KR100906683B1 - Heater temperature control equipment of drying machine for wide glass - Google Patents

Abstract

The present invention relates to a heater temperature control device of a large area glass drying apparatus.

The present invention provides a heater temperature control apparatus for a large-area glass drying apparatus, comprising: a chamber providing a high temperature / high pressure environment through hot air supply discharge; and a heater for heating a glass surface introduced into the chamber. A heater module that is dividedly arranged with respect to an area and generates heat individually; A sensor for dividing a portion of the heating area with frequent temperature change for each region and detecting an area center temperature of each divided region; A microcomputer that compensates for the temperature deviation by comparing the temperature detected by the sensor with a preset temperature; And a heater controller for controlling the temperature of the heater module according to the compensation signal output from the microcomputer.

According to the present invention, the heating area formed by the arrangement of the heater module is divided into areas where temperature changes frequently, such as a part where hot air is drawn in / out and a part where glass is drawn in / out, and detects only the area center temperature of the partitioned area. By compensating for the temperature deviation, the number of sensors for detecting the heating temperature and the number of heater controllers can be greatly reduced.

Description

HEATER TEMPERATURE CONTROL EQUIPMENT OF DRYING MACHINE FOR WIDE GLASS}

The present invention relates to a heater temperature control device of a large area glass drying apparatus.

In general, LCD glass corresponds to a substrate that is the base of a liquid crystal display device. An initial cleaning process for removing foreign substances on a substrate, a PR coating process for applying a photosensitive material, an exposure process for transmitting light through a mask, and a Developing process to remove PR decomposed by-Etching process to etch deposited film into PR shape-PR peeling process to remove PR with STRIP chemical solution-Inspection process to check for abnormality after completion of process-Deposition process to deposit thin film on substrate Processed through.

The cleaning step of removing impurities on the surface of the process is further included. After the cleaning step, a drying step is required to dry and remove the cleaning liquid.

In this drying process, the glass surface is dried using a heating plate, that is, a heater that is a planar heating element, or the heater is mounted in a chamber of high temperature and high pressure, and dried with hot air input / exhaust.

As described above, the conventional drying apparatus technology in which the heater is mounted in the chamber 1 is a heater 4 isolated through the insulator 3 inside the aluminum plate 2, as shown in FIGS. 1 and 2. The heater module 5 and a plurality of the heater module 5 are arranged to be wider than the glass (G) area to form a heating area, the sensor (6) for detecting the surface temperature of the plurality of heater modules (5), respectively It is configured to include).

In the conventional drying apparatus as described above, when power is supplied to a heater and heated, heat is conducted to the aluminum plate 2 to evaporate moisture while heating the glass G spaced at the top of the aluminum plate 2. On the other hand, it is dried by the hot air flowing into the chamber (1).

However, in the conventional drying apparatus as described above, when the sensor 6 detects the temperature of each of the heater modules 5 and is higher than a preset temperature, the heater controller for controlling the temperature of the corresponding heater module 5 operates to operate the temperature. Comprising a structure for compensating for the deviation, the sensor 6 for detecting the temperature as the number of each heater module (5) should be mounted, the deviation by comparing the temperature detected by the temperature sensor 6 with a preset temperature Is generated, the heater controller for controlling the power supplied to the heater module 5 also has to be provided corresponding to each of the heater module 5, the manufacturing cost is high, and as a result of the arrangement and wiring of the sensor The problem is that the structure is very complex.

In addition, when there is a deviation between the temperature detected by each sensor and the predetermined temperature, the heater controller 5 operates the heater module 5 while switching the heater from time to time to compensate for the deviation, the heater controller portion including the heater and the heater While this life is shortened, there is a problem that causes frequent failures.

 The present invention provides a heater temperature control apparatus for a large-area glass drying apparatus, comprising: a chamber for providing a high temperature / high pressure environment through hot air supply discharge; and a heater for heating a glass surface introduced into the chamber. A heater module that is dividedly arranged with respect to an area and generates heat individually; A sensor for dividing a portion of the heating area with frequent temperature change for each region and detecting an area center temperature of each divided region; A microcomputer that compensates for the temperature deviation by comparing the temperature detected by the sensor with a preset temperature; And a heater controller for controlling the temperature of the heater module according to the compensation signal output from the microcomputer.

The present invention partitions an area where temperature changes frequently, such as a part where hot air is drawn in / out and a part where glass is drawn in / out of the heating area formed by the arrangement of the heater modules, and detects only the area center temperature of the partitioned area. By compensating for the deviation, the number of sensors for detecting the heating temperature and the number of heater controllers can be greatly reduced.

3 is a block diagram showing a configuration according to an embodiment of the present invention, Figure 4 is according to an embodiment of a heater module of the present invention prior to explaining the present invention 5 is a block diagram showing a configuration of a microcomputer in the present invention, FIG. 6 is a block diagram showing a configuration according to another embodiment of the present invention, and FIG. Is a block diagram showing a heater temperature control state.

The present invention will be described below with reference to the accompanying drawings presented as above.

First, as shown in the accompanying drawings, FIGS. 3 and 4, the present invention provides a chamber 1 and a glass G surface introduced into the chamber 1 to provide a high temperature / high pressure environment through hot air supply discharge. A heater temperature control apparatus (10) of a large-area glass drying apparatus including a heater for heating, comprising: a heater module (11) which is dividedly arranged with respect to a heating area in the chamber (1) and generates heat separately; A sensor (12) for dividing a portion of the heating area with frequent temperature change by region and detecting an area center temperature of each divided region; A microcomputer 13 for compensating for the temperature deviation by comparing the temperature detected by the sensor 12 with a preset temperature; And a heater controller 14 for adjusting the temperature of the heater module 11 according to the compensation signal output from the microcomputer 13.

Here, the heater module 11 of the present invention, as shown in the accompanying drawings, Figure 4, the heat wire pattern (11b) is formed of a conductor (11a); It may be configured to include; a conducting plate (11c) for conducting heat generated in the hot wire pattern (11b).

In this case, the substrate 11a and the conductive plate 11c may be ceramic panels or other non-metallic minerals having high thermal conductivity.

In addition, the heating wire pattern 11b is a conductive wire made of a temperature reactant that generates heat when power is supplied, and may be formed by being printed on the substrate 11a or may be formed by etching. In this case, the temperature reactant may be tungsten itself, or may include tungsten. When the temperature reactant is tungsten itself, the temperature reactant may be formed by etching or punching it with a hot wire pattern 11b. After printing the tungsten powder in a specific shape through a silk screen, it may be integrated with the substrate 11a through firing.

In this case, when power is supplied to the hot wire pattern 11b, heat is generated, but its temperature changes according to the level of the power supplied.

In the present invention, the heater module 11 is described by showing 30 as one embodiment in a 5 X 6 array, it is noted that such an embodiment is not limited to the scope of the present invention.

On the other hand, in the present invention, the area of the heating area includes a first area (A1) which is a tip portion in the direction in which hot air is introduced into the chamber (1); A second area A2 which is a tip portion in a direction in which hot air is discharged; Third and fourth regions A3 and A4, which are tips at the shutter (door) direction in which the glass G is drawn / drawn into the chamber 1; A fifth region A5 which is a central portion of the first to fourth regions; And sixth and seventh regions A6 and A7 which are both sides of the four corner portions excluding the first to fifth regions.

For example, the first area A1 is the heater module number 2, 3, 4, 5, the second area A2 is the heater module number 26, 27, 28, 29, and the third area A3 is the heater module number. 7,13,14,19, fourth area A4 is heater module number 12,17,18,24, sixth area A6 is heater module number 6,30, and seventh area A7 is Heater module number 1, 25 may be. (The heater module numbers are divided into small numbers marked on each heater block in the drawing.)

At this time, the area partitioned as above does not mean an integrated state between the adjacent heating modules 11, but is divided for heater temperature control.

In addition, the sixth and seventh regions A6 and A7 may be further divided into eighth and ninth regions, respectively. That is, the heater module numbers 6 and 30 constituting the sixth area A6 are separated, and the sixth area A6 is the heater module number 6, the eighth area is the heater module number 30, and the seventh area A7. Heater module Nos. 1 and 25 constituting) may be separated, and the seventh region A7 may be the heater module number 1, and the ninth region may be the heater module number 25.

The divided areas may be divided according to the heating area considering the environment of the chamber 1 and the area of the glass G, and the range and shape of the divided areas may be changed within the scope of the present invention. It does not escape.

Meanwhile, in the present invention, the sensor 12 may be a temperature sensor installed at each center of each partitioned area.

The sensor 12 is preferably located at the center of a region where the temperature of heat generated from the heater modules 11 constituting each region can be calculated with an average value relatively accurately.

Meanwhile, in the present invention, the microcomputer 13 is a microcomputer such as an IC which is an integrated circuit of a logic circuit or a logic circuit that calculates and corrects a deviation between a preset and stored heating temperature and a temperature of a corresponding region input from the sensor 12. It may be a processor.

At this time, the microcomputer 13 receives a temperature detection signal from each of the sensors 12 of each region A1 to A7 as shown in FIG. 5 and outputs a deviation by comparing with a preset heating temperature. It may be configured to include a comparator 13a.

In this case, when the temperature of the corresponding region input from the sensor 12 is lower than the preset stored temperature, the heater module 11 including the corresponding heater controller 14 connected to the rear by outputting a-value is included in the corresponding region. Control the power to lower the power, and if the temperature of the corresponding input area is high, the output of the + value controls the corresponding heater controller 14 connected to the rear to increase the power of the heater modules 11 included in the corresponding area. .

In addition, as shown in FIG. 6, the microcomputer 13 measures the resistance value of the heating wire pattern 11b of each heater module 11 to heat the heating wire included in the heater module 11 included in the same area. If there is a deviation from the average resistance of the patterns 11b, the heater controller 14 of the corresponding heater module 11 is operated to increase or decrease the power supply state to control the heating temperature.

In this case, each heater module 11 included in the area is controlled by an independent heater controller 14.

In addition, the microcomputer 13 stores the resistance value of the heating wire pattern 11b in advance according to the temperature, compares the previously stored resistance value with the resistance value of the heating wire pattern 11b, and if there is a deviation, the corresponding heater module ( It is also possible to control the heating temperature by increasing or decreasing the power supply state by operating the heater controller 14 of 11).

In addition, the present invention excludes the sensor 12, receives only the resistance value of the heating wire pattern (11b) included in each heater module 11, and the previously-stored resistance value and the resistance value of the heating wire pattern (11b) In comparison, when there is a deviation, the heating temperature of the power supply may be controlled by operating the heater controller 14 of the heater module 11 to increase or decrease the power supply state.

In addition, the heater controller 14 of the present invention is to supply the power supplied to the heating wire pattern (11b) included in the heater module 11 in accordance with the temperature deviation signal or the resistance value deviation signal input from the microcomputer (13). It can be an IC chip with a comparator or a comparator, or it can be a discrete circuit such as a resistor or a relay.

As described above, the present invention configured as described above has 30 heater modules 11 in an example of 5 X 6 in one embodiment, and the area of the heating area is the tip portion in the direction in which hot air is introduced into the chamber 1. The first area A1, the second area A2 that is the tip of the hot air discharge direction, and the third or fourth area that is the tip of the shutter G inlet / outlet of the glass G into the chamber 1; (A3) (A4), the fifth region A5 which is the center portion of the first to fourth regions, and the sixth and seventh regions A6 which are both sides of the four corner portions except for the first region to the fifth region. (A7).

In this case, the first area A1 is the heater module number 2, 3, 4, 5, the second area A2 is the heater module number 26, 27, 28, 29, and the third area A3 is the heater. Module numbers 7, 13, 14, and 19 are used, the fourth area A4 is heater module numbers 12, 17, 18, and 24, and the sixth area A6 is heater module numbers 6 and 30. Assume that area A7 is heater module numbers 1 and 25.

In this state, power is supplied to the drying apparatus, and operation is started when the temperature in the chamber 1 and the temperature of the heater portion are kept above a predetermined temperature in a state in which the heating temperature is set and stored in advance.

At this time, when the shutter of the chamber 1 is opened for the introduction of the glass G, the area temperature near the open shutter is lowered due to the inflow of external air. For example, when the shutter of the third area A3 is opened, the temperature of the heater module 11 included in the third area A3, that is, the heater module numbers 12, 17, 18, and 24 is lowered.

Then, the sensor 12 for detecting the temperature of the third region A3 inputs the detected temperature to the microcomputer 13, and the microcomputer 13 previously inputs the temperature value of the third region A3. By comparing the stored and stored temperature values and outputting the deviation values as much as the deviation occurs, the heater controller 14 is the heater module 11 included in the third area A3, that is, the heater module numbers 12, 17, 18 By controlling the power supplied to each of the hot wire patterns 11b, the generated temperature deviation is compensated for and maintained at the same temperature as the surrounding area.

In this case, as shown in FIG. 7 for more precise temperature maintenance, the heater module 11 included in the corresponding area, for example, the fourth area A4, that is, the heater module numbers 7, 13, 14, and 19 are included. The temperature and resistance values of the respective heating wire patterns 11b are inputted to the respective comparators 13a included in the microcomputer 13, so that each of the comparators 13a is preset and stored in the preset temperature and resistance values and the input values. By comparing the output values of the deviation and operating the heater controller 14, the temperature deviation can be compensated.

In this case, the resistance values of the heating wire patterns 11b input to the comparators 13a of the microcomputer 13 are summed and divided by the number of the heating wire patterns 11b to calculate an average value, and the average resistance value and each heating wire are calculated. It is also preferable to compensate the deviation by comparing the resistance values of the pattern 11b.

According to the present invention as described above, among the heating areas formed by the arrangement of the plurality of heater modules 11, the hot air is drawn in / out and the glass is drawn in / out, such as the area where the temperature changes frequently, respectively, the partition By compensating for the temperature deviation by detecting only the area center temperature of the area, the number of sensors for detecting the heating temperature and the number of heater controllers can be greatly reduced.

In addition, the present invention is to detect the temperature of each heater module as in the prior art, and if there is a deviation in the detected temperature, driving the heater and the heater generated when repeating the switching operation to cut off the power supplied to the heater from time to time It can prevent circuit breakdown and waste of power.

In addition, the present invention compensates the temperature variation of each partitioned region of the heating area, as well as the resistance variation of the heating wire patterns 11b constituting the heater module 11 included in each region, thereby more precisely controlling the temperature and temperature of the heater. Temperature uniformity of the heating area can be maintained.

While the invention has been described and illustrated in connection with a preferred embodiment for illustrating the principles of the invention, the invention is not limited to the configuration and operation as such is shown and described. Rather, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims. Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

1 is a cross-sectional view showing the configuration of a conventional heater module.

Figure 2 is a block diagram showing the configuration of a conventional heater temperature control device.

3 is a block diagram showing a configuration according to an embodiment of the present invention.

Figure 4 is a perspective view showing a configuration according to an embodiment of the heater module of the present invention.

Figure 5 is a block diagram showing an exemplary configuration of a microcomputer in the present invention.

6 is a block diagram showing a configuration according to another embodiment of the present invention.

7 is a block diagram showing a heater temperature control state of the present invention.

      <Description of the symbols for the main parts of the drawings>

10: heater temperature control device 11: heater module

11a: substrate 11b: hot wire pattern

11c: conduction plate 12: sensor

13: microcomputer 14: heater controller

1: chamber 2: glass

A1 ~ A7: 1st area ~ 7th area

Claims (14)

Heater temperature control device 10 of a large-area glass drying apparatus including a chamber (1) for providing a high temperature / high pressure environment through the hot air supply discharge and a heater for heating the glass (G) surface introduced into the chamber (1) A first region (A1) which is a tip portion in a direction in which hot air is introduced into the chamber (1); A second area A2 which is a tip portion in a direction in which hot air is discharged; Third and fourth regions A3 and A4, which are tips at the shutter (door) direction in which the glass G is drawn / drawn into the chamber 1; A fifth region A5 which is a central portion of the first to fourth regions; The heating area is divided into sixth and seventh regions A6 and A7, which are both sides of the four corner portions except the first to fifth regions, and the heating area is divided in the chamber 1 with respect to the heating area. Heater modules 11 arranged and individually generating heat operation; A sensor (12) for dividing a portion of the heating area with frequent temperature change by region and detecting an area center temperature of each divided region; A microcomputer 13 for compensating for the temperature deviation by comparing the temperature detected by the sensor 12 with a preset temperature; And a heater controller (14) for controlling the temperature of the heater module (11) according to the compensation signal output from the microcomputer (13). The heater module (11) of claim 1, further comprising: a substrate (11a) having a hot wire pattern (11b) formed of a conductor; And a conduction plate (11c) for conducting heat generated from the hot wire pattern (11b). 3. The heater temperature control apparatus according to claim 2, wherein the substrate (11a) and the conductive plate (11c) are ceramic panels. 3. The heater temperature control apparatus of claim 2, wherein the hot wire pattern (11b) is a conductive wire formed of a temperature reactant that generates heat when power is supplied, and is etched on the substrate (11a). 5. The heater temperature control apparatus of claim 4, wherein the temperature reactant is tungsten. delete The heater temperature control apparatus of claim 1, wherein the sixth and seventh regions A6 and A7 are further divided into eighth and ninth regions on both sides. The heater temperature control apparatus of claim 1, wherein the sensor is a temperature sensor installed at each center of each partitioned area. The microcomputer of claim 1, wherein the microcomputer 13 is formed of a microcontroller or an integrated circuit of an IC which calculates and corrects a deviation between a preset and stored heating temperature and a temperature of a corresponding region input from the sensor 12. Heater temperature control device of a large area glass drying apparatus, characterized in that the processor. 10. The apparatus of claim 1 or 9, wherein the microcomputer 13 includes a comparator 13a for receiving a temperature detection signal from each of the sensors 12 in each region and comparing the preset heating temperature with a preset stored temperature. Heater temperature control device of a large area glass drying apparatus, characterized in that configured. The heating wire pattern (11b) of claim 1, wherein the microcomputer (13) measures the resistance value of the heating wire pattern (11b) including each heater module (11) to configure the heater module (11) included in the same area. If there is a deviation from the average resistance value of the heater, the heater of the heater module 11, the heater of the large-area glass drying apparatus, characterized in that the heating temperature is controlled by increasing or decreasing the power supply state by operating the heater controller (14) Temperature control. 12. The apparatus of claim 11, wherein each heater module (11) included in the area is controlled by an independent heater controller (14). The method of claim 1, wherein the microcomputer 13 sets and stores the resistance value of the heating wire pattern 11b in advance according to the temperature and compares the previously stored resistance value with the resistance value of the heating wire pattern 11b. , The heater temperature control device of the large-area glass drying apparatus, characterized in that for controlling the heating temperature by operating the heater controller 14 of the heater module 11 to increase or decrease the power supply state. The power supply of claim 1, wherein the heater controller 14 is supplied to the heating wire pattern 11b included in the heater modules 11 according to a temperature deviation signal or a resistance value deviation signal input from the microcomputer 13. Heater temperature control device of a large area glass drying apparatus, characterized in that the IC chip including a comparator.

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