CN111169614B - Deep sea temperature control device and processing method thereof - Google Patents
Deep sea temperature control device and processing method thereof Download PDFInfo
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- CN111169614B CN111169614B CN202010014695.4A CN202010014695A CN111169614B CN 111169614 B CN111169614 B CN 111169614B CN 202010014695 A CN202010014695 A CN 202010014695A CN 111169614 B CN111169614 B CN 111169614B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
- B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
- B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
- B63G8/36—Adaptations of ventilation, e.g. schnorkels, cooling, heating, or air-conditioning
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Abstract
A deep sea temperature control device and a processing method thereof comprise a working chamber, wherein a refrigerating module is arranged in the working chamber, and a radiating module is arranged outside the working chamber; the structure of the refrigeration module is as follows: the air conditioner comprises an inner shell, wherein the inner shell is fixed on the inner wall surface in a working cabin, an inner radiator is arranged in the inner part of the inner shell, and a plurality of air blowers are arranged at the bottom of the inner radiator; the structure of the heat dissipation module is as follows: including fixing the cold plate of leading at work cabin outer wall, lead the upper surface interval of cold plate and install a plurality of semiconductor refrigeration pieces, its upper surface is fixed with outer radiator, lead the upper surface of cold plate and the clearance department of every semiconductor refrigeration piece and be provided with the heat insulation layer, the externally mounted of heat insulation layer has seal shell, seal shell all surrounds above-mentioned semiconductor refrigeration piece and outer radiator including, drive controller is still installed to seal shell's inside, seal shell's inside is full of the conduction oil, seal shell's top is opened has the compensation hole, the compensator is installed to compensation hole department. The work is reliable.
Description
Technical Field
The invention relates to the technical field of deep sea operation of manned submersible, in particular to a deep sea temperature control device and a processing method thereof.
Background
The manned submersible has great differences in working seasons, regions, depths and the like depending on the working objects and tasks. Constrained by space conditions in the cabin, the manned cabin is generally not paved with heat insulation layers and is not provided with an air conditioning system at present. When the operation is carried out in shallow water or low latitude, the cabin is in a high-temperature and high-humidity state; when the deep sea works, the cabin is in a low-temperature and low-humidity state; the extreme cabin environment both reduces the operational efficiency and affects personnel health and equipment safety.
The traditional air conditioning device generally adopts a compressor refrigeration principle, has large equipment volume and vibration noise and has a refrigerant leakage risk, and is mainly applied to open environments such as land or ships. If the air conditioner is arranged in a passenger cabin with a narrow space, the problem of vibration noise needs to be solved, and the risks of cabin pressure rise and personnel poisoning caused by refrigerant leakage need to be borne. If the air conditioner is arranged outboard, the problems of deep sea pressure resistance and pipeline penetration of the air conditioner need to be solved.
Disclosure of Invention
The applicant provides a deep sea temperature control device and a processing method thereof aiming at the defects in the prior art, so that the active control function of the temperature and the humidity in a deep sea platform cabin is realized by adopting a deep sea outboard air conditioning device and a cabin wall heat transfer mode.
The technical scheme adopted by the invention is as follows:
a deep sea temperature control device comprises a working cabin, wherein a refrigeration module is arranged in the working cabin, and a heat dissipation module is arranged outside the working cabin and in a position corresponding to the refrigeration module;
the structure of the refrigeration module is as follows: the air conditioner comprises an inner shell, wherein the inner shell is fixed on the inner wall surface in a working cabin, an inner radiator is arranged in the inner part of the inner shell, and a plurality of air blowers are arranged at the bottom of the inner radiator;
the structure of the heat dissipation module is as follows: including fixing the cold plate of leading at work cabin outer wall, lead the upper surface interval of cold plate and install a plurality of semiconductor refrigeration pieces, the last fixed surface of semiconductor refrigeration piece has outer radiator, the clearance department of leading the upper surface of cold plate and every semiconductor refrigeration piece is provided with the heat insulation layer, the externally mounted of heat insulation layer has seal shell, seal shell all surrounds above-mentioned semiconductor refrigeration piece and outer radiator including, seal shell's inside still installs drive controller, and seal shell's inside is full of the conduction oil, open seal shell's top has the compensation hole, compensation hole department installs the compensator.
The further technical scheme is as follows:
the semiconductor refrigerating sheet has the structure that: the heat radiator comprises a hot end and a cold end which are arranged at intervals in an up-down parallel mode, the hot end and the cold end are connected through a plurality of connecting column components, the upper top surface of the hot end is fixed with the outer radiator, and the lower bottom surface of the cold end is fixed with the cold guide plate.
The inner radiator is fixed on the inner wall surface of the working cabin.
The air feeder is provided with two air feeders.
The cross-section of sealed casing becomes "hoistingL" structure.
A processing method of a deep sea temperature control device comprises the following installation processes:
the assembly process of the refrigeration module comprises the following steps:
fixing an inner machine shell on the inner wall of a working cabin, coating heat-conducting grease on the inner surface of the inner machine shell, fixing an inner radiator on the inner machine shell, keeping the inner radiator tightly attached to the inner wall of the working cabin, and fixing a blower on the inner radiator;
(II) assembling the heat dissipation module:
the first step is as follows: fixedly mounting the sealing shell to the outer surface of the working cabin;
the second step is that: coating heat-conducting grease on the inner surface of the sealed shell, and tightly attaching the cold guide plate to the inner part of the sealed shell, namely the outer surface of the working cabin, and simultaneously corresponding to the position of the inner radiator;
the third step: coating heat-conducting grease on the upper surface of the cold conducting plate, and uniformly distributing and closely attaching a plurality of semiconductor refrigerating pieces to the cold conducting plate;
the fourth step: keeping the sealed shell and the working cabin horizontally placed, pouring dilute heat insulation glue into the sealed shell until the space from the cold end to the hot end of the semiconductor refrigerating sheet 6 is filled up to 2/3 height position, and waiting for hardening to form a heat insulation layer;
the fifth step: the hot end of the semiconductor refrigeration piece is closely attached with an external radiator;
and a sixth step: filling heat conduction oil for the heat dissipation module through the oil-filled compensation hole, and installing a compensator filled with the heat conduction oil on the compensation hole;
the seventh step: and (4) finishing.
The invention has the following beneficial effects:
the invention has compact and reasonable structure and convenient operation, can conveniently provide a deep sea outboard air conditioning device by the mutual matching work of the refrigeration module and the heat dissipation module, adopts the design that the inner cavity is filled with heat conduction oil and communicated with the compensator, has simple and reliable structure, and effectively solves the problems of deep sea pressure compensation, air conditioning heat dissipation module cooling, deep sea electrical insulation and the like.
The deep sea outboard air conditioning device provided by the invention adopts the specially-made pressure-resistant heat-insulating material, and effectively solves the problems that the semiconductor refrigerating sheet cannot resist deep sea water pressure, the heat-insulating material is invalid under pressure, and the cold and hot ends of the refrigerating sheet are short-circuited due to the fact that heat conducting oil is filled in the inner cavity.
The deep sea outboard air conditioning device provided by the invention adopts a bulkhead heat transfer mode, and effectively solves the problems of pipeline cabin-through cooling and refrigerating output transmission.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the semiconductor chilling plate of the present invention.
Wherein: 1. a working cabin; 2. sealing the housing; 3. a compensator; 4. heat conducting oil; 5. an external heat sink; 6. a semiconductor refrigeration sheet; 7. a heat insulating layer; 8. a cold conducting plate; 9. an inner heat sink; 10. a drive controller; 11. a blower; 12. an inner shell;
601. a hot end; 602. a connecting post assembly; 603. and (4) cold ends.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 and fig. 2, the deep sea temperature control device of the present embodiment includes a working cabin 1, a refrigeration module is installed in the cabin of the working cabin 1, and a heat dissipation module is installed outside the cabin of the working cabin 1 and in a position corresponding to the refrigeration module;
the structure of the refrigeration module is as follows: the air conditioner comprises an inner shell 12, wherein the inner shell 12 is fixed on the inner wall surface in a cabin of a working cabin 1, an inner radiator 9 is arranged in the inner shell 12, and a plurality of air blowers 11 are arranged at the bottom of the inner radiator 9;
the structure of the heat dissipation module is as follows: including fixing the cold board 8 of leading at 1 outer wall in work compartment, lead the upper surface interval of cold board 8 and install a plurality of semiconductor refrigeration pieces 6, the upper surface fixed of semiconductor refrigeration piece 6 has outer radiator 5, the upper surface of leading cold board 8 and the clearance department of every semiconductor refrigeration piece 6 are provided with heat insulation layer 7, the externally mounted of heat insulation layer 7 has seal housing 2, seal housing 2 all surrounds above-mentioned semiconductor refrigeration piece 6 and outer radiator 5 including, drive controller 10 is still installed to seal housing 2's inside, seal housing 2's inside is full of conduction oil 4, open seal housing 2's top has the compensation hole, compensator 3 is installed to compensation hole department.
The structure of the semiconductor refrigerating sheet 6 is as follows: the heat radiator comprises a hot end 601 and a cold end 603 which are arranged at an upper-lower parallel interval, the hot end 601 and the cold end 603 are connected through a plurality of connecting column components 602, the upper top surface of the hot end 601 is fixed with an outer radiator 5, and the lower bottom surface of the cold end 603 is fixed with a cold guide plate 8.
The inner radiator 9 is fixed to the inner wall surface of the working chamber 1.
The blower 11 is provided in two.
The cross-section of the sealing shell 2 becomes the structure of the L-type yarns.
The processing method of the deep sea temperature control device comprises the following installation processes:
the assembly process of the refrigeration module comprises the following steps:
fixing an inner shell 12 on the inner wall of the working cabin 1, coating heat-conducting grease on the inner surface of the inner shell 12, fixing an inner radiator 9 on the inner shell 12, keeping the inner radiator 9 tightly attached to the inner wall of the working cabin 1, and fixing a blower 11 on the inner radiator 9;
(II) assembling the heat dissipation module:
the first step is as follows: fixedly mounting the sealing shell 2 on the outer surface of the working cabin 1;
the second step is that: coating heat-conducting grease on the inner surface of the sealed shell 2, and tightly attaching the cold-conducting plate 8 to the inner part of the sealed shell 2, namely the outer surface of the working cabin 1, and simultaneously corresponding to the position of the inner radiator 9;
the third step: coating heat-conducting grease on the upper surface of the cold conducting plate 8, and uniformly distributing and closely mounting the plurality of semiconductor refrigerating sheets 6 on the cold conducting plate 8;
the fourth step: keeping the sealed shell 2 and the working cabin 1 horizontally placed, pouring dilute heat insulation glue into the sealed shell 2 until the semiconductor refrigerating sheet 6 is filled from the cold end 603 to the 2/3 position of the gap between the hot end 601, and waiting for hardening to form a heat insulation layer 7;
the fifth step: the hot end 601 of the semiconductor refrigeration sheet 6 is closely attached with the outer radiator 5;
and a sixth step: filling heat conduction oil 4 into the heat dissipation module through the oil-filled compensation hole, and installing the compensator 3 filled with the heat conduction oil 4 on the compensation hole;
the seventh step: and (4) finishing.
The specific structure and function of the invention are as follows:
the refrigerating system mainly comprises a heat dissipation module, a refrigeration module, a sealed shell 2, a compensator 3, a driving controller 10, an outer radiator 5, a semiconductor refrigeration sheet 6, a heat insulation layer 7, a cold conduction plate 8, an inner radiator 9, a blower 11, an inner shell 12 and a working cabin 1.
The structure of the heat dissipation module is as follows: comprises a sealed shell 2 and an internal accessory unit inside the sealed shell; the whole radiating module is fixed with the outer wall surface of the working cabin 1.
The upper surface of the sealing shell 2 is communicated with the compensator 3 through a compensation hole, the lower surface of the sealing shell consists of a cold conducting plate 8 and a heat insulating layer 7 and is fixed to the working cabin 1 in an adherence manner, and heat conducting oil 4 is filled in the sealing shell 2 and the compensator 3; when the working depth of the deep sea outboard air conditioning device changes, the compensator 3 compensates for the pressure deformation in the seal housing 2 and its housing.
The semiconductor refrigerating sheet 6 is arranged on the upper surface of the cold guide plate 8 in a wall pasting manner;
the heat insulation layer 7 covers the area, including the area of the cold guide plate 8 without the semiconductor refrigeration sheet 6, the internal gap area of the semiconductor refrigeration sheet 6 and the area from the inner wall of the sealed shell 2 to the cold guide plate 8;
the heat insulating layer 7 realizes heat insulation of the hot end 601 (upper end face) and the cold end 603 (lower end face) of the semiconductor refrigerating sheet 6 and bears deep sea water pressure.
The outer radiator 5 is attached to the upper surface (hot end 601) of the semiconductor refrigeration sheet 6;
the structure of the refrigeration module is as follows: an internal accessory unit comprising an internal housing 12 and its interior;
the inner radiator 9 is arranged on the inner surface of the working cabin 1 in an adherence manner;
the blower fan 11 is disposed on the lower surface of the inner radiator 9.
The thickness of the heat insulating material filled in the semiconductor refrigerating sheet 6 is not more than 2/3 of the gap, and the rest 1/3 gap is filled with heat conducting oil 4; the thermal insulation material is low-viscosity fluid when being filled, and has good pressure resistance and thermal insulation performance after being solidified.
The heat transfer oil 4 fills all the gaps outside the upper surface of the heat insulating layer 7, including the region inside the semiconductor chilling plate 6 not filled with the heat insulating material.
The heat on the upper surface of the semiconductor refrigeration sheet 6 is finally conducted into the seawater through the outer radiator 5, the heat conduction oil 4, the sealed shell 2 and the like.
The cold energy on the lower surface of the semiconductor refrigeration sheet 6 is finally sent into the working chamber through the cold guide plate 8, the cabin wall of the working chamber 1, the internal radiator 9, the blower 11 and the like.
The drive controller 10 realizes control of switching of the cooling/heating functions, the magnitude of the cooling/heating capacity, the start and stop of the blower 11, and the like.
The basic working principle of the invention is as follows:
according to the invention, a direct current voltage is loaded at two ends of a semiconductor refrigerating sheet 6 (by utilizing the Peltier effect of a semiconductor), so that the temperature of one end of the semiconductor refrigerating sheet is reduced, and the temperature of the other end of the semiconductor refrigerating sheet is increased, thus the heat flows from one end of the refrigerating sheet to the other end in a directional manner, the purpose of refrigerating/heating is achieved, and the direction of current is changed, and the heat flows in the opposite direction; through reasonable design of the heat insulating layer 7, the heat short circuit between the hot end 601 and the cold end 603 is isolated, and the refrigeration efficiency is improved; the deep sea high voltage resistance and the electrical insulation problem are solved by an oil filling compensation mode.
The above description is intended to be illustrative and not restrictive, and the scope of the invention is defined by the appended claims, which may be modified in any manner within the scope of the invention.
Claims (6)
1. A deep sea temperature control device is characterized in that: the refrigeration device comprises a working cabin (1), wherein a refrigeration module is arranged in the working cabin (1), and a heat dissipation module is arranged outside the working cabin (1) and in a position corresponding to the refrigeration module;
the structure of the refrigeration module is as follows: the air conditioner comprises an inner shell (12), wherein the inner shell (12) is fixed on the inner wall surface in a cabin of a working cabin (1), an inner radiator (9) is installed inside the inner shell (12), and a plurality of air blowers (11) are installed at the bottom of the inner radiator (9);
the structure of the heat dissipation module is as follows: including leading cold board (8) of fixing at work compartment (1) outer wall, lead the upper surface interval of cold board (8) and install a plurality of semiconductor refrigeration pieces (6), the last fixed surface of semiconductor refrigeration piece (6) has outer radiator (5), lead the upper surface of cold board (8) and clearance department of every semiconductor refrigeration piece (6) and be provided with heat insulation layer (7), the externally mounted of heat insulation layer (7) has seal housing (2), seal housing (2) all surrounds including above-mentioned semiconductor refrigeration piece (6) and outer radiator (5), drive controller (10) are still installed to the inside of seal housing (2), and the inside of seal housing (2) is full of conduction oil (4), open the top of seal housing (2) has the compensation hole, compensator (3) are installed to compensation hole department.
2. The deep sea temperature control device of claim 1, wherein: the semiconductor refrigerating sheet (6) has the structure that: the heat radiator comprises a hot end (601) and a cold end (603) which are arranged at an upper-lower parallel interval, the hot end (601) and the cold end (603) are connected through a plurality of connecting column assemblies (602), the upper top surface of the hot end (601) is fixed with an outer heat radiator (5), and the lower bottom surface of the cold end (603) is fixed with a cold guide plate (8).
3. The deep sea temperature control device of claim 1, wherein: the inner radiator (9) is fixed on the inner wall surface of the working cabin (1).
4. The deep sea temperature control device of claim 1, wherein: the number of the air blowers (11) is two.
5. The deep sea temperature control device of claim 1, wherein: the cross section of sealed casing (2) becomes "hoistingroller" structure.
6. A processing method using the deep sea temperature control device of claim 1, characterized in that: the method comprises the following installation processes:
the assembly process of the refrigeration module comprises the following steps:
fixing an inner shell (12) on the inner wall of a working cabin (1), coating heat-conducting grease on the inner surface of the inner shell (12), fixing an inner radiator (9) on the inner shell (12), keeping the inner radiator (9) tightly attached to the inner wall of the working cabin (1), and fixing a blower (11) on the inner radiator (9);
(II) assembling the heat dissipation module:
the first step is as follows: fixedly installing the sealing shell (2) on the outer surface of the working cabin (1);
the second step is that: coating heat-conducting grease on the inner surface of the sealed shell (2), and closely mounting a cold-conducting plate (8) inside the sealed shell (2), namely the outer surface of the working cabin (1), and simultaneously corresponding to the position of the inner radiator (9);
the third step: heat-conducting grease is coated on the upper surface of the cold conducting plate (8), and a plurality of semiconductor refrigerating sheets (6) are uniformly distributed and tightly attached to the cold conducting plate (8);
the fourth step: keeping the sealed shell (2) and the working cabin (1) horizontally placed, pouring dilute heat insulation glue into the sealed shell (2) until the cold end (603) of the semiconductor refrigeration sheet (6) is filled to the height position of 2/3 in the gap of the hot end (601), and waiting for hardening to form a heat insulation layer (7);
the fifth step: an outer radiator (5) is closely mounted at the hot end (601) of the semiconductor refrigeration sheet (6);
and a sixth step: the heat dissipation module is filled with heat conduction oil (4) through the compensation hole, and the compensator (3) filled with the heat conduction oil (4) is installed on the compensation hole;
the seventh step: and (4) finishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014695.4A CN111169614B (en) | 2020-01-07 | 2020-01-07 | Deep sea temperature control device and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014695.4A CN111169614B (en) | 2020-01-07 | 2020-01-07 | Deep sea temperature control device and processing method thereof |
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| Publication Number | Publication Date |
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| CN111169614A CN111169614A (en) | 2020-05-19 |
| CN111169614B true CN111169614B (en) | 2020-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010014695.4A Active CN111169614B (en) | 2020-01-07 | 2020-01-07 | Deep sea temperature control device and processing method thereof |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111591419B (en) * | 2020-05-22 | 2021-07-06 | 中国船舶科学研究中心 | Hot cabinet cooling system for deep sea manned platform |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1948544A1 (en) * | 1968-09-27 | 1970-04-02 | Yoshimasa Kawakita | Underwater breathing apparatus using mixed liquid gases |
| DE2801534C3 (en) * | 1978-01-14 | 1980-09-25 | Bruker-Physik Ag, 7512 Rheinstetten | Warm water circuit heating in working submarines or diving chambers |
| CN102941916A (en) * | 2012-11-14 | 2013-02-27 | 合肥天鹅制冷科技有限公司 | Temperature control device for submerge device |
| CN103070430B (en) * | 2013-02-16 | 2014-01-01 | 哈尔滨工业大学 | Dry sea cucumber automatic foaming machine and dry cucumber foaming method |
| CN205801489U (en) * | 2016-04-23 | 2016-12-14 | 广东合即得能源科技有限公司 | A kind of boat-carrying heat pump type air conditioning system |
| CN106904262B (en) * | 2017-03-10 | 2019-07-16 | 上海船舶研究设计院（中国船舶工业集团公司第六〇四研究院） | A kind of marine cabin phase transformation absorption systems |
| CN109000413A (en) * | 2018-07-26 | 2018-12-14 | 中国船舶科学研究中心（中国船舶重工集团公司第七0二研究所） | A kind of passive outboard cooling system suitable for underwater platform |
| CN109994801A (en) * | 2019-04-27 | 2019-07-09 | 广州市旋通节能科技有限公司 | A kind of battery radiator structure of the sub- ship of battery |
| CN110481742B (en) * | 2019-09-18 | 2023-12-15 | 中交第二航务工程勘察设计院有限公司 | Ship propulsion device and use method |
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