CN111145993A - 线圈部件 - Google Patents
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- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
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Abstract
在线圈部件中,在利用绝缘层覆盖素体的表面使表面的凹凸平滑化的基础上,设置屏蔽层。屏蔽层的Cu层设置于平滑面,所以抑制厚度变化,以实质上均匀的厚度形成。在线圈部件中,难以产生屏蔽层薄的部位和不存在屏蔽层的部位,有效地抑制屏蔽层的功能降低。
Description
技术领域
本发明涉及线圈部件。
背景技术
现有技术中,已知有在由磁性材料构成的素体的内部设置有线圈的线圈部件。在专利文献1(日本特开2016-72615号公报)中公开有具有由金属磁性粉体通过粘合树脂粘接的粘接粉体覆盖线圈的结构的素体。
线圈部件在大多的情况下与各种电子部件一起安装,所以要求对电子部件造成坏影响的磁通量不会从线圈部件泄漏。在专利文献2(日本特开2017-76796号公报)和专利文献3(日本特开2004-266120号公报)中公开有为了抑制来自线圈部件的磁通量泄漏而利用由导电材料构成的屏蔽层覆盖素体表面的技术。
发明内容
如上述专利文献1的线圈部件,在素体表面由粘接粉体构成的情况下,素体表面由于露出于表面的金属磁性粉体而容易产生凹凸。因此,如果用屏蔽层覆盖素体表面,则屏蔽层产生厚度不均。
根据本发明,提供实现了屏蔽层的厚度的均匀化的线圈部件。
本发明一个方面的线圈部件包括:素体,其包含利用粘合树脂粘接金属磁性粉体而成的粘接粉体和埋设于该粘接粉体内的线圈,并具有在该线圈的轴向上相对的一对主面;绝缘层,其覆盖素体的一方的主面;和屏蔽层,其隔着绝缘层设置于一方的主面上。
在上述线圈部件中,由粘接粉体构成素体的表面,所以虽然在素体表面容易产生凹凸,但是素体表面的凹凸通过覆盖素体表面的绝缘层而平滑化。因此,能够抑制经由绝缘层设置于一方的主面上的屏蔽层的厚度变化。
其他方面的线圈部件中,还包括设置于素体的另一方的主面的、与线圈的两端部电连接的一对外部电极端子。
其他方面的线圈部件中,素体具有长方体状的外形,绝缘层覆盖素体的一方的主面和4个侧面,屏蔽层隔着绝缘层设置于一方的主面上和4个侧面上。该情况下,利用屏蔽层进一步抑制来自线圈部件的磁通量泄漏。
其他方面的线圈部件中,屏蔽层具有多层结构。
其他方面的线圈部件中,粘接粉体中的金属磁性粉体的含量为80~92vol%。
附图说明
图1是实施方式的线圈部件的概略立体图。
图2是图1所示的线圈部件的II-II线截面图。
图3是表示图1所示的线圈部件的制造方法的各工序的截面图。
图4是表示了图1所示的线圈部件的制造方法的各工序的截面图。
图5是图2所示的线圈部件的截面图的重要部位放大图。
图6是图2所示的线圈部件的截面图的重要部位放大图。
图7是表示不同方式的线圈部件的概略截面图。
图8是表示了不同方式的线圈部件的概略截面图。
具体实施方式
下面,参照附图,详细地说明各种实施方式。此外,在各附图中对相同或相当的部分标注同一的符号,并省略重复的说明。
如图1和图2所示,实施方式的线圈部件1具有长方体状的外形。线圈部件1包括:素体10、设置于素体10的下表面10b的一对外部电极端子40A、40B、从素体10的下表面10b延伸至各侧面10d、10f的一对接地电极端子40C、40D、和设置于除下表面10b以外的素体10的表面10a、10c、10d、10e、10f的屏蔽层50而构成。线圈部件1作为一例,以长边2.0mm、短边1.6mm、高度0.9mm的尺寸设计。
素体10具有长方体状的外形,上表面10a(一方的主面)和下表面10b(另一方的主面)平行且彼此相对。素体10具有线圈部20和覆盖部30,在覆盖部30内埋设有线圈部20。
线圈部20包括线圈C,其具有与作为上表面10a和下表面10b的相对方向的上下方向平行的轴。
线圈C具有:基板22、设置于基板22的上表面22a的上线圈导体24A、设置于基板22的下表面22b的下线圈导体24B、和一对引出导体26A、26B。
基板22具有平板矩形,以与上下方向正交的方式配置。基板22具有设置于与线圈C的轴心对应的区域的贯通孔22c。另外,基板22在与上线圈导体24A的外周侧端部对应的位置具有贯通孔22d。而且,基板22在贯通孔22c的边缘区域且在上线圈导体24A的内周侧端部与下线圈导体24B的内周侧端部重叠的位置具有贯通孔22e。能够使用在玻璃布中浸渍有氰酸酯树脂(BT(双马来酰亚胺三嗪)树脂:注册商标)的基板且板厚60μm的基板作为作为基板22。此外,还能够使用除BT树脂以外的聚酰亚胺、芳纶等。作为基板22的材料,还能够使用陶瓷或玻璃。作为基板22的材料,优选大量生产的印刷基板材料,特别是最优选用于BT印刷基板、FR4印刷基板、或FR5印刷基板的树脂材料。
上线圈导体24A和下线圈导体24B为以包围基板22的贯通孔22c的方式设置的平面线圈。即,线圈C具有2段的平面线圈。各线圈导体24A、24B从素体10的上下方向观察,能够卷绕成例如圆形状或椭圆形状、四边形状。上线圈导体24A和下线圈导体24B经由基板22的贯通孔22e连接。各线圈导体24A、24B能够由Cu等金属材料构成。在本实施方式中,各线圈导体24A、24B通过Cu的电解镀形成。
一对引出导体26A、26B从线圈C的端部延伸至素体10的下表面10b。一个引出导体26A在素体10的侧面10c侧从上线圈导体24A的外周侧端部经由贯通孔22d延伸至素体10的下表面10b。另一个引出导体26B在与侧面10c相对的侧面10d侧从下线圈导体24B的外周侧端部延伸至素体10的下表面10b。
线圈部20包括一体覆盖构成线圈C的各线圈导体24A、24B和各引出导体26A、26B的覆盖树脂28。覆盖树脂28将线圈C和覆盖部30电绝缘。
覆盖部30一体覆盖线圈部20,并且构成素体10的表面10a~10f。覆盖部30由通过粘合树脂将金属磁性粉体粘接的粘接粉体构成。金属磁性粉可以由例如铁镍合金(坡莫合金合金)、羰基铁、非结晶、非晶质或结晶质的FeSiCr系合金、铁硅铝磁合金等构成。粘合树脂为例如热固化性的环氧树脂。在本实施方式中,粘接粉体中的金属磁性粉体的含量以体积百分比计为80~92vol%,以质量百分比计为95~99wt%。从磁特性的观点考虑,粘接粉体中的金属磁性粉体的含量体积百分比计,也可以为85~92vol%,以质量百分比计,为97~99wt%。
一对外部电极端子40A、40B均具有长方形状,设置于素体10的下表面10b的侧面10c侧和侧面10d侧。一外部电极端子40A在下表面10b沿着与侧面10c对应的边延伸。外部电极端子40A经由引出导体26A与线圈C的一端部(即,上线圈导体24A的外周侧端部)连接。另一外部电极端子40B在下表面10b沿着与侧面10d对应的边延伸。外部电极端子40B经由引出导体26B与线圈C的另一端部(即,下线圈导体24B的外周侧端部)连接。外部电极端子40A、40B能够使用Cr、Cu、Ni、Sn、Au、焊锡等。外部电极端子40A、40B也可以为多层结构。外部电极端子40A、40B也可以由含有银粉的导电性树脂构成。也可以在外部电极端子40A、40B的表层形成有镀镍层和镀锡层。
一对接地电极端子40C、40D设置于素体10的长度方向的中央附近。一个接地电极端子40C从素体10的下表面10b沿着侧面10d延伸,与形成于侧面10d的后述的屏蔽层50的Cu层51连接。另一个接地电极端子40D从素体10的下表面10b沿着侧面10f延伸,与形成于侧面10f的后述的屏蔽层50的Cu层51连接。接地电极端子40C、40D能够使用Cr、Cu、Ni、Sn、Au、焊锡等。接地电极端子40C、40D也可以为多层结构。接地电极端子40C、40D也可以由含有银粉的导电性树脂构成。也可以在接地电极端子40C、40D的表层形成有镀镍层和镀锡层。
屏蔽层50是用于防止线圈C的磁通量泄漏到线圈部件1的外部的层。屏蔽层50具有多层结构(本实施方式中2层结构),从靠近素体10的一方依次为Cu层51、坡莫合金层52。Cu层51的厚度为例如0.1~1μm。坡莫合金层52的厚度为例如0.1~1μm。坡莫合金层52的厚度也可以为0.1~10μm的范围。屏蔽层50设置为经由绝缘层45一体覆盖素体10的表面10a、10c、10d、10e、10f。绝缘层45在本实施方式中由环氧树脂构成。构成绝缘层45的材料不局限于环氧树脂,也可以为玻璃等。绝缘层45的厚度为例如1~5μm。
以下,参照图3和图4对制造上述线圈部件1的步骤进行说明。
在制造线圈部件1时,如图3(a)所示,准备素体10。然后,如图3(b)所示,利用抗蚀剂60遮蔽素体10的下表面10b的整面。接着,如图3(c)所示,在除由抗蚀剂60覆盖的下表面10b以外的素体表面的整体涂敷环氧树脂并使其固化,形成绝缘层45。环氧树脂能够通过例如印刷或蘸湿涂敷于素体表面。接着,如图3(d)所示,通过无电解镀敷由Cu覆盖除由抗蚀剂60覆盖的下表面10b以外的素体表面的整体,形成Cu层51。此外,在形成Cu层51时,使绝缘层45上载持铂催化剂。
然后,如图4(a)所示,在除去了抗蚀剂60后,在素体10的下表面10b形成各外部电极端子40A、40B和各接地电极端子40C、40D。然后,如图4(b)所示,由抗蚀剂62遮蔽素体10的下表面10b的整面。此时,各外部电极端子40A、40被抗蚀剂62覆盖,设置于下表面10b的部分的各接地电极端子40C、40D也被抗蚀剂62覆盖。
另外,如图4(c)所示,通过无电解镀敷由坡莫合金覆盖除由抗蚀剂62覆盖的下表面10b以外的素体表面的整体,形成坡莫合金层52。由此,形成包含Cu层51和坡莫合金层52的屏蔽层50。形成屏蔽层50后,如图4(d)所示,除去抗蚀剂60,根据需要进行后工序(例如,通过Ni和Sn的滚镀,在外部电极端子40A、40B和接地电极端子40C、40D的表层形成电镀层的工序),线圈部件1完成。
在上述线圈部件1中,如图5所示,绝缘层45介于Cu层51和素体10的表面(例如上表面10a)之间。素体10的表面由通过粘合树脂将金属磁性粉体粘接的粘接粉体构成,所以各个金属磁性粉体的形状在素体表面出现而容易产生凹凸。另外,在通过切削或研磨形成素体10的表面的情况下,由于金属磁性粉体的脱离和破裂、缺口,会在素体表面产生凹凸。如本实施方式的粘接粉体,在粘接粉体中的金属磁性粉体的含量极高的情况下,特别容易产生凹凸。因此,在由屏蔽层50的Cu层51直接覆盖素体表面的情况下,会在屏蔽层50的Cu层51产生厚度变化。特别是,在产生屏蔽层50的Cu层51变薄的部位或不存在的部位(孔)的情况下,作为屏蔽层的功能显著降低。
因此,在线圈部件1中,在利用绝缘层45覆盖素体10的表面使表面的凹凸平滑化的基础上,设置屏蔽层50。由此,如图5所示,屏蔽层50的Cu层51设置为平滑面,所以抑制厚度不均,能够以实质上均匀的厚度形成。其结果,在线圈部件1中,难以产生屏蔽层50薄的部位和不存在的部位,有效地抑制屏蔽层50的功能降低。另外,由于利用绝缘层45抑制屏蔽层50的厚度变化,所以能够抑制形成孔的情况,同时使屏蔽层50变薄。
另外,在线圈部件1中,利用绝缘层45使屏蔽层50远离素体10的表面。因此,如图6所示,即使在外部电极端子40A设置成靠近素体10的侧面10c的情况下,也能够充分地确保外部电极端子40A与屏蔽层50的Cu层51的分开距离d,抑制在高频电流施加到线圈部件1时在外部电极端子40A与屏蔽层50的Cu层51之间短路的情况。另外,通过绝缘层45使屏蔽层50与素体10的表面绝缘分离,所以也抑制在屏蔽层50由高频的集肤效应产生的电流的情况。
本发明不限定于上述实施方式,能够进行各种变更。
例如,屏蔽层50并不一定需要设置于除下表面10b以外的素体10的表面10a、10c、10d、10e、10f,只要至少设置于上表面10a即可。素体10的上表面10a是与线圈C的轴正交的面,磁通量特别容易泄漏,所以通过在素体10的上表面10a设置屏蔽层50,能够有效地抑制磁通量的泄漏。在将屏蔽层50设置于素体10的表面10a、10c、10d、10e、10f的情况下,与仅设置于上表面10a的情况相比,进一步抑制来自线圈部件1的磁通量泄漏。
图7表示仅在素体10的上表面10a设置有屏蔽层50的线圈部件1A。在线圈部件1A中,绝缘层45和屏蔽层50仅设置于素体10的上表面10a,绝缘层45介于屏蔽层50和素体10的上表面10a之间。在线圈部件1A中,屏蔽层50的Cu层51也设置于利用绝缘层45平滑化后的面,所以能够以实质上均匀的厚度形成。线圈部件1A的接地端子电极40E从素体10的下表面10b沿着侧面10d、10f延伸至上表面10a,与屏蔽层50的Cu层51连接。
线圈C不局限于包括2段的平面线圈的结构,平面线圈的段数能够适当增减。线圈也可以为螺旋状的线圈。
屏蔽层不局限于2层结构,也可以为单层结构或3层以上的多层结构。在屏蔽层为多层结构的情况下,与屏蔽层为单层结构的情况相比,屏蔽效果提高。屏蔽层能够由具有比构成素体的覆盖部的粘接粉体高的导磁率的材料构成。屏蔽层能够由除上述坡莫合金和Cu以外的铁氧体、Ni、Ni合金等构成。
此外,在屏蔽层的表面还可以设置由环氧树脂等构成的绝缘层。该情况下,能够实现线圈部件1和外部的绝缘。设置于屏蔽层的表面的绝缘层也可以为图8所示的形式。即,设置于屏蔽层50的表面的绝缘层55覆盖屏蔽层50的Cu层51和坡莫合金层52的端部51a、52a(即,素体下表面10b附近的下端部),Cu层51和坡莫合金层52不露出到外部。构成绝缘层55的材料不局限于环氧树脂,也可以为玻璃等。绝缘层55的厚度能够设计为比位于屏蔽层50的内侧的绝缘层45的厚度薄。
Claims (5)
1.一种线圈部件,其特征在于,包括:
素体,其包含利用粘合树脂粘接金属磁性粉体而成的粘接粉体和埋设于该粘接粉体内的线圈,并具有在该线圈的轴向上相对的一对主面;
绝缘层,其覆盖所述素体的一方的主面;和
屏蔽层,其隔着所述绝缘层设置于所述一方的主面上。
2.如权利要求1所述的线圈部件,其特征在于:
还包括设置于所述素体的另一方的主面的、与所述线圈的两端部电连接的一对外部电极端子。
3.如权利要求2所述的线圈部件,其特征在于:
所述素体具有长方体状的外形,
所述绝缘层覆盖所述素体的所述一方的主面和4个侧面,
所述屏蔽层隔着所述绝缘层设置在所述一方的主面上和所述4个侧面上。
4.如权利要求1~3中任一项所述的线圈部件,其特征在于:
所述屏蔽层具有多层结构。
5.如权利要求1~4中任一项所述的线圈部件,其特征在于:
所述粘接粉体中的金属磁性粉体的含量为80~92vol%。
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