CN111192841A - Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method - Google Patents

Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method Download PDF

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Publication number
CN111192841A
CN111192841A CN202010071709.6A CN202010071709A CN111192841A CN 111192841 A CN111192841 A CN 111192841A CN 202010071709 A CN202010071709 A CN 202010071709A CN 111192841 A CN111192841 A CN 111192841A
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light source
surface light
substrate
curved surface
adhesive tape
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CN202010071709.6A
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Chinese (zh)
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舒鑫
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Yuyuanyang Ningbo Technology Co Ltd
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Yuyuanyang Ningbo Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an intelligent rotary type curved surface light source robot complete machine assembly line and a light source manufacturing method, wherein the intelligent rotary type curved surface light source robot complete machine assembly line comprises a transmission belt, wherein a plurality of groups of curved surface light source production robots are respectively arranged on two sides of the transmission belt; the material output port of each curved surface light source production robot faces the conveying belt; the curved surface light source is manufactured, the production efficiency of the curved surface light source is improved, mass production can be realized, and the product yield and the product consistency are also greatly improved.

Description

Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method
Technical Field
The invention relates to an intelligent rotary type curved surface light source robot complete machine assembly line and a light source manufacturing method.
Background
The chinese patent application No. 201811522973.6 discloses a curved surface light source and a method for manufacturing the same, which solves the problem that the curved surface light source has poor light emitting continuity and needs a light outlet cover to atomize the light source. At present, equipment special for producing the product is not provided, the existing equipment can be only utilized for split production, the efficiency is low, and the product yield is low.
Disclosure of Invention
The invention aims to overcome the defects and provide an intelligent rotary type curved surface light source robot whole machine production line.
In order to achieve the purpose, the invention adopts the following specific scheme:
an intelligent rotary type whole machine assembly line of a curved-surface light source robot comprises a rotary material moving mechanism, an annular top plate arranged above the rotary material moving mechanism, and a material moving mechanical arm, a bonding pad placing mechanism, a solder paste dispensing mechanism, a wafer placing mechanism, a reflow soldering mechanism, an adhesive tape dispensing mechanism, an adhesive tape drying mechanism and a bending female die mechanism which are arranged on the bottom surface of the top plate and sequentially arranged along the circumferential direction of the top plate;
the rotary material moving mechanism is provided with a substrate carrier and is used for driving the substrate carrier to do circular motion, the substrate carrier comprises a bending male die and a male die driving cylinder, and the bending male die is connected with the output end of the male die driving cylinder.
The material moving mechanical arm comprises a first linear displacement motor, a first lifting support, a first electromagnetic push rod, a first lifting plate, a piezoelectric micro-moving plate and an electrostatic adsorption plate, wherein the first linear displacement motor is arranged on the top plate, the first lifting support is connected with the output end of the first linear displacement motor, the first electromagnetic push rod is fixed on the first lifting support, the first lifting plate is connected with the push rod of the first electromagnetic push rod, the piezoelectric micro-moving plate is arranged on the bottom surface of the first lifting plate, and the electrostatic adsorption plate is arranged on the bottom surface of the piezoelectric micro-moving plate.
Wherein, the pad placing mechanism and the wafer placing mechanism respectively comprise a second linear displacement motor, a second lifting bracket, a second electromagnetic push rod, a second lifting plate, a material distributing base body, a material distributing roller and a material distributing driving motor, the second linear displacement motor is arranged on the top plate, the second lifting bracket is fixed at the output end of the second linear displacement motor, the second electromagnetic push rod is fixed on the second lifting bracket, the second lifting plate is connected with the push rod of the second electromagnetic push rod, the material distributing base body is fixed at the bottom surface of the second lifting plate, feeding rail fixing grooves are arranged at intervals at the top end of the material distributing base body, material storage grooves are arranged corresponding to each feeding rail fixing groove, a discharge hole is arranged at the bottom end of the material distributing base body, the material distributing roller is rotatably arranged in the material distributing base body, the circumferential surface of the material distributing roller is an electrostatic roller surface, and a layer of positioning isolation layer is coated on the, the periphery of the positioning isolation layer of the pad placing mechanism is provided with pad material containing wells corresponding to the quantity and the position intervals according to the feeding intervals of the pads, the periphery of the positioning isolation layer of the wafer placing mechanism is provided with wafer material containing wells corresponding to the quantity and the position intervals according to the feeding intervals of the wafers, the pad material containing wells and the wafer material containing wells penetrate through the positioning isolation layer, and the distributing driving motor is arranged at one end of the distributing base body and the output end of the distributing driving motor is connected with one end of the distributing rolling shaft.
The solder paste dispensing mechanism and the adhesive tape dispensing mechanism respectively comprise a third linear displacement motor, a third lifting support, a third electromagnetic push rod and a third lifting plate, the third linear displacement motor is arranged on the top plate, the third lifting support is fixed at the output end of the third linear displacement motor, the third electromagnetic push rod is fixed on the third lifting support, the third lifting plate is connected with the push rod of the third electromagnetic push rod, the bottom surface of the third lifting plate of the solder paste dispensing mechanism is provided with a solder paste dispensing head, and the bottom surface of the third lifting plate of the adhesive tape dispensing mechanism is provided with an adhesive tape dispensing head.
Wherein, reflow soldering mechanism, adhesive tape stoving mechanism all include the case lid body that is the circular arc shape and generate heat the board, the top of case lid body is fixed on the roof, the bottom of case lid body is the opening form and the butt moves the material mechanism in the gyration, the interior top surface of case lid body is located to the board that generates heat, adhesive tape stoving mechanism's case lid body, the length that generates heat the board are greater than reflow soldering mechanism's case lid body, the length that generates heat the board.
The bending die mechanism comprises a die driving cylinder and a bending die, the die driving cylinder is fixed on the top, and the bending die is connected with the output end of the die driving cylinder.
The material moving mechanism is arranged on one side, close to the material moving mechanical arm, of the top plate, and the conveying mechanism is used for conveying the substrate and transferring the finished curved-surface light source out of the working area.
The invention has the beneficial effects that: compared with the prior art, the invention utilizes the rotary type of the substrate carrier to sequentially pass through the pad placing mechanism, the solder paste dispensing mechanism, the wafer placing mechanism, the reflow soldering mechanism, the adhesive tape dispensing mechanism, the adhesive tape drying mechanism and the bending female die mechanism, thereby manufacturing the curved surface light source, improving the production efficiency of the curved surface light source, realizing mass production and greatly improving the product yield and the product consistency.
In addition, a bending male die and a bending female die mechanism are arranged on the substrate carrier and matched with each other to form integral pressing type bending, so that a curved surface light source with higher curved surface precision can be obtained.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic view of the present invention with the top plate hidden;
FIG. 4 is an exploded view of the substrate carrier of the present invention;
FIG. 5 is a schematic structural view of the material moving mechanical arm of the invention;
FIG. 6 is a schematic diagram of the structure of the pad placement mechanism of the present invention;
FIG. 7 is a schematic structural view of a wafer placement mechanism of the present invention;
FIG. 8 is a schematic structural view of a solder paste dispensing mechanism of the present invention;
FIG. 9 is a schematic structural view of a glue dispensing mechanism of the present invention;
FIG. 10 is a schematic structural view of a press bending die mechanism of the present invention;
FIG. 11 is a schematic structural view of a reflow soldering mechanism or a glue strip drying mechanism of the present invention;
description of reference numerals: 1-rotating a material moving mechanism; 11-a substrate carrier; 111-bending male die; 112-male die driving cylinder; 113-a fixed seat; 2-a material moving mechanical arm; 21-a first linear displacement motor; 22-a first lifting bracket; 23-a first electromagnetic pusher; 24-a first lifter plate; 25-a piezoelectric microplate; 26-an electrostatic adsorption plate; 3-a pad placement mechanism; 31-pad material holding well; 4-a solder paste dispensing mechanism; 41-solder paste dispensing head; 5-a wafer placement mechanism; 51-wafer holding well; 6-a reflow soldering mechanism; 7-adhesive tape dispensing mechanism; 71-adhesive tape dispensing head; 8-adhesive tape drying mechanism; 9-bending the female die mechanism; 91-driving a cylinder by a female die; 92-bending the female die; 101-a second linear displacement motor; 102-a second lifting bracket; 103-a second electromagnetic push rod; 104-a second lifter plate; 105-a material-distributing base; 1051-a feed rail fixation groove; 1052-a storage tank; 106-a material separating roller; 107-a material-separating driving motor; 108-positioning the isolation layer; 201-a third linear displacement motor; 202-a third lifting support; 203-a third electromagnetic pusher; 204-a third lifter plate; 301-a lid of the tank; 302-a heat generating plate; 100-a top plate; 200-a transport mechanism; a conveying belt-a.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 11, the whole intelligent rotary type curved surface light source robot assembly line according to the embodiment includes a conveyor belt a, and a plurality of groups of curved surface light source production robots are respectively disposed on two sides of the conveyor belt; the material output port of each curved surface light source production robot faces the conveying belt; the transmission band is used for collecting the finished product of curved surface light source production robot production.
Each curved surface light source production robot comprises a rotary material moving mechanism 1, an annular top plate 100 arranged above the rotary material moving mechanism 1, and a material moving mechanical arm 2, a bonding pad placing mechanism 3, a solder paste dispensing mechanism 4, a wafer placing mechanism 5, a reflow soldering mechanism 6, an adhesive tape dispensing mechanism 7, an adhesive tape drying mechanism 8 and a bending female die mechanism 9 which are arranged on the bottom surface of the top plate 100 and are sequentially arranged along the circumferential direction of the top plate 100;
the rotary material moving mechanism 1 is provided with a substrate carrier 11, the rotary material moving mechanism 1 is used for driving the substrate carrier 11 to do circular motion, the substrate carrier 11 comprises a bending male die 111 and a male die driving cylinder 112, and the bending male die 111 is connected with the output end of the male die driving cylinder 112.
Specifically, the substrate carrier 11 further comprises a fixing seat 113, the fixing seat 113 is detachably connected to a transfer plate, a strip-shaped hole is formed in each gap of the bent fixing seat 113 corresponding to the substrate, the bending male die 111 is embedded in the fixing seat 113 and connected with the output end of the male die driving cylinder 112, the rotary material transferring mechanism 1 comprises a cam divider and a transfer plate, the outer diameter of the transfer plate is larger than the inner diameter of the top plate 100 and smaller than the outer diameter of the top plate 100, the middle part of the transfer plate is connected to the output end of the cam divider, the substrate carrier 11 is arranged on the transfer plate, the male die driving cylinder 112 is fixed on the bottom surface of the transfer plate, the cam divider is used for driving the substrate carrier 11 to sequentially pass through the material transferring mechanical arm 2, the pad placing mechanism 3, the solder paste dispensing mechanism 4, the wafer placing mechanism 5, the reflow soldering mechanism 6, the adhesive tape dispensing mechanism 7, the adhesive tape drying mechanism 8 and, therefore, a curved surface light source is manufactured, the rotating position of the substrate carrier 11 is easily controlled by adopting a cam divider, and the substrate carrier 11 is ensured to be accurately matched with the material moving mechanical arm 2, the bonding pad placing mechanism 3, the solder paste dispensing mechanism 4, the wafer placing mechanism 5, the reflow soldering mechanism 6, the adhesive tape dispensing mechanism 7, the adhesive tape drying mechanism 8 and the bending female die mechanism 9; in this embodiment, the top plate 100 is attached to a base plate by a plurality of support posts, and the cam divider is fixed to the middle of the base plate.
The working mode of the embodiment is as follows: before the work begins, a circuit is designed on a substrate and a gap is formed according to the circuit, during the work, a first material moving mechanical arm 2 grabs the punched substrate and places the substrate on a substrate carrier 11, then a rotary material moving mechanism 1 drives the substrate carrier 11 to rotate to the position below a bonding pad placing mechanism 3, the bonding pad placing mechanism 3 correspondingly places bonding pads on positive and negative bonding pad positions of the substrate according to the circuit on the substrate, after the bonding pads are placed, the substrate carrier 11 rotates to the position below a tin paste dispensing mechanism 4, the tin paste dispensing mechanism 4 coats tin paste on the bonding pads, then the substrate carrier 11 rotates to a wafer placing mechanism 5, the wafer placing mechanism 5 correspondingly places flip luminous wafers on the bonding pads coated with the tin paste, after the flip luminous wafers are placed, the substrate carrier 11 enters a reflow soldering mechanism 6, the reflow soldering mechanism 6 heats the tin paste on the bonding pads, melting solder paste, welding the flip-chip luminous chip with a bonding pad and the bonding pad with a circuit of a substrate together, binding the flip-chip luminous chip and the substrate into a whole, then enabling a substrate carrier 11 to enter the lower part of an adhesive tape dispensing mechanism 7, enabling the adhesive tape dispensing mechanism 7 to apply an adhesive layer on the welded flip-chip luminous chip to seal and form an adhesive tape, enabling the substrate carrier 11 to enter an adhesive tape drying mechanism 8 after the completion, drying the adhesive tape by the adhesive tape drying mechanism 8, enabling the substrate carrier 11 to rotate to the lower part of a bending female die mechanism 9 after the completion, enabling a male die driving cylinder 112 to drive a bending male die 111 to lift up at the moment, enabling the bending male die 111 to be matched with the bending female die mechanism 9, bending the welded substrate in a planar state to form a curved light source, enabling the substrate carrier 11 to return to a station of a material moving mechanical arm 2 again after the bending is completed, enabling the material moving mechanical arm 2 to take out the finished, and then the substrate is transferred out, and another new substrate is picked and put on the substrate carrier 11 to manufacture the curved surface light source.
Certainly, a plurality of substrate carriers 11 can be placed on the transfer plate at intervals, so that a plurality of curved surface light sources can be manufactured at the same time, and the production efficiency is improved.
In the embodiment, the substrate carrier 11 is rotated to sequentially pass through the pad placing mechanism 3, the solder paste dispensing mechanism 4, the wafer placing mechanism 5, the reflow soldering mechanism 6, the adhesive tape dispensing mechanism 7, the adhesive tape drying mechanism 8 and the bending female die mechanism 9, so that a curved surface light source is manufactured, the production efficiency of the curved surface light source is improved, mass production can be realized, and the product yield and the product consistency are also greatly improved.
In addition, the bending male die 111 is arranged on the substrate carrier 11 to be matched with the bending female die mechanism 9, so that integral press-fit bending is formed, and a curved surface light source with higher curved surface precision can be obtained.
The whole intelligent rotary type curved surface light source robot assembly line comprises a material moving mechanical arm 2, wherein the material moving mechanical arm comprises a first linear displacement motor 21, a first lifting support 22, a first electromagnetic push rod 23, a first lifting plate 24, a piezoelectric micro-moving plate 25 and an electrostatic adsorption plate 26, the first linear displacement motor 21 is arranged on a top plate 100, the first lifting support 22 is connected with the output end of the first linear displacement motor 21, the first electromagnetic push rod 23 is fixed on the first lifting support 22, the first lifting plate 24 is connected with the push rod of the first electromagnetic push rod 23, the piezoelectric micro-moving plate 25 is arranged on the bottom surface of the first lifting plate 24, and the electrostatic adsorption plate 26 is arranged on the bottom surface of the piezoelectric micro-moving plate 25.
When the substrate or the finished curved light source is grabbed, the first linear displacement motor 21 drives the substrate or the finished curved light source adsorbed on the electrostatic adsorption plate 26 to move through the first lifting support 22, so that the substrate or the finished curved light source is transferred onto the substrate carrier 11, or the finished curved light source is taken out from the substrate carrier 11 and transferred out of the working area, the transfer of the substrate and the finished product curved surface light source is realized mechanically, the improvement of automation is facilitated, the production efficiency is high, and the labor cost is saved.
In the present embodiment of the complete machine assembly line of the intelligent rotary type curved surface light source robot, each of the pad placing mechanism 3 and the wafer placing mechanism 5 includes a second linear displacement motor 101, a second lifting bracket 102, a second electromagnetic push rod 103, a second lifting plate 104, a material distributing base 105, a material distributing roller 106, and a material distributing driving motor 107, the second linear displacement motor 101 is disposed on the top plate 100, the second lifting bracket 102 is fixed at an output end of the second linear displacement motor 101, the second electromagnetic push rod 103 is fixed on the second lifting bracket 102, the second lifting plate 104 is connected to a push rod of the second electromagnetic push rod 103, the material distributing base 105 is fixed on a bottom surface of the second lifting plate 104, material feeding rail fixing slots 1051 are disposed at intervals at a top end of the material distributing base 105, material storage slots 1052 are disposed corresponding to each material feeding rail fixing slot 1051, and a material discharge port is disposed at a bottom end of the material distributing base 105, the distribution roller 106 is rotatably arranged in the distribution base 105, the circumferential surface of the distribution roller 106 is an electrostatic roller surface, the circumferential surface of the distribution roller 106 is coated with a layer of positioning isolation layer 108, the circumferential surface of the positioning isolation layer 108 of the pad placement mechanism 3 is provided with pad material containing wells 31 with corresponding quantity and position intervals according to the feeding intervals of the pads, the circumferential surface of the positioning isolation layer 108 of the wafer placement mechanism 5 is provided with wafer material containing wells 51 with corresponding quantity and position intervals according to the feeding intervals of the wafers, the pad material containing wells 31 and the wafer material containing wells 51 penetrate through the positioning isolation layer 108, and the distribution driving motor 107 is arranged at one end of the distribution base 105, and the output end of the distribution driving motor is connected with one end of the distribution roller 106.
In practical use, when the substrate carrier 11 is driven by the index plate to rotate to the position below the pad placing mechanism 3, the second linear displacement motor 101 of the pad placing mechanism 3 drives the material separating base 105 and the material separating roller 106 of the pad placing mechanism 3 to move to the position above the substrate carrier 11 through the second lifting bracket 102 of the pad placing mechanism 3, then the second electromagnetic push rod 103 of the pad placing mechanism 3 drives the material separating base 105 and the material separating roller 106 of the pad placing mechanism 3 to downwards extend to contact with the substrate through the second lifting plate 104 of the pad placing mechanism 3, then the pad is conveyed to the material feeding rail fixing groove 1051 of the material separating base 105 through an external material feeding rail (which can adopt a vacuum feeding or vibration feeding mode), and slides into the material storage tank 1052 along the material feeding rail fixing groove 1051, then the material separating driving motor 107 of the pad placing mechanism 3 drives the material separating roller 106 to rotate, when the pad containing well 31 on the positioning isolation layer 108 rotates through the storage tank 1052, the bonding pads in the material storage tank 1052 fall into the bonding pad material accommodating well 31 and are adsorbed by the electrostatic roller surface of the distributing roller 106, and the distributing roller 106 rotates to the discharge port of the distributing base 105 along with the rotation of the distributing roller 106, at the moment, the distributing roller 106 is powered off, so that the bonding pads fall onto the designated positions of the substrate, and the placement of the bonding pads is completed; similarly, when the index plate drives the substrate carrier 11 to rotate to the position below the wafer placing mechanism 5, the wafer placing mechanism 5 places the flip-chip light-emitting wafer at the position corresponding to the substrate; and a roller type material discharging is adopted, so that the placing speed is high and the precision is high.
In the present embodiment, the solder paste dispensing mechanism 4 and the adhesive tape dispensing mechanism 7 each include a third linear displacement motor 201, a third lifting bracket 202, a third electromagnetic push rod 203 and a third lifting plate 204, the third linear displacement motor 201 is disposed on the top plate 100, the third lifting bracket 202 is fixed to an output end of the third linear displacement motor 201, the third electromagnetic push rod 203 is fixed to the third lifting bracket 202, the third lifting plate 204 is connected to a push rod of the third electromagnetic push rod 203, a solder paste dispensing head 41 is disposed on a bottom surface of the third lifting plate 204 of the solder paste dispensing mechanism 4, and an adhesive tape dispensing head 71 is disposed on a bottom surface of the third lifting plate 204 of the adhesive tape dispensing mechanism 7.
In practical use, the third linear displacement motor 201 drives the solder paste dispensing head 41 or the adhesive tape dispensing head 71 to realize displacement in the horizontal direction, the third electromagnetic push rod 203 drives the solder paste dispensing head 41 or the adhesive tape dispensing head 71 to realize displacement in the vertical direction, when the substrate carrier 11 rotates to the position below the solder paste dispensing mechanism 4, the solder paste dispensing head 41 coats solder paste on a bonding pad, and the solder paste is coated on each bonding pad on the substrate under the driving of the third linear displacement motor 201 of the solder paste dispensing mechanism 4, and when the substrate carrier 11 rotates to the position below the adhesive tape dispensing mechanism 7, the adhesive tape dispensing head 71 coats an adhesive layer on the flip-chip light-emitting wafer, and the adhesive layer is pulled into an adhesive tape along the arrangement direction of the flip-chip light-emitting wafer under the driving of the third linear displacement motor 201 of the adhesive tape dispensing mechanism 7.
In the present embodiment, the reflow soldering mechanism 6 and the adhesive tape drying mechanism 8 each include a case cover 301 in an arc shape and a heating plate 302, the top end of the case cover 301 is fixed on the top plate 100, the bottom end of the case cover 301 is in an open shape and abuts against the rotary material moving mechanism 1, the heating plate 302 is disposed on the inner top surface of the case cover 301, and the lengths of the case cover 301 and the heating plate 302 of the adhesive tape drying mechanism 8 are greater than the lengths of the case cover 301 and the heating plate 302 of the reflow soldering mechanism 6.
In practical use, after the flip-chip light-emitting chip is placed on the bonding pad by the chip placement mechanism 5, the substrate carrier 11 rotates along with the rotation of the rotating plate and enters the box cover 301 of the reflow soldering mechanism 6, and meanwhile, the heating plate 302 of the reflow soldering mechanism 6 generates heat to heat the solder paste on the bonding pad, so that the solder paste is melted, and the flip-chip light-emitting chip and the bonding pad are connected together and the bonding pad and the substrate are connected into a whole, so that the positioning and firmness of the flip-chip light-emitting chip are realized; and after adhesive tape dispensing mechanism 7 formed the adhesive tape, base plate carrier 11 got into in the case lid body 301 of adhesive tape dispensing mechanism 7, and the board 302 that generates heat of adhesive tape dispensing mechanism 7 generates heat simultaneously, dries the adhesive tape on the base plate, makes the adhesive tape solidification, adopts the stoving mode, makes the adhesive tape solidification fast.
According to the whole intelligent rotary type curved surface light source robot assembly line, the bending female die mechanism 9 comprises a female die driving cylinder 91 and a bending female die 92, the female die driving cylinder 91 is fixed on the top, and the bending female die 92 is connected with the output end of the female die driving cylinder 91. During the in-service use, die drive cylinder 91 drives crooked die 92 downward probe, and crooked die 92 cooperates with crooked terrace die 111, bends the base plate and forms curved surface light source, and whole bending type is crooked, does benefit to the luminous wafer of protection flip-chip, improves the product yield.
Further, the bending male die 111 includes a male die base plate, a plurality of male die press-bending portions provided corresponding to the gap of the base plate, the heights of the plurality of male die press-bending portions gradually increase from both ends to the middle, the free end surfaces of the male die press-bending portions support the inclined surface for press-bending and are convexly provided with a positioning portion matched with the gap of the base plate, the bending female die 92 includes a female die base plate, a plurality of female die press-bending portions provided corresponding to the gap of the base plate, the heights of the plurality of female die press-bending portions gradually decrease from both ends to the middle, and the free end surfaces of the female die press-bending portions are press-bending.
The complete machine assembly line of the intelligent rotary type curved surface light source robot in the embodiment further comprises a conveying mechanism 200, wherein the conveying mechanism 200 is arranged on one side, close to the material moving mechanical arm 2, of the top plate 100, and the conveying mechanism 200 is used for conveying a substrate and transferring a finished curved surface light source out of a working area. Specifically, the conveying mechanism 200 is arranged on the bottom plate, during actual use, blanking-completed substrates are placed on the conveying mechanism 200 at equal intervals in a single-chip mode through an external manipulator, the substrates are driven by the conveying mechanism 200 to move to the position below the material moving mechanical arm 2, then the material moving mechanical arm 2 grabs the substrates on the conveying mechanism 200 and transfers the substrates to the substrate carrier 11, and after the substrates form a curved-surface light source, the curved-surface light source on the substrate carrier 11 is taken out and transferred to the conveying mechanism 200 by the material moving mechanical arm 2, and then the substrates are transferred out of a working area through the conveying mechanism 200. In this embodiment, the conveying mechanism 200 is an existing conveying belt structure, which is not described herein again.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.

Claims (10)

1. An intelligent rotary type curved surface light source robot complete machine production line is characterized in that,
the device comprises a conveying belt (a), wherein a plurality of groups of curved surface light source production robots are respectively arranged on two sides of the conveying belt; the material output port of each curved surface light source production robot faces the conveying belt; the transmission band is used for collecting the finished product of curved surface light source production robot production.
2. The whole robot production line of the intelligent rotary type curved-surface light source according to claim 1,
each curved surface light source production robot comprises a rotary material moving mechanism (1), an annular top plate (100) arranged above the rotary material moving mechanism (1), and a material moving mechanical arm (2), a bonding pad placing mechanism (3), a solder paste dispensing mechanism (4), a wafer placing mechanism (5), a reflow soldering mechanism (6), an adhesive tape dispensing mechanism (7), an adhesive tape drying mechanism (8) and a bending female die mechanism (9) which are arranged on the bottom surface of the top plate (100) and are sequentially arranged along the circumferential direction of the top plate (100); it is characterized in that the preparation method is characterized in that,
the rotary material moving mechanism (1) is provided with a substrate carrier (11), the rotary material moving mechanism (1) is used for driving the substrate carrier (11) to do circular motion, the substrate carrier (11) comprises a bending male die (111) and a male die driving cylinder (112), and the bending male die (111) is connected with the output end of the male die driving cylinder (112).
3. The whole robot production line of the intelligent rotary type curved-surface light source according to claim 1, it is characterized in that the material moving mechanical arm (2) comprises a first linear displacement motor (21), a first lifting bracket (22), a first electromagnetic push rod (23), a first lifting plate (24), a piezoelectric micromotion plate (25) and an electrostatic adsorption plate (26), the first linear displacement motor (21) is arranged on the top plate (100), the first lifting bracket (22) is connected with the output end of the first linear displacement motor (21), the first electromagnetic push rod (23) is fixed on the first lifting bracket (22), the first lifting plate (24) is connected with a push rod of a first electromagnetic push rod (23), the piezoelectric micromotion plate (25) is arranged on the bottom surface of the first lifting plate (24), and the electrostatic adsorption plate (26) is arranged on the bottom surface of the piezoelectric micromotion plate (25).
4. The intelligent rotary type whole robot assembly line for the curved light source according to claim 1, wherein the pad placing mechanism (3) and the wafer placing mechanism (5) each comprise a second linear displacement motor (101), a second lifting bracket (102), a second electromagnetic push rod (103), a second lifting plate (104), a distribution base (105), a distribution roller (106) and a distribution driving motor (107), the second linear displacement motor (101) is disposed on the top plate (100), the second lifting bracket (102) is fixed at the output end of the second linear displacement motor (101), the second electromagnetic push rod (103) is fixed on the second lifting bracket (102), the second lifting plate (104) is connected with the push rod of the second electromagnetic push rod (103), the distribution base (105) is fixed at the bottom surface of the second lifting plate (104), and feeding rails (1051) and corresponding feeding rail fixing grooves are formed at intervals at the top end of the distribution base (105) Decide groove (1051) and be equipped with storage silo (1052), the bottom of dividing material pedestal (105) is equipped with the drain hole, divide material roller bearing (106) to rotate to locate in dividing material pedestal (105), the periphery of dividing material roller bearing (106) is the static roll surface, the periphery cladding of dividing material roller bearing (106) has one deck location isolation layer (108), the pad that corresponds quantity and position interval is offered according to the blowing interval of pad to the periphery of the location isolation layer (108) of pad placement mechanism (3) holds material well (31), the wafer that the wafer held material well (51) of corresponding quantity and position interval were offered according to the blowing interval of wafer to the periphery of the location isolation layer (108) of wafer placement mechanism (5), pad holds material well (31), wafer and holds material well (51) and all runs through location isolation layer (108), divide material driving motor (107) to locate the one end of dividing material (105), the wafer, And the output end of the feed roller is connected with one end of the feed roller (106).
5. The whole robot production line of the intelligent rotary type curved-surface light source according to claim 1, it is characterized in that the solder paste dispensing mechanism (4) and the adhesive tape dispensing mechanism (7) both comprise a third linear displacement motor (201), a third lifting bracket (202), a third electromagnetic push rod (203) and a third lifting plate (204), the third linear displacement motor (201) is arranged on the top plate (100), the third lifting bracket (202) is fixed at the output end of the third linear displacement motor (201), the third electromagnetic push rod (203) is fixed on a third lifting bracket (202), the third lifting plate (204) is connected with the push rod of the third electromagnetic push rod (203), a solder paste dispensing head (41) is arranged on the bottom surface of a third lifting plate (204) of the solder paste dispensing mechanism (4), and a rubber strip dispensing head (71) is arranged on the bottom surface of a third lifting plate (204) of the rubber strip dispensing mechanism (7).
6. The whole intelligent rotary type curved-surface light source robot assembly line of claim 1, wherein the reflow soldering mechanism (6) and the adhesive tape drying mechanism (8) comprise arc-shaped case cover bodies (301) and heating plates (302), the top ends of the case cover bodies (301) are fixed on the top plate (100), the bottom ends of the case cover bodies (301) are open and abut against the rotary material moving mechanism (1), the heating plates (302) are arranged on the inner top surface of the case cover bodies (301), and the lengths of the case cover bodies (301) and the heating plates (302) of the adhesive tape drying mechanism (8) are greater than the lengths of the case cover bodies (301) and the heating plates (302) of the reflow soldering mechanism (6).
7. The whole intelligent rotary type curved-surface light source robot assembly line of claim 1, wherein the bending die mechanism (9) comprises a die driving cylinder (91) and a bending die (92), the die driving cylinder (91) is fixed on the top, and the bending die (92) is connected with the output end of the die driving cylinder (91).
8. The whole intelligent rotary curved surface light source robot assembly line of claim 1, further comprising a conveying mechanism (200), wherein the conveying mechanism (200) is disposed on a side of the top plate (100) close to the material-moving mechanical arm (2), and the conveying mechanism (200) is used for conveying the substrate and transferring the finished curved surface light source out of the working area.
9. The whole intelligent rotary curved surface light source robot assembly line of claim 6, further comprising a conveying mechanism (200), wherein the conveying mechanism (200) is disposed on a side of the top plate (100) close to the material-moving mechanical arm (2), and the conveying mechanism (200) is used for conveying the substrate and transferring the finished curved surface light source out of the working area.
10. A manufacturing method comprises the following steps: before the work begins, a circuit is designed on a substrate and a gap is formed according to the circuit, during the work, a first material moving mechanical arm 2 grabs the punched substrate and places the substrate on a substrate carrier 11, then a rotary material moving mechanism 1 drives the substrate carrier 11 to rotate to the position below a bonding pad placing mechanism 3, the bonding pad placing mechanism 3 correspondingly places bonding pads on positive and negative bonding pad positions of the substrate according to the circuit on the substrate, after the bonding pads are placed, the substrate carrier 11 rotates to the position below a tin paste dispensing mechanism 4, the tin paste dispensing mechanism 4 coats tin paste on the bonding pads, then the substrate carrier 11 rotates to a wafer placing mechanism 5, the wafer placing mechanism 5 correspondingly places flip luminous wafers on the bonding pads coated with the tin paste, after the flip luminous wafers are placed, the substrate carrier 11 enters a reflow soldering mechanism 6, the reflow soldering mechanism 6 heats the tin paste on the bonding pads, melting solder paste, welding the flip-chip luminous chip with a bonding pad and the bonding pad with a circuit of a substrate together, binding the flip-chip luminous chip and the substrate into a whole, then enabling a substrate carrier 11 to enter the lower part of an adhesive tape dispensing mechanism 7, enabling the adhesive tape dispensing mechanism 7 to apply an adhesive layer on the welded flip-chip luminous chip to seal and form an adhesive tape, enabling the substrate carrier 11 to enter an adhesive tape drying mechanism 8 after the completion, drying the adhesive tape by the adhesive tape drying mechanism 8, enabling the substrate carrier 11 to rotate to the lower part of a bending female die mechanism 9 after the completion, enabling a male die driving cylinder 112 to drive a bending male die 111 to lift up at the moment, enabling the bending male die 111 to be matched with the bending female die mechanism 9, bending the welded substrate in a planar state to form a curved light source, enabling the substrate carrier 11 to return to a station of a material moving mechanical arm 2 again after the bending is completed, enabling the material moving mechanical arm 2 to take out the finished, and then the substrate is transferred out, and another new substrate is picked and put on the substrate carrier 11 to manufacture the curved surface light source.
CN202010071709.6A 2020-01-21 2020-01-21 Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method Withdrawn CN111192841A (en)

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CN202010071709.6A CN111192841A (en) 2020-01-21 2020-01-21 Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method

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Application Number Priority Date Filing Date Title
CN202010071709.6A CN111192841A (en) 2020-01-21 2020-01-21 Intelligent rotary type curved surface light source robot complete machine assembly line and light source manufacturing method

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CN111192841A true CN111192841A (en) 2020-05-22

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Application publication date: 20200522