CN111145937A - Busbar for capacitor - Google Patents
Busbar for capacitor Download PDFInfo
- Publication number
- CN111145937A CN111145937A CN202010045861.7A CN202010045861A CN111145937A CN 111145937 A CN111145937 A CN 111145937A CN 202010045861 A CN202010045861 A CN 202010045861A CN 111145937 A CN111145937 A CN 111145937A
- Authority
- CN
- China
- Prior art keywords
- metal
- metal wire
- busbar
- leading
- wire layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 118
- 229910052751 metal Inorganic materials 0.000 claims abstract description 118
- 238000003466 welding Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 11
- 230000002500 effect on skin Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/161—Details
- H01R25/162—Electrical connections between or with rails or bus-bars
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a busbar for a capacitor, which comprises a busbar body and at least one leading-out terminal, and is characterized in that: the bus bar body is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires, and the metal wires are connected through connecting wires; the leading-out terminal is connected with the metal wire layer. The invention solves the problems that the prior busbar for the capacitor is easy to generate skin effect under the high-frequency application condition and has larger self-inductance under the high-frequency condition.
Description
Technical Field
The invention relates to the technical field of a busbar and leading-out terminal leading-out structure connected inside a capacitor, in particular to a busbar for a capacitor.
Background
One of the bus bar and leading-out terminal leading-out structures internally connected with the existing capacitor is formed by integrally stamping and bending a copper plate 3 with the thickness of 1-3mm as shown in figure 1. When the capacitor core is applied, the capacitor core is directly welded or welded on the copper bar through a lead/copper foil. But the existing busbar has the following defects: 1) the skin effect is easy to generate under the high-frequency application condition; 2) the self-inductance under high frequency is large.
In addition, the existing processing die for the busbar is complex and very high in cost, large-tonnage stamping equipment (more than 80T) is required for processing the copper bar, and the processing cost is high.
Disclosure of Invention
The invention aims to provide a busbar for a capacitor, which mainly solves the problems in the prior art that: the existing bus bar for the capacitor is easy to generate skin effect under the high-frequency application condition and has larger self-inductance under the high-frequency condition; the second problem is that the conventional capacitor busbar has the problems of complex processing die and high cost, and the provided capacitor busbar is provided.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a condenser is with arranging, is arranged body, at least one leading-out terminal including female, its characterized in that: the bus bar body is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires, and the metal wires are connected through connecting wires; the leading-out terminal is connected with the metal wire layer.
Further, at least two metal wires of each metal wire layer are arranged in parallel; the connecting wires and the metal wires are in mutually perpendicular directions or form included angles.
Furthermore, gaps are arranged between the metal wires in each metal wire layer.
Furthermore, each metal wire layer comprises at least two groups of metal wire groups formed by at least four metal wires, each metal wire group is formed by tightly connecting at least two metal wires, and a gap is arranged between every two adjacent metal wire groups.
Further, the cross-sectional area of the metal wire ranges from 0.2 mm to 20 mm; the cross-sectional area of the connecting wire is 0.2 mm to 20 mm.
Furthermore, the lower end of the leading-out terminal is provided with a welding leg.
Further, the busbar body is composed of a metal wire layer, and the leading-out terminal is connected with the metal wire layer.
Further, the busbar body is formed by sequentially connecting more than two metal conductor layers in an up-down overlapping manner, and adjacent metal conductor layers are connected through a connecting conductor.
Furthermore, the metal wire layer is also provided with a through hole.
In view of the technical characteristics, the invention has the following beneficial effects:
1. the invention discloses a busbar for a capacitor, which provides a structure form for connecting the busbar in the capacitor and leading out a terminal, compared with the existing product, the product of the invention has the following advantages: 1) the terminal stamping processing die is simple, high-speed stamping can be realized, and the die and processing cost is low; 2) the processing terminal stamping equipment is general equipment (below 80T), so that the processing cost is low; 3) the skin effect is low and negligible under the high-frequency application condition; 4) the self-inductance is small under the high-frequency condition, and the influence on the use effect of a product caused by serious heating (namely, the larger the self-inductance is, the more serious the heating is) of the busbar for the capacitor under the high-frequency condition is avoided.
2. Compared with the copper bar in the prior art, the bus bar for the capacitor has the advantages of saving more materials, larger surface area and lighter weight.
Drawings
Fig. 1 is a schematic structural diagram of a busbar for a capacitor in the prior art.
Fig. 2 is a schematic structural diagram of a busbar for a capacitor in embodiment 1.
Fig. 3 is a schematic structural view of a lead terminal in embodiment 1.
Fig. 4 is a schematic structural diagram of a busbar for a capacitor in embodiment 2.
In the figure: 1 is a busbar body; 11 is a metal wire; 12 is a connecting lead; 13 is a through hole; 2 is a leading-out terminal; 21 is a welding leg; 22 is a fixed mounting hole; and 3, a copper plate of a busbar for the conventional capacitor.
Detailed Description
The invention will be further illustrated with reference to specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Referring to fig. 2 to 3, in embodiment 1, a busbar for a capacitor includes a busbar body 1 and at least one leading-out terminal 2, and is characterized in that: the bus bar body 1 is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires 11, and the metal wires 11 are connected through connecting wires 12; the leading-out terminal 2 is connected with the metal wire layer.
The metal wires 11 are connected by connecting wires 12, for example, the metal wires 11 and the connecting wires 12 are connected by welding including, but not limited to, spot welding, soldering, resistance welding, and riveting. The connecting wires 12 are used for connecting the metal wires 11 together, and the connecting wires 12 and the metal wires 11 have the function of current flowing.
At least two metal wires 11 of each metal wire layer are arranged in parallel, and the parallel arrangement can form a plane metal wire layer and also can form a three-dimensional metal wire layer, such as a metal wire layer with a U-shaped section; connecting wire 12 and metal wire 11 are mutually perpendicular direction or are the contained angle, are convenient for connecting wire 12 and connect fixedly to metal wire 11 for each metal wire 11 can form firm metal wire layer shape.
The leading-out terminal 2 can be connected with the metal wire layer in a welding and/or riveting mode, can be connected to the peripheral edge part of the metal wire layer, can also be connected to the upward surface of the metal wire layer, and can also be connected to the downward surface of the metal wire layer.
According to the structure and the requirement of the capacitor and the busbar product, the leading-out terminals 2 can be one, two or more, and can be uniformly distributed on the metal wire layer or non-uniformly distributed on the metal wire layer.
The cross section of the metal wire 11 is circular, oval or square, and the cross section of the connecting wire 12 is circular, oval or square, which can be selected according to actual conditions.
And a gap is arranged between the metal wire 11 and the metal wire 11 in each metal wire layer. Alternatively, each metal wire layer comprises at least two groups of metal wire groups formed by at least four metal wires 11, each metal wire group is formed by tightly connecting at least two metal wires 11, and a gap is formed between adjacent metal wire groups. The design in clearance can effectively reduce the skin effect of the metal to the electric current on the line layer, has reduced the product simultaneously and has been reduced the equivalent series inductance of female arranging for the condenser promptly. A gap is formed between the metal wire 11 and the metal wire 11, and compared with the gap formed between adjacent metal wire groups, the effect of reducing the skin effect of current is better, and the effect of reducing the equivalent series inductance of a product is better; and gaps are arranged between adjacent metal lead groups, so that compared with the gaps arranged between the metal leads 11 and the metal leads 11, the processing efficiency is higher, and the space utilization is reasonable.
Preferably, the cross-sectional area of the metal wire 11 ranges from 0.2 mm to 20 mm; the cross-sectional area of the connecting wire 12 is 0.2 mm to 20 mm. The metal wire 11 and the connecting wire 12 within the cross-sectional area range can meet the requirements of the capacitor on current circulation and current flow, and simultaneously can reduce the volume and weight of the metal wire 11 and the connecting wire 12 as much as possible, and save the materials of the metal wire 11 and the connecting wire 12.
The lower end of the leading-out terminal 2 is provided with a welding foot 21, as shown in fig. 3, the welding foot 21 is convenient for assembling the leading-out terminal 2 with the busbar body 1 in a soldering/resistance welding/riveting mode or the like, and each layer of metal wire layer of the busbar body 1 can be assembled together. According to the product structure, the solder tails 21 can be arranged in different forms, such as a single solder tail, two solder tails or a plurality of solder tails, or the busbar body 1 can also be the same side or different sides of each metal wire layer of the busbar body 1, and the like.
According to the capacitor and the busbar product structure and requirements, the upper end of the leading-out terminal 2 can be provided with a fixed mounting hole 22 or a mounting stud, and the fixed mounting hole 22 can also be provided with a fixed nut, so that the capacitor is indirectly fixed on a specified position by connecting and fixing the leading-out terminal 2.
In this embodiment 1, female body 1 of arranging comprises one deck metal wire layer, leading-out terminal 2 is four, four leading-out terminal 2 unevenly distribute and connect on metal wire layer, and every leading-out terminal 2 is actually three leg through leg 21 promptly, and the both sides of branch leading-out terminal 2, leading-out terminal one side are equipped with a leg 21, and the opposite side is equipped with two legs 21, and it is fixed to form the triangle, carries out fixed connection in metal wire layer one side up with leading-out terminal 2 and metal wire layer more firmly, is equipped with fixed mounting hole 22 on every leading-out terminal 2.
In the production process of the busbar, the metal lead 11 and the connecting lead 12 can be cut in advance according to the required length, and the metal lead 11 and the connecting lead 12 are welded together by soldering, resistance welding and other welding modes to form the busbar body 1; the metal wires 11 are parallel to each other, a small gap exists between every two wires or a group of wires, a small gap exists between every two adjacent groups, and the connecting wires 12 and the metal wires 11 are perpendicular to each other or form an included angle. And then the leading-out terminal 2 is assembled on the busbar body 1 by modes of tin soldering, resistance welding, riveting and the like according to specific requirements to form the busbar for the capacitor.
Referring to fig. 4, embodiment 2 is substantially the same as embodiment 1 except that: the metal conductor layer is also provided with a through hole 13.
When the leading-out terminal 2 is connected to the metal wire layer facing downwards, the through hole 13 is arranged at the corresponding position of the metal wire layer of the busbar body 1 so as to lead out or penetrate out the leading-out terminal 2 conveniently, and various requirements of different capacitors on busbar products are met.
When the busbars are combined and applied in pairs, when the leading-out terminal 2 of one busbar interferes with the other busbar body 1, the corresponding through hole 13 can be arranged on the busbar body 1 with the interference busbar so as to facilitate the superposition of the busbar bodies 1 and meet various requirements of different capacitors on busbar products.
The through holes 13 for leading the leading-out terminals of other busbars can be selectively arranged between the adjacent leading-out terminals 2, when the leading-out terminals of other busbars are led through by the through holes 13, namely two busbars are combined, the leading-out terminals of other busbars can be conveniently led out by the through holes 13, gaps exist between the inner walls of the through holes 13 and the leading-out terminals of other busbars, and the gaps are convenient for infiltration of potting materials which are generally insulating materials when the capacitor is produced, so that the through holes 13 are prevented from being communicated with the leading-out terminals of other busbars.
Alternatively, the lead terminal 2 may be directly fixed and connected to the upward surface of the metal wire layer.
The three schemes can be selected and designed according to the requirement of an actual capacitor on the busbar structure and the current flow, the multilayer metal wire layer-by-layer design can increase the current flow of the busbar body 1 according to the requirement, meanwhile, the space arrangement of the metal wire layer can be more reasonably arranged, and the limited space in the capacitor is better utilized.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The utility model provides a condenser is with arranging, arranges body (1), at least one leading-out terminal (2) including female, its characterized in that: the bus bar body (1) is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires (11) in an arrangement mode, and the metal wires (11) are connected through connecting wires (12); the leading-out terminal (2) is connected with the metal conducting layer.
2. The busbar according to claim 1, wherein: at least two metal wires (11) of each metal wire layer are arranged in parallel; the connecting lead (12) and the metal lead (11) are in mutually perpendicular directions or form an included angle.
3. The busbar according to claim 2, wherein: gaps are arranged between the metal leads (11) in each metal lead layer and the metal leads (11).
4. The busbar according to claim 2, wherein: at least two groups of metal lead groups formed by at least four metal leads (11) in each metal lead layer are arranged, each metal lead group is formed by tightly connecting at least two metal leads (11), and a gap is arranged between every two adjacent metal lead groups.
5. The busbar according to claim 3 or 4, wherein: the cross-sectional area of the metal wire (11) ranges from 0.2 square millimeter to 20 square millimeters; the cross-sectional area of the connecting lead (12) is 0.2 mm to 20 mm.
6. The busbar according to claim 5, wherein: and the lower end of the leading-out terminal (2) is provided with a welding leg (21).
7. The busbar according to claim 6, wherein: the bus bar body (1) is composed of a metal wire layer, and the leading-out terminal (2) is connected with the metal wire layer.
8. The busbar according to claim 6, wherein: the busbar body (1) is formed by sequentially connecting more than two metal conductor layers in an up-down overlapping manner, and the adjacent metal conductor layers are connected through a connecting conductor.
9. The busbar according to claim 7 or 8, wherein: the metal wire layer is also provided with a through hole (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010045861.7A CN111145937A (en) | 2020-01-16 | 2020-01-16 | Busbar for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010045861.7A CN111145937A (en) | 2020-01-16 | 2020-01-16 | Busbar for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111145937A true CN111145937A (en) | 2020-05-12 |
Family
ID=70525450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010045861.7A Pending CN111145937A (en) | 2020-01-16 | 2020-01-16 | Busbar for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111145937A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111740285A (en) * | 2020-08-11 | 2020-10-02 | 阳光电源股份有限公司 | Partially bent press-fit bus and processing method thereof |
-
2020
- 2020-01-16 CN CN202010045861.7A patent/CN111145937A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111740285A (en) * | 2020-08-11 | 2020-10-02 | 阳光电源股份有限公司 | Partially bent press-fit bus and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9193001B2 (en) | Welding jig and welding process for planar magnetic components | |
| CN202178142U (en) | Inductor/transformer and automobile power supply circuit board | |
| CN105514072A (en) | Power module low-inductance lead terminal | |
| CN111145937A (en) | Busbar for capacitor | |
| CN204348492U (en) | Meet electronic transformer skeleton and the electronic transformer of safety | |
| CN211350124U (en) | Busbar for capacitor | |
| CN105914036A (en) | Multilayer ceramic capacitor of low ESL | |
| CN206685996U (en) | A kind of motor stator winding connection structure | |
| CN204155616U (en) | A kind of busbar | |
| CN202888171U (en) | Thyristor module | |
| CN212907419U (en) | Lead structure of organic film capacitor | |
| CN216902547U (en) | Busbar for capacitor | |
| CN216698098U (en) | Busbar for capacitor | |
| CN218940250U (en) | Busbar for capacitor | |
| CN220691850U (en) | Improved miniature inductor | |
| CN218940249U (en) | Busbar for capacitor | |
| CN207599406U (en) | A kind of multilayer circuit board LED light strip | |
| CN220821986U (en) | Equal-height positioning busbar | |
| CN2899056Y (en) | Four-loop metal foil winding topological structure | |
| CN214753403U (en) | Capacitor with bus bar laminated flanging structure | |
| CN216133763U (en) | Base, power filtering module and vehicle | |
| CN217588702U (en) | Busbar for capacitor | |
| CN210668055U (en) | Anti-oxidation and heightening-free flat-plate transformer | |
| CN214068695U (en) | 2.5D packaging structure and electronic equipment | |
| CN219203502U (en) | High-quality factor medium wave broadcast signal receiving antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |