CN111180299A - Material surface treatment device - Google Patents
Material surface treatment device Download PDFInfo
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- CN111180299A CN111180299A CN202010240496.5A CN202010240496A CN111180299A CN 111180299 A CN111180299 A CN 111180299A CN 202010240496 A CN202010240496 A CN 202010240496A CN 111180299 A CN111180299 A CN 111180299A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
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Abstract
The invention provides a material surface treatment device, which belongs to the technical field of electronics and comprises a treatment chamber, an electron gun, an operation table and an adjusting mechanism, wherein the electron gun, the operation table and the adjusting mechanism are arranged in the treatment chamber, and the treatment chamber forms a vacuum environment through a pumping and exhausting hole on one side. The processing device utilizes the electron beam to process the surface of the material, has the characteristics of only consuming electric energy, being reusable, having high cost-effectiveness ratio and the like, has short action time, does not influence the processed object body, can obviously improve the surface smoothness of the processed material, is environment-friendly and harmless to human bodies, and can be widely applied to the technical fields of aerospace, precision machining, power electronics, instruments and meters, material modification, anticorrosion treatment, environmental protection technology and the like.
Description
Technical Field
The invention relates to a material surface treatment device, belongs to the technical field of electronics, and particularly relates to a device for performing material surface treatment by using electron beams, which has the application range including but not limited to: aerospace, precision machining, power electronics, instruments and meters, material modification, anticorrosion treatment, environmental protection technology and the like.
Background
Surface treatment refers to a technique for re-processing the surface of a substance or material by means of a method, tool, process, or the like. Currently, the surface treatment methods mainly include: grinding, heat treatment, chemical and laser methods.
The polishing method is a method of repeatedly rubbing the surface of an object to be treated with fine and high-strength fine particles. With the advance of technology, the grinding method has appeared to use supersonic speed particles to first collide and then rub, which aims to improve the working efficiency, but the processing efficiency of the method still needs to be improved, and the method has certain material loss.
The heat treatment process is a process of performing surface treatment of a material by a calcination process such as quenching and annealing. With the progress of the technology, the heat treatment method adopts hypersonic flame fixed-point injection to realize more accurate surface treatment, and the method has certain local deformation.
The chemical method is to use chemical agents, such as phosphoric acid, phosphate and the like, and erode specific areas, microscopic bulges or impurities on the surface of the treated object after being diluted in a certain proportion, and the chemical method has certain harm to the environment and human bodies.
The laser method is to irradiate the surface of the object to be treated with a high-power short-time high-energy laser beam to generate a local micro-melting state. Compared with the first three methods, although the laser method is advanced in technology, the laser method has the defects of long processing time and low working efficiency due to the contradiction between the spot size and the light energy intensity.
In order to improve the existing material processing method, on one hand, the processing precision is improved, the stability of a processing system is improved, on the other hand, the processing deformation of the material surface is reduced, and the harm to the environment and the human body is reduced, a new material processing device and a new material processing method are urgently needed to be designed.
Disclosure of Invention
In view of the above technical background and problems, the present invention utilizes electron beams to treat the surface of a material, and has the characteristics of electric energy consumption, reusability, high cost-effectiveness ratio, etc., the treatment mode has short action time, does not affect the treated object body, can significantly improve the surface smoothness of the treated material, is environment-friendly, has no harm to human bodies, and can be widely applied to the technical fields of aerospace, precision processing, power electronics, instruments and meters, material modification, anticorrosion treatment, environmental protection technology, etc.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
a material surface treatment device comprises a treatment chamber, an electron gun, an operation table and an adjusting mechanism, wherein the electron gun, the operation table and the adjusting mechanism are arranged inside the treatment chamber, one side of the treatment chamber is provided with an exhaust hole, and the material surface treatment device comprises: the treatment chamber is a sealing structure with a door or a cover body; the electron gun comprises a gun barrel, a cathode for emitting electron beams, an anode for guiding the electron beams to transmit and a solenoid for collecting the electron beams, wherein one end of the gun barrel is communicated with the inside of the processing chamber, the cathode is arranged at the other end of the gun barrel, the anode is in a circular ring or hollow column structure and is arranged right below the cathode, and the solenoid is coiled on the outer wall of the gun barrel; the operation table is arranged in the emission area of the electron gun and is used for fixing the processed material; the adjusting mechanism is used for driving the operating platform to move repeatedly so as to realize complete treatment of the surface of the treated material; the pumping and exhausting hole is connected with a vacuum pump set on one hand for realizing the vacuum environment in the processing chamber, and is connected with an inert gas source on the other hand for charging and discharging inert gas into and from the processing chamber.
Preferably, the electric spray gun is used for forming the surface alloy of the processed material, and consists of a spray pipe, a plasma generating electrode used for generating electrons and a plating substance used for generating plating substance ions, wherein: one end of the spray pipe is communicated with the inside of the processing chamber, the other end of the spray pipe is provided with the plasma generating electrode, and the electroplated object is arranged under the plasma generating electrode.
Preferably, the arrangement schemes of the electron gun and the electric spray gun comprise a parallel arrangement scheme and an intersecting arrangement scheme: when the electron gun and the electric spray gun adopt a parallel arrangement scheme, the adjusting mechanism is a translation adjusting mechanism which drives the operating platform to do linear motion repeatedly between the electron gun and the emission area of the electric spray gun; when the electron gun and the electric spray gun adopt an intersecting arrangement scheme, the adjusting mechanism is a rotary adjusting mechanism, and the rotary adjusting mechanism drives the operating platform to repeatedly perform circular motion between the electron gun and the emission area of the electric spray gun.
Preferably, the translation adjustment mechanism includes a translation table, a rotating wheel, a driven wheel and a transmission chain, wherein: the translation platform is the bearing main part, and the bottom of translation platform is installed on the inner wall of treatment chamber, and the upper portion horizontal mounting of translation platform has a plurality of swiveling wheels and follows the driving wheel, swiveling wheel and the outside parcel from the driving wheel have drive chain, drive chain's surface is connected with the bottom of operation panel.
Preferably, the rotation adjusting mechanism includes a rotation table and a rotation shaft, the rotation table is a load-bearing body, the rotation table is installed inside the processing chamber through the rotation shaft, the rotation shaft is driven to rotate by a rotation motor, and the operation table is installed at an eccentric position of the rotation table.
Preferably, the system further comprises a switch, an energy storage element, a charging power supply and a system controller, wherein: the charging power supply is used for charging the energy storage element on one hand and supplying power to the electric spray gun on the other hand; the switch is used for instantly releasing the electric energy of the energy storage element to the electron gun; the system controller is used for controlling the charging power supply, the switch and the vacuum pump set to work;
preferably, the energy storage element comprises a capacitor and/or an inductor, and the capacitor and/or the inductor form an energy storage circuit through a current limiting resistor and a switch, and are used for storing electric energy provided by the charging power supply on one hand and instantaneously discharging to the electron gun on the other hand.
Preferably, the charging power source is one of a large-capacity battery pack, an AC power source, or a DC power source.
Preferably, the switch is one or more of an MOS tube, a thyristor and an IGBT.
Preferably, the system controller is one of an MCU, an FPGA or a PLC, and is used for charge and discharge management, trigger control, operation of an operation platform, fault alarm and man-machine interaction.
The invention proposesMaterial surface treatment deviceHas the following beneficial effects:
(1) the device bombards the surface of the treated object by using high-speed electrons to ensure that particles fall off, move or collide with other particles on the surface layer of the treated object, and the electron beam surface treatment has the following advantages and advantages: the precision is high, the surface finish quality is good, and the processing precision can reach micron or even nanometer level under the computer-aided control. The stability is good, and the processing space and the energy distribution are always kept stable in the service life of the electron emitting electrode. The deformation is small, high-speed electrons only act on the surface of the treated object, the time is extremely short, and the overall temperature rise of the treated object is small. The method has wide application range, and compared with a laser method, the electron beam method not only can quickly process large-size workpieces or special-shaped parts, but also can process metal parts, alloy parts, non-metal parts and metal and non-metal mixed parts.
(2) In order to enrich the processing capacity of an electron beam surface treatment system and expand the application range and the application field, the invention provides a technical scheme of combining an electron gun with an electric spray gun, and the material surface treatment device not only has the capacity of electron beam surface treatment but also has the capacity of surface alloy forming by combining with a surface coating technology, thereby providing guarantee for supporting various scene applications, meeting the preparation requirements of special workpieces and improving diversified and large-scale processing capacity.
Drawings
FIG. 1 is a schematic diagram of the device layout of a first embodiment of the present invention;
FIG. 2 is a system diagram illustrating a first embodiment of the present invention;
FIG. 3 is a schematic view of an adjusting mechanism according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of the device layout of a second embodiment of the present invention;
FIG. 5 is a schematic diagram of a third embodiment device layout of the present invention;
FIG. 6 is a system diagram illustrating a third embodiment of the present invention;
FIG. 7 is a schematic diagram of an energy storage circuit according to the present invention;
FIG. 8 is a surface of an oxygen-free copper workpiece as originally machined;
fig. 9 is a surface of an oxygen-free copper workpiece treated using the present invention.
In the figure, 1-treatment chamber, 2-electron gun, 201-gun tube, 202-cathode, 203-anode, 204-solenoid, 3-operation table, 4-adjustment mechanism, 401-translation table, 402-rotating wheel, 403-driven wheel, 404-driving chain, 405-rotating table, 406-rotating shaft, 5-exhaust hole, 6-electric spray gun, 601-spray pipe, 602-plasma generating pole, 603-electroplating object.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The invention will be further explained with reference to the accompanying drawings in which:
example one
As shown in fig. 1 to 3, the material surface treatment apparatus includes a treatment chamber 1, and an electron gun 2, a stage 3, and an adjustment mechanism 4 installed inside the treatment chamber 1, and an exhaust hole 5 is provided at one side of the treatment chamber 1. In the figure, a processing chamber 1 is a sealed cavity structure with covers at two ends, an electron gun 2 is vertically arranged right above the processing chamber 1, the electron gun 2 is composed of a gun tube 201, a cathode 202 for emitting electron beams, an anode 203 for guiding the electron beams to transmit and a solenoid 204 for converging the electron beams, one end of the gun tube 201 is communicated with the inside of the processing chamber 1, the cathode 202 is installed at the other end of the gun tube 201, the anode 203 is in a circular ring or hollow column structure and is arranged right below the cathode 202, and the solenoid 204 is coiled on the outer wall of the gun tube 201.
Specifically, the cathode 202 is made of a metal material, and mainly functions to emit an electron beam under a high-pressure field. The anode 203 is made of metal, and is generally annular, and mainly functions to form a circuit loop with the cathode 202 to guide the electron beam to transmit. The solenoid 204 is energized to generate a guiding magnetic field, which fills the entire space of the cathode 202 and the anode 203 and serves to focus the electron beam so that it does not diverge.
In fig. 1, a stage 3 is provided in an emission region of an electron gun 2 and is used for fixing a material to be processed; the adjusting mechanism 4 is used for driving the operation table 3 to move repeatedly so as to realize the complete treatment of the surface of the treated material, and the operation table 3 is connected with the metal shell of the treatment chamber 1 in a common ground mode.
In fig. 1, the pumping/exhausting hole 5 is connected to a vacuum pump unit for realizing a vacuum environment inside the processing chamber 1, and is connected to an inert gas source for charging and discharging an inert gas into and from the processing chamber 1. During specific work, the interior of the processing chamber 1 is in a vacuum sealing state and is filled with a very small amount of inert gas, and the optimal value is 2-3%. After the treatment, the vacuum was released and the treated material was taken out. Wherein, the vacuum pump group is a vacuum pumping mechanism consisting of a mechanical pump and a molecular pump and is used for maintaining the vacuum degree in the processing chamber.
In the present embodiment, the surface of the object to be processed is bombarded by the high-speed electrons, so that the particles fall off, move or collide with other particles on the surface layer of the object to be processed, thereby significantly improving the surface smoothness of the object to be processed.
As shown in fig. 2, in order to work with the above device, a switch, an energy storage element, a charging power supply and a system controller are also required, wherein: the charging power supply is used for charging the energy storage element, and the switch is used for instantly releasing the electric energy of the energy storage element to the electron gun; the system controller is used for controlling the charging power supply, the switch and the vacuum pump set to work.
It should be noted that, in the present embodiment, a translation adjusting mechanism is adopted, as shown in fig. 3, the translation adjusting mechanism includes a translation table 401, a rotating wheel 402, a driven wheel 403, and a transmission chain 404, where: the translation table 401 is a load-bearing main body, the bottom of the translation table 401 is mounted on the inner wall of the processing chamber 1, the upper portion of the translation table 401 is horizontally provided with a plurality of rotating wheels 402 and driven wheels 403, the rotating wheels 402 and the driven wheels 403 are wrapped with transmission chains 404, and the outer surfaces of the transmission chains 404 are connected with the bottom of the operation table 3. Specifically, the rotating wheel 402 is controlled to rotate forward or backward to drive the transmission chain 404 to move clockwise or counterclockwise, so that the operation table 3 moves repeatedly in the area under the electron gun 2, and the surface of the processed material is fully processed.
The metal drive chain 404 has a certain conductivity, and can make the cathode 202, the anode 203, and the translation stage 401 constitute an electric circuit, thereby ensuring that the electrons finally strike the object to be processed.
Example two
The electric spray gun 6 is added on the basis of the first embodiment, the electric spray gun 6 can be used for forming the surface alloy of the processed material, as shown in fig. 4, the electric spray gun 6 and the electron gun 2 are arranged on the processing chamber 1 side by side, specifically, the electric spray gun 6 is composed of a spray pipe 601, a plasma generating electrode 602 for generating electrons and a plating object 603 for generating plating object ions, wherein: one end of the nozzle 601 is connected to the inside of the processing chamber 1, the other end of the nozzle 601 is provided with a plasma generator 602, and the plating object 603 is disposed right below the plasma generator 602.
Specifically, the plasma generating electrode 602 is connected with a positive electrode, the electroplated object 603 is connected with a negative electrode, the voltage is generally 220V, and the output voltage of the power supply in actual use is generally between hundred volts and kilovolts and is determined according to different application occasions and requirements.
In operation, the charging power source provides power to make the emitter of the plasma generator 602 spray plasma onto the plating object 603, so as to excite the metal particles of the plating object 603, and the metal particles of the plating object 603 adhere to the surface of the object to be processed under the guidance of the space field inside the processing chamber 1. The specific form of the plating 603 may be a solid metal, such as a tungsten plate, molybdenum plate, or the like.
In this embodiment, the adjustment mechanism 4 is a translational adjustment mechanism, and the operation table 3 can be repeatedly moved linearly between the electron gun 2 and the emission area of the electron gun 6 by the translational adjustment mechanism.
It should be noted that, in general, the electron gun 2 is used for surface finish improvement and the electron gun 6 is used for surface coating, and both of them can be used independently. However, in some special applications, such as high voltage electrodes, the surface is tungsten resistant to ablation and the substrate is copper with good conductivity, since the electron gun 2 not only has the ability to enhance the surface finish but also has the ability to fuse different materials closely. That is, after the electric spray gun 6 finishes the surface coating, the electric spray gun 2 needs to be reused for processing, so as to form an alloy state at the interface between the surface coating and the substrate, thereby achieving the purpose of firm and sufficient fusion.
EXAMPLE III
As shown in fig. 5 to 7, this embodiment includes a processing chamber 1, and an electron gun 2, an operation table 3, an adjusting mechanism 4 and an electric spray gun 6 installed inside the processing chamber 1, wherein a side of the processing chamber 1 is also provided with a pumping and exhausting hole 5, but the arrangement of the electron gun 2 and the electric spray gun 6 is an intersecting arrangement, in the figure, the electron gun 2 is in a horizontal position, the electric spray gun 6 is in a vertical position, and the processing chamber 1 adopts a cylindrical or circular cavity, which is more compact than the first and second embodiments.
In the figure, the adjustment mechanism 4 is a rotation adjustment mechanism, and specifically includes a turntable 405 and a rotation shaft 406, the turntable 405 is a main body for supporting, the turntable 405 is mounted inside the processing chamber 1 via the rotation shaft 406, the rotation shaft 406 is driven by a rotation motor to rotate, and the operation table 3 is mounted at an eccentric position of the turntable 405.
Specifically, the adjustment mechanism 4 carries the operation table 3 to rotate circumferentially at a certain inclination angle, and finishes the surface treatment operation when the operation table is rotated to the area where the electron gun 2 is located, and finishes the surface coating operation when the operation table is rotated to the area where the electron gun 6 is located. In operation, the electron gun 2 treatment and the electron gun 6 treatment are alternately repeated for the purpose of: the effect of the plating layer and the surface alloy is improved, and simultaneously, the surface smoothness is further improved. Under the conditions of ensuring production efficiency and controlling comprehensive cost, the thickness of the preferable plating layer and the surface alloy layer is in the range of 1-10 microns, and the method is beneficial to improving ablation resistance, insulating strength, corrosion resistance and the like.
In fig. 6, a switch, an energy storage element, a charging power supply and a system controller are also required to work with the device, wherein: the charging power supply is used for charging the energy storage element on one hand and supplying power to the electric spray gun 6 on the other hand; the switch is used for instantly releasing the electric energy of the energy storage element to the electron gun; the system controller is used for controlling the charging power supply, the switch and the vacuum pump set to work;
specifically, the energy storage element includes a capacitor and/or an inductor, the capacitor and/or the inductor form an energy storage circuit through a current limiting resistor and a switch, on one hand, the capacitor and/or the inductor is used for storing electric energy provided by the charging power supply, and on the other hand, the capacitor and/or the inductor is used for instantly discharging to the electron gun, and a specific structure can be referred to as fig. 7, in which the capacitor, the inductor, the resistor, and the switch are connected in series, and the inductor and the capacitor are used.
The charging power source is one of a large-capacity battery pack, an AC power source, and a DC power source. The switch is one or more of MOS tube, thyratron, thyristor or IGBT. The system controller is one of MCU, FPGA or PLC, and is used for charge and discharge management, trigger control, operation panel operation, fault alarm and man-machine interaction. Specifically, the system controller is composed of an integrated circuit and mainly achieves the functions of charging and discharging, triggering control, operation of an operation console, state monitoring, logic management, emergency management, fault alarming, man-machine interaction and the like of the whole system. Before working, the object to be processed is cleaned and put into a processing chamber. And in the working process, setting working parameters and automatically finishing a surface treatment task. After the operation, the vacuum was released and the object was taken out.
Fig. 8 and 9 are microscopic surface comparisons of oxygen-free copper workpieces before and after treatment using the present invention. Fig. 8 is a surface of an oxygen-free copper workpiece as originally machined, and fig. 9 is a surface of an oxygen-free copper workpiece after treatment using the present invention. The observation resolution was 50 microns. In power electronic systems, the surface finish of the core components may affect the dielectric strength and tolerance thresholds of the system. A microscopic scanning electron microscope is utilized to observe the oxygen-free copper workpiece, and the microscopic surface conditions before and after the treatment by the method are compared. When the surface of the oxygen-free copper workpiece reaches the finish degree Ra0.1 by the traditional machining means, peak valley-shaped turning marks (inclined straight stripes) and a large amount of impurities (black spots) on the surface of the oxygen-free copper workpiece can still be clearly seen, and after the oxygen-free copper workpiece is treated by the method, the peak valley-shaped turning marks and the impurities are basically eliminated when the oxygen-free copper workpiece is observed at a scale of 50 microns, so that the flatness is better, and the surface finish degree is further improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A material surface treatment device is characterized by comprising a treatment chamber (1), and an electron gun (2), an operation table (3) and an adjusting mechanism (4) which are arranged inside the treatment chamber (1), wherein one side of the treatment chamber (1) is provided with an exhaust hole (5), wherein:
the treatment chamber (1) is a sealing structure with a door or a cover body;
the electron gun (2) consists of a gun barrel (201), a cathode (202) for emitting electron beams, an anode (203) for guiding the electron beams to transmit and a solenoid (204) for converging the electron beams, one end of the gun barrel (201) is communicated with the inside of the processing chamber (1), the cathode (202) is installed at the other end of the gun barrel (201), the anode (203) is of a circular ring or hollow column structure and is arranged right below the cathode (202), and the solenoid (204) is coiled on the outer wall of the gun barrel (201);
the operating platform (3) is arranged in the emission area of the electron gun (2) and is used for fixing the processed material;
the adjusting mechanism (4) is used for driving the operating platform (3) to move repeatedly so as to realize complete treatment of the surface of the treated material;
the exhaust hole (5) is connected with a vacuum pump set on one hand for realizing the vacuum environment in the processing chamber (1), and is connected with an inert gas source on the other hand for charging and discharging inert gas into the processing chamber (1).
2. The material surface treatment device according to claim 1, further comprising an electric spray gun (6) for forming the surface alloy of the material to be treated, said electric spray gun (6) being composed of a nozzle (601), a plasma generating electrode (602) for generating electrons, and a plating (603) for generating ions of the plating, wherein: one end of the spray pipe (601) is communicated with the inside of the processing chamber (1), the other end of the spray pipe (601) is provided with the plasma generating electrode (602), and the electroplated object (603) is arranged right below the plasma generating electrode (602).
3. The material surface treatment device according to claim 2, characterized in that the arrangement of the electron guns (2) and (6) comprises a parallel arrangement and an intersecting arrangement:
when the electron gun (2) and the electric spray gun (6) adopt a parallel arrangement scheme, the adjusting mechanism (4) is a translation adjusting mechanism, and the translation adjusting mechanism drives the operating platform (3) to repeatedly and linearly move between the emission areas of the electron gun (2) and the electric spray gun (6);
when the electron gun (2) and the electric spray gun (6) adopt an intersecting arrangement scheme, the adjusting mechanism (4) is a rotary adjusting mechanism, and the rotary adjusting mechanism drives the operating platform (3) to repeatedly and circularly move between the emission areas of the electron gun (2) and the electric spray gun (6).
4. A material surface treatment device according to claim 3, characterized in that the translational adjustment mechanism comprises a translation stage (401), a rotating wheel (402), a driven wheel (403) and a transmission chain (404), wherein: translation platform (401) are the bearing main part, and the bottom of translation platform (401) is installed on the inner wall of treatment chamber (1), and the upper portion horizontal installation of translation platform (401) has a plurality of swiveling wheels (402) and follows driving wheel (403), outside parcel that swiveling wheel (402) and follow driving wheel (403) has drive chain (404), the surface of drive chain (404) is connected with the bottom of operation panel (3).
5. A material surface treatment apparatus according to claim 3, characterized in that the rotation adjustment mechanism comprises a rotary table (405) and a rotary shaft (406), the rotary table (405) being a load-bearing body, the rotary table (405) being mounted inside the treatment chamber (1) by means of the rotary shaft (406), the rotary shaft (406) being driven in rotation by a rotary motor, the operation table (3) being mounted in an eccentric position on the rotary table (405).
6. The material surface treatment apparatus of claim 4 or 5, further comprising a switch, an energy storage element, a charging power source, and a system controller, wherein:
the charging power supply is used for charging the energy storage element on one hand and supplying power to the electric spray gun (6) on the other hand;
the switch is used for instantly releasing the electric energy of the energy storage element to the electron gun;
the system controller is used for controlling the charging power supply, the switch and the vacuum pump set to work.
7. The material surface treatment device according to claim 6, characterized in that the energy storage element comprises a capacitor and/or an inductor, and the capacitor and/or the inductor form an energy storage circuit through a current limiting resistor and a switch, and are used for storing electric energy provided by a charging power supply on one hand and instantaneously discharging to the electron gun on the other hand.
8. The material surface treatment apparatus of claim 6, wherein the charging power source is one of a large capacity battery pack, an AC power source, or a DC power source.
9. The material surface treatment device according to claim 6, wherein the switch is one or more of a MOS tube, a thyristor or an IGBT.
10. The material surface treatment device of claim 6, wherein the system controller is one of an MCU, an FPGA, or a PLC, and the system controller is used for charge and discharge management, trigger control, operation of an operation console, fault alarm, and human-computer interaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010240496.5A CN111180299A (en) | 2020-03-31 | 2020-03-31 | Material surface treatment device |
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| CN202010240496.5A CN111180299A (en) | 2020-03-31 | 2020-03-31 | Material surface treatment device |
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| CN111180299A true CN111180299A (en) | 2020-05-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115305473A (en) * | 2022-07-18 | 2022-11-08 | 中国科学院空天信息创新研究院 | Metal part processing device and method suitable for vacuum device |
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- 2020-03-31 CN CN202010240496.5A patent/CN111180299A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115305473A (en) * | 2022-07-18 | 2022-11-08 | 中国科学院空天信息创新研究院 | Metal part processing device and method suitable for vacuum device |
| CN115305473B (en) * | 2022-07-18 | 2024-02-23 | 中国科学院空天信息创新研究院 | Metal part processing device and processing method suitable for vacuum device |
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