CN111185680A - Silicon wafer cutting process and cutting device thereof - Google Patents
Silicon wafer cutting process and cutting device thereof Download PDFInfo
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- CN111185680A CN111185680A CN202010111926.3A CN202010111926A CN111185680A CN 111185680 A CN111185680 A CN 111185680A CN 202010111926 A CN202010111926 A CN 202010111926A CN 111185680 A CN111185680 A CN 111185680A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Dicing (AREA)
Abstract
The technical scheme of the invention is realized as follows: a silicon wafer cutting process comprises the following steps: presetting the cutting shape and size through a control center, and correcting a cutting head of a laser cutting machine; clamping a silicon wafer on an optical experiment platform through a clamping mechanism; the clamped semiconductor silicon chip is positioned by adopting a high-definition CCD camera and a camera lens; after the positioning is finished, carrying out laser cutting processing through a laser cutting mechanism; and after the cutting is finished, the scraps remained on the silicon wafer are cleaned by the cleaning mechanism after the cutting is finished. By adopting the cutting process, the cut silicon wafer is high in cutting precision, clean and convenient to take and place.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a silicon wafer cutting process and a silicon wafer cutting device.
Background
With the development of science and technology, the electronic industry has been rapidly advanced, the requirements of various integrated and control circuits have been rapidly increased, the demand of semiconductor chips has been increased day by day, and semiconductor silicon chips are commonly used chips in the integrated and control circuits; therefore, the processing technology of semiconductor silicon wafers by many enterprises is more and more delicate;
at the present stage, many enterprises have adopted a laser cutting mode to perform molding processing on a semiconductor silicon wafer, and the enterprises also adopt laser cutting to perform cutting processing on the silicon wafer for a long time, and after long-time use and research, the laser cutting process and device at the present stage have several problems:
firstly, a silicon wafer is clamped on an optical experiment platform through a clamping mechanism at the present stage, the clamping mechanism needs to clamp the silicon wafer in multiple directions in the clamping process, and the clamping efficiency is low; in the process of pressing the silicon wafer tightly, the silicon wafer can be damaged by pressing;
secondly, after the laser cutting device in the current stage finishes cutting, a lot of juice can be remained on the silicon wafer, and the silicon wafer can be very hot, so that the cleaning and the material taking are inconvenient;
there is a need for a laser cutting process for silicon wafers to solve the above-mentioned technical problems.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a silicon wafer cutting process and a silicon wafer cutting device.
The technical scheme of the invention is realized as follows: a silicon wafer cutting process comprises the following steps:
s1: presetting the cutting shape and size through a control center, and correcting a cutting head of a laser cutting machine;
s2: clamping a silicon wafer on an optical experiment platform through a clamping mechanism;
s3: the clamped semiconductor silicon chip is positioned by adopting a high-definition CCD camera and a camera lens;
s4: after the positioning is finished, carrying out laser cutting processing through a laser cutting mechanism;
s5: after the cutting is finished, the scraps remained on the silicon wafer after the cutting is finished are cleaned by the cleaning mechanism
By adopting the cutting process, the cut silicon wafer is high in cutting precision, clean and convenient to take and place.
In addition, the invention also discloses a silicon wafer cutting device, which comprises a workbench, a rack arranged on the workbench, a CNC control panel arranged on the rack and a laser cutting device, and is characterized in that: the clamping device comprises a positioning device and a clamping part which is arranged on the workbench through a feeding mechanism with x-axis and y-axis moving functions; the positioning device and the laser cutting device are both arranged on the frame through a conveying connecting piece, and are arranged in parallel, and the output directions of the positioning device and the laser cutting device face the clamping part; the clamping part comprises a supporting platform, a telescopic cylinder, an adsorption mechanism, a horizontal detection mechanism for detecting the levelness of the supporting platform and an adjusting device for adjusting the levelness of the supporting platform; a longitudinal through hole is formed in the middle of the supporting platform; one end of each telescopic cylinder is fixedly connected with the edge of the longitudinal through hole, and the other end of each telescopic cylinder is installed on the feeding mechanism and moves on the x axis and the y axis along with the feeding mechanism; the adsorption mechanism comprises a vacuum pump and a sucker; the vacuum pump is arranged on the workbench and is connected with the sucker through an air pipe; the sucker is arranged in the longitudinal through hole.
Preferably: the horizontal detection mechanism comprises a box body and a pressure sensor which are arranged at the bottom of the supporting platform; the rolling way is arranged in the box body in the horizontal direction, balls are arranged in the rolling way, and two ends of the rolling way are in contact with the pressure sensor.
Preferably: the adjusting device is arranged on the feeding mechanism through a mounting seat and comprises a plurality of adjusting cylinders which are arranged in the axial direction of the longitudinal through hole; the output end of each adjusting cylinder vertically faces the supporting platform; and the output end of each adjusting cylinder is provided with a supporting block.
Preferably: the conveying connecting piece comprises a conveying frame, a sliding rail and two sliding blocks arranged on the sliding rail in a sliding mode, and one end of the conveying frame is fixedly arranged at the top of the frame; the bottom surface of the transportation frame is provided with the sliding rail; limiting blocks are arranged at two ends of the sliding rail; and each limiting block is provided with a driving cylinder which respectively drives the two sliding blocks to slide in the sliding rail.
Preferably: the positioning device comprises a CCD camera, a camera lens, an illuminating lamp and a mounting rack; the camera lens and the CCD camera are fixedly arranged on the mounting frame; the CDD camera is fixedly installed at the top of the camera lens, and the illuminating lamp is fixedly arranged on the periphery of the camera lens in an annular mode; the mounting rack is fixedly mounted on a sliding block through a connecting column.
Preferably: the mounting rack comprises baffles arranged at two sides of the CCD camera and a cover plate for mounting the tops of the two baffles; the cover plate is fixedly arranged on the conveying connecting piece; the cover plate is arranged at one end of the connecting column far away from the sliding block, and the bottom of the cover plate is provided with an elastic extrusion piece for preventing the camera from shaking during working; the elastic extrusion piece comprises an extrusion plate and a spring; the extrusion plate is arranged on the bottom surface of the cover plate through the spring; the lower ends of the baffles at the two sides of the CCD camera are respectively provided with a supporting piece for supporting the CCD camera; the supporting piece comprises a screw rod, a screw head and a supporting plate; the screw rod penetrates through the baffle and is in threaded connection with the baffle; the two ends of the screw rod are respectively provided with the screw head and the supporting plate.
Preferably: the cleaning device also comprises a cleaning mechanism; the cleaning mechanism comprises a cleaning recovery cylinder with a water outlet on the side wall, a full-coverage spray header and a spray upright post; the cleaning and recycling cylinder is arranged on the outer wall of the bottom of the telescopic cylinder and is connected with the outer wall of the bottom of the telescopic cylinder through a sealing element; the spraying upright post is fixedly arranged on the bottom surface of the cleaning and recycling cylinder, and a water diversion pipe is arranged on the spraying upright post; one end of the water conduit passes through the cleaning and recovering cylinder and is communicated with an external water source; the other end is communicated with the full-coverage spray header through a water suction pump; the full-coverage spray header faces the supporting platform.
Preferably: the sealing element comprises a sealing ring and a gland, and the sealing ring is sleeved at the joint of the bottom plate of the cleaning and recovering cylinder and the telescopic cylinder; the gland compresses the sealing ring and the lower end surface is glued with the bottom surface of the cleaning and recycling cylinder.
Preferably: still including the guard ring that is used for protecting laser cutting device, the guard ring cover is established outside laser head of laser cutting device, and on the bottom plate of connecting rod installation wash bowl.
The invention has the beneficial effects that:
(1) the traditional manual clamping mode through a clamp is improved into a mode of utilizing a vacuum pump to be matched with a sucker for adsorption, so that the efficiency of clamping can be simply and effectively improved, in addition, when the sucker is vacuumized, the silicon wafer is compressed by external atmospheric pressure, the stability of clamping the silicon wafer is improved, a compressing piece is not required for compressing, the blank can be reduced, and the waste is reduced;
(2) the levelness of the supporting platform can be completely ensured by arranging the level detection device and the adjusting device, so that the cutting precision is effectively improved;
(3) by arranging the positioning device, the position of the silicon wafer can be better detected by matching the CCD camera and the camera lens in the positioning device, and the cutting precision is further improved;
(4) the CCD camera and the camera lens are detachably mounted on the mounting frame, so that the CCD camera and the camera lens are convenient to detach, maintain, repair and maintain.
(5) Through being provided with wiper mechanism, wiper mechanism can cool off and abluent processing with the work piece that just the cutting was accomplished, and the staff of being convenient for gets the silicon chip that processing was accomplished, and reduces abluent step once more, improves machining efficiency, and the staff of being convenient for accomodates.
(6) Through being provided with the sealing member, can effectually prevent to wash the phenomenon that the junction of retrieving section of thick bamboo bottom plate and telescopic cylinder appears leaking.
(7) Through being provided with the guard ring, can prevent to bump the damage with cutting head and positioner among the laser cutting device among the production and processing process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of an adjusting device;
FIG. 3 is a schematic structural view of a horizontal detecting mechanism;
FIG. 4 is a schematic structural diagram of the positioning device;
FIG. 5 is a schematic structural view of the mounting bracket;
FIG. 6 is a schematic structural diagram of another embodiment of the present invention;
fig. 7 is a schematic view showing a detailed structure of the cleaning mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The technical scheme of the invention is realized as follows: a silicon wafer cutting process comprises the following steps:
s1: presetting the cutting shape and size through a control center, and correcting a cutting head of a laser cutting machine;
s2: clamping a silicon wafer on an optical experiment platform through a clamping mechanism;
s3: the clamped semiconductor silicon chip is positioned by adopting a high-definition CCD camera and a camera lens;
s4: after the positioning is finished, carrying out laser cutting processing through a laser cutting mechanism;
s5: after the cutting is finished, the scraps remained on the silicon wafer after the cutting is finished are cleaned by the cleaning mechanism
By adopting the cutting process, the cut silicon wafer is high in cutting precision, clean and convenient to take and place.
Example 2
In addition, as shown in fig. 1-3, the invention also discloses a silicon wafer cutting device, which comprises a workbench 1, a frame 11 mounted on the workbench 1, a CNC control panel 12 mounted on the frame 11, and a laser cutting device 13, and in the embodiment of the invention, the silicon wafer cutting device further comprises a positioning device 2 and a clamping part 3 mounted on the workbench 1 through a feeding mechanism 14 with x-axis and y-axis moving functions; the positioning device 2 and the laser cutting device 13 are both arranged on the frame 11 through the conveying connecting piece 4, the positioning device 2 and the laser cutting device 13 are arranged in parallel, and the output directions of the positioning device and the laser cutting device are both towards the clamping part 3; the clamping component 3 comprises a supporting platform 31, a telescopic cylinder 32, an adsorption mechanism 33, a horizontal detection mechanism 34 for detecting the levelness of the supporting platform 31 and an adjusting device 35 for adjusting the levelness of the supporting platform 31; a longitudinal through hole 36 in the middle of the supporting platform 31; one end of each telescopic cylinder 32 is fixedly connected with the edge of the longitudinal through hole 36, and the other end of each telescopic cylinder 32 is installed on the feeding mechanism 14 and moves on the x axis and the y axis along with the feeding mechanism 14; the adsorption mechanism 33 includes a vacuum pump 331 and a suction cup 332; the vacuum pump 331 is installed on the workbench 1 and is connected with the suction cup 332 through an air pipe 333; the suction cup 332 is mounted in the longitudinal through hole 36.
In the embodiment of the present invention, the level detection mechanism 34 includes a box 341 and a pressure sensor 342 mounted at the bottom of the support platform; a roller path 343 is formed in the horizontal direction inside the box 341, a ball 344 is arranged inside the roller path 343, and both ends of the roller path 343 are in contact with the pressure sensor 342.
In the embodiment of the present invention, the adjusting device 35 is mounted on the feeding mechanism 14 through a mounting seat 351, and the adjusting device 35 includes a plurality of adjusting cylinders 352 arranged along the axial direction of the longitudinal through hole; the output end of each adjustment cylinder 352 is vertically oriented towards the support platform 31; and the output end of each adjusting cylinder 352 is provided with a supporting block 353.
By adopting the technical scheme, the traditional manual clamping mode through a clamp is improved into a mode of utilizing a vacuum pump to be matched with a sucker for adsorption, so that the efficiency of clamping can be simply and effectively improved, in addition, when the inside of the sucker is vacuumized, the silicon wafer is compressed by the atmospheric pressure equivalent to the outside, the stability of clamping the silicon wafer is improved, and a compressing piece is not required to compress, so that the blank can be reduced, and the waste is reduced;
secondly, the levelness of the supporting platform can be completely ensured by arranging the level detection device and the adjusting device, so that the cutting precision is effectively improved;
example 3 differs from example 2 in that
As shown in fig. 1, 4 and 5, in the embodiment of the present invention, the conveying connecting member 4 includes a conveying frame 41, a sliding rail 42 and two sliding blocks 43 slidably disposed on the sliding rail 42, and one end of the conveying frame 40 is fixedly mounted on the top of the rack 2; the sliding rail 42 is arranged and installed on the bottom surface of the transportation frame 41; limiting blocks 44 are arranged at two ends of the sliding rail 42; each limiting block 44 is provided with a driving cylinder 45, and the driving cylinders 45 respectively drive the two sliding blocks 43 to slide in the sliding rails 42.
In the embodiment of the present invention, the positioning device 2 includes a CCD camera 21, a camera lens 22, an illuminating lamp 23, and a mounting frame 24; the pick-up lens 22 and the CCD camera 21 are fixedly arranged on the mounting frame 24; the CDD camera is fixedly arranged at the top of the camera lens, and the illuminating lamp 23 is fixedly arranged on the periphery of the camera lens 22 in an annular mode; the mounting frame 24 is fixedly mounted on a slider 43 by means of a connecting column 25.
In the embodiment of the present invention, the mounting frame 24 includes baffles 241 disposed at both sides of the CCD camera 21 and a cover plate 242 for mounting the tops of the two baffles 241; the cover plate 242 is fixedly arranged on the conveying connecting piece 4; the cover plate 242 is installed at one end of the connecting pole 25 far away from the slide block 43, and the bottom of the cover plate 242 is provided with a flexible extrusion 26 for preventing the camera from shaking during operation; the elastic pressing member 26 includes a pressing plate 261 and a spring 262; the pressing plate 262 is mounted on the bottom surface of the cover plate 242 through the spring 261; the lower ends of the baffles 241 at the two sides of the CCD camera 21 are respectively provided with a supporting piece 27 for supporting the CCD camera 21; the supporting member 27 includes a screw 271, a screw head 272, and a supporting plate 273; the screw 271 penetrates through the baffle 241 and is in threaded connection with the baffle 241; the screw head 272 and the support plate 273 are respectively disposed at both ends of the screw 271.
By adopting the technical scheme, the positioning device is arranged, and the CCD camera and the camera lens in the positioning device are matched for use, so that the position of the silicon wafer can be better detected, and the cutting precision is further improved;
secondly, with CCD camera and camera lens demountable installation on the mounting bracket, convenient to detach, maintenance and maintenance.
It should be noted that the support plate is extended and retracted by the screw rod, so as to support the CCD camera and detach the CCD camera.
Example 4 differs from example 3 in that
As shown in fig. 6-7, in the present embodiment, a cleaning mechanism 5 is further included; the cleaning mechanism 5 comprises a cleaning recovery cylinder 51 with a water outlet on the side wall, a full-coverage spray header 52 and a spray upright column 53; the cleaning and recycling cylinder 51 is arranged on the outer wall of the bottom of the telescopic cylinder 32 and is connected with the outer wall through a sealing element 54; the spraying upright column 53 is fixedly arranged on the bottom surface of the cleaning and recycling cylinder 51, and a water conduit 55 is arranged on the spraying upright column 53; one end of the water conduit 55 passes through the cleaning and recovering cylinder 51 and is communicated with an external water source; the other end is communicated with the full-coverage spray header 52 through a water suction pump 56; the full coverage showerhead 52 faces the support platform 31.
In the embodiment of the present invention, the sealing element 54 includes a sealing ring 541 and a pressing cover 542, the sealing ring 541 is sleeved at the connection between the bottom plate of the cleaning and recycling cylinder 51 and the telescopic cylinder 32; the gland 542 compresses the sealing ring 541 and the lower end surface is glued to the bottom surface of the cleaning and recovering cylinder 51.
In the specific embodiment of the invention, the cleaning device further comprises a protective ring 6 for protecting the laser cutting device 13, wherein the protective ring 6 is sleeved outside the laser head of the laser cutting device 13 and is arranged on the bottom plate of the cleaning barrel 51 through a connecting rod 61.
The invention has the beneficial effects that: through being provided with wiper mechanism, wiper mechanism can cool off and abluent processing with the work piece that just the cutting was accomplished, and the staff of being convenient for gets the silicon chip that processing was accomplished, and reduces abluent step once more, improves machining efficiency, and the staff of being convenient for accomodates.
Secondly, through being provided with the sealing member, can effectually prevent to wash the phenomenon that the junction of recovery section of thick bamboo bottom plate and telescopic cylinder appears leaking.
In addition, the protective ring is arranged, so that the cutting head and the positioning device in the laser cutting device can be prevented from being damaged in the production and processing process.
When the cleaning device is additionally arranged, an output shaft of an adjusting cylinder of the adjusting device penetrates through a bottom plate of the cleaning device to be fixedly connected with the supporting platform; a waterproof sleeve for preventing water leakage is arranged at the joint of the output shaft of the adjusting cylinder book and the bottom plate of the cleaning and recovering cylinder, and the height of the waterproof sleeve is higher than that of the cleaning and recovering cylinder, so that water leakage is avoided; in addition, the full-coverage spray head is longitudinally and slidably arranged on the upright post, and the spray height can be adjusted according to the size of the silicon wafer, so that the cleaning work is realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A silicon wafer cutting process comprises the following steps:
s1: presetting the cutting shape and size through a control center, and correcting a cutting head of a laser cutting machine;
s2: clamping a silicon wafer on an optical experiment platform through a clamping mechanism;
s3: the clamped semiconductor silicon chip is positioned by adopting a high-definition CCD camera and a camera lens;
s4: after the positioning is finished, carrying out laser cutting processing through a laser cutting mechanism;
s5: and after the cutting is finished, the scraps remained on the silicon wafer are cleaned by the cleaning mechanism after the cutting is finished.
2. The utility model provides a cutting device of silicon chip, includes the workstation, installs frame on the workstation, installs CNC control panel and laser cutting device in the frame, its characterized in that: the clamping device comprises a positioning device and a clamping part which is arranged on the workbench through a feeding mechanism with x-axis and y-axis moving functions; the positioning device and the laser cutting device are both arranged on the frame through a conveying connecting piece, and are arranged in parallel, and the output directions of the positioning device and the laser cutting device face the clamping part; the clamping part comprises a supporting platform, a telescopic cylinder, an adsorption mechanism, a horizontal detection mechanism for detecting the levelness of the supporting platform and an adjusting device for adjusting the levelness of the supporting platform; a longitudinal through hole is formed in the middle of the supporting platform; one end of each telescopic cylinder is fixedly connected with the edge of the longitudinal through hole, and the other end of each telescopic cylinder is installed on the feeding mechanism and moves on the x axis and the y axis along with the feeding mechanism; the adsorption mechanism comprises a vacuum pump and a sucker; the vacuum pump is arranged on the workbench and is connected with the sucker through an air pipe; the sucker is arranged in the longitudinal through hole.
3. The silicon wafer cutting device according to claim 2, wherein: the horizontal detection mechanism comprises a box body and a pressure sensor which are arranged at the bottom of the supporting platform; the rolling way is arranged in the box body in the horizontal direction, balls are arranged in the rolling way, and two ends of the rolling way are in contact with the pressure sensor.
4. The silicon wafer cutting device according to claim 3, wherein: the adjusting device is arranged on the feeding mechanism through a mounting seat and comprises a plurality of adjusting cylinders which are arranged in the axial direction of the longitudinal through hole; the output end of each adjusting cylinder vertically faces the supporting platform; and the output end of each adjusting cylinder is provided with a supporting block.
5. The silicon wafer cutting device according to claim 2, wherein: the conveying connecting piece comprises a conveying frame, a sliding rail and two sliding blocks arranged on the sliding rail in a sliding mode, and one end of the conveying frame is fixedly arranged at the top of the frame; the bottom surface of the transportation frame is provided with the sliding rail; limiting blocks are arranged at two ends of the sliding rail; and each limiting block is provided with a driving cylinder which respectively drives the two sliding blocks to slide in the sliding rail.
6. The silicon wafer cutting device according to claim 2, wherein: the positioning device comprises a CCD camera, a camera lens, an illuminating lamp and a mounting rack; the camera lens and the CCD camera are fixedly arranged on the mounting frame; the CDD camera is fixedly installed at the top of the camera lens, and the illuminating lamp is fixedly arranged on the periphery of the camera lens in an annular mode; the mounting rack is fixedly mounted on a sliding block through a connecting column.
7. The silicon wafer cutting device according to claim 5, wherein: the mounting rack comprises baffles arranged at two sides of the CCD camera and a cover plate for mounting the tops of the two baffles; the cover plate is fixedly arranged on the conveying connecting piece; the cover plate is arranged at one end of the connecting column far away from the sliding block, and the bottom of the cover plate is provided with an elastic extrusion piece for preventing the camera from shaking during working; the elastic extrusion piece comprises an extrusion plate and a spring; the extrusion plate is arranged on the bottom surface of the cover plate through the spring; the lower ends of the baffles at the two sides of the CCD camera are respectively provided with a supporting piece for supporting the CCD camera; the supporting piece comprises a screw rod, a screw head and a supporting plate; the screw rod penetrates through the baffle and is in threaded connection with the baffle; the two ends of the screw rod are respectively provided with the screw head and the supporting plate.
8. The silicon wafer cutting device according to claim 2, wherein: the cleaning device also comprises a cleaning mechanism; the cleaning mechanism comprises a cleaning recovery cylinder with a water outlet on the side wall, a full-coverage spray header and a spray upright post; the cleaning and recycling cylinder is arranged on the outer wall of the bottom of the telescopic cylinder and is connected with the outer wall of the bottom of the telescopic cylinder through a sealing element; the spraying upright post is fixedly arranged on the bottom surface of the cleaning and recycling cylinder, and a water diversion pipe is arranged on the spraying upright post; one end of the water conduit passes through the cleaning and recovering cylinder and is communicated with an external water source; the other end is communicated with the full-coverage spray header through a water suction pump; the full-coverage spray header faces the supporting platform.
9. The silicon wafer cutting device according to claim 8, wherein: the sealing element comprises a sealing ring and a gland, and the sealing ring is sleeved at the joint of the bottom plate of the cleaning and recovering cylinder and the telescopic cylinder; the gland compresses the sealing ring and the lower end surface is glued with the bottom surface of the cleaning and recycling cylinder.
10. The silicon wafer cutting device according to claim 8, wherein: still including the guard ring that is used for protecting laser cutting device, the guard ring cover is established outside laser head of laser cutting device, and on the bottom plate of connecting rod installation wash bowl.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010111926.3A CN111185680A (en) | 2020-02-24 | 2020-02-24 | Silicon wafer cutting process and cutting device thereof |
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| CN202010111926.3A CN111185680A (en) | 2020-02-24 | 2020-02-24 | Silicon wafer cutting process and cutting device thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112091442A (en) * | 2020-05-23 | 2020-12-18 | 深圳市腾鑫精密电子芯材科技有限公司 | Semiconductor chip processing is with cutting equipment |
| CN113996947A (en) * | 2021-11-18 | 2022-02-01 | 苏州久泰精密技术股份有限公司 | Novel adhesive product cutting device with flexible laser |
| CN114603265A (en) * | 2022-05-10 | 2022-06-10 | 常州市金锤隆锻造有限公司 | Silicon wafer cutting equipment and method for accurately cutting wafer |
-
2020
- 2020-02-24 CN CN202010111926.3A patent/CN111185680A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112091442A (en) * | 2020-05-23 | 2020-12-18 | 深圳市腾鑫精密电子芯材科技有限公司 | Semiconductor chip processing is with cutting equipment |
| CN113996947A (en) * | 2021-11-18 | 2022-02-01 | 苏州久泰精密技术股份有限公司 | Novel adhesive product cutting device with flexible laser |
| CN113996947B (en) * | 2021-11-18 | 2024-03-22 | 苏州久泰精密技术股份有限公司 | Novel cutting device for driving flexible laser adhesive product |
| CN114603265A (en) * | 2022-05-10 | 2022-06-10 | 常州市金锤隆锻造有限公司 | Silicon wafer cutting equipment and method for accurately cutting wafer |
| CN114603265B (en) * | 2022-05-10 | 2022-07-26 | 常州市金锤隆锻造有限公司 | Silicon wafer cutting equipment and method for accurately cutting wafer |
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