitting diode packages have different vertical/horizontal ratios. In addition, when connecting to an external wiring, various forms can be selected and arranged depending on which direction and at which intervals the wiring is drawn.
Fig. 9a and 9b are plan views showing light emitting diode packages arranged in different vertical and horizontal ratios. In fig. 9a and 9b, for convenience of explanation, six light emitting diode packages are arranged in 2 × 3 rows and columns.
Similar to the light emitting diode package shown in fig. 1, a square-shaped light emitting diode package 100 having substantially the same lateral length L1 and vertical length L2 is arranged in fig. 9a, and a rectangular-shaped light emitting diode package 100' having a lateral length L1 longer than a vertical length L2 is arranged in fig. 9 b.
Regarding the pitch between the light emitting diode chips that emit light between the light emitting diode packages, the pitch is relatively wide in the case of fig. 9a and relatively narrow in the case of fig. 9b when viewed in the lateral direction. In contrast, the pitch between the light emitting diode chips that emit light between the light emitting diode packages is relatively narrow in the case of fig. 9a and relatively wide in the case of fig. 9b when viewed in the vertical direction. In addition, the pitch between the external wirings led out from between the light emitting diode packages may be different depending on the positions of the first terminals and the second terminals, and is relatively wide in the case of fig. 9a and relatively narrow in the case of fig. 9 b.
Thus, the light emitting diode package of the present invention can be provided in various aspect ratios, and the light emitting diode packages can be arranged in various ways according to the application program of the light emitting element. Thereby, the degree of freedom in arrangement of the light emitting diode packages is increased. The light emitting diode package according to the present invention has a quadrangular shape, but is not limited thereto, and may be modified into various shapes such as a triangular shape or an original shape as needed.
As described above, according to an embodiment of the present invention, there is provided a light emitting diode package having high light emitting efficiency while preventing defects in connection and disconnection with an external terminal, which can be applied according to various shapes and areas.
While the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art and those having ordinary knowledge in the art that various modifications and variations can be made to the present invention without departing from the spirit and scope of the present invention as set forth in the following claims.
Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, and should be determined by the claims.

Claims (10)

1. A light emitting diode package, comprising:
a substrate including a main body having a front surface and a rear surface, and having a through hole penetrating the front surface and the rear surface;
a first terminal and a second terminal provided on the substrate, the first terminal being electrically connected to the first fastening member, the second terminal being electrically connected to the second fastening member;
a light emitting diode chip provided on the substrate and connected to the first terminal and the second terminal;
a core coupled to at least one of the first fastening member and the second fastening member and provided in the through hole; and
a terminal insulating portion provided in the through hole and covering an inner circumferential surface of the through hole to separate the substrate from the core,
the through hole has an inclined surface inclined with respect to the front surface.
2. The light emitting diode package of claim 1,
the inclined surface is provided at least one of between the inner peripheral surface constituting the through hole and the front surface and between the inner peripheral surface constituting the through hole and the rear surface.
3. The light emitting diode package of claim 2,
the magnitude of the terminal insulating part increases as going from the portion provided with the inclined surface toward the front direction.
4. The light emitting diode package of claim 2,
the magnitude of the terminal insulating part decreases as going from the portion provided with the inclined surface toward the front direction.
5. The light emitting diode package of claim 2,
the terminal insulating portion increases in width from the portion provided with the inclined surface toward the back surface direction.
6. The light emitting diode package of claim 2,
the width of the terminal insulating portion decreases from the portion provided with the inclined surface toward the back surface direction.
7. The light emitting diode package of claim 1,
the inner peripheral surface constituting the through-hole has a groove.
8. The light emitting diode package of claim 1,
the inclined surface is provided in plurality.
9. The light emitting diode package of claim 8,
at least a part of the inner peripheral surface and the inclined surface constituting the through hole have different roughness from each other.
10. The light emitting diode package of claim 1,
the inclined surfaces have different shapes from each other.
CN202010022604.1A 2017-09-19 2018-09-17 Light emitting diode package Active CN111192953B (en)

Priority Applications (1)

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CN202010022604.1A CN111192953B (en) 2017-09-19 2018-09-17 Light emitting diode package

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002054110A (en) * 2000-08-10 2002-02-20 Daito Kinzoku Kk Metal fitting for external facing plate
KR101255671B1 (en) * 2012-03-08 2013-04-17 장일호 Led package module and manufacturing method thereof
KR20170030057A (en) * 2015-09-08 2017-03-16 서울바이오시스 주식회사 Light emitting diode package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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KR101210477B1 (en) * 2010-04-02 2012-12-10 주식회사 아이에스티 Light emitting diode package and method of manufacturing the same
KR20110126456A (en) * 2010-05-17 2011-11-23 삼성엘이디 주식회사 Light-emitting diode module
KR20130127838A (en) * 2012-05-15 2013-11-25 삼성전자주식회사 Light emitting device package
KR20150077208A (en) * 2013-12-27 2015-07-07 서울바이오시스 주식회사 Semiconductor device package, light diode package and optical module including the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002054110A (en) * 2000-08-10 2002-02-20 Daito Kinzoku Kk Metal fitting for external facing plate
KR101255671B1 (en) * 2012-03-08 2013-04-17 장일호 Led package module and manufacturing method thereof
KR20170030057A (en) * 2015-09-08 2017-03-16 서울바이오시스 주식회사 Light emitting diode package

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