CN111163615A - External liquid cooling heat dissipation system of data center switch - Google Patents
External liquid cooling heat dissipation system of data center switch Download PDFInfo
- Publication number
- CN111163615A CN111163615A CN201911244955.0A CN201911244955A CN111163615A CN 111163615 A CN111163615 A CN 111163615A CN 201911244955 A CN201911244955 A CN 201911244955A CN 111163615 A CN111163615 A CN 111163615A
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- pipeline
- cooling liquid
- heat dissipation
- copper pipe
- water pump
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 69
- 238000001816 cooling Methods 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 title claims abstract description 36
- 239000000110 cooling liquid Substances 0.000 claims abstract description 79
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 claims abstract description 74
- 239000010949 copper Substances 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 69
- 239000002826 coolant Substances 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims description 32
- 230000000694 effects Effects 0.000 description 11
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Abstract
The invention provides an external liquid cooling heat dissipation system of a data center switch, which comprises a switch box body, wherein two sides of the switch box body are respectively provided with a cooling liquid pipeline, and the cooling liquid pipelines are connected with a water tank through a water pump; the switch box in be provided with the mainboard, be provided with on the mainboard and wait to dispel the heat the device, wait to be provided with the copper pipe on the heat dissipation device, the one end and the coolant pipe contact of copper pipe are connected, the copper pipe other end pass the switch box and wait to dispel the heat the surface contact of device and be connected for the heat of waiting to dispel the heat the device leads to the coolant pipe through the copper pipe. Because the cooling liquid pipelines are positioned at two sides of the box body of the exchanger, the control part of the heat dissipation system can change the flow speed and the flow of the liquid in the cooling liquid pipeline according to the temperatures of different parts, thereby improving the flexibility of the heat dissipation system, achieving the purpose of targeted heat dissipation and improving the utilization efficiency of the internal heat dissipation liquid.
Description
Technical Field
The invention relates to the technical field of a heat dissipation system of a data center switch, in particular to an external liquid cooling heat dissipation system of the data center switch.
Background
With the increase of data throughput of data centers, switches used in data centers are also developing in the direction of forwarding larger and faster traffic. The performance of the data center switch is enhanced, the heat dissipation capacity of each electronic element in the switch is gradually increased, and if the electronic element causes work interruption or even equipment damage due to insufficient heat dissipation, the electronic element is unacceptable for the data center with strict service reliability and stability requirements, so that the data center switch needs a set of reliable and effective heat dissipation system to ensure the reliable operation of self service.
At present, data center switches mostly adopt an internal air cooling mode, and compared with a liquid cooling mode, the effect is relatively poor, and larger noise is generated, so that the liquid cooling mode can be used for radiating electronic elements in the switches; however, when the liquid cooling form is adopted, the leakage of the pipeline due to the sealing problem may be caused, the heat dissipation effect of the liquid cooling is seriously affected, and even the equipment is damaged.
In order to reduce the influence caused by leakage of the liquid cooling pipeline, the layout of the liquid cooling pipeline cannot be designed more complicatedly, only one heat dissipation pipeline is often adopted, the heat dissipation effect cannot be exerted to the maximum extent, and the regulation and control flexibility in the heat dissipation process is also limited.
Disclosure of Invention
In order to reduce the influence caused by liquid cooling pipeline leakage and exert the maximum radiating effect, the invention provides an external liquid cooling radiating system of a data center switch.
The technical scheme of the invention is as follows:
the technical scheme of the invention provides an external liquid cooling heat dissipation system of a data center switch, which comprises a switch box body, wherein two sides of the switch box body are respectively provided with a cooling liquid pipeline, and the cooling liquid pipelines are connected with a water tank through a water pump;
the switch box in be provided with the mainboard, be provided with on the mainboard and wait to dispel the heat the device, wait to be provided with the copper pipe on the heat dissipation device, the one end and the coolant pipe contact of copper pipe are connected, the copper pipe other end pass the switch box and wait to dispel the heat the surface contact of device and be connected for the heat of waiting to dispel the heat the device leads to the coolant pipe through the copper pipe.
Preferably, one end of the copper pipe, which is in contact with the cooling liquid pipeline, is designed into a shape of a fin. So as to increase the heat dissipation area and enhance the heat dissipation effect.
Preferably, external pipeline shells are arranged on two sides of the exchanger box body, and the cooling liquid pipeline is arranged in the external pipeline shells.
Preferably, the device to be cooled comprises an optical module interface; the copper tube comprises an optical module interface copper tube; the cooling pipeline comprises an optical module interface cooling liquid pipeline; the water pump comprises an optical module pipeline water pump;
one end of the optical module interface copper pipe is in contact connection with the optical module interface cooling liquid pipeline; the other end of the optical module interface copper pipe penetrates through the switch box body to be in contact connection with the surface of the optical module interface, and the optical module interface cooling liquid pipeline is connected with the water tank through the optical module pipeline water pump.
Preferably, the device to be cooled comprises a CPU; the copper pipe comprises a CPU copper pipe; the cooling pipeline comprises a CPU cooling liquid pipeline; the water pump comprises a CPU pipeline water pump;
one end of the CPU copper pipe is in contact connection with a CPU cooling liquid pipeline; the other end of the CPU copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the CPU, and the CPU cooling liquid pipeline is connected with the water tank through the CPU pipeline water pump.
Preferably, the device to be cooled comprises a switching chip; the copper tube comprises an exchange chip copper tube; the cooling pipeline comprises an exchange chip cooling liquid pipeline; the water pump comprises a chip exchange pipeline water pump;
one end of the exchange chip copper pipe is in contact connection with an exchange chip cooling liquid pipeline; the other end of the exchange chip copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the exchange chip, and an exchange chip cooling liquid pipeline is connected with the water tank through an exchange chip pipeline water pump.
Preferably, the device to be cooled comprises a transformer; the copper pipe comprises a transformer copper pipe; the cooling pipeline comprises a transformer cooling liquid pipeline; the water pump comprises a transformer pipeline water pump
One end of the transformer copper pipe is in contact connection with a transformer cooling liquid pipeline; the other end of the transformer copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the transformer, and a transformer cooling liquid pipeline is connected with the water tank through a transformer pipeline water pump.
Preferably, the two sides of the exchanger box are respectively a first side and a second side;
the optical module interface cooling liquid pipeline and the CPU cooling liquid pipeline are arranged in an external pipeline shell on the first side of the switch box body;
and the exchange chip cooling liquid pipeline and the transformer cooling liquid pipeline are arranged in an external pipeline shell at the second side of the exchanger box body.
Preferably, a temperature sensor is arranged on the device to be cooled, the temperature sensor is connected with a controller, and the controller is connected with the water pump.
In order to solve the reliability of the liquid cooling heat dissipation system of the data center switch, the patent provides an external liquid cooling heat dissipation system matched with copper pipes and heat dissipation fins, the characteristic that the copper pipes can rapidly lead out heat generated by electronic elements is utilized, the heat of the electronic elements is conducted to cooling liquid pipelines positioned on two sides of a box body of the switch, and one ends of the copper pipes, which are in contact with the cooling liquid pipelines, are designed into the fins, so that the heat dissipation area is increased, and the heat dissipation effect is enhanced.
Meanwhile, the cooling liquid pipelines are located on two side faces of the box body of the data center switch, so that the safety of internal electronic components is not affected when the pipelines leak, and other devices inside the cabinet are prevented from being affected by leakage overflow to the maximum extent.
Because the coolant liquid pipeline is located the both sides of switch box, consequently the design can be more nimble, has designed different pipelines to the inside different important heat dissipation sources of data center switch, has different pipeline forms, also has different water pumps, and cooling system's control part can be according to the temperature of different parts in order to change the velocity of flow and the flow of the inside liquid of coolant liquid pipeline of place, improves cooling system's flexibility to reach the pertinence heat dissipation, and improve the utilization efficiency of inside coolant liquid. The normal work of other pipelines can not be influenced when a certain cooling liquid pipeline breaks down.
In order to improve the reliability of the heat dissipation pipelines, the double-pipeline design is adopted for all the cooling liquid pipelines, so that the problem that when one pipeline breaks down, the heat dissipation is insufficient, and the fault is caused is prevented. Meanwhile, in order to protect the pipelines positioned on the two sides of the switch from being damaged due to the influence of external force such as collision and the like, a metal protection shell matched with the switch is arranged outside the pipelines, and the heat dissipation pipelines are wrapped to protect the probability that the heat dissipation pipelines inside are damaged due to direct impact.
According to the technical scheme, the invention has the following advantages: the heat dissipation effect of electronic elements inside the switch is improved by using a water cooling mode, and meanwhile, the heat of the device is transferred to the cooling liquid pipelines on the two side surfaces outside the switch case by using a copper pipe and fin mode, so that the cooling liquid pipelines are moved to the outside while the heat dissipation effect of liquid cooling is ensured, the damage of the internal elements of the switch and other external equipment caused by faults such as pipeline leakage is prevented, and the reliability of the liquid cooling heat dissipation equipment is improved. On the other hand, in order to improve the flexibility of liquid cooling heat dissipation, the system adopts different heat dissipation pipelines for different heat dissipation electronic elements in the exchanger, and the heat dissipation pipelines are not interfered with each other, so that the reliability and the flexibility of a heat dissipation strategy are ensured.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic top view of an external liquid-cooling heat dissipation system of a data center switch according to an embodiment of the present invention.
Fig. 2 is a schematic side view of an external liquid-cooling heat dissipation system of a data center switch according to an embodiment of the present invention.
Fig. 3 is a connection block diagram of a heat dissipation system controller according to an embodiment of the invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The technical scheme of the invention provides an external liquid cooling heat dissipation system of a data center switch, which comprises a switch box body, wherein two sides of the switch box body are respectively provided with a cooling liquid pipeline, and the cooling liquid pipelines are connected with a water tank through a water pump;
the switch box body in be provided with the mainboard, be provided with on the mainboard and wait to dispel the heat the device, wait to be provided with the copper pipe on the heat dissipation device, the one end and the coolant liquid pipeline contact of copper pipe are connected, the copper pipe come one end pass the switch box body and wait to dispel the heat the surface contact of device and be connected for with heat through copper pipe leading-in coolant liquid pipeline. One end of the copper pipe, which is contacted with the cooling liquid pipeline, is designed into a shape of a fin. So as to increase the heat dissipation area and enhance the heat dissipation effect.
Example two
As shown in fig. 1 to 3, the technical solution of the present invention provides an external liquid-cooling heat dissipation system for a data center switch, where the differences between the system and the first embodiment include;
In this embodiment, the device to be cooled includes an optical module interface 1; the copper pipe comprises an optical module interface copper pipe 2; the cooling pipeline comprises an optical module interface cooling liquid pipeline 3; the water pump comprises a light module pipeline water pump 22;
one end of the optical module interface copper pipe 2 is in contact connection with an optical module interface cooling liquid pipeline 3; the other end of the optical module interface copper pipe 2 penetrates through the exchanger box body to be in contact connection with the surface of the optical module interface 1, and the optical module interface cooling liquid pipeline 3 is connected with the water tank 16 through an optical module pipeline water pump 22.
The device to be cooled comprises a CPU 6; the copper pipe comprises a CPU copper pipe 5; the cooling pipeline comprises a CPU cooling liquid pipeline 4; the water pump comprises a CPU pipeline water pump 7;
one end of the CPU copper pipe 5 is in contact connection with the CPU cooling liquid pipeline 4; the other end of the CPU copper pipe 5 penetrates through the box body of the exchanger to be in contact connection with the surface of the CPU6, and the CPU cooling liquid pipeline 4 is connected with the water tank 16 through a CPU pipeline water pump 7;
the device to be cooled comprises a switching chip 9; the copper tube comprises an exchange chip copper tube 10; the cooling pipeline comprises an exchange chip cooling liquid pipeline 13; a chip exchange pipeline water pump 15;
one end of the exchange chip copper pipe 10 is in contact connection with an exchange chip cooling liquid pipeline 13; the other end of the exchange chip copper pipe 10 penetrates through the exchanger box body to be in contact connection with the surface of the exchange chip 9, and an exchange chip cooling liquid pipeline 13 is connected with a water tank 16 through an exchange chip pipeline water pump 15;
the device to be cooled comprises a transformer 12; the copper pipe comprises a transformer copper pipe 11; the cooling pipeline comprises a transformer cooling liquid pipeline 14; the water pump comprises a transformer pipeline water pump 20;
one end of the transformer copper pipe 11 is in contact connection with a transformer cooling liquid pipeline 14; the other end of the transformer copper pipe 11 penetrates through the exchanger box body to be in contact connection with the surface of the transformer 12, and the transformer cooling liquid pipeline 14 is connected with the water tank 16 through a transformer pipeline water pump 20.
The two sides of the exchanger box 8 are respectively a first side and a second side;
the optical module interface cooling liquid pipeline 3 and the CPU cooling liquid pipeline 4 are arranged in an external pipeline shell 17 on the first side of the switch box body;
the exchange chip cooling liquid pipeline 13 and the transformer cooling liquid pipeline 14 are arranged in an external pipeline shell on the second side of the exchanger box body 8.
The device to be cooled is provided with a temperature sensor 18, the temperature sensor 18 is connected with a controller 19, and the controller is connected with the water pump. In this embodiment, all the water pumps are connected to the controller 19; the temperature sensor 18 detects the temperature of the device to be cooled, and the controller 19 controls the water pump connected with the corresponding cooling liquid pipeline to work according to the detected temperature and controls and adjusts the temperature by controlling the liquid flow and the flow speed in the cooling liquid pipeline.
In order to solve the reliability of the liquid cooling heat dissipation system of the data center switch, the patent provides an external liquid cooling heat dissipation system matched with copper pipes and heat dissipation fins, the characteristic that the copper pipes can rapidly lead out heat generated by electronic elements is utilized, the heat of the electronic elements is conducted to cooling liquid pipelines positioned on two sides of a box body of the switch, and one ends of the copper pipes, which are in contact with the cooling liquid pipelines, are designed into the fins, so that the heat dissipation area is increased, and the heat dissipation effect is enhanced.
Meanwhile, the cooling liquid pipelines are located on two side faces of the data center switch box body 8, so that the safety of internal electronic components cannot be influenced when the pipelines leak, and other equipment inside the cabinet is prevented from being influenced by leakage overflow to the maximum extent.
Because the coolant liquid pipeline is located the both sides of switch box 8, consequently the design can be more nimble, has designed different pipelines to the inside different important heat dissipation sources of data center switch, has different pipeline forms, also has different water pumps, and cooling system's control part can be according to the temperature of different parts in order to change the velocity of flow and the flow of the inside liquid of coolant liquid pipeline of place, improves cooling system's flexibility to reach the pertinence heat dissipation, and improve the utilization efficiency of inside coolant liquid. The normal work of other pipelines can not be influenced when a certain cooling liquid pipeline breaks down.
In order to improve the reliability of the heat dissipation pipelines, the double-pipeline design is adopted for all the cooling liquid pipelines, so that the problem that when one pipeline breaks down, the heat dissipation is insufficient, and the fault is caused is prevented.
In order to control the temperature of the heat dissipating device more accurately, flexibly and reliably, the controller 19 can control the water pump of the pipeline corresponding to the heat dissipating device according to the real-time temperature of the heat dissipating device read by the temperature sensor 18 on each heat dissipating device, a communication circuit is arranged between the sensor and the controller for transmitting data (such as I2C or SPI), the controller controls the water pump by controlling the current of the water pump, and the temperature sensor corresponding to each heat dissipating device is positioned on the heat dissipating device and directly contacted with the heat dissipating device.
When the temperature of the element read by the temperature sensor rises, the controller 19 executes a corresponding control algorithm (such as a PID method) according to the temperature rising trend, and increases the flow speed or flow rate of the cooling liquid in the pipeline for the water pump of the pipeline corresponding to the element so as to improve the heat dissipation effect of the element; when the temperature read by the sensor is reduced, the controller controls the water pump to reduce the flow and the flow speed of the corresponding pipeline, so that the energy and the cooling liquid are saved, and the heat dissipation flexibility is improved. The controller can adjust the water pumps corresponding to different components to realize flexible control of different components.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. An external liquid cooling heat dissipation system of a data center switch is characterized by comprising a switch box body, wherein two sides of the switch box body are respectively provided with a cooling liquid pipeline, and the cooling liquid pipeline is connected with a water tank through a water pump;
the switch box in be provided with the mainboard, be provided with on the mainboard and wait to dispel the heat the device, wait to be provided with the copper pipe on the heat dissipation device, the one end and the coolant pipe contact of copper pipe are connected, the copper pipe other end pass the switch box and wait to dispel the heat the surface contact of device and be connected for the heat of waiting to dispel the heat the device leads to the coolant pipe through the copper pipe.
2. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 1, wherein the end of the copper tube in contact with the cooling liquid pipe is designed in the shape of a fin.
3. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 1, wherein external pipe housings are disposed on both sides of the switch box, and the coolant pipe is disposed in the external pipe housings.
4. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 3, wherein the device to be cooled comprises an optical module interface; the copper tube comprises an optical module interface copper tube; the cooling pipeline comprises an optical module interface cooling liquid pipeline; the water pump comprises an optical module pipeline water pump;
one end of the optical module interface copper pipe is in contact connection with the optical module interface cooling liquid pipeline; the other end of the optical module interface copper pipe penetrates through the switch box body to be in contact connection with the surface of the optical module interface, and the optical module interface cooling liquid pipeline is connected with the water tank through the optical module pipeline water pump.
5. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 4, wherein the device to be cooled comprises a CPU; the copper pipe comprises a CPU copper pipe; the cooling pipeline comprises a CPU cooling liquid pipeline; the water pump comprises a CPU pipeline water pump;
one end of the CPU copper pipe is in contact connection with a CPU cooling liquid pipeline; the other end of the CPU copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the CPU, and the CPU cooling liquid pipeline is connected with the water tank through the CPU pipeline water pump.
6. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 5, wherein the device to be cooled comprises a switch chip; the copper tube comprises an exchange chip copper tube; the cooling pipeline comprises an exchange chip cooling liquid pipeline; the water pump comprises a chip exchange pipeline water pump;
one end of the exchange chip copper pipe is in contact connection with an exchange chip cooling liquid pipeline; the other end of the exchange chip copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the exchange chip, and an exchange chip cooling liquid pipeline is connected with the water tank through an exchange chip pipeline water pump.
7. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 6, wherein the device to be cooled comprises a transformer; the copper pipe comprises a transformer copper pipe; the cooling pipeline comprises a transformer cooling liquid pipeline; the water pump comprises a transformer pipeline water pump;
one end of the transformer copper pipe is in contact connection with a transformer cooling liquid pipeline; the other end of the transformer copper pipe penetrates through the exchanger box body to be in contact connection with the surface of the transformer, and a transformer cooling liquid pipeline is connected with the water tank through a transformer pipeline water pump.
8. The external liquid-cooled heat dissipation system of the data center switch as recited in claim 7, wherein the two sides of the switch box are respectively a first side and a second side;
the optical module interface cooling liquid pipeline and the CPU cooling liquid pipeline are arranged in an external pipeline shell on the first side of the switch box body;
and the exchange chip cooling liquid pipeline and the transformer cooling liquid pipeline are arranged in an external pipeline shell at the second side of the exchanger box body.
9. The external liquid cooling heat dissipation system of the data center switch as claimed in claim 1, wherein a temperature sensor is disposed on the device to be cooled, the temperature sensor is connected to a controller, and the controller is connected to the water pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911244955.0A CN111163615B (en) | 2019-12-06 | 2019-12-06 | External liquid cooling heat dissipation system of data center switch |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911244955.0A CN111163615B (en) | 2019-12-06 | 2019-12-06 | External liquid cooling heat dissipation system of data center switch |
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| Publication Number | Publication Date |
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| CN111163615A true CN111163615A (en) | 2020-05-15 |
| CN111163615B CN111163615B (en) | 2022-02-18 |
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| CN112325183A (en) * | 2020-07-08 | 2021-02-05 | 海洋王（东莞）照明科技有限公司 | Explosion-proof floodlight |
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| CN111163615B (en) | 2022-02-18 |
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