CN111155057A

CN111155057A - Limiting structure, line source device and evaporation system

Info

Publication number: CN111155057A
Application number: CN202010064989.8A
Authority: CN
Inventors: 钟纪奇
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd; Mianyang BOE Optoelectronics Technology Co Ltd
Priority date: 2020-01-20
Filing date: 2020-01-20
Publication date: 2020-05-15

Abstract

The utility model provides a limit structure, line source device and coating by vaporization system relates to coating by vaporization technical field. This limit structure includes coating by vaporization source, two limiting plates, adsorbs hole and adsorption component, wherein: the evaporation source is fixed on a mounting surface and used for spraying evaporation materials; the two limiting plates are fixed on the mounting surface and are oppositely arranged on two sides of the evaporation source, and the two limiting plates are provided with cavities; the adsorption hole is arranged on the surface of the limiting plate close to the evaporation source and is communicated with the cavity; the adsorption component is communicated with the cavity and is used for adsorbing the evaporation materials accumulated on the surface of the limiting plate close to the evaporation source through the adsorption hole. The limiting structure, the line source device and the evaporation system can guarantee the evaporation quality of products, avoid the falling of the limiting plate due to material accumulation, and prolong the service life of the limiting plate.

Description

Limiting structure, line source device and evaporation system

Technical Field

The disclosure relates to the technical field of evaporation, in particular to a limiting structure, a line source device and an evaporation system.

Background

Vacuum evaporation is a commonly used thin film forming technique, and is widely used for manufacturing thin films of materials such as metals or semiconductors due to its advantages of simple film forming method, high purity and high compactness of the thin film.

The conventional vapor deposition apparatus mainly includes an evaporation source and a limiting plate, wherein an evaporation material is injected from the evaporation source during the evaporation process, and the limiting plate is disposed at an upper end of an injection portion of the evaporation source, so that an evaporation incident angle of the evaporation source is controlled by the limiting plate. However, along with the increase of the evaporation time, the accumulation of the evaporation materials can occur at the end part and the inner side of the limiting plate, so that the evaporation angle is reduced, the load of the limiting plate is increased, the evaporation effect of the product is influenced, the falling risk of the limiting plate is increased, and the service life of the limiting plate is shortened.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The purpose of the present disclosure is to overcome the deficiencies in the prior art, and provide a limiting structure, a line source device and an evaporation system, which can ensure the evaporation quality of products, avoid the falling of limiting plates due to the accumulation of materials, and prolong the service life of the limiting plates.

According to an aspect of the present disclosure, there is provided a confinement structure comprising:

the evaporation source is fixed on a mounting surface and used for spraying evaporation materials;

the two limiting plates are fixed on the mounting surface and are oppositely arranged on two sides of the evaporation source, and each limiting plate is provided with a cavity;

the adsorption hole is arranged on the surface, close to the evaporation source, of the limiting plate and is communicated with the cavity;

and the adsorption component is communicated with the cavity and is used for adsorbing the evaporation materials accumulated on the surface of the limiting plate close to the evaporation source through the adsorption hole.

In an exemplary embodiment of the present disclosure, the limiting plate includes:

the supporting part is fixed on the mounting surface and extends to one side far away from the mounting surface;

one end of the limiting part is connected to one end, far away from the mounting surface, of the supporting part, and the other end of the limiting part extends to one side, close to the evaporation source, of the supporting part according to a preset angle;

an opening for exposing the vapor deposition source is provided between the two limiting sections corresponding to the two limiting plates.

In an exemplary embodiment of the disclosure, the number of the adsorption holes is multiple, and each of the adsorption holes is uniformly distributed on the surface of the limiting plate close to the evaporation source according to a preset interval.

In an exemplary embodiment of the present disclosure, the supporting portion and the limiting portion are an integrated structure, and the cavity penetrates through the supporting portion and the limiting portion.

In an exemplary embodiment of the present disclosure, an evaporation angle of the evaporation source is defined by an opening between two of the limiting portions, and the evaporation angle is 45 °.

According to an aspect of the present disclosure, there is provided a line source apparatus including:

the confinement structure of any one of the above; and

the crucible mechanism is arranged on one side of the mounting surface, which is far away from the evaporation source, and is used for providing evaporation materials for the evaporation source.

In an exemplary embodiment of the present disclosure, the line source device includes a plurality of crucible mechanisms and a plurality of limiting structures, and each crucible mechanism is disposed in one-to-one correspondence with each limiting structure.

In an exemplary embodiment of the disclosure, the line source device includes two limiting structures and two crucible mechanisms, which are arranged in a one-to-one correspondence, and one of the crucible mechanisms is used for providing an evaporation host material to the evaporation source of the limiting structure corresponding to the crucible mechanism, and the other crucible mechanism is used for providing an evaporation guest material to the evaporation source of the limiting structure corresponding to the crucible mechanism.

In an exemplary embodiment of the present disclosure, the line source device further includes:

an evaporation chamber for accommodating the confinement structure and the crucible mechanism;

the control valve is arranged on the evaporation chamber;

and the vacuum pump is communicated with the evaporation chamber through the control valve and is used for adjusting the vacuum degree in the evaporation chamber when the control valve is opened.

According to an aspect of the present disclosure, there is provided an evaporation system comprising the line source device of any one of the above.

This disclosed limit structure, line source device and coating by vaporization system, accessible coating by vaporization source spray coating by vaporization material, simultaneously, locate the coating by vaporization source both sides respectively with two limiting plates, and the exit angle of coating by vaporization material is injectd to two limiting plates of accessible to realize film coating by vaporization function. In the process, the adsorption component can be communicated with the adsorption holes through the cavity, the applied suction force is transmitted to the adsorption holes through the cavity, and then the evaporation materials accumulated in and around the adsorption holes are adsorbed outside the limiting plate, so that the evaporation materials are prevented from accumulating on the surface of the limiting plate, the limiting plate is prevented from falling off due to accumulation of the materials, and the service life of the limiting plate is prolonged; meanwhile, the evaporation materials accumulated at the end parts of the limiting plates can be adsorbed through the adsorption holes, so that the evaporation angle is prevented from being reduced due to accumulation of the materials at the end parts of the limiting plates, and the evaporation quality of the product is ensured.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic view showing a structure of a line source device in the related art.

FIG. 2 is a schematic view of the evaporation source in the range of the evaporation angle.

Fig. 3 is a partially enlarged schematic view of fig. 2.

Figure 4 is a schematic structural view of a line source device according to an embodiment of the present disclosure.

Fig. 5 is a partially enlarged schematic view of a surface of a limiting plate close to a vapor deposition source according to an embodiment of the present disclosure.

FIG. 6 is a schematic view of an evaporation chamber according to an embodiment of the disclosure.

Fig. 7 is a schematic diagram of the connection between the control valve and the vacuum pump according to the embodiment of the disclosure.

In the figure: 100. a crucible mechanism; 200. a vapor deposition source; 300. a limiting plate; 1. a vapor deposition source; 11. a mounting surface; 2. a limiting plate; 21. a support portion; 22. a restricting section; 23. an adsorption hole; 3. connecting a pipeline; 4. a crucible mechanism; 5. an evaporation chamber; 6. a control valve; 7. a vacuum pump.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.

As shown in fig. 1-3, in the related art, the evaporation system mainly includes a crucible mechanism 100, an evaporation source 200, and a limiting plate 300, during the evaporation process, the evaporation material sprayed from the evaporation source 200 is sputtered onto the limiting plate 300 at the same time of evaporation, and as the evaporation time increases, the evaporation material inside the limiting plate 300 is accumulated, so that the load applied to the inside of the limiting plate 300 increases, and then the phenomena of peeling, falling off, or poor solution occur, and the service life of the limiting plate 300 is shortened. Meanwhile, as shown in fig. 2 and 3, as the materials at the end of the limiting plate 300 are accumulated, the evaporation angle is decreased to decrease the angle θ, and it can be seen from the correspondence between the angle θ and the coating thickness that the coating thickness becomes thinner as the angle θ is decreased, and therefore, it is necessary to increase the production temperature inside the crucible mechanism 100, and further increase the vaporization rate and the injection amount of the material to increase the thickness of the coating, but the production temperature is too high, which affects the stability of the evaporation.

The present disclosure provides a limiting structure, as shown in fig. 4, the limiting structure may include an evaporation source 1, two limiting plates 2, an adsorption hole, and an adsorption assembly, wherein:

the evaporation source 1 can be fixed on a mounting surface 11 and can be used for spraying evaporation materials;

the two limiting plates 2 can be fixed on the mounting surface 11 and can be oppositely arranged on two sides of the evaporation source 1, and the two limiting plates 2 can be provided with cavities;

the adsorption hole can be arranged on the surface of the limiting plate 2 close to the evaporation source 1 and can be communicated with the cavity;

the adsorption component can be communicated with the cavity and can be used for adsorbing the evaporation materials accumulated on the surface of the limiting plate 2 close to the evaporation source 1 through the adsorption holes.

This disclosed limit structure, accessible coating by vaporization source 1 sprays the coating by vaporization material, simultaneously, locates coating by vaporization source 1 both sides respectively with two limiting plate 2, and coating by vaporization material's exit angle is injectd to two limiting plate 2 of accessible to realize film coating by vaporization function. In the process, the adsorption component can be communicated with the adsorption holes through the cavity, the applied suction force is transmitted to the adsorption holes through the cavity, and then the evaporation materials accumulated in and around the adsorption holes are adsorbed to the outside of the limiting plate 2, so that the evaporation materials are prevented from accumulating on the surface of the limiting plate 2, the limiting plate 2 is prevented from falling off due to accumulation of the materials, and the service life of the limiting plate 2 is prolonged; meanwhile, the evaporation materials accumulated at the end parts of the limiting plates 2 can be adsorbed through the adsorption holes, so that the evaporation angle is prevented from being reduced due to the accumulation of the materials at the end parts of the limiting plates 2, and the evaporation quality of a product is ensured.

The following is a detailed description of portions of the limiting structure of the embodiments of the present disclosure:

the vapor deposition source 1 may be fixed to a mounting surface 11, and specifically, the vapor deposition source 1 may be fixed to the mounting surface 11 by welding, clamping, screwing, or the like, the mounting surface 11 may be a plate-shaped plane, and may be in a rectangular, circular, oval, or irregular pattern, and the material may be metal, alloy, stainless steel, or the like, and the shape and material of the mounting surface 11 are not particularly limited as long as they can be used to fix various devices or devices. The evaporation source 1 may have an opening through which an evaporation material may be injected, for example, the evaporation source 1 may be a nozzle, which may be in communication with a crucible mechanism 4 and may be used to inject the evaporation material carried in the crucible mechanism 4, and the evaporation material may be a metal material, a semiconductor material, or other materials that may be used for evaporation, and is not particularly limited herein.

The limiting plate 2 can be fixed on the mounting surface 11, and for convenience of replacement of the limiting plate 2, the limiting plate can be detachably connected with the mounting surface 11, for example, the limiting plate 2 can be connected with the mounting surface 11 in a threaded manner and also clamped with the mounting surface 11, of course, the limiting plate can also be connected with the mounting surface 11 in other manners, for example, the limiting plate can also be connected with the mounting surface 11 in an integrated manner, and no special limitation is made here. The limiting plate 2 may be made of a rigid material, for example, a metal, an alloy, or stainless steel, but other rigid materials are also possible, and are not limited herein. The limiting structure of the present disclosure may include two limiting plates 2, both the two limiting plates 2 may be fixed on the mounting surface 11, and may be arranged in parallel, and in addition, the two limiting plates 2 may be arranged on both sides of the evaporation source 1 relatively, and the evaporation angle of the evaporation source 1 may be limited by the two limiting plates 2. During the evaporation process, the evaporation material sprayed by the evaporation source 1 can be emitted to the outer side of the limiting plates 2 from the interval part between the two limiting plates 2 to complete the coating, and the rest part is shielded by the limiting plates 2 and is deposited on the surfaces of the limiting plates 2 close to the evaporation source 1.

Both the limiting plates 2 may have cavities, which may be disposed in the sidewalls of the limiting plates 2 and may serve as flow channels for air flow or impurities. For example, the limiting plate 2 may include an inner wall and an outer wall disposed outside the inner wall, a space capable of accommodating airflow or impurities is provided between the inner wall and the outer wall, the space is a cavity, and of course, the cavity may also be a channel integrally formed in a side wall of the limiting plate 2, or may also be a pipeline embedded in the side wall of the limiting plate 2, and the like, where the form of the cavity is not particularly limited, as long as the cavity can accommodate airflow or impurities.

In an embodiment, the restriction plate 2 may include a support portion 21 and a restriction portion 22, wherein:

the support portion 21 may have a plate-like structure and may have a rectangular shape, and one end thereof may be fixed to the mounting surface 11 and the other end thereof may extend to a side away from the mounting surface 11. For example, the supporting portion 21 may be fixed to the mounting surface 11 by welding, bonding, clipping, or screwing, and the supporting portion 21 may be fixed to the mounting surface 11 by other methods, which are not illustrated here. Can have integrated into one piece in its lateral wall cavity in the supporting part 21, this cavity can supply air current or impurity to flow through, simultaneously, in order to guarantee the rigidity of supporting part 21, avoid the supporting part 21 to take place deformation, can set up the enhancement post in the cavity, should strengthen the post and can push up between the inner wall and the outer wall of supporting part 21, the quantity of strengthening the post can be a plurality ofly, and a plurality of enhancement post evenly distributed is in the cavity.

The limiting portion 22 may also be a plate-shaped structure, and may be rectangular, and one end thereof may be connected to one end of the supporting portion 21 away from the mounting surface 11, the other end may extend to one side of the supporting portion 21 close to the evaporation source 1 according to a preset angle, and the end thereof away from one end of the supporting portion 21 does not extend to a position right above the evaporation source 1, and an evaporation angle may be determined by an included angle between the end of the supporting portion 21 and a connecting line of the evaporation source 1 and an extending line of the evaporation source 1 in a vertical direction. It should be noted that the preset angle may be an included angle between the supporting portion and the limiting portion, which may be greater than 0 ° and less than or equal to 90 °, for example, it may be 30 °, 45 °, 60 °, or 90 °, of course, it may also be other preset angles, and is not limited herein. Both ends of the restricting portion 22 in the lateral direction may be flush with both ends of the supporting portion 21 in the lateral direction. The restriction portion 22 can also be internally provided with a cavity integrally formed in the side wall of the restriction portion, the cavity can be used for air flow or impurities to flow through, meanwhile, in order to ensure the rigidity of the restriction portion 22, the restriction portion 22 is prevented from deforming, a reinforcing column can be arranged in the cavity, the reinforcing column can be arranged between the inner wall and the outer wall of the restriction portion 22, the number of the reinforcing columns can be multiple, and the plurality of reinforcing columns can be uniformly distributed in the cavity.

The limiting portion 22 and the supporting portion 21 may be of an integral structure, or the limiting portion 22 and the supporting portion 21 may be connected together by welding, clamping, or screwing, and the like, which is not limited herein. The restricting portion 22 and the supporting portion 21 may be made of the same material, for example, they may be made of a metal material, an alloy material, or a stainless steel material, and are not particularly limited. Of course, the materials of the limiting portion 22 and the supporting portion 21 may also be different, for example, the limiting portion 22 may be an alloy material, and the supporting portion 21 may be a metal material; the restricting part 22 may be a stainless material, and the supporting part 21 may be an alloy material; the restricting part 22 may be a metal material, and the supporting part 21 may be a stainless steel material. Of course, the restricting portion 22 and the supporting portion 21 may be made of other materials with higher rigidity, which is not listed here.

Preferably, the limiting portion 22 and the supporting portion 21 are of an integral structure, the cavity can penetrate between the supporting portion 21 and the limiting portion 22, and a plurality of reinforcing columns are uniformly distributed in the cavity, so that deformation of the limiting portion 22 and the supporting portion 21 is avoided. Two supporting parts 21 corresponding to the two limiting plates 2 can be oppositely arranged and can be parallelly fixed on two sides of the evaporation source 1, the preset angle and the extending length of the two limiting parts 22 extending towards the direction of the evaporation source 1 can be equal, an opening exposing the evaporation source 1 can be arranged between the two limiting parts 22 corresponding to the two limiting plates 2, and the included angle of the end points on two sides of the opening and the connecting line formed by the evaporation source 1 can be 2 times of the evaporation angle. Namely: the evaporation source 1 can be positioned in the middle of the two limiting plates 2, so that the evaporation angles of the left side and the right side of the evaporation source 1 can be equal, and the evaporation quality of a product can be guaranteed. In one embodiment, the deposition angle may be 45 °, but the size of the deposition angle may be set according to actual deposition requirements, and is not particularly limited herein. The vapor deposition angle can be defined by the positional relationship between the ends of the two limiting portions 22 and the vapor deposition source 1.

As shown in fig. 5, the adsorption holes 23 may be disposed on the surface of the limiting plate 2 close to the evaporation source 1, and may be communicated with the cavity, so that the evaporation material accumulated on the surface of the limiting plate 2 may be discharged to the outside of the limiting plate 2 through the adsorption holes 23 and the cavity, and the evaporation material is prevented from accumulating inside the limiting plate 2, thereby avoiding the risk of dropping or poor solution of the limiting plate 2, and prolonging the service life of the limiting plate 2. The adsorption holes 23 may have a circular, oval, square or irregular shape, and are not particularly limited herein. In an embodiment, the adsorption holes 23 may be through holes, and the number of the adsorption holes 23 may be multiple, and the multiple adsorption holes 23 may be uniformly distributed on the surface of the limiting plate 2 close to the evaporation source 1 according to a predetermined pitch. For example, the plurality of adsorption holes 23 may be uniformly distributed in a plurality of rows and a plurality of columns at a predetermined interval, for example, the predetermined interval may be 1cm, 1.5cm, 2cm, 2.5cm or 3cm, and of course, other predetermined intervals may be used, which is not particularly limited herein.

The adsorption component can be communicated with the cavity through a connecting pipeline 3, can be used for adsorbing the evaporation materials on the surface of the limiting plate 2 close to the evaporation source 1, avoids the accumulation of the evaporation materials on the surface of the limiting plate 2, and the connecting pipeline 3 can be arranged outside the limiting structure so as to avoid influencing the injection path of the evaporation source 1. In an embodiment, the limiting structure can further include a detection component, a control component and a valve, the valve can be arranged on one side of the adsorption hole 23 and can be used for shielding or opening the adsorption hole 23, the detection component and the control component can be arranged on one side of the limiting plate 2 far away from the evaporation source 1 and can be used for detecting the thickness of the film on the surface of the limiting plate 2 and transmitting the detected thickness of the film to the control component in real time, the control component can open the valve when the received thickness of the film reaches a preset value and simultaneously control the adsorption component to start working, and then the evaporation materials on the surface of the limiting plate 2 are adsorbed through the adsorption hole 23 and the cavity. In another embodiment, the adsorption module can adsorb the vapor deposition material on the surface of the limiting plate 2 close to the vapor deposition source 1 in real time during the vapor deposition process, and the operation mode of the adsorption module is not particularly limited herein. For example, the detecting component may be a film thickness meter, and of course, other devices or apparatuses that can be used for detecting the thickness of the thin film may also be used, which are not listed here. The control component may be a controller or a central processing unit, and of course, may also be other devices or apparatuses that can be used for control, which are not listed here.

Particularly, the adsorption component can apply suction to the cavity in the course of the work, transmit suction to the adsorption hole 23 through the cavity, and then absorb the evaporation material that accumulates around the adsorption hole 23 to discharge evaporation material through connecting tube 3, avoid producing the risk that limiting plate 2 drops or inferior solution because of the evaporation material accumulation, extension limiting plate 2 life. Meanwhile, the adsorption component can also suck away materials accumulated at the end part of the limiting part 22 far away from the supporting part 21 through the adsorption hole 23, so that the reduction of the evaporation angle caused by the accumulation of the materials at the end part of the limiting plate 2 is prevented, the phenomenon that the thickness of a film layer is ensured by increasing the production temperature inside the crucible mechanism 4 is avoided, the production temperature can be reduced, the consumption of the evaporation materials is reduced, and the production cost is reduced. The adsorption element may be, for example, a mechanical pump, but may also be other devices or apparatuses that can be used to adsorb impurities, which are not listed here.

The embodiment of the present disclosure further provides a line source apparatus, which includes the limiting structure and the crucible mechanism 4 of any of the above embodiments, and the specific details and the beneficial effects of each part in the limiting structure have been described in detail in the corresponding limiting structure, and therefore, the details are not described herein again.

The crucible mechanism 4 may be disposed on a side of the mounting surface 11 away from the evaporation source 1, and may be used to provide the evaporation source 1 with an evaporation material, which may be a metal or a semiconductor material, or may be other materials that may be used for evaporation, and is not listed here. For example, the crucible mechanism may include a crucible cavity and a connection valve, the connection valve may be disposed between the crucible cavity and the evaporation source 1, and may be used to communicate the crucible cavity and the evaporation source 1, and during the evaporation process, the evaporation material in the crucible mechanism 4 may be conveyed to the evaporation source 1 through the connection valve.

In one embodiment, the line source device of the present disclosure may include a plurality of crucible mechanisms 4 and a plurality of limiting structures, each crucible mechanism 4 and each limiting structure may be disposed in one-to-one correspondence, and each crucible mechanism 4 and each limiting structure may be located in the same evaporation chamber. Namely: each crucible mechanism 4 can be arranged corresponding to each evaporation source 1 of each limiting structure, and evaporation materials can be provided for each evaporation source 1 through each crucible mechanism 4. Note that the evaporation materials in different crucible mechanisms 4 may be different, for example, a part of the crucible mechanisms 4 may be used to provide evaporation host materials, and another part of the crucible mechanisms 4 may be used to provide evaporation guest materials.

For example, the line source device may include two limiting structures and two crucible mechanisms 4 disposed in one-to-one correspondence. One crucible mechanism 4 can be used for supplying an evaporation host material to the evaporation source 1 with the corresponding limiting structure, and the other crucible mechanism 4 can be used for supplying an evaporation guest material to the evaporation source 1 with the corresponding limiting structure. In the evaporation process, the two crucible mechanisms 4 and the two limiting structures can work simultaneously, and the evaporation angles of the two limiting structures and the production temperature of the crucible mechanisms 4 can be controlled respectively, so that the effect of adjusting the evaporation ratio of the host material and the guest material is realized.

As shown in fig. 6, the line source apparatus of the embodiment of the present disclosure may further include an evaporation chamber 5, a control valve, and a vacuum pump, wherein:

the evaporation chamber 5 can be a closed working space, the evaporation chamber 5 can be in a vacuum state in the working process, and the vacuum degree in the evaporation chamber 5 can be adjusted through a vacuum pump and a control valve. The line source device of the present disclosure may include a plurality of evaporation chambers 5, each evaporation chamber 5 may have different functions, for example, as shown in fig. 6, the evaporation chambers EV3 and EV4 may be used to accommodate the limiting structure and the crucible mechanism 4, each evaporation chamber EV3 or EV4 may include two limiting structures disposed opposite to each other and two crucible mechanisms 4 disposed corresponding to each other, and the rest of the evaporation chambers 5 may be used to convey a hard mask, a substrate, an evaporation substrate, or the like, and are not limited herein.

As shown in fig. 7, the control valve 6 may be disposed on the evaporation chamber 5, and may be configured to open or close the evaporation chamber 5 so as to adjust the vacuum degree in the evaporation chamber 5, when there are a plurality of evaporation chambers 5, there may also be a plurality of control valves 6, and at least one control valve 6 is disposed on each evaporation chamber 5. The vacuum pump 7 may be in communication with the evaporation chamber 5 through the control valve 6, and may be used to adjust the vacuum in the evaporation chamber 5 when the control valve 6 is open, thereby controlling the amount of growth of material accumulated inside the limiting plate 2. In particular, the vacuum pump 7 may be used to evacuate the evaporation chamber 5 or to inflate the evaporation chamber 5 to bring the vacuum level inside the evaporation chamber 5 to production requirements. It should be noted that one vacuum pump 7 can be simultaneously connected to the control valves 6 of a plurality of evaporation chambers 5, and can simultaneously evacuate or inflate a plurality of evaporation chambers 5.

Embodiments of the present disclosure also provide an evaporation system that may include any of the line source devices described above. The structure and advantages of the line source device can be referred to the line source device in the above embodiments, and will not be described in detail.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A confinement structure, comprising:

2. The restraint structure of claim 1 wherein the restraint panel comprises:

3. The limiting structure of claim 1, wherein the number of the absorption holes is multiple, and each of the absorption holes is uniformly distributed on the surface of the limiting plate close to the evaporation source according to a preset interval.

4. The restraint structure of claim 2 wherein the support portion and the restraint portion are a unitary structure, and the cavity extends through the support portion and the restraint portion.

5. The limiting structure according to claim 2, wherein an evaporation angle of the evaporation source is defined by an opening between two of the limiting sections, the evaporation angle being 45 °.

6. A line source apparatus, comprising:

the confinement structure of any one of claims 1-5; and

7. The line source apparatus according to claim 6, wherein the line source apparatus comprises a plurality of the crucible mechanisms and a plurality of the limiting structures, and each of the crucible mechanisms is provided in one-to-one correspondence with each of the limiting structures.

8. The line source device according to claim 7, wherein the line source device comprises two limiting structures and two crucible mechanisms, wherein the two limiting structures and the two crucible mechanisms are arranged in a one-to-one correspondence manner, one crucible mechanism is used for providing evaporation host materials for the evaporation source of the limiting structure corresponding to the crucible mechanism, and the other crucible mechanism is used for providing evaporation guest materials for the evaporation source of the limiting structure corresponding to the crucible mechanism.

9. The line source apparatus of claim 6, further comprising:

the control valve is arranged on the evaporation chamber;

10. An evaporation system comprising the line source device according to any one of claims 6 to 9.