CN111156727A

CN111156727A - Oxygen reduction device, gas regulating system and refrigeration appliance

Info

Publication number: CN111156727A
Application number: CN201811322357.6A
Authority: CN
Inventors: 吴临远; 任相华; 仲伟
Original assignee: Bo Xihua Electric Jiangsu Co Ltd; BSH Hausgeraete GmbH
Current assignee: Bo Xihua Electric Jiangsu Co Ltd; BSH Hausgeraete GmbH
Priority date: 2018-11-07
Filing date: 2018-11-07
Publication date: 2020-05-15
Anticipated expiration: 2038-11-07
Also published as: CN111156727B

Abstract

An oxygen reduction device (5), a gas conditioning system and a refrigeration appliance (100), the oxygen reduction device (5) comprising: an electrolytic cell (51) and a heat shield (53), wherein: said electrolytic cell (51) being located within said heat shield (53); the heat shield (53) comprises a semiconductor cooling element with a hot end facing the electrolytic cell (51) and a cold end facing away from the electrolytic cell (51). By adopting the scheme, the placing flexibility of the oxygen reduction device can be improved.

Description

Oxygen reduction device, gas regulating system and refrigeration appliance

Technical Field

The embodiment of the invention relates to the technical field of refrigerators, in particular to an oxygen reduction device, a gas regulating system and a refrigerating appliance.

Background

At present, a refrigerator is generally adopted to refrigerate or freeze food so as to prolong the storage time of the food and delay the deterioration of the food. In order to further extend the storage period of food or improve the freshness of food, some methods of adjusting the atmosphere in the storage chamber by using an oxygen reduction device have been developed.

However, the oxygen reduction device generates heat during operation, and the refrigerator is a device for keeping the articles fresh through low temperature, so that the placement position of the oxygen reduction device in the refrigerator is limited, and the placement flexibility is low.

Disclosure of Invention

It is an object of embodiments of the present invention to improve the flexibility of placement of oxygen reduction devices.

To solve the above technical problem, an embodiment of the present invention provides an oxygen reduction device, including: an electrolytic cell and heat shield assembly, wherein: said electrolytic cell being located within said heat shield; the heat shielding device comprises a semiconductor refrigeration component, wherein the hot end of the semiconductor refrigeration component faces the electrolytic cell, and the cold end of the semiconductor refrigeration component faces away from the electrolytic cell.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

the electrolytic cell is positioned in the heat shielding device, the heat shielding device can shield the heat generated by the electrolytic cell to avoid heat dissipation, and the hot end of the semiconductor refrigeration part of the heat shielding device faces the electrolytic cell. The cold junction deviates from the electrolytic cell, the electrolytic cell is not influenced by the external environment by adopting the heat shielding device, the working environment temperature of the electrolytic cell can be improved, and the generated heat does not influence the external environment temperature, so that the placing flexibility of the oxygen reduction device can be improved.

In addition, when the heat generated by the electrolytic cell is prevented from being dissipated to the external environment, the working environment temperature of the electrolytic cell is improved, the working time of the electrolytic cell can be shortened by the higher environment temperature, and the working efficiency of the oxygen reduction device is improved.

Optionally, the heat shield is provided with a gas inlet, a gas outlet, a water inlet and a water outlet, wherein: the gas inlet is connected with the gas inlet channel of the electrolytic cell and is suitable for providing oxygen for the electrolytic cell; and/or the gas outlet is connected with the exhaust channel of the electrolytic cell and is suitable for discharging unreacted gas and water generated by the electrolytic cell in the oxygen reduction process; and/or the water inlet is connected with a water supply channel of the electrolytic cell and is suitable for supplying water to the electrolytic cell; and/or the water outlet is connected with the water drainage channel of the electrolytic cell and is suitable for discharging unreacted water and gas generated by the electrolytic cell in the oxygen reduction process.

Optionally, the heat shield apparatus further comprises: and a heat insulating part connected to the semiconductor cooling component.

Optionally, the heat insulation part is provided with a fixing part for fixing the electrolytic cell, so that the electrolytic cell can be prevented from shaking.

Optionally, the oxygen reduction device further comprises: and the heating device is positioned in the heat shielding device, so that the working environment temperature of the electrolytic cell can be improved, and the working efficiency of the electrolytic cell is improved.

Optionally, the electrolytic cell comprises: at least two sub-electrolytic cells are connected in series to form a galvanic pile; the sub-electrolytic cell includes: the catalyst layer is positioned between the proton exchange membrane and the anode plate and between the proton exchange membrane and the cathode plate, so that the current of the electrolytic cell can be reduced under the condition of not influencing the working performance of the electrolytic cell. Therefore, the integration difficulty of the electrolytic cell can be reduced, and the current can be reduced without an auxiliary current conversion device.

Optionally, the electrolytic cell further comprises: air feed channel, water supply channel, exhaust passage and drainage channel, wherein: the gas supply channel is respectively communicated with the gas inlets of the sub-electrolytic cells and provides oxygen for the cathode plates of the sub-electrolytic cells; and/or the water supply channel is respectively communicated with the water inlet of each sub-electrolytic cell and is used for supplying water to the anode plates of the sub-electrolytic cells; and/or the exhaust channel is respectively communicated with the exhaust port of each sub-electrolytic cell and is used for exhausting residual air and water generated by the cathode plate of the sub-electrolytic cell; and/or the water drainage channel is respectively communicated with the water drainage port of each sub-electrolytic cell and is used for draining residual water and gas generated by the anode plates of the sub-electrolytic cells.

Optionally, the electrolytic cell further comprises: and a first insulating layer positioned around the stack, the gas supply channel, the water supply channel, the gas exhaust channel, or the water discharge channel being positioned on the first insulating layer.

Optionally, the electrolytic cell further comprises: the fixed end plates are respectively arranged on two sides of the galvanic pile and are parallel to the galvanic pile. The fixed end plate can tightly press each sub-electrolytic cell, so that the looseness of the electrolytic cells is avoided.

Optionally, the fixed end plate includes an air inlet connection port, a water inlet connection port, an exhaust connection port, and a water discharge connection port, wherein: the air inlet connecting port is connected with the air supply channel; and/or the water inlet connecting port is connected with the water supply channel; and/or the exhaust connecting port is connected with the exhaust channel; and/or the drainage connecting port is connected with the drainage channel.

Optionally, the fixed end plate is provided with an opening for connecting a power supply.

Optionally, each sub-electrolytic cell in the stack is stacked, and a second insulating layer is arranged between two adjacent sub-electrolytic cells. The electric interference and short circuit between the sub-electrolytic cells can be avoided.

Optionally, the sub-electrolytic cell further comprises: electrically conductive board, baffle and gas diffusion layer, wherein: the fluidic plate is positioned between the electrically conductive plate and the gas diffusion layer.

Optionally, a sealing ring is disposed between the gas diffusion layer and the flow guide plate, so as to prevent leakage of water and gas.

Optionally, the fluidic plates include an outer fluidic plate and an inner fluidic plate, wherein the outer fluidic plate is positioned between the conductive plate and the inner fluidic plate, and the inner fluidic plate is positioned between the outer fluidic plate and the gas diffusion layer.

Optionally, a plurality of first notches are formed in the outer guide plate, a plurality of second notches are formed in the inner guide plate, and the first notches are intersected with the second notches.

Optionally, the electrolytic cell further comprises: and the pressure control device is connected with the sub-electrolytic cells and is used for detecting the voltage of the connected sub-electrolytic cells.

Optionally, the electrolytic cell further comprises: and the alarm device is connected with the pressure control device and is suitable for outputting alarm prompt when the voltage of the sub electrolytic cell detected by the pressure control device is higher than a threshold value.

An embodiment of the present invention further provides a gas conditioning system, including: air feeder, water supply installation, any one of above-mentioned oxygen reduction plant, wherein: the air supply device is connected with the oxygen reduction device and is suitable for inputting the air in the room to be conditioned of the refrigeration appliance to the oxygen reduction device; the water supply device is connected with the oxygen reduction device and is suitable for supplying water to the oxygen reduction device; the oxygen reduction device is suitable for electrolyzing oxygen in the air input by the air supply device to obtain water so as to reduce the oxygen content in the air input by the air supply device to obtain low-oxygen air, and the low-oxygen air is conveyed to the room to be conditioned.

Optionally, the gas conditioning system further comprises: and the water condensing device is connected with the oxygen reduction device and is suitable for condensing water in the hypoxic air, and the hypoxic air after water condensation is conveyed to the chamber to be conditioned.

Optionally, the water condensing device is connected with the water supply device, and water condensed by the water condensing device is delivered to the water supply device. The water obtained by condensation is delivered to the water supply device, so that the water is recycled, the service life of the water in the water supply device can be prolonged, and the water supplement frequency is reduced.

Optionally, the gas conditioning system further comprises: and the oxygen conveying device is suitable for conveying the oxygen generated by the oxygen reduction device into an aerobic chamber in the refrigeration appliance.

The embodiment of the invention also provides a refrigeration appliance comprising any one of the oxygen reduction devices.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects: because the cold junction of semiconductor refrigeration part and the indoor air contact of refrigeration utensil's compartment, can reduce the influence to compartment indoor temperature, and when avoiding the heat that the electrolytic cell produced to give off to external environment, improved the operational environment temperature of electrolytic cell, and higher ambient temperature can shorten the operating time of electrolytic cell, improves oxygen reduction device's work efficiency. Therefore, the working efficiency of the refrigeration appliance can be improved.

The embodiment of the invention also provides another refrigeration appliance comprising any one of the gas regulating systems.

Drawings

FIG. 1 is a schematic structural diagram of a refrigeration device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a gas conditioning system according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of another gas conditioning system in an embodiment of the invention;

FIG. 4 is a schematic diagram of the operation of a gas conditioning system in an embodiment of the present invention;

FIGS. 5 to 6 are schematic views of an electrolytic cell according to an embodiment of the present invention from different perspectives;

FIG. 7 is a schematic view of the structure of another electrolytic cell in the embodiment of the present invention;

FIG. 8 is a schematic diagram of an electrolytic cell in an embodiment of the present invention;

FIG. 9 is a schematic view showing the internal structure of an electrolytic cell according to an embodiment of the present invention;

FIG. 10 is an exploded view of a sub-electrolytic cell in an embodiment of the present invention;

FIGS. 11-12 are schematic structural diagrams of an oxygen reduction device in different viewing angles according to an embodiment of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the embodiments of the present invention comprehensible, specific embodiments accompanied with figures are described in detail below.

Embodiments of the present invention provide a gas conditioning system that may be used in a refrigeration appliance. With reference to fig. 1, the gas conditioning system can condition the composition of the atmosphere in the compartment 2 to be conditioned of the refrigeration appliance 100. For example, the oxygen content in the compartment 2 to be conditioned is reduced by the gas conditioning system to inhibit the respiration of some food materials, inhibit the proliferation of microorganisms and thus prolong the shelf life of the food.

The embodiment of the invention also provides an oxygen reduction device 5, and the oxygen reduction device 5 can be used for the refrigeration appliance 100 to adjust the oxygen content in the air in the compartment 2 to be regulated of the refrigeration appliance 100.

FIG. 2 is a schematic diagram of a gas conditioning system according to an embodiment of the present invention. FIG. 3 shows a schematic diagram of another gas conditioning system according to an embodiment of the present invention. Fig. 4 shows a schematic diagram of the operation of a gas conditioning system according to an embodiment of the invention. FIGS. 5 to 6 are schematic views of an electrolytic cell according to an embodiment of the present invention at different viewing angles. FIG. 7 is a schematic view showing the structure of another electrolytic cell in the embodiment of the present invention. FIG. 8 is a schematic diagram of an electrolytic cell in an embodiment of the present invention. FIG. 9 is a schematic view showing the internal structure of an electrolytic cell according to an embodiment of the present invention. FIG. 10 is an exploded view of a sub-electrolytic cell in an embodiment of the present invention. FIGS. 11-12 are schematic structural diagrams of an oxygen reduction device in different viewing angles according to an embodiment of the present invention. The specific structure, operation principle and flow of the gas conditioning system and the oxygen reduction device are described below with reference to fig. 1 to 12.

With reference to fig. 11 and 12, in an implementation, the oxygen reduction device 5 may include: an Electrolytic Cell (Electrolytic Cell)51 and a heat shield 53. The electrolytic cell 51 may be an electrolytic cell having an oxygen-consuming cathode, the electrolytic cell 51 being located within the heat shield 53; the heat shield 53 may comprise a semi-conductor cooling member with a hot end facing the electrolytic cell 51 and a cold end facing away from the electrolytic cell 51.

The heat shield device can reduce the influence of the external environment on the electrolytic cell, improve the working environment temperature of the electrolytic cell, reduce the influence of the heat generated by the electrolytic cell on the external environment temperature, and further improve the placement flexibility of the oxygen reduction device. In addition, when the heat generated by the electrolytic cell is prevented from being dissipated to the external environment, the working environment temperature of the electrolytic cell is improved, the working time of the electrolytic cell can be shortened by the higher environment temperature, and the working efficiency of the oxygen reduction device is improved.

When the oxygen reduction device 5 is placed in the to-be-conditioned chamber 2 of the refrigeration appliance 100, the cold end of the semiconductor refrigeration component is in contact with the gas in the to-be-conditioned chamber 2 of the refrigeration appliance 100, so that the influence caused by the temperature in the to-be-conditioned chamber 2 can be reduced. And the hot end of the semiconductor refrigeration component faces the electrolytic cell 51, so the low temperature in the chamber 2 to be regulated of the refrigeration appliance 100 does not affect the work of the electrolytic cell 51, thereby improving the flexibility of placing the oxygen reduction device 5 and improving the work efficiency of the refrigeration appliance 100.

Referring to fig. 11 and 12, the heat shielding device 53 is provided with a gas inlet 53c, a gas outlet 53d, a water inlet 53f, and a water outlet 53 e. The gas inlet 53c and the gas outlet 53d may be located on one end surface 53a of the heat shield 53, and the water inlet 53f and the water outlet 53e may be located on the other end surface 53b of the heat shield 53. The gas inlet 53c is connected to a gas supply channel 521 of the electrolytic cell 51, and can provide oxygen for the electrolytic cell 51; the gas outlet 53d is connected to the exhaust passage 523 of the electrolytic cell 51, and can exhaust unreacted gas and water generated in the oxygen reduction process of the electrolytic cell 51; the water inlet 53f is connected to a water supply passage 522 of the electrolytic cell 51, and can supply water to the electrolytic cell 51; the water outlet 53e is connected to a drain passage 524 of the electrolytic cell 51, and can drain unreacted water and gas generated from the electrolytic cell 51 during the oxygen reduction process.

The semiconductor refrigeration component can form a closed space to enclose the electrolytic cell 51, or the semiconductor refrigeration component can form a semi-closed space to partially enclose the electrolytic cell 51.

In an embodiment of the present invention, the heat shielding device 53 may further include: and a heat insulating part connected to the semiconductor cooling component. The thermal insulation part and the semiconductor refrigeration component can partially or completely surround the electrolytic cell 51. For example, the heat shielding device 53 has a hexahedral shape, the periphery of which can be made using the semiconductor refrigeration parts, and the top and bottom surfaces of which can be made using the heat insulating parts. In practical applications, the shape of the heat shielding device 53 may be set to other regular or irregular shapes according to the position of the oxygen reduction device 5 to be placed.

The heat insulating portion may be provided with a fixing portion (not shown) for fixing the electrolytic cell 51. The electrolytic cell 51 can be fixed by a fixing portion to prevent the electrolytic cell 51 from shaking.

In order to further improve the working efficiency of the electrolytic cell 51, in the embodiment of the present invention, a heating device (not shown in the figure) may be further disposed in the heat shielding device 53, the heating device may increase the temperature of the environment in which the electrolytic cell 51 is located, and since the electrolytic rate of the electrolytic cell 51 is increased in the environment with a higher temperature, the working efficiency of the electrolytic cell 51 may be increased, so that the working efficiency of the oxygen reduction device 5 may be increased.

In the embodiment of the present invention, the oxygen reduction device 5 may include an electrolytic cell 51, and the electrolytic cell 51 may include a Proton Exchange Membrane (PEM) having Proton conductivity and a cathode plate 532 and an anode plate 531 at both sides of the PEM. The water supply device 6 supplies water to the anode plate 531 of the electrolytic cell 51, when the oxygen reduction device 5 works, the water is electrolyzed into oxygen atoms and hydrogen ions, the oxygen atoms are combined to form oxygen gas on the anode plate 531, the hydrogen ions obtained by electrolysis are transported to the cathode plate 532 through the PEM, the hydrogen ions react with the oxygen gas in the air of the cathode plate 532 to obtain water, so that the content of the oxygen gas in the air can be reduced, low-oxygen air is obtained, the obtained low-oxygen air is sent back to the chamber 2 to be regulated of the refrigeration device 100, the content of the oxygen gas in the chamber 2 to be regulated can be reduced, and the adjustment of the gas components in the chamber 2 to be regulated is realized.

In practical application, the current of the electrolytic cell is high, and when the electrolytic cell is used in a household appliance, the electrolytic cell cannot be directly used due to the high current, so that the integration of the electrolytic cell is difficult, and an auxiliary current conversion device is generally needed to reduce the current. In order to simplify the difficulty of integrating the electrolytic cells in the household appliance, referring to fig. 7 and 8, in an embodiment of the present invention, the electrolytic cell 51 may include a stack 510 formed by connecting at least two sub-electrolytic cells 511 in series. The sub-electrolytic cell 511 includes: a proton exchange membrane 533, an anode plate 531, a cathode plate 532, and a catalyst layer, wherein the proton exchange membrane 533 is located between the anode plate 531 and the cathode plate 532, and the catalyst layer is located between the proton exchange membrane 533 and the anode plate 531, and between the proton exchange membrane 533 and the cathode plate 532.

The cathode plate 532 of one sub-electrolytic cell 511 of the two adjacent sub-electrolytic cells 511 is connected with the anode plate 531 of the other sub-electrolytic cell 511, so that the two adjacent sub-electrolytic cells 511 are connected in series. The connected sub-cells 511 may be connected by a conductive part 8, wherein the conductive part 8 may be: wires, metal sheets, etc., and may also be other conductive devices.

The electrolytic cell 51 is configured as a stack 510 consisting of at least two sub-electrolytic cells 511, when the electrolytic cell 51 electrolyzes the same amount of water, the area of the catalyst layer of each sub-electrolytic cell 511 is smaller than that of the existing electrolytic cell, and since the magnitude of the current is positively correlated with the area of the catalyst layer, the same voltage is applied, and the current of the sub-electrolytic cell 511 is smaller than that of the existing electrolytic cell. The number of the sub-electrolytic cells 511 connected in series can be set according to the amount of the electrolytic water required by the electrolytic cell 51, and since the sub-electrolytic cells 511 in the electrolytic cell 51 provided by the embodiment of the present invention are connected in series, the current of the electrolytic cell 51 can be reduced without affecting the working performance of the electrolytic cell 51. This reduces the integration difficulty of the electrolytic cell 51 and also reduces the current level without the aid of auxiliary current switching devices.

Referring to fig. 9, there is shown a schematic view of the internal structure of an electrolytic cell in an embodiment of the present invention. The electrolytic cell 51 may include a gas supply passage 521, a water supply passage 522, a gas exhaust passage 523, and a water discharge passage 524.

In an embodiment of the present invention, each sub-electrolytic cell 511 may include: air inlet, water inlet, gas vent and outlet. The gas supply channel 521 may be communicated with the gas inlet of each sub-electrolytic cell 511, respectively, to supply oxygen to the cathode plate 532 of the sub-electrolytic cell 511. The water supply channel 522 may be respectively communicated with the water inlet of each sub-electrolytic cell 511 to supply water to the anode plates 531 of the sub-electrolytic cells 511. The exhaust passage 523 may be communicated with the exhaust port of each sub-electrolytic cell 511, respectively, for exhausting water generated from the cathode plate 532 of the sub-electrolytic cell 511, as well as unreacted gas. The water discharge passage 524 may be communicated with a water discharge port of each sub-electrolytic cell 511, respectively, for discharging unreacted water, and gas generated from the anode plates 531 of the sub-electrolytic cells 511. The air supply passage 521 and the air discharge passage 523 may communicate, and the water supply passage 522 and the water discharge passage 524 may communicate.

In specific implementation, the air inlet of each sub-electrolytic cell 511 may also correspond to a respective air supply channel 521; the water inlet of each sub-electrolytic cell 511 can also correspond to a respective water supply channel 522; the exhaust port of each sub-electrolytic cell 511 can also correspond to a respective exhaust channel 523; there may also be a respective drainage channel 524 for each sub-cell 511. It should be understood that, in practical applications, the air supply channel 521, the water supply channel 522, the air exhaust channel 523 and the water exhaust channel 524 of the electrolytic cell 51 may also have other arrangements and connection manners, which only needs to provide air and water for the electrolytic cell 51 and exhaust the water and air generated by the electrolytic cell 51, and the specific arrangement manner of the air supply channel 521, the water supply channel 522, the air exhaust channel 523 and the water exhaust channel 524 may be set according to practical application scenarios.

Referring to fig. 7 and 9, in an implementation, the electrolytic cell 51 may further include: a first insulating layer 517 around the stack 510, and the air supply channel 521, the water supply channel 522, the air discharge channel 523, or the water discharge channel 524 may be on the first insulating layer 517.

The first insulating layer 517 may be perpendicular to the stack 510, and may insulate the external electrical interference with the electrolytic cell 51. A groove may be formed on the first insulating layer 517, and the groove may be used to place a pipeline corresponding to the air supply channel 521, the water supply channel 522, the air exhaust channel 523, or the water drain channel 524.

In order to improve the fixing stability of the electrolytic cell 51 and avoid the loosening of the sub-electrolytic cells 511 in the group of electrolytic cells 51, the electrolytic cell 51 may further include two fixing end plates 516, and the number of the fixing end plates 516 may be two, and the two fixing end plates are respectively located on two sides of the electric pile 510 and are parallel to the electric pile 510. After the sub-electrolytic cells 511 are connected in series to form the stack 510, the fixed end plates 516 may be pressed on both sides of the stack 510, and the fixed end plates 516 may be provided with connection holes, and the two fixed end plates 516 may be fixed by using fasteners such as screws to cooperate with the connection holes, so as to press the plurality of sub-electrolytic cells 511 located between the two fixed end plates 516.

In a specific implementation, the fixed end plate 516 may be provided with an air inlet connection port 512, an air inlet connection port 515, an air outlet connection port 513, and a water outlet connection port 514.

In the embodiment of the present invention, the air inlet connection port 512 may be connected to the air supply channel 521, the water inlet connection port 515 may be connected to the water supply channel 522, the air outlet connection port 513 may be connected to the air outlet channel 523, and the water outlet connection port 514 may be connected to the water outlet channel 524.

An opening 516a for connecting a power supply is formed in the fixed end plate 516, and the power supply can be connected with the electrolytic cell 51 through the opening 516a to supply power to the electrolytic cell 51. Specifically, the power sources are connected to 2 sub-electrolytic cells 511 at both ends in the stack, respectively.

A second insulating layer 518 may be provided between adjacent sub-cells 511 to isolate the adjacent sub-cells 511 from short circuits.

Referring to fig. 10, which shows an exploded view of a sub-electrolytic cell in an embodiment of the present invention, the sub-electrolytic cell 511 may further include: conductive plate 534, fluidic plate 535, and gas diffusion layer 536.

The conductive plate 534 may be connected to a power source to provide power to the electrolytic cell 51. The fluidic plate 535 is located between the conductive plate 534 and the gas diffusion layer 536. The baffle 535 may direct the flow of water or gas. The baffle 535 can be a treated graphite plate. The gas diffusion layer 536 may guide the diffusion of the gas, and the gas diffusion layer 536 may be carbon paper.

In a specific implementation, the fluidic plates 535 can include an outer fluidic plate 5351 and an inner fluidic plate 5352, wherein the outer fluidic plate 5351 is located between the conductive plate 534 and the inner fluidic plate 5352, and the inner fluidic plate 5352 is located between the outer fluidic plate 5351 and the gas diffusion layer 536.

The outer guide plate 5351 is provided with a plurality of first notches 5351a, the inner guide plate 5352 is provided with a plurality of second notches 5352a, and the first notches 5351a and the second notches are intersected 5352 a.

In the specific implementation, a gas diffusion layer 536 and a gas guide plate 535 are arranged on one side of the cathode plate 532, and a gas diffusion layer 536 and a gas guide plate 535 are also arranged on one side of the anode plate 531, that is, the gas diffusion layer 536 and the gas guide plate 535 are symmetrically arranged on two sides of the PEM with the PEM as the center. According to the characteristics of the electrolytic reaction generated by the cathode plate 532 and the anode plate 531, two horizontal first notches 5351a are formed at two ends of the outer guide plate 5351 arranged at one side of the cathode plate 532, and a plurality of second notches 5352a perpendicular to the first notches 5351a are formed in the inner guide plate 5352, so that the diffusion of the supplied gas can be facilitated. The outer guide plate 5351 arranged on one side of the anode plate 531 is provided with a first notch 5351a in the vertical direction, and the inner guide plate 5352 is provided with a plurality of second notches 5352a perpendicular to the first notches 5351a, so that the diffusion speed of water provided by the water supply device 6 can be improved.

In order to avoid water and gas leakage, the sub-electrolytic cell 511 may further include a sealing ring 537, and the sealing ring 537 is located between the gas diffusion layer 536 and the inner flow guide plate 5352. The inner ring of the sealing ring 537 may have an opening size smaller than the inner baffle 5352, but the outer ring of the sealing ring 537 has a size larger than the outer circumference size of the inner baffle 5352.

In a particular implementation, an isolation plate 538 is disposed between the fixed end plate 516 and the conductive plate 534, and the isolation plate 538 may provide electrical isolation between the fixed end plate 516 and the conductive plate 534.

In a specific implementation, referring to fig. 8, the electrolytic cell 51 may further include: and a pressure control device 54 connected to the sub-electrolytic cell 511, wherein the pressure control device 54 can detect the voltage of the connected sub-electrolytic cell 511. A corresponding pressure control device 54 may be provided for each sub-cell 511. When the pressure control device 54 detects that the voltage of the sub-electrolytic cell 511 connected thereto exceeds the threshold value, the alarm device connected to the pressure control device 54 can issue an alarm prompt, so that the use safety of the electrolytic cell 51 can be improved, and the potential safety hazard caused by hydrogen leakage can be avoided.

In a specific implementation, the gas conditioning system may include: a gas supply device 4, a water supply device 6 and an oxygen reduction device 5. The oxygen reduction device may adopt the oxygen reduction device 5 provided in any of the above embodiments of the present invention, and the specific structure, the working principle, and the process thereof may refer to the description in any of the above embodiments of the present invention, and are not described herein again.

In a specific implementation, the air supply device 4 is connected to the oxygen reduction device 5, and may input the air in the compartment 2 to be conditioned of the refrigeration appliance 100 to the oxygen reduction device 5, and the air supply device 4 may include an air pump, an air extractor, and the like. The water supply device 6 is connected with the oxygen reduction device 5 and can provide water for the oxygen reduction device 5. The oxygen reduction device 5 can reduce oxygen in the air input by the air supply device 4 into water so as to reduce the oxygen content in the air input by the air supply device 4 to obtain low-oxygen air, and the obtained low-oxygen air is conveyed to the room 2 to be conditioned.

According to the scheme, the oxygen in the air in the room to be conditioned is reduced through the oxygen reduction device in the gas regulating system, the oxygen content is reduced, the obtained low-oxygen air is input into the room to be conditioned so as to inhibit the respiration of food, the oxidation of the air to the food is reduced, and the freshness keeping time of the food can be prolonged.

Water may be present in the hypoxic air as water vapor due to the heat generated during electrolysis. After the hypoxic air containing water vapor is conveyed to the to-be-conditioned chamber 2, water accumulation in the to-be-conditioned chamber 2 is easily caused, and in order to solve the problem of water accumulation in the to-be-conditioned chamber 2, in the embodiment of the present invention, the gas conditioning system may further include: and a water condensing device 3. The water condensing device 3 is connected with the oxygen reduction device 5, can condense water vapor in the hypoxic air, and the hypoxic air after water condensation is conveyed to the room 2 to be conditioned. Will through condensing water device 3 water in the hypoxemia air condenses to can reduce to wait to carry to wait to transfer the water content in the hypoxemia air of room 2, can reduce the humidity of air, so can avoid waiting to transfer interior ponding of room 2.

The water condensation device 3 is not shown in fig. 2 and 3, and the water condensation device 3 may be connected to the oxygen reduction device 5, or may be located between the oxygen reduction device 5 and the water supply device 6, and connected to the oxygen reduction device 5 and the water supply device 6, respectively.

In specific implementation, the water condensing device 3 can be connected with the water supply device 6, water vapor in the hypoxic air is condensed into water after passing through the water condensing device 3, the condensed water is conveyed to the water supply device 6, and the water is recycled, so that the service life of the water in the water supply device 6 can be prolonged, and the supplement frequency of the water is reduced.

In a specific implementation, the water condensation device 3 can be composed of a plurality of bent pipes, and the pipes of the water condensation device 3 are designed into a winding pattern, so that the air path of a water cooling area can be increased, and therefore, water vapor can be effectively condensed. When the hypoxic air flows through the curve, water vapor can be condensed into water when meeting cold, and the water obtained by condensation is trapped at the bottom of the pipeline, so that the separation of the air and the water is realized, and the water vapor content in the hypoxic air is reduced.

In the refrigeration device 100, some food materials containing more hemoglobin, such as lean meat, can be beneficial to maintaining the color of the food materials in an oxygen-rich environment, and in order to make good use of resources, the gas conditioning system may further include an oxygen delivery device (not shown in the figure) that can deliver the oxygen generated by the oxygen reduction device 5 to an aerobic chamber in the refrigeration device 100.

The water supply mechanism 6, the gas supply mechanism 4, the oxygen reduction device 5 and the water condensation device 3 can be placed in a mechanical chamber of the refrigeration appliance 100. The oxygen reduction device 5 may also be placed in the storage compartment, and may be specifically configured according to the type of oxygen reduction device 5 and the specific configuration of the refrigeration appliance 100.

In a specific implementation, the gas conditioning system may be operated intermittently, and may be stopped when the oxygen content in the compartment 2 to be conditioned of the refrigeration appliance 100 reaches a set oxygen content. The specific value of the set oxygen content can be set according to different articles stored in the room 2 to be regulated or according to the required storage period. For example, the gas conditioning system can be controlled to stop working after the oxygen content in the compartment 2 to be conditioned has decreased from 21% to 5%.

In the specific implementation, the amount of oxygen reduced is related to the current, so that whether the oxygen content in the chamber 2 to be regulated reaches the set oxygen content can be determined through the working time of the oxygen reduction device 5 so as to determine the start and stop of the oxygen reduction device 5; an oxygen detection device can be arranged in the chamber 2 to be regulated to detect the oxygen content so as to determine the start and stop of the oxygen reduction device 5; the start and stop of the oxygen reduction device 5 can also be determined by detecting the opening and closing times and the opening duration of the door of the chamber 2 to be regulated. It will be appreciated that in practice, the start-stop of the oxygen reduction device 5 may be determined in other ways.

To facilitate a better understanding and realization of embodiments of the present invention by those skilled in the art, the following description will be given with reference to specific embodiments.

Referring to fig. 2 to 4, the water supply device 6 may include a water pump 62 and a water tank 61. The water pump 62 can make the water in the water tank 61 enter the water supply channel 522 through the water inlet 53f on the heat shield 53 of the oxygen reduction device 5 and through the water inlet connection port 515 of the electrolytic cell 51, so as to reach the anode plate 531 of the sub electrolytic cell 511 through the water inlet of each sub electrolytic cell 511 in the electrolytic cell 51, the water is electrolyzed at the anode plate 531 of each sub electrolytic cell 511 to obtain hydrogen ions and oxygen atoms, the hydrogen ions are transported to the cathode plate 532 of the sub electrolytic cell 511 through the PEM, the oxygen atoms are combined to form oxygen, the oxygen formed by each sub electrolytic cell 511 can be converged to the water discharge channel 524 of the electrolytic cell 51 along with the unreacted water through the water discharge port and is discharged out of the oxidation reduction device through the water discharge connection port 514 from the water outlet 53e of the heat shield 53, the obtained oxygen can be directly discharged out of the refrigeration apparatus 100, and the obtained oxygen can be recycled, for example, the generated oxygen is introduced into the aerobic chamber, the oxygen content of the aerobic compartment is increased so that the proportion of the oxygen content in the air is higher than 21%. Since the electrolytic cell 51 emits heat during operation and the ambient temperature is high, there is a possibility that water vapor may be mixed in oxygen, and oxygen generated from the anode plate 531 of the sub-electrolytic cell 511 may be fed into the water tank 61 to remove the water vapor mixed in the oxygen and improve the dryness of the oxygen.

The air supply device 4 inputs the air in the chamber 2 to be conditioned to the air supply channel 521 through the air inlet 53c of the heat shielding device 53 and the air inlet connecting port 512 of the electrolytic cell 51, and conveys the air in the chamber 2 to be conditioned to the air inlet of each sub-electrolytic cell 511 through the air supply channel 521, so as to reach the cathode plate 532 of each sub-electrolytic cell 511, and oxygen in the air reacts with hydrogen ions in the cathode plate 532 to generate water and obtain low-oxygen air. The water turns into water vapor at high temperature and is discharged from the exhaust port of each sub-electrolytic cell 511 along with the hypoxic air, and is discharged from the oxygen reduction device 5 through the exhaust passage 523 of the electrolytic cell 51 and the gas outlet 53d of the heat shield 53. The resulting hypoxic air can be fed into the room 2 to be conditioned via a pipe, thereby reducing the oxygen content of the air in the room 2 to be conditioned.

In order to avoid the vapor in the hypoxemia air to cause treating transferring 2 interior ponding in the room, the obtained hypoxemia air that thoughtlessly has vapor can let in to congeal water installation 3, through congealing water installation 3 back, vapor is condensed, can carry out the drying to the hypoxemia air, and the hypoxemia air after being dried lets in treating transferring 2 backs, can avoid treating transferring 2 interior ponding in the room. The condensed water in the water condensing device 3 may be input to the water tank 61 to be recycled again.

In the process of adjusting the oxygen content in the air in the room 2 to be adjusted, the reduction of oxygen is mainly realized by the decomposition and the generation of water under the action of the electrolytic cell 51, the decomposition and the generation of water basically keep dynamic balance, and in the process, no other substances appear, the water quality is not influenced, and the water is recycled, so that the service life of the gas adjusting system can be prolonged, and frequent water addition is not needed.

In addition, in the embodiment of the present invention, capillary effect woven material may be used instead of the water pump 62 for water supply. The water pump 62 may also be of the peristaltic type so that a continuous supply of water is achieved and the flow of water can be precisely controlled.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. An oxygen reduction device (5), comprising: an electrolytic cell (51) and a heat shield (53), wherein:

said electrolytic cell (51) being located within said heat shield (53);

the heat shield (53) comprises a semiconductor cooling element with a hot end facing the electrolytic cell (51) and a cold end facing away from the electrolytic cell (51).

2. The oxygen reduction device (5) according to claim 1, characterized in that the heat shield (53) is provided with a gas inlet (53c), a gas outlet (53d), a water inlet (53f) and a water outlet (53e), wherein:

the gas inlet (53c) is connected with a gas supply channel (521) of the electrolytic cell (51) and is suitable for supplying oxygen to the electrolytic cell (51); and/or the presence of a gas in the gas,

the gas outlet (53d) is connected with the exhaust channel (523) of the electrolytic cell (51) and is suitable for discharging unreacted gas and water generated by the electrolytic cell (51) in the oxygen reduction process; and/or the presence of a gas in the gas,

-said water inlet (53f) connected to a water supply channel (522) of said electrolytic cell (51) adapted to supply said electrolytic cell (51) with water; and/or the presence of a gas in the gas,

the water outlet (53e), connected to the water discharge channel (524) of the electrolytic cell (51), is adapted to discharge unreacted water and gases generated by the electrolytic cell (51) during oxygen reduction.

3. The oxygen reduction device (5) according to claim 1, characterized in that the heat shield device (53) further comprises: and a heat insulating part connected to the semiconductor cooling component.

4. The oxygen reduction device (5) according to claim 3, characterized in that the insulation is provided with a fixing portion for fixing the electrolytic cell (51).

5. The oxygen reduction device (5) according to claim 1, further comprising: heating means located within said heat shield means (53).

6. The oxygen reduction device (5) according to any one of claims 1 to 5, wherein the electrolytic cell (51) comprises: a stack (510) of at least two sub-cells (511) connected in series; the sub-electrolytic cell (511) comprises: a proton exchange membrane (533), an anode plate (531), a cathode plate (532), and a catalyst layer, wherein the proton exchange membrane (533) is located between the anode plate (531) and the cathode plate (532), and the catalyst layer is located between the proton exchange membrane (533) and the anode plate (531), and between the proton exchange membrane (533) and the cathode plate (532).

7. The oxygen reduction device (5) according to claim 6, wherein the electrolytic cell further comprises: an air supply channel (521), a water supply channel (522), an air discharge channel (523), and a water discharge channel (524), wherein:

the gas supply channel (521) is respectively communicated with the gas inlet of each sub-electrolytic cell (511) and is used for supplying oxygen to the cathode plate (532) of the sub-electrolytic cell (511); and/or the presence of a gas in the gas,

the water supply channel (522) is respectively communicated with the water inlet of each sub-electrolytic cell (511) and is used for supplying water to the anode plates (531) of the sub-electrolytic cells (511); and/or the presence of a gas in the gas,

the exhaust channel (523) is respectively communicated with the exhaust port of each sub-electrolytic cell (511) and is used for exhausting residual air and water generated by the cathode plate (532) of the sub-electrolytic cell (511); and/or the presence of a gas in the gas,

the drainage channel (524) is respectively communicated with the drainage port of each sub-electrolytic cell (511) and is used for draining residual water and gas generated by the anode plate (531) of the sub-electrolytic cell (511).

8. An oxygen reduction device according to claim 7, wherein the electrolytic cell (51) further comprises: a first insulating layer (517) located around the stack (510), the gas supply channel (521), the water supply channel (522), the gas exhaust channel (523), or the water drain channel (524) being located on the first insulating layer (517).

9. The oxygen reduction device (5) according to claim 7, wherein the electrolytic cell (51) further comprises: the fixed end plates (516) are respectively arranged on two sides of the electric pile (510), and the fixed end plates (516) are parallel to the electric pile (510).

10. The oxygen reduction device (5) according to claim 9, wherein the stationary end plate (516) comprises: air inlet connection mouth (512), water inlet connection mouth (515), exhaust connection mouth (513) and drainage connection mouth (514), wherein:

the air inlet connecting port (512) is connected with the air supply channel (521); and/or the presence of a gas in the gas,

the water inlet connecting port (515) is connected with the water supply channel (522); and/or the presence of a gas in the gas,

the exhaust connection port (513) is connected to the exhaust channel (523); and/or the presence of a gas in the gas,

the drain connection port (514) is connected to the drain channel (524).

11. The oxygen reduction device (5) according to claim 9, wherein the stationary end plate (516) is provided with an opening (516a) for connection to a power supply.

12. The oxygen reduction device (5) according to claim 6, wherein each sub-cell (511) in the stack (510) is stacked, and a second insulating layer (518) is provided between two adjacent sub-cells (511).

13. The oxygen reduction device (5) according to claim 6, wherein the sub-electrolytic cell (511) further comprises: a conductive plate (534), a fluidic plate (535), and a gas diffusion layer (536), wherein: the fluidic plate (535) is located between the conductive plate (534) and the gas diffusion layer (536).

14. The oxygen reduction device (5) according to claim 13, characterized in that a sealing ring (537) is arranged between the gas diffusion layer (536) and the flow guide plate (535).

15. The oxygen reduction device (5) of claim 13, wherein the fluidic plates (535) comprise an outer fluidic plate (5351) and an inner fluidic plate (5352), wherein the outer fluidic plate (5351) is located between the electrically conductive plate (534) and the inner fluidic plate (5352), and the inner fluidic plate (5352) is located between the outer fluidic plate (5351) and the gas diffusion layer (536).

16. The oxygen reduction device (5) according to claim 15, wherein the outer baffle (5351) is provided with a plurality of first notches (5351a), the inner baffle (5352) is provided with a plurality of second notches (5352a), and the first notches (5351a) intersect with the second notches (5352 a).

17. The oxygen reduction device (5) according to claim 6, wherein the electrolytic cell (51) further comprises: and the pressure control device (54) is connected with the sub electrolytic cells (511), and the pressure control device (54) is used for detecting the voltage of the connected sub electrolytic cells (511).

18. The oxygen reduction device (5) according to claim 17, wherein the electrolytic cell (51) further comprises: and the alarm device is connected with the pressure control device (54) and is suitable for outputting alarm prompt when the voltage of the sub electrolytic cell (511) detected by the pressure control device (54) is higher than a preset threshold value.

19. A gas conditioning system, comprising: gas supply device (4), water supply device (6), oxygen reduction device (5) according to any one of claims 1 to 18, wherein:

the air supply device (4) is connected with the oxygen reduction device (5) and is suitable for inputting the air in the compartment (2) to be regulated of the refrigeration appliance (100) to the oxygen reduction device (5);

the water supply device (6) is connected with the oxygen reduction device (5) and is suitable for supplying water to the oxygen reduction device (5);

the oxygen reduction device (5) is suitable for electrolyzing oxygen in the air input by the air supply device (4) to obtain water so as to reduce the oxygen content in the air input by the air supply device (4) to obtain low-oxygen air, and the low-oxygen air is conveyed to the room (2) to be conditioned.

20. The gas conditioning system as recited in claim 19, further comprising: the water condensing device (3) is connected with the oxygen reduction device (5) and is suitable for condensing water in the low-oxygen air, and the low-oxygen air after water condensation is conveyed to the chamber (2) to be conditioned.

21. Gas conditioning system according to claim 20, characterized in that the water condensing means (3) is connected to the water supply means (6), the water condensed by the water condensing means (3) being delivered to the water supply means (6).

22. The gas conditioning system as recited in claim 19, further comprising: an oxygen delivery device adapted to deliver oxygen produced by the oxygen reduction device (5) into an aerobic compartment within a refrigeration appliance (100).

23. A refrigeration appliance (100) comprising an oxygen reduction device (5) as claimed in any one of claims 1 to 18.

24. A refrigeration appliance (100) comprising a gas conditioning system according to any of claims 19 to 22.