CN111168515A - Wafer multistation edge polishing equipment - Google Patents
Wafer multistation edge polishing equipment Download PDFInfo
- Publication number
- CN111168515A CN111168515A CN202010023550.0A CN202010023550A CN111168515A CN 111168515 A CN111168515 A CN 111168515A CN 202010023550 A CN202010023550 A CN 202010023550A CN 111168515 A CN111168515 A CN 111168515A
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- wafer
- air suction
- ring
- air
- machine body
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Abstract
The invention discloses a wafer multi-station edge polishing device, which structurally comprises a fixed rod, a polishing system, a hydraulic cylinder and a machine body, wherein two polishing systems are arranged on the top end surface of the machine body, the hydraulic cylinder is arranged right above the polishing systems and is mechanically connected with the polishing systems, the fixed rod is arranged at the topmost end of the machine body, the polishing system comprises an air inlet, a main rod, a folding cylinder, a fixed disk and an operating platform, the operating platform is fixed right above the machine body, the fixed disk is arranged right above the operating platform, the invention fixes a wafer by utilizing the downward pressing of the hydraulic cylinder through the mutual matching among the hydraulic cylinder, the main rod and the fixed disk, avoids the relative sliding of the wafer during the fixing, the invention realizes the adsorption of the wafer by utilizing the mutual matching of the fixed disk and the air inlet and the like and utilizing the air suction inner ring and the air, ensure that the wafer is uniformly adsorbed and stressed and cannot be broken into two halves from the middle.
Description
Technical Field
The invention relates to the field of wafer cutting equipment, in particular to wafer multi-station edge polishing equipment.
Background
The wafer is formed by slicing the whole crystal bar, the application of the wafer on the electronic device is gradually increased along with the reduction of parts of the electronic device, stricter requirements are provided for the surface granularity, geometric parameters, edges and surface roughness of the wafer, the edges of the wafer need to be polished, the hardness of the wafer is too high when the wafer is pressed and fixed, the wafer is easy to embrittle, the wafer which is being polished is separated from the middle and is folded into two parts, and the polishing yield is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: the utility model provides a wafer multistation edge polishing equipment, its structure includes dead lever, polishing system, pneumatic cylinder, organism top face is equipped with two polishing systems, be equipped with the pneumatic cylinder directly over the polishing system, pneumatic cylinder and polishing system mechanical connection, the organism top is equipped with the dead lever, polishing system contains air intake, mobile jib, folding section of thick bamboo, fixed disk, operation platform fixes directly over the organism, be equipped with the fixed disk directly over the operation platform, fixed disk top face is equipped with folding section of thick bamboo, folding section of thick bamboo is hollow structure, folding section of thick bamboo and fixed disk fixed connection, folding section of thick bamboo top installation mobile jib, it has the air intake to open on the mobile jib, air intake and organism mechanical connection.
As a further optimization of the technical scheme, the folding cylinder is of a structure with a narrow upper part and a wide lower part.
As the further optimization of this technical scheme, the fixed disk comprises the inner ring of breathing in, lane, circular slab, the outer loop of breathing in, be equipped with the inner ring of breathing in the middle of the circular slab is positive, the inner ring of breathing in and circular slab structure as an organic whole, the inner diameter of the outer loop of breathing in is greater than the outer diameter of the inner ring of breathing in, the outer loop of breathing in is located the circular slab surface, the outer loop of breathing in and the inner ring of breathing in are through the lane intercommunication more than two, and these lanes are even equidistance and distribute, the inner ring of breathing in and a folding section of thick bamboo intercommunication.
As a further optimization of this technical scheme, the outer cambered surface in top that the circular slab is close to folding section of thick bamboo is equipped with three removal frame, removal frame and circular slab adopt sliding fit, it comprises notch, spout, fan shape frame to remove the frame, the notch is opened in the circular slab, be equipped with the spout in the middle of the inside ground of notch is positive, spout and circular slab structure as an organic whole, fan shape frame and notch adoption sliding fit.
As a further optimization of the technical scheme, a finger notch is arranged at the end, close to the outer side, of the fan-shaped frame, and the finger notch and the fan-shaped frame are of an integrated structure.
As a further optimization of the technical scheme, the fan-shaped frame is of a hollow fan-shaped structure.
As a further optimization of this technical scheme, be equipped with the amount of wind adjustable ring between folding section of thick bamboo and the air intake, amount of wind adjustable ring and mobile jib mechanical connection, the amount of wind adjustable ring comprises swivel becket, wind gap, baffle, casing, swivel becket normal running fit, the last fixed baffle that is equipped with of shells inner wall, baffle and shells inner wall level are fixed, the baffle is the fan-shaped structure of triangle, the centre of a circle contained angle of baffle is less than 90 degrees, baffle and swivel becket cooperate each other, and the interior unsealed space of baffle horizontal space is the wind gap.
As a further optimization of the technical scheme, the round plate and the folding cylinder are provided with sponge blocks on the ground bottom surface relatively, the sponge blocks are attached to the bottom surface of the round plate in shape, and the round plate and the sponge blocks are movably fixed.
Advantageous effects
Compared with the prior art, the wafer multi-station edge polishing equipment has the following advantages:
1. according to the invention, through mutual matching among the hydraulic cylinder, the main rod and the fixed disk, the wafer is fixed after being pressed down by the hydraulic cylinder, so that the wafer is prevented from sliding relatively when being fixed.
2. The wafer adsorption device realizes adsorption of the wafer by matching the fixed disc with the air inlet and the like in an air exhaust mode, and simultaneously performs adsorption of the inside and the outside of the wafer by adopting the air suction inner ring and the air suction outer ring, so that the wafer is ensured to be uniformly adsorbed and not to be broken into two parts from the middle.
3. According to the invention, the height of the fixed disc from the operating platform is adjusted through the mutual matching of the folding cylinder and the fixed disc, so that the folding type wafer clamping device is suitable for wafers with any different thicknesses, and the practicability is improved.
4. The fan-shaped frame and the fixed disc are matched with each other, the fan-shaped frame can be movably moved to extend outwards, the fixed diameter of the circular plate is expanded, the fixed range is wider, and the stress is more uniform when the hydraulic system presses down and fixes the wafer.
5. According to the invention, through the design of the sponge block, when the hydraulic cylinder is pressed down, the pressure of the hydraulic cylinder on the wafer is reduced, the phenomenon that the wafer is directly broken due to overlarge impact is avoided, and the sponge block has a smooth outer surface and cannot be scratched after being contacted with the wafer.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic perspective view of a wafer multi-station edge polishing apparatus according to the present invention.
FIG. 2 is a schematic perspective view of the polishing system of the present invention.
FIG. 3 is a schematic of the floor of the polishing system of the present invention.
FIG. 4 is a schematic structural view of the polishing system with an air volume adjusting ring according to the present invention.
Fig. 5 is a plan view schematically illustrating a stationary platen with a movable frame according to the present invention.
Fig. 6 is a schematic plan view of the fixed tray with the movable rack installed thereon according to the present invention.
Fig. 7 is a schematic plan view of the air quantity adjusting ring of the present invention in use.
Fig. 8 is a schematic plan view of the air quantity adjusting ring of the present invention.
In the figure: the polishing machine comprises a fixed rod 1, a polishing system 2, a hydraulic cylinder 3, a machine body 4, an air inlet 21, a main rod 23, a folding cylinder 24, a fixed disk 25, a moving rack 26, an operating platform 27, an air suction inner ring 251, a thin channel 252, a circular plate 253, an air suction outer ring 254, a notch 261, a sliding chute 262, a fan-shaped rack 264, a finger notch 263, an air volume adjusting ring 22, a rotating ring 221, an air port 222, a baffle 223 and a shell 224.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example one
Referring to fig. 1-4, the invention provides a wafer multi-station edge polishing apparatus, which comprises a fixing rod 1, a polishing system 2, two polishing systems 2, and a machine body 4, wherein the top end surface of the machine body 4 is provided with the two polishing systems 2, the hydraulic cylinder 3 is arranged right above the polishing systems 2, the hydraulic cylinder 3 is mechanically connected with the polishing systems 2, the fixing rod 1 is arranged at the topmost end of the machine body 4, the polishing system 2 comprises an air inlet 21, a main rod 23, a folding cylinder 24, a fixing disc 25 and an operating platform 27, the operating platform 27 is fixed right above the machine body 4, the fixing disc 25 is arranged right above the operating platform 27, the folding cylinder 24 is arranged at the top end surface of the fixing disc 25, the folding cylinder 24 is of a hollow structure, the folding cylinder 24 is fixedly connected with the fixing disc 25, the main rod 23 is mounted at the top end of the folding, the main rod 23 is provided with an air inlet 21, and the air inlet 21 is mechanically connected with the machine body 4.
The folding cylinder 24 is of a structure with a narrow top and a wide bottom, so that the air is more concentrated when being extracted, and the sound of hollow sound cannot be generated due to space rippling.
The fixed disk 25 is composed of an air suction inner ring 251, fine channels 252, a circular plate 253 and an air suction outer ring 254, the air suction inner ring 251 is arranged in the middle of the circular plate 253, the air suction inner ring 251 and the circular plate 253 are of an integrated structure, the inner diameter of the air suction outer ring 254 is larger than the outer diameter of the air suction inner ring 251, the air suction outer ring 254 is positioned on the outer surface of the circular plate 253, the air suction outer ring 254 and the air suction inner ring 251 are communicated through more than two fine channels 252, the fine channels 252 are uniformly and equidistantly distributed, the air suction inner ring 251 is communicated with the folding cylinder 24, the air suction inner ring 251 and the air suction outer ring 254 are adopted to simultaneously suck and adsorb the inside and the outside of a wafer, and the wafer is guaranteed to be uniformly adsorbed and not to be broken into two.
When using, at first, push down through pneumatic cylinder 3, the wafer is fixed, avoid the wafer to take place relative slip when fixed, still accessible utilization air exhaust's mode, gaseous from the fixed disk 25 with the wafer contact adsorb the air, recirculation fixed disk 25 and mobile jib 23, realize adsorbing the wafer, and adopt the inner ring 251 of breathing in and breathe in outer loop 254 to absorb the absorption simultaneously to the inside and the outside of wafer, guarantee that the wafer adsorbs the atress evenly can not follow the middle and begin to break into two halves, folding cylinder 24's design, adjust the height between the fixed disk 25 apart from operation platform 27, be suitable for the wafer of arbitrary different thickness, the practicality is improved, and folding cylinder 24 is the structure of width under the upper narrow, when extracting the air, it is more concentrated, can not because of the space rippling, the sound of the production sky is buzzing.
Example two
Referring to fig. 1-8, the invention provides a wafer multi-station edge polishing apparatus, which comprises a fixing rod 1, a polishing system 2, two polishing systems 2, and a machine body 4, wherein the top end surface of the machine body 4 is provided with the two polishing systems 2, the hydraulic cylinder 3 is arranged right above the polishing systems 2, the hydraulic cylinder 3 is mechanically connected with the polishing systems 2, the fixing rod 1 is arranged at the topmost end of the machine body 4, the polishing system 2 comprises an air inlet 21, a main rod 23, a folding cylinder 24, a fixing disc 25 and an operating platform 27, the operating platform 27 is fixed right above the machine body 4, the fixing disc 25 is arranged right above the operating platform 27, the folding cylinder 24 is arranged at the top end surface of the fixing disc 25, the folding cylinder 24 is of a hollow structure, the folding cylinder 24 is fixedly connected with the fixing disc 25, the main rod 23 is mounted at the top end of the folding, the main rod 23 is provided with an air inlet 21, and the air inlet 21 is mechanically connected with the machine body 4.
The folding cylinder 24 is of a structure with a narrow top and a wide bottom, so that the air is more concentrated when being extracted, and the sound of hollow sound cannot be generated due to space rippling.
The fixed disk 25 is composed of an air suction inner ring 251, fine channels 252, a circular plate 253 and an air suction outer ring 254, the air suction inner ring 251 is arranged in the middle of the circular plate 253, the air suction inner ring 251 and the circular plate 253 are of an integrated structure, the inner diameter of the air suction outer ring 254 is larger than the outer diameter of the air suction inner ring 251, the air suction outer ring 254 is positioned on the outer surface of the circular plate 253, the air suction outer ring 254 and the air suction inner ring 251 are communicated through more than two fine channels 252, the fine channels 252 are uniformly and equidistantly distributed, the air suction inner ring 251 is communicated with the folding cylinder 24, the air suction inner ring 251 and the air suction outer ring 254 are adopted to simultaneously suck and adsorb the inside and the outside of a wafer, and the wafer is guaranteed to be uniformly adsorbed and not to be broken into two.
The outer cambered surface of top that the circular plate 253 is close to folding section of thick bamboo 24 is equipped with three removal frame 26, removal frame 26 and circular plate 253 adopt sliding fit, removal frame 26 comprises notch 261, spout 262, fan-shaped frame 264, notch 261 opens in circular plate 253, be equipped with spout 262 in the middle of the inside ground of notch 261 is positive, spout 262 and circular plate 253 are the integrated structure, fan-shaped frame 264 and notch 261 adopt sliding fit, and movable removal fan-shaped frame 264 extends its fan-shaped frame 264 outwards, expands the fixed diameter of circular plate 253, and it is wider to let fixed scope, and the atress is also more even when hydraulic system pushes down fixed wafer.
The end of the fan-shaped frame 264 close to the outer side is provided with a finger notch 263, and the finger notch 263 and the fan-shaped frame 264 are of an integrated structure, so that the inward and outward movement of the fan-shaped frame 264 is facilitated.
The fan-shaped frame 264 is a hollow fan-shaped structure, and has a large contact area with the edge of the wafer, so that the stress is more uniform.
The air volume adjusting ring 22 is arranged between the folding barrel 24 and the air inlet 21, the air volume adjusting ring 22 is mechanically connected with the main rod 23, the air volume adjusting ring 22 is composed of a rotating ring 221, an air port 222, a baffle 223 and a shell 224, the shell 224 is in rotating fit with the rotating ring 221, the baffle 223 is fixedly arranged on the inner wall of the shell 224, the baffle 223 and the inner wall of the shell 224 are horizontally fixed, the baffle 223 is of a triangular fan-shaped structure, the included angle of the circle center of the baffle 223 is smaller than 90 degrees, the baffle 223 is matched with the rotating ring 221, the air port 222 is an unsealed space in the horizontal space of the baffle 223, the passing component is adjusted by the overlapping degree of the rotating ring 221 and the baffle 223, the less the rotating ring 221 and the baffle 223 overlap, the smaller the air port 222 is, and the stronger the adsorption energy of the.
On the basis of embodiment one, movable removal fan-shaped frame 264, outwards extend its fan-shaped frame 264, the fixed diameter of extension circular slab 253, let fixed scope wider, the atress is also more even when hydraulic system pushes down fixed wafer, still can pass through the design of sponge piece 26, when pneumatic cylinder 3 pushed down, reduce the direct pressure to the wafer of pneumatic cylinder 3, it is too big to avoid its impact, the wafer directly breaks, and sponge piece 26 surface is smooth, can not cause the scratch to it after contacting with the wafer.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The utility model provides a wafer multistation edge polishing equipment which characterized in that: the structure of the polishing machine comprises a fixing rod (1), a polishing system (2), a hydraulic cylinder (3) and a machine body (4), wherein the top end face of the machine body (4) is provided with the two polishing systems (2), the hydraulic cylinder (3) is arranged right above the polishing system (2), the hydraulic cylinder (3) is mechanically connected with the polishing system (2), the top end of the machine body (4) is provided with the fixing rod (1), the polishing system (2) comprises an air inlet (21), a main rod (23), a folding cylinder (24), a fixing disc (25) and an operating platform (27), the operating platform (27) is fixed right above the machine body (4), the fixing disc (25) is arranged right above the operating platform (27), the top end face of the fixing disc (25) is provided with the folding cylinder (24), the folding cylinder (24) is of a hollow structure, the main rod (23) is installed at the top end of the folding cylinder (24), the main, the air inlet (21) is mechanically connected with the machine body (4).
2. The wafer multi-station edge polishing apparatus of claim 1, wherein: the folding cylinder (24) is of a structure with a narrow upper part and a wide lower part.
3. The wafer multi-station edge polishing apparatus of claim 1, wherein: the fixed disk (25) is composed of an air suction inner ring (251), a thin channel (252), a circular plate (253) and an air suction outer ring (254), the air suction inner ring (251) is arranged in the middle of the circular plate (253), the inner diameter of the air suction outer ring (254) is larger than that of the air suction inner ring (251), the air suction outer ring (254) is located on the outer surface of the circular plate (253), the air suction outer ring (254) is communicated with the air suction inner ring (251) through more than two thin channels (252), and the air suction inner ring (251) is communicated with the folding cylinder (24).
4. A wafer multi-station edge polishing apparatus according to claim 3, wherein: the cambered surface is equipped with three removal frame (26) outside the top that circular plate (253) are close to folding section of thick bamboo (24), remove frame (26) and circular plate (253) and adopt sliding fit, it comprises notch (261), spout (262), fan-shaped frame (264) to remove frame (26), notch (261) is opened in circular plate (253), be equipped with spout (262) in the middle of the inside ground of notch (261) is positive, fan-shaped frame (264) and notch (261) adopt sliding fit.
5. The wafer multi-station edge polishing apparatus of claim 4, wherein: the end of the fan-shaped frame (264) close to the outer side is provided with a finger notch (263).
6. The wafer multi-station edge polishing apparatus of claim 4 or 5, wherein: the fan-shaped frame (264) is of a hollow fan-shaped structure.
7. A wafer multi-station edge polishing apparatus according to claim 1 or 2, wherein: be equipped with air regulation ring (22) between folding section of thick bamboo (24) and air intake (21), air regulation ring (22) and mobile jib (23) mechanical connection, air regulation ring (22) comprises rotating ring (221), wind gap (222), baffle (223), casing (224) and rotating ring (221) normal running fit, the fixed baffle (223) that is equipped with on casing (224) inner wall, baffle (223) are the fan-shaped structure of triangle, baffle (223) and rotating ring (221) mutually support, and baffle (223) horizontal space in the unsealed space be wind gap (222).
8. A wafer multi-station edge polishing apparatus according to claim 3, wherein: the round plate (253) and the folding cylinder (24) are provided with sponge blocks (26) on the ground surface, and the sponge blocks (26) are attached to the round plate (253) in shape.
9. The wafer multi-station edge polishing apparatus of claim 8, wherein: the outer surface of the sponge block (26) is smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010023550.0A CN111168515B (en) | 2020-01-09 | 2020-01-09 | Wafer multistation edge polishing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010023550.0A CN111168515B (en) | 2020-01-09 | 2020-01-09 | Wafer multistation edge polishing equipment |
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| Publication Number | Publication Date |
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| CN111168515A true CN111168515A (en) | 2020-05-19 |
| CN111168515B CN111168515B (en) | 2021-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010023550.0A Active CN111168515B (en) | 2020-01-09 | 2020-01-09 | Wafer multistation edge polishing equipment |
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| CN105332992A (en) * | 2014-07-30 | 2016-02-17 | 睿励科学仪器（上海）有限公司 | Vacuum sucker |
| US20160240414A1 (en) * | 2013-09-26 | 2016-08-18 | Suss Microtec Lithography Gmbh | Chuck for Suction and Holding a Wafer |
| CN108723972A (en) * | 2017-04-20 | 2018-11-02 | 上海新昇半导体科技有限公司 | Edge grinding pedestal, edge grinding system and method based on bernoulli principle |
| CN109531332A (en) * | 2018-11-21 | 2019-03-29 | 湖南大合新材料有限公司 | A kind of quick clamping device for the polishing of gallium antimonide monocrystalline piece side |
| CN209065022U (en) * | 2018-09-30 | 2019-07-05 | 成都惠锋智造科技有限公司 | Circular saw adsorbent equipment |
| CN209273474U (en) * | 2018-12-31 | 2019-08-20 | 厦门精伟机械制造有限公司 | A kind of vapour-pressure type vacuum chuck |
| CN110394823A (en) * | 2019-09-03 | 2019-11-01 | 苏州日和科技有限公司 | A kind of manipulator sucker component |
| CN210452721U (en) * | 2019-07-02 | 2020-05-05 | 伍玩秋 | Automatic mechanical equipment for electrical assembly |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010041522A1 (en) * | 1995-06-09 | 2001-11-15 | Applied Materials, Inc. Delaware Corporation | Fluid-pressure regulated wafer polishing head |
| EP1029632A2 (en) * | 1999-02-17 | 2000-08-23 | Fujikoshi Kikai Kogyo Kabushiki Kaisha | Abrasive machine |
| US20160240414A1 (en) * | 2013-09-26 | 2016-08-18 | Suss Microtec Lithography Gmbh | Chuck for Suction and Holding a Wafer |
| CN105332992A (en) * | 2014-07-30 | 2016-02-17 | 睿励科学仪器（上海）有限公司 | Vacuum sucker |
| CN204160322U (en) * | 2014-10-29 | 2015-02-18 | 江苏惠宇玻璃有限公司 | A kind of automatic lens trim grinder sucker disk seat |
| CN108723972A (en) * | 2017-04-20 | 2018-11-02 | 上海新昇半导体科技有限公司 | Edge grinding pedestal, edge grinding system and method based on bernoulli principle |
| CN209065022U (en) * | 2018-09-30 | 2019-07-05 | 成都惠锋智造科技有限公司 | Circular saw adsorbent equipment |
| CN109531332A (en) * | 2018-11-21 | 2019-03-29 | 湖南大合新材料有限公司 | A kind of quick clamping device for the polishing of gallium antimonide monocrystalline piece side |
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| CN210452721U (en) * | 2019-07-02 | 2020-05-05 | 伍玩秋 | Automatic mechanical equipment for electrical assembly |
| CN110394823A (en) * | 2019-09-03 | 2019-11-01 | 苏州日和科技有限公司 | A kind of manipulator sucker component |
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| CN111168515B (en) | 2021-08-10 |
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