CN111146125A - Temperature control device and etching equipment - Google Patents

Temperature control device and etching equipment Download PDF

Info

Publication number
CN111146125A
CN111146125A CN202010001117.7A CN202010001117A CN111146125A CN 111146125 A CN111146125 A CN 111146125A CN 202010001117 A CN202010001117 A CN 202010001117A CN 111146125 A CN111146125 A CN 111146125A
Authority
CN
China
Prior art keywords
chamber
temperature
etching
temperature control
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010001117.7A
Other languages
Chinese (zh)
Other versions
CN111146125B (en
Inventor
刘彦修
任志明
李发业
周建
李显杰
田龙宇
晏熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202010001117.7A priority Critical patent/CN111146125B/en
Publication of CN111146125A publication Critical patent/CN111146125A/en
Application granted granted Critical
Publication of CN111146125B publication Critical patent/CN111146125B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

The application discloses temperature control device and etching equipment, the device includes: the shell is of an open structure and is arranged on a top plate of the etching chamber, a temperature control cavity is formed between the top plate and the shell by the opening of the shell facing the top plate, and the heating element is used for heating gas in the temperature control cavity so that the temperature of the top plate of the etching chamber is close to the temperature of etching liquid in the etching chamber. The embodiment of the application heats the gas in the cavity on the top plate of the etching chamber through the heating element, so that the top plate is heated, the temperature of the top plate is kept close to the temperature of the etching liquid in the etching chamber, the volatile gas of the etching liquid is prevented from forming liquid drops when meeting condensation junctions on the top plate of the etching chamber, the defect of an etching process caused by the falling back of the liquid drops is avoided, the uniformity on an etching substrate is ensured, and the yield of products is improved.

Description

Temperature control device and etching equipment
Technical Field
The present application relates generally to the field of etching technologies, and in particular, to a temperature control device and an etching apparatus.
Background
In the etching process, in order to increase the etching rate, it is sometimes necessary to heat the chemical solution. During the etching process, the chemical liquid in the etching chamber can volatilize. After the volatilized gas moves to the top of the etching chamber, the gas is liquefied and condensed at the top of the etching chamber to form liquid drops.
Along with the increase of the amount of the condensed liquid medicine, the liquid drops gradually increase and finally drop on the etching substrate, so that the concentration of the liquid medicine at the dropping position of the liquid medicine is changed, the concentration of the etching liquid is uneven, over-etching or under-etching of the etching substrate can be caused, the deviation of the CD Bias and the standard value is overlarge, the technological defect of etching is caused, and the product yield is reduced.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a temperature control device and an etching apparatus to improve the uniformity of the etching process.
In a first aspect, there is provided a temperature control device comprising:
the shell is of an open structure and is arranged on a top plate of the etching chamber, a temperature control cavity is formed between the top plate and the shell by the opening of the shell facing the top plate, and the heating element is used for heating gas in the temperature control cavity so that the temperature of the top plate of the etching chamber is close to the temperature of etching liquid in the etching chamber.
In the temperature control device according to one or more embodiments of the present application, a first partition plate is disposed in the casing, the first partition plate divides the temperature control cavity into a first cavity and a second cavity, the heating element is disposed in the second cavity, a first exhaust hole is disposed on a wall of the casing corresponding to the first cavity, an air inlet is disposed on a wall of the casing corresponding to the second cavity, and a first through hole communicating the first cavity and the second cavity is disposed on the first partition plate.
In the temperature control device according to one or more embodiments of the present application, a first fan blade assembly is disposed in the first through hole.
In the temperature control device according to one or more embodiments of the present application, a rectifying plate is disposed in the first cavity, and a second exhaust hole is disposed on the rectifying plate.
In the temperature control device according to one or more embodiments of the present application, a heat conducting sheet is disposed in the first cavity near the first partition.
In the temperature control device according to one or more embodiments of the present application, a flow deflector is disposed in the first cavity and adjacent to the heat conducting fin, and the heat conducting fin is located between the flow deflector and the first partition plate.
In the temperature control device according to one or more embodiments of the present application, a second partition is disposed in the second cavity, the second partition divides the second cavity into a heating chamber and a gas supply chamber, the heating element is disposed in the heating chamber, the gas inlet is disposed on a housing wall corresponding to the gas supply chamber, the first through hole is disposed on a housing wall corresponding to the heating chamber, a second through hole communicating the heating chamber and the gas supply chamber is disposed on the second partition, and a third through hole communicating the first cavity and the gas supply chamber is further disposed on the first partition corresponding to the gas supply chamber.
In the temperature control device according to one or more embodiments of the present application, a second fan blade assembly is disposed in the second through hole, and a third fan blade assembly is disposed in the third through hole.
In the temperature control device according to one or more embodiments of the present application, a temperature sensor is disposed on an inner wall of the casing corresponding to the first cavity, a control chip is embedded on an outer wall of the casing, the temperature sensor is electrically connected to the control chip, and the control chip is configured to control opening or closing of the heating element, the first fan blade assembly, the second fan blade assembly, and the third fan blade assembly based on a temperature value acquired by the temperature sensor.
In a second aspect, an embodiment of the present application provides an etching apparatus, including:
the temperature control device heats the top plate of the etching chamber, so that the temperature of the top plate is close to the temperature of the etching liquid in the etching chamber.
To sum up, the embodiment of the application provides a temperature control device and etching equipment establishes the casing through covering on the etching chamber roof, form sealed cavity at the etching chamber top, and then set up heating element in this casing, utilize this heating element to the gas heating in the cavity, make the etching chamber roof of this cavity bottom heated, make the temperature of this roof keep being close with the temperature of the etching solution in the etching chamber, the volatile gas of having avoided the etching solution meets condensation on the etching chamber roof and forms the liquid drop, thereby the etching process defect because the liquid drop falls back and causes has been avoided, the homogeneity on the etching base plate has been guaranteed, the yields of product has been improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic structural diagram of an etching apparatus in the prior art;
FIG. 2 is a schematic structural diagram of a temperature control device according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a temperature control device according to another embodiment of the present application;
FIG. 4 is a schematic structural diagram of a temperature control device according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a temperature control device according to another embodiment of the present application;
FIG. 6 is a schematic structural diagram of a temperature control device according to yet another embodiment of the present application;
FIG. 7 is a schematic structural diagram of a top cover of a temperature control device according to an embodiment of the present application;
FIG. 8 is a schematic structural diagram of an etching apparatus according to an embodiment of the present application;
FIG. 9 is a dot pattern diagram under a prior art etching apparatus;
fig. 10 is a dot pattern diagram under the etching apparatus in the embodiment of the present application.
Reference numerals:
1-etching chamber, 11-top plate, 12-cover plate, 2-temperature control device, 13-temperature control cavity, 2-1-first cavity, 2-2-second cavity, 21-first partition plate, 21-1-first through hole, 21-2-second through hole, 22-air inlet, 23-second partition plate, 23-1-third through hole, 2-21-heating chamber, 2-22-air supply chamber, 3-heating element, 24-first exhaust hole, 25-top cover, 4-1-first fan blade component, 4-2-second fan blade component, 4-3-third fan blade component, 5-heat conducting sheet, 6-flow guiding sheet, 7-rectifying plate, 7-1-second exhaust hole, 8-temperature sensor, 9-control chip.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
It will be appreciated that in the etching process, as shown in figure 1, it is carried out using an etching chamber as shown in figure 1, the etching chamber 1 being provided with a top plate 11, typically a glass plate, and a cover plate 12 on top. In the etching process, the etching liquid is heated to accelerate the etching speed, so that when gas generated by the etching liquid rises to the top plate, the gas is cooled on the top plate due to the temperature difference and is condensed to form liquid drops. As the droplets increase, the droplets, which gradually thicken, will fall back onto the etch substrate, causing defects in the etch process.
In the embodiment of the application, in order to overcome the above defects, a temperature control device with a temperature control function is provided to replace the cover plate, so that the temperature of the top plate is ensured to be consistent with the temperature of the etching liquid according to the temperature of the etching liquid by using the stability control device, and the condensation on the top plate to form liquid drops is avoided.
For convenience of understanding and explanation, the temperature control device and the etching apparatus according to the embodiment of the present application are explained in detail below with reference to fig. 1 to 10.
Fig. 2 is a schematic structural diagram of a temperature control device according to an embodiment of the present application, and as shown in fig. 2, the temperature control device may include:
the casing 2 and set up heating element 3 in this casing, this casing is open structure, and this casing sets up on roof 11 of etching chamber 1, and the uncovered of this casing towards this roof, forms temperature control cavity 4 between this roof and this casing, and this heating element is used for heating the gas in this temperature control cavity for the temperature of the roof of this etching chamber is close with the etching liquid temperature in this etching chamber.
Specifically, in the embodiment of the present application, in order to control the temperature of the top plate of the etching chamber, so that the temperature of the top plate is close to that of the etching liquid in the etching chamber, so as to avoid the condensation of the etching liquid gas on the top plate, as shown in fig. 1, the cover plate 12 on the top plate 11 of the etching chamber is replaced by a temperature control device. Namely, a housing with an open structure is provided, and then the housing is disposed on the top plate 11 of the etching chamber 1, so that the opening of the housing faces the top plate, thereby forming a cavity, namely, a temperature-controlled cavity, between the housing 2 and the top plate 11. And then set up a heating element 3 in the inside of the body 2, make this heating element start, can heat the gas in the temperature control cavity, and then make the bottom wall temperature of the temperature control cavity rise, the roof 11 temperature rise of the erosion room immediately, make the temperature rise in the erosion room synchronously, in order to keep the same or similar temperature with the etchant in the erosion room, in order to avoid in the course of the etching process, because the temperature of the roof of the erosion room is lower than the temperature of the etchant, and form the liquid droplet of the etchant on it.
For example, as shown in fig. 2 and 3, the housing may be a rectangular parallelepiped structure with an open end, and when in use, the open end of the housing faces the top plate, for example, the open end of the housing faces downward, and is buckled on the top plate, so that a temperature control cavity is formed between the top plate 11 and the housing 2. The fixing of the housing on the top plate can be realized by connecting pieces such as clamping or bolts.
For another example, as shown in fig. 2, the heating element 3 may be mounted within a side wall of the housing. The heating element can be an electric heating element, such as an electric heating coil, an electric heating plate or an electric heating rod, and can be made of alloy or ceramic. The embodiment of the present application does not limit this.
The gas may be air or another gas supplied by a compressor.
Alternatively, as shown in fig. 3, in the temperature control device according to the embodiment of the present application, in order to improve the temperature control efficiency, that is, the heating efficiency of the top plate, a first partition plate 21 may be provided in the housing 2. The first clapboard divides the temperature control cavity into a first cavity 2-1 and a second cavity 2-2, and the heating element can be arranged in the second cavity.
As shown in fig. 3 and 4, an air inlet 22 is disposed on a wall of the housing corresponding to the second cavity, a first exhaust hole 24 is disposed on the housing corresponding to the second cavity, and a first through hole 21-1 communicating the first cavity and the second cavity is disposed on the first partition, so that the air entering through the improved air inlet enters the first cavity 2-1 through the first through hole after the second cavity is heated. The ceiling of the first chamber is heated and finally removed from the first exhaust hole 24.
For example, as shown in fig. 3, the first partition 21 is provided to be connected to three inner walls of the housing 2 and to be vertical. And is vertical when the lid is placed on the top plate 11.
The first partition 21 is provided with a first through hole 21-1, and as shown in fig. 3, a plurality of air inlets 22 are provided on the top wall of the housing 2.
Furthermore, in order to accelerate the flow rate of the gas, a first fan blade assembly 4-1 can be arranged in the first through hole 21-1, so that when the first fan blade assembly is started, the gas entering from the gas inlet 22 can be rapidly conveyed from the second cavity 2-2 to the first cavity 2-1 by the first fan blade assembly after being heated by the electric heating element 3, and the top plate of the etching chamber is heated.
It is understood that the heating element can be deactivated when the temperature of the top plate is heated to a temperature close to the temperature of the etchant solution.
It will also be appreciated that when the top plate is too hot, or after the process is complete, the top plate may need to be cooled. At this time, when the heating element stops working, the external cooling gas is input from the air inlet 22 and enters the second cavity 2-2, and then directly enters the first cavity 2-1 from the first through hole 21-1 under the action of the first fan blade assembly without heating, so that the top plate in the first cavity 2-1 is cooled, and finally is discharged from the first exhaust hole 24.
Optionally, as shown in fig. 5, in the embodiment of the present application, in order to improve the heating efficiency, a heat conducting sheet 5 is disposed in the first cavity near the first partition plate.
Optionally, as shown in fig. 5, in the embodiment of the present application, in order to increase the flow velocity of the gas, a flow deflector 6 is disposed in the first cavity and close to the heat conducting fin, so that the heat conducting fin is located between the flow deflector and the first partition plate.
Optionally, as shown in fig. 5, in the embodiment of the present application, in order to increase the flow rate of the gas and increase the exhaust speed, a rectifying plate 7 may be disposed in the first cavity, and a second exhaust hole 71 may be disposed on the rectifying plate.
Further, as shown in fig. 6, in the temperature control device according to the embodiment of the present application, in order to increase the heating speed or the cooling speed of the top plate, a second partition 23 may be disposed in the second chamber 2-2 to divide the second chamber into the heating chamber 2-21 and the air-sending chamber 2-22, so that the heating element is disposed in the heating chamber 2-21, and the first through hole 21-1 is located on the first partition 21 corresponding to the heating chamber 2-21. A second through hole 21-2 is formed in the first partition 21 corresponding to the air supply chamber 2-22 to communicate the first cavity with the air supply chamber, and a third through hole 23-1 is formed in the second partition 23 to communicate the air supply chamber with the heating chamber.
Further, in order to improve the gas flow rate, a second fan blade assembly 4-2 is arranged in the second through hole 21-2, and a third fan blade assembly 4-3 is arranged in the third through hole 23-1.
Based on the above arrangement, in actual operation, when the etching chamber needs to be heated, the electric heating element 3, the first fan blade assembly 4-1 and the third fan blade assembly 4-3 can be turned on, so that the gas entering the gas supply chamber 2-22 from the gas inlet 22 is directly and rapidly delivered to the heating chamber 2-21 by the third fan blade assembly 4-3 to be heated; the heated gas is further rapidly conveyed to the first cavity by the first fan blade assembly 4-1 to heat the first cavity, so that the first cavity is heated to the etching chamber below the first cavity. When the temperature in the etching chamber needs to be reduced, the heating element 3, the first fan blade assembly 4-1 and the third fan blade assembly 4-3 can be closed, the second fan blade assembly 4-2 is opened, so that cooling gas entering from the air inlet is directly and quickly conveyed into the first cavity by the second fan blade assembly 4-2, high-temperature gas in the second cavity is discharged from the first exhaust hole 24 and the second exhaust air 7-1, and is continuously discharged with the cooling gas and hot air along with the continuous entering of the cooling gas, so that the first cavity is cooled, namely, the etching chamber is cooled.
Further, in order to improve the accuracy of temperature control, a temperature sensor 8 may be further disposed on the inner wall of the housing corresponding to the first cavity, for example, on the top cover 25 shown in fig. 7, so as to monitor the temperature in the cavity in real time, so that the controller controls the opening or closing of each fan blade assembly and the electric heating element according to the monitored temperature, and thus, the temperature of the etching chamber can be accurately controlled.
Optionally, as shown in fig. 4, in order to control the opening or closing of each fan blade assembly and each electric heating element, a control chip 9 may be embedded in the outer wall of the casing 2. The control chip can be electrically connected with the temperature sensor and receives the temperature collected by the temperature sensor. And is electrically connected with each fan blade component and the electric heating element to trigger the opening and closing of each fan blade component and the electric heating element.
For example, in practice, a control panel on the control chip or an interface on the control chip may be used to connect with another terminal, and control parameters, such as an input temperature threshold, are input into the control chip, so that when the temperature in the temperature control cavity is monitored to be lower than the temperature threshold, which means that the temperature of the top plate of the etching chamber is lower than the temperature of the etching solution, the control chip generates a trigger signal to turn on the heating element, the third fan blade assembly and the first fan blade assembly, and turn off the second fan blade assembly, so as to heat the gas delivered to the heating chamber through the third fan blade assembly, thereby heating the top plate of the etching chamber; when the monitored temperature is higher than the temperature threshold value, the temperature of the etching chamber is over high, and the waste of etching liquid is possibly caused, the control chip generates a trigger signal, the heating element, the third fan blade assembly and the first fan blade assembly are closed, the second fan blade assembly is opened, so that cooling gas entering from the gas inlet is directly conveyed to the first cavity by the second fan blade assembly, and a top plate in the first cavity is cooled, so that the cooling of the etching chamber is realized.
On the other hand, as shown in fig. 8, an embodiment of the present application further provides an etching apparatus, where the etching apparatus includes the temperature control device and the etching chamber in the foregoing embodiment, and the temperature control device is covered on a top plate of the etching chamber, so as to implement temperature control on the top plate by using the temperature control device, and further implement temperature control on the etching chamber.
It will be appreciated that in practice, by modifying the etching apparatus shown in figure 1, the process capability is greatly improved by replacing the cover plate with a temperature control device. Compared with the etching equipment shown in fig. 1, the etching equipment in the embodiment of the application has the advantage that the uniformity of the etched substrate in the process is improved.
By using the etching apparatus shown in fig. 1 and the etching apparatus in the embodiment of the present application, an etching process test is performed, that is, an etching process is performed on different etching apparatuses under the same condition, and then a test result is detected, visual diagrams of the detection result are shown in fig. 9 and fig. 10, fig. 9 is a detection result diagram corresponding to the etching apparatus shown in fig. 1, and fig. 10 is a detection result diagram corresponding to the embodiment of the present application.
From the detection results shown in FIGS. 9 and 10, the number of abnormal points was reduced from 8 to 2, Ppk of the etching apparatus was increased from 0.44 (smaller than the standard value: 1.33) to 1.36, and uniformity was reduced from 11.86% (larger than the standard value: 10%) to 6.76%, which was remarkable in improvement effect.
To sum up, the embodiment of the application provides a temperature control device and etching equipment establishes the casing through covering on the etching chamber roof, form sealed cavity at the etching chamber top, and then set up heating element in this casing, utilize this heating element to the gas heating in the cavity, make the etching chamber roof of this cavity bottom heated, make the temperature of this roof keep being close with the temperature of the etching solution in the etching chamber, the volatile gas of having avoided the etching solution meets condensation on the etching chamber roof and forms the liquid drop, thereby the etching process defect because the liquid drop falls back and causes has been avoided, the homogeneity on the etching base plate has been guaranteed, the yields of product has been improved.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (10)

1. A temperature control apparatus, characterized in that the apparatus comprises:
the casing and set up heating element in the casing, the casing is open structure, the casing sets up on the roof of sculpture room, just the uncovered orientation of casing the roof with form the control by temperature change cavity between the casing, heating element is used for heating gas in the control by temperature change cavity makes the temperature of the roof of sculpture room with the sculpture indoor temperature of liquid is close.
2. The temperature control apparatus according to claim 1, wherein a first partition is disposed in the housing, the first partition divides the temperature control chamber into a first chamber and a second chamber, the heating element is disposed in the second chamber, a first exhaust hole is disposed on a wall of the housing corresponding to the first chamber, an air inlet is disposed on a wall of the housing corresponding to the second chamber, and a first through hole communicating the first chamber and the second chamber is disposed on the first partition.
3. The temperature control device of claim 2, wherein a first fan blade assembly is disposed within the first through-hole.
4. The temperature control device of claim 2, wherein a rectifying plate is disposed in the first cavity, and a second vent hole is disposed in the rectifying plate.
5. The temperature control apparatus of claim 2, wherein a thermally conductive sheet is disposed within the first cavity proximate the first partition.
6. The temperature control apparatus of claim 5, wherein a baffle is disposed within the first cavity adjacent the thermally conductive sheet, the thermally conductive sheet being positioned between the baffle and the first divider.
7. The temperature control value device according to any one of claims 2 to 6, wherein a second partition is provided in the second chamber, the second partition divides the second chamber into a heating chamber and a gas supply chamber, the heating element is provided in the heating chamber, the gas inlet is provided in a wall of a housing corresponding to the gas supply chamber, the first through hole is provided in a wall of a housing corresponding to the heating chamber, a second through hole communicating the heating chamber and the gas supply chamber is provided in the second partition, and a third through hole communicating the first chamber and the gas supply chamber is further provided in the first partition corresponding to the gas supply chamber.
8. The temperature control device of claim 7, wherein a second fan assembly is disposed in the second through hole, and a third fan assembly is disposed in the third through hole.
9. The temperature control device according to any one of claims 2 to 6 and 8, wherein a temperature sensor is disposed on an inner wall of the housing corresponding to the first cavity, a control chip is embedded on an outer wall of the housing, the temperature sensor is electrically connected to the control chip, and the control chip is configured to control the heating element, the first fan blade assembly, the second fan blade assembly and the third fan blade assembly to be turned on or off based on a temperature value acquired by the temperature sensor.
10. An etching apparatus, characterized in that the apparatus comprises:
an etching chamber and a temperature control device according to any one of claims 1 to 9 covering a top plate of the etching chamber, wherein the temperature control device heats the top plate of the etching chamber to make the temperature of the top plate close to the temperature of etching liquid in the etching chamber.
CN202010001117.7A 2020-01-02 2020-01-02 Temperature control device and etching equipment Active CN111146125B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010001117.7A CN111146125B (en) 2020-01-02 2020-01-02 Temperature control device and etching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010001117.7A CN111146125B (en) 2020-01-02 2020-01-02 Temperature control device and etching equipment

Publications (2)

Publication Number Publication Date
CN111146125A true CN111146125A (en) 2020-05-12
CN111146125B CN111146125B (en) 2022-12-13

Family

ID=70523370

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010001117.7A Active CN111146125B (en) 2020-01-02 2020-01-02 Temperature control device and etching equipment

Country Status (1)

Country Link
CN (1) CN111146125B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100888711B1 (en) * 2008-06-18 2009-03-17 이프로링크텍(주) Airlock chamber comprising apparatus for preventing gas condensation from wafer
US20140242530A1 (en) * 2013-02-26 2014-08-28 Sung Guk An Substrate heat treatment apparatus and method
CN204407298U (en) * 2014-12-03 2015-06-17 上饶光电高科技有限公司 A kind of covering plate structure improving etching groove dropping liquid
CN204857676U (en) * 2015-07-28 2015-12-09 张家港国龙光伏科技有限公司 Antidrip liquid sculpture capping board
CN208108656U (en) * 2018-03-10 2018-11-16 成都迪泰化工有限公司 A kind of electric drying oven with forced convection
CN109244009A (en) * 2018-09-03 2019-01-18 深圳市华星光电技术有限公司 Wet-method etching device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100888711B1 (en) * 2008-06-18 2009-03-17 이프로링크텍(주) Airlock chamber comprising apparatus for preventing gas condensation from wafer
US20140242530A1 (en) * 2013-02-26 2014-08-28 Sung Guk An Substrate heat treatment apparatus and method
CN204407298U (en) * 2014-12-03 2015-06-17 上饶光电高科技有限公司 A kind of covering plate structure improving etching groove dropping liquid
CN204857676U (en) * 2015-07-28 2015-12-09 张家港国龙光伏科技有限公司 Antidrip liquid sculpture capping board
CN208108656U (en) * 2018-03-10 2018-11-16 成都迪泰化工有限公司 A kind of electric drying oven with forced convection
CN109244009A (en) * 2018-09-03 2019-01-18 深圳市华星光电技术有限公司 Wet-method etching device

Also Published As

Publication number Publication date
CN111146125B (en) 2022-12-13

Similar Documents

Publication Publication Date Title
US7257956B2 (en) Cooling apparatus
US8763480B2 (en) Dew formation testing device and dew formation testing method
US5579826A (en) Method for burn-in of high power semiconductor devices
JP3178295U (en) Replaceable upper chamber parts for plasma processing equipment
US8878105B2 (en) Steam cooker
EP3587944A1 (en) Air conditioning device
US10307849B2 (en) Vacuum-processing device and control method therefor, and vacuum soldering device and control method therefor
US20130211617A1 (en) System monitoring apparatus and control method thereof
CN111146125B (en) Temperature control device and etching equipment
US20160174574A1 (en) Forced moisture evacuation for rapid baking or cooking
KR20160049761A (en) System and method for cooling and heating battery container
US20200132310A1 (en) Induction cooking hob with integrated down-draft hood
CN104936783A (en) Screen printer
JP2005197600A (en) Semiconductor production system
JP2005039207A (en) Etching device
JP2009094446A (en) Pattern formation method, and pattern formation device
JP6961161B2 (en) Cabinet for solid material containers
KR100906683B1 (en) Heater temperature control equipment of drying machine for wide glass
EP3846593B1 (en) Plasma generation device and plasma head cooling method
EP3352549B1 (en) Cooling device for electronic device
CN217768311U (en) Rapid heat treatment device for wafer
JP2684266B2 (en) Decompression evaporative cooling equipment
CN110349828A (en) Dry etching equipment
CN106786051A (en) Switch cubicle air conditioner
CN217360642U (en) Control box with temperature and humidity detection function

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant