CN216174771U - Silicon wafer degumming device for semiconductor material processing - Google Patents
Silicon wafer degumming device for semiconductor material processing Download PDFInfo
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- CN216174771U CN216174771U CN202122177308.1U CN202122177308U CN216174771U CN 216174771 U CN216174771 U CN 216174771U CN 202122177308 U CN202122177308 U CN 202122177308U CN 216174771 U CN216174771 U CN 216174771U
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- degumming
- silicon wafer
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- cleaning pool
- drying box
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Abstract
The utility model discloses a silicon wafer degumming device for semiconductor material processing, which comprises a degumming mechanism, a clamp mechanism and a workbench, wherein the degumming mechanism and the clamp mechanism are arranged on the workbench; the degumming mechanism comprises a screw rod, a processing support, a degumming cleaning pool, a filter screen, a drain pipe, a control switch, a fine cleaning pool, a drying box upper cover, a drying box and a drying box door, the working table is provided with the processing support, the inner side of the processing support is provided with the screw rod, the lower part of the screw rod is provided with the degumming cleaning pool, the inner side of the degumming cleaning pool is provided with the filter screen, the rear part of the degumming cleaning pool is provided with the drain pipe, and one side of the drain pipe is provided with the fine cleaning pool. Has the advantages that: the silicon wafer is conveyed into the two cleaning tanks through the clamp mechanism, residues on the surface of the silicon wafer can be efficiently cleaned, and the drying chamber is arranged, so that manual operation is reduced.
Description
Technical Field
The utility model relates to the field of semiconductor processing, in particular to a silicon wafer degumming device for semiconductor material processing.
Background
The cleanliness of silicon chip surface directly influences the in service behavior of equipment, after the silicon chip passes through wire-electrode cutting processing, can remain impurity on the surface, need through coming unstuck to wash and meticulous washing, the silicon chip comes unstuck and washs the impurity on silicon chip surface through specific liquid, for example spray the washing, ultrasonic cleaning etc., traditional mode of coming unstuck is that the hand comes unstuck, wash back and forth through artifical use squirt to silicon chip surface, reach the purpose of use, the inefficiency, it is unclean to wash, there is not the whole process of coming unstuck of standard control and the cost of coping saw is expensive, bring certain influence to people and environment in the course of working.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon wafer degumming device for semiconductor material processing, which can effectively solve the problems of the existing device in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the silicon wafer degumming device for semiconductor material processing comprises a degumming mechanism, a clamp mechanism and a workbench, wherein the degumming mechanism and the clamp mechanism are arranged on the workbench;
the degumming mechanism comprises a screw rod, a processing support, a degumming cleaning pool, a filter screen, a drain pipe, a control switch, a fine cleaning pool, a drying box upper cover, a drying box and a drying box door, the processing support is arranged on the workbench, the screw rod is arranged on the inner side of the processing support, the degumming cleaning pool is arranged below the screw rod, the filter screen is arranged on the inner side of the degumming cleaning pool, the drain pipe is arranged behind the degumming cleaning pool, the fine cleaning pool is arranged on one side of the drain pipe, the control switch is arranged in front of the fine cleaning pool, the drying box is arranged on one side of the fine cleaning pool, the drying box upper cover is arranged above the drying box, and the drying box door is arranged behind the drying box;
the utility model discloses a silicon wafer clamping device, including anchor clamps mechanism, lead screw, removal guide block, anchor clamps supporting beam, pivot, first motor, second motor, cylinder, telescopic link, silicon wafer clamp, the outside of lead screw is provided with remove the guide block, the one side of removing the guide block is provided with the second motor, the place ahead of removing the guide block is provided with anchor clamps supporting beam, the place ahead of anchor clamps supporting beam is provided with the pivot, the place ahead of pivot is provided with first motor, the below of first motor is provided with the cylinder, the below of cylinder is provided with the telescopic link, the below of telescopic link is provided with the silicon wafer clamp.
Preferably, the degumming mechanism comprises a hydraulic cylinder, a push rod and a metal plate, the hydraulic cylinder is arranged on the workbench, the push rod is arranged at the rear of the hydraulic cylinder, and the metal plate is arranged at the rear of the push rod.
Preferably, the degumming mechanism comprises a cleaning liquid pipe nozzle, a cleaning liquid pipe handle and a cleaning liquid tank, the cleaning liquid tank is arranged on the workbench, the cleaning liquid pipe is arranged above the cleaning liquid tank, the cleaning liquid pipe is arranged in front of the cleaning liquid pipe, and the cleaning liquid pipe nozzle is arranged below the cleaning liquid pipe.
Preferably, the workbench is fixed with the machining support through a bolt, the machining support is connected with the lead screw through a bearing, the machining support is connected with the second motor through a bolt, the lead screw is connected with the movable guide block through a thread, and the movable guide block is connected with the clamp supporting beam through welding.
Preferably, the fixture supporting beam is connected with the rotating shaft in an interference fit mode, the rotating shaft is connected with the first motor through a coupler, the first motor is fixed with the cylinder through a bolt, the cylinder is connected with the telescopic rod in a sliding mode, and the telescopic rod is connected with the silicon wafer clamp in a welding mode.
Preferably, the workbench is connected with the degumming cleaning tank in a welding mode, the degumming cleaning tank is connected with the filter screen through a bolt, and the degumming cleaning tank is connected with the drain pipe in a welding mode.
Preferably, the workstation with control switch passes through bolted connection, the workstation with meticulous washing pond passes through welded connection, the workstation with stoving case passes through welded connection, the stoving case with stoving case upper cover passes through the bolt fastening, the stoving case with stoving case door passes through the pulley connection.
Preferably, the workbench and the hydraulic cylinder are fixed through bolts, the hydraulic cylinder is connected with the push rod through a plunger, and the push rod is connected with the metal plate through welding.
Preferably, the workstation with the cleaning solution case passes through bolted connection, the cleaning solution case with cleaning solution pipe passes through welded connection, cleaning solution pipe with cleaning solution pipe handle passes through welded connection, cleaning solution pipe with cleaning solution pipe shower nozzle passes through welded connection.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the degumming cleaning pool and the fine cleaning pool are arranged, so that the film can be sufficiently cleaned, the cleanliness of the surface of the film is improved, the drying box is arranged, the cleaning and drying integration is realized, the manual operation is reduced, and the processing efficiency is improved.
2. The clamping mechanism is arranged, so that the clamping operation is simpler, and the use is more convenient.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is an isometric view of a silicon wafer debonding apparatus for semiconductor material processing according to the present invention;
FIG. 2 is a top view of an embodiment 1 of the apparatus for debonding a silicon wafer from a semiconductor material according to the present invention;
FIG. 3 is a right side view of an embodiment 1 of the silicon wafer degumming apparatus for semiconductor material processing according to the present invention;
fig. 4 is an isometric view of example 2 of the silicon wafer debonding apparatus of the present invention for semiconductor material processing.
Reference numbers in the figures:
1. a degumming mechanism; 2. a clamp mechanism; 3. a work table; 4. a lead screw; 5. processing a bracket; 6. moving the guide block; 7. a clamp support beam; 8. a rotating shaft; 9. a first motor; 10. a second motor; 11. a degumming cleaning tank; 12. a filter screen; 13. a control switch; 14. a fine cleaning tank; 15. a drain pipe; 16. a cylinder; 17. a telescopic rod; 18. an upper cover of the drying box; 19. a drying box; 20. a drying chamber door; 21. a silicon wafer clamp; 101. a hydraulic cylinder; 102. a push rod; 103. a metal plate; 110. a cleaning fluid pipe spray head; 111. cleaning a liquid pipe; 112. a cleaning fluid pipe handle; 113. and a cleaning liquid tank.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1:
as shown in fig. 1, 2 and 3, the utility model provides a technical scheme of a silicon wafer degumming device for semiconductor material processing, which comprises a degumming mechanism 1, a clamp mechanism 2 and a workbench 3, wherein the degumming mechanism 1 and the clamp mechanism 2 are arranged on the workbench 3;
the degumming mechanism 1 comprises a screw rod 4, a processing bracket 5, a degumming cleaning pool 11, a filter screen 12, a drain pipe 15, a control switch 13, a fine cleaning pool 14, a drying box upper cover 18, a drying box 19 and a drying box chamber door 20, the processing bracket 5 is arranged on the workbench 3, the screw rod 4 is arranged on the inner side of the processing bracket 5, the degumming cleaning pool 11 is arranged below the screw rod 4, the degumming cleaning pool 11 can carry out rough processing on impurities on the surface of a film, the filter screen 12 is arranged on the inner side of the degumming cleaning pool 11, the filter screen 12 filters the impurities in the cleaning liquid, the cleaning liquid can be reused, the drain pipe 15 is arranged behind the degumming cleaning pool 11, the fine cleaning pool 14 is arranged on one side of the drain pipe 15, the fine cleaning pool 14 carries out fine processing on the silicon wafer to reach the use standard, the control switch 13 is arranged in front of the fine cleaning pool 14, the drying box 19 is arranged on one side of the fine cleaning pool 14, the drying box 19 dries the silicon wafer to accelerate the processing efficiency, an upper drying box cover 18 is arranged above the drying box 19, and a drying box chamber door 20 is arranged behind the drying box 19;
the fixture mechanism 2 comprises a movable guide block 6, a fixture support beam 7, a rotating shaft 8, a first motor 9, a second motor 10, a cylinder 16, an expansion link 17, a silicon wafer clamp 21, the outer side of a lead screw 4 is provided with the movable guide block 6, one side of the movable guide block 6 is provided with the second motor 10, the front of the movable guide block 6 is provided with the fixture support beam 7, the front of the fixture support beam 7 is provided with the rotating shaft 8, the front of the rotating shaft 8 is provided with the first motor 9, the lower side of the first motor 9 is provided with the cylinder 16, the lower side of the cylinder 16 is provided with the expansion link 17, the lower side of the expansion link 17 is provided with the silicon wafer clamp 21, the silicon wafer clamp 21 can be used for simultaneously placing a plurality of silicon wafers to improve the processing efficiency.
Preferably, the degumming mechanism 1 comprises a hydraulic cylinder 101, a push rod 102 and a metal plate 103, the hydraulic cylinder 101 is arranged on the worktable 3, the push rod 102 is arranged behind the hydraulic cylinder 101, and the metal plate 103 is arranged behind the push rod 102; the worktable 3 is fixed with the processing bracket 5 through bolts, the processing bracket 5 is connected with the lead screw 4 through a bearing, the processing bracket 5 is connected with the second motor 10 through bolts, the lead screw 4 is connected with the movable guide block 6 through threads, the movable guide block 6 is connected with the clamp supporting beam 7 through welding, the clamp supporting beam 7 is connected with the rotating shaft 8 through interference fit, the rotating shaft 8 is connected with the first motor 9 through a coupler, the first motor 9 is fixed with the cylinder 16 through bolts, the cylinder 16 is connected with the telescopic rod 17 in a sliding way, the telescopic rod 17 is connected with the silicon wafer clamp 21 through welding, the worktable 3 is connected with the degumming cleaning pool 11 through welding, the degumming cleaning pool 11 is connected with the filter screen 12 through bolts, the degumming cleaning pool 11 is connected with the drain pipe 15 through welding, the worktable 3 is connected with the control switch 13 through bolts, the worktable 3 is connected with the fine cleaning pool 14 through welding, the worktable 3 is connected with the drying box 19 through welding, drying box 19 passes through the bolt fastening with drying box upper cover 18, and drying box 19 passes through the pulley with drying box door 20 and is connected, and workstation 3 passes through the bolt fastening with pneumatic cylinder 101, and pneumatic cylinder 101 passes through the plunger with push rod 102 and is connected, and push rod 102 passes through welded connection with metal sheet 103.
Example 2:
the main difference between example 2 and example 1 is that, as shown in fig. 4: the degumming mechanism 1 comprises a cleaning liquid pipe spray head 110, a cleaning liquid pipe 111, a cleaning liquid pipe handle 112 and a cleaning liquid tank 113, the cleaning liquid tank 113 is arranged on the workbench 3, a cleaning liquid pipe 111 is arranged above the cleaning liquid tank 113, the cleaning liquid pipe handle 112 is arranged in front of the cleaning liquid pipe 111, the cleaning liquid pipe spray head 110 is arranged below the cleaning liquid pipe 111, the workbench 3 is connected with the cleaning liquid tank 113 through bolts, the cleaning liquid tank 113 is connected with the cleaning liquid pipe 111 through welding, the cleaning liquid pipe 111 is connected with the cleaning liquid pipe handle 112 through welding, and the cleaning liquid pipe 111 is connected with the cleaning liquid pipe spray head 110 through welding.
The working principle and the using process of the utility model are as follows:
an operator places a silicon wafer on a silicon wafer clamp 21, starts a second motor 10, a lead screw 4 drives a clamp mechanism 2 to move, starts a first motor 9, the silicon wafer clamp 21 swings back and forth, under the action of an air cylinder 16, an expansion link 17 drives the silicon wafer clamp 21 to move in the vertical direction, the silicon wafer clamp 21 is firstly immersed in a degumming cleaning pool 11, the silicon wafer clamp 21 swings back and forth due to the driving of the first motor 9, impurities on the silicon wafer can be roughly cleaned, after the cleaning is finished, a guide block 6 is moved to drive the clamp mechanism 2 to a fine cleaning pool 14, a control switch 13 is opened, a push rod 102 is driven by a hydraulic cylinder 101 to enable a metal plate 103 to reciprocate, liquid solution in the fine cleaning pool 14 can be driven to oscillate back and forth or the operator holds a cleaning liquid pipe handle 112, a cleaning liquid tank 113 extracts the cleaning liquid and sends the cleaning liquid to a cleaning liquid pipe nozzle 110, the silicon wafer is further cleaned to reach the use standard, and after the silicon wafer is cleaned, the movable guide block 6 drives the clamp mechanism 2 to enter the drying box 19 to dry the silicon wafer.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A silicon chip degumming device for semiconductor material processing, its characterized in that: the device comprises a degumming mechanism (1), a clamp mechanism (2) and a workbench (3), wherein the degumming mechanism (1) and the clamp mechanism (2) are arranged on the workbench (3);
the degumming mechanism (1) comprises a screw rod (4), a processing support (5), a degumming cleaning pool (11), a filter screen (12), a drain pipe (15), a control switch (13), a fine cleaning pool (14), a drying box upper cover (18), a drying box (19) and a drying box door (20), the processing support (5) is arranged on the workbench (3), the screw rod (4) is arranged on the inner side of the processing support (5), the degumming cleaning pool (11) is arranged below the screw rod (4), the filter screen (12) is arranged on the inner side of the degumming cleaning pool (11), the drain pipe (15) is arranged behind the degumming cleaning pool (11), the fine cleaning pool (14) is arranged on one side of the drain pipe (15), and the control switch (13) is arranged in front of the fine cleaning pool (14), the drying box (19) is arranged on one side of the fine cleaning pool (14), the drying box upper cover (18) is arranged above the drying box (19), and the drying box door (20) is arranged behind the drying box (19);
the clamp mechanism (2) comprises a movable guide block (6), a clamp supporting beam (7), a rotating shaft (8), a first motor (9), a second motor (10), a cylinder (16), an expansion rod (17) and a silicon wafer clamp (21), the outer side of the screw rod (4) is provided with the movable guide block (6), one side of the movable guide block (6) is provided with the second motor (10), the front of the movable guide block (6) is provided with the clamp supporting beam (7), the rotating shaft (8) is arranged in front of the clamp supporting beam (7), the first motor (9) is arranged in front of the rotating shaft (8), the silicon wafer clamp is characterized in that the air cylinder (16) is arranged below the first motor (9), the telescopic rod (17) is arranged below the air cylinder (16), and the silicon wafer clamp (21) is arranged below the telescopic rod (17).
2. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: the degumming mechanism (1) comprises a hydraulic cylinder (101), a push rod (102) and a metal plate (103), the hydraulic cylinder (101) is arranged on the workbench (3), the push rod (102) is arranged behind the hydraulic cylinder (101), and the metal plate (103) is arranged behind the push rod (102).
3. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: degumming mechanism (1) is including washing liquid pipe shower nozzle (110), washing liquid pipe (111), washing liquid pipe handle (112), washing liquid case (113), be provided with on workstation (3) washing liquid case (113), washing liquid case (113) top is provided with washing liquid pipe (111), the place ahead of washing liquid pipe (111) is provided with washing liquid pipe handle (112), the below of washing liquid pipe (111) is provided with washing liquid pipe shower nozzle (110).
4. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: workstation (3) with processing support (5) pass through the bolt fastening, processing support (5) with lead screw (4) pass through the bearing and connect, processing support (5) with second motor (10) pass through bolted connection, lead screw (4) with remove guide block (6) and pass through threaded connection, remove guide block (6) with anchor clamps supporting beam (7) pass through welded connection.
5. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: the utility model discloses a silicon wafer clamp, including anchor clamps supporting beam (7), pivot (8) and first motor (9), first motor (9) and cylinder (16) pass through the bolt fastening, cylinder (16) with telescopic link (17) sliding connection, telescopic link (17) with silicon chip clamp (21) pass through welded connection.
6. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: the worktable (3) is connected with the degumming cleaning pool (11) in a welding mode, the degumming cleaning pool (11) is connected with the filter screen (12) in a bolt mode, and the degumming cleaning pool (11) is connected with the drain pipe (15) in a welding mode.
7. The silicon wafer degumming device for semiconductor material processing according to claim 1, characterized in that: workstation (3) with control switch (13) pass through bolted connection, workstation (3) with meticulous washing pond (14) pass through welded connection, workstation (3) with stoving case (19) pass through welded connection, stoving case (19) with stoving case upper cover (18) pass through the bolt fastening, stoving case (19) with stoving case room door (20) pass through the pulley connection.
8. The silicon wafer degumming device for semiconductor material processing according to claim 2, characterized in that: the workbench (3) and the hydraulic cylinder (101) are fixed through bolts, the hydraulic cylinder (101) and the push rod (102) are connected through a plunger, and the push rod (102) and the metal plate (103) are connected through welding.
9. The silicon wafer degumming device for semiconductor material processing according to claim 3, characterized in that: workstation (3) with cleaning solution case (113) pass through bolted connection, cleaning solution case (113) with cleaning solution pipe (111) pass through welded connection, cleaning solution pipe (111) with cleaning solution pipe handle (112) pass through welded connection, cleaning solution pipe (111) with cleaning solution pipe shower nozzle (110) pass through welded connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122177308.1U CN216174771U (en) | 2021-09-09 | 2021-09-09 | Silicon wafer degumming device for semiconductor material processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122177308.1U CN216174771U (en) | 2021-09-09 | 2021-09-09 | Silicon wafer degumming device for semiconductor material processing |
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| CN216174771U true CN216174771U (en) | 2022-04-05 |
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| CN202122177308.1U Active CN216174771U (en) | 2021-09-09 | 2021-09-09 | Silicon wafer degumming device for semiconductor material processing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115518937A (en) * | 2022-11-07 | 2022-12-27 | 合肥升滕半导体技术有限公司 | Semiconductor ceramic part cleaning device and cleaning process thereof |
| CN116454012A (en) * | 2023-05-06 | 2023-07-18 | 江苏旭泰电子科技有限公司 | Cleaning and degumming equipment for photovoltaic silicon wafer |
-
2021
- 2021-09-09 CN CN202122177308.1U patent/CN216174771U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115518937A (en) * | 2022-11-07 | 2022-12-27 | 合肥升滕半导体技术有限公司 | Semiconductor ceramic part cleaning device and cleaning process thereof |
| CN115518937B (en) * | 2022-11-07 | 2023-03-03 | 合肥升滕半导体技术有限公司 | Semiconductor ceramic part cleaning device and cleaning process thereof |
| CN116454012A (en) * | 2023-05-06 | 2023-07-18 | 江苏旭泰电子科技有限公司 | Cleaning and degumming equipment for photovoltaic silicon wafer |
| CN116454012B (en) * | 2023-05-06 | 2023-11-24 | 江苏旭泰电子科技有限公司 | Cleaning and degumming equipment for photovoltaic silicon wafer |
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Effective date of registration: 20220715 Address after: 221000 plant A9 and A10, fenghuangwan Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Jiangsu AISI Semiconductor Technology Co.,Ltd. Address before: 471000 No. 61, group 1, gedangtou village, Hongshan Township, Xigong District, Luoyang City, Henan Province Patentee before: Gao Yinhui |