CN105514072A - Power module low-inductance lead terminal - Google Patents
Power module low-inductance lead terminal Download PDFInfo
- Publication number
- CN105514072A CN105514072A CN201610062337.4A CN201610062337A CN105514072A CN 105514072 A CN105514072 A CN 105514072A CN 201610062337 A CN201610062337 A CN 201610062337A CN 105514072 A CN105514072 A CN 105514072A
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- China
- Prior art keywords
- lead terminal
- terminal
- lead
- end pin
- power model
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
- H01L23/4855—Overhang structure
Abstract
The invention discloses a power module low-inductance lead terminal. The lead terminal comprises a first lead terminal body and a second lead terminal body which are connected with a positive busbar and a negative busbar of an external power source of a power module. The first lead terminal body comprises a plurality of first lead terminal pins, first supporting parts and first fixed connecting parts which are connected sequentially. The second lead terminal body comprises a plurality of second lead terminal pins, second supporting parts and second fixed connecting parts which are connected sequentially. The first lead terminal pins of the first lead terminal body and the second lead terminal pins of the second lead terminal body are arranged in a staggered mode. The pins of the two terminal bodies are located on the same straight line so as to reduce terminal parasitic inductance, and correspondingly, copper foil on the DBC is designed to be in a staggering shape, so that interconnection is achieved; the parallel crossing structure is adopted in the positive and negative terminal bodies, the loop area of the power lead terminal is reduced, and parasitic inductance of the power terminal bodies is greatly reduced, is about 11.9 nH, and is only half of that of a general power lead terminal; meanwhile, the occupied distance of the two lead terminal bodies on the power module is saved.
Description
Technical field
The present invention relates to the low inductance leads technical field of power model, particularly relate to the low inductance leads terminal of power model.
Background technology
When design power module, in order to make power model meet the high-frequency condition of work of big current, the stray inductance of the lead terminal of power model should be reduced, to reduce to open the voltage fluctuation with power terminal when turning off as far as possible.
The stray inductance of module can be divided into lead terminal stray inductance L1, bonding line stray inductance and L2 and DBC distributed parasitic inductance L3, and triangular mutual inductance, when power model is opened or turn off, electric current jumps bust, due to the existence of stray inductance, the positive and negative lead wires terminal of module can produce an induced voltage VL, the voltage of this voltage and DC bus is superimposed, occurs voltage fluctuation when causing module to open or turn off.Because the resistance to of power chip is pressed with certain restriction, if the too fast chip voltage that will cause of current variation is too high during module switch, cause chip failure.
Due to lead terminal Structure Designing Problem in existing power model, cause module to there is larger stray inductance, limit the further raising of module work frequency and switching speed.
Therefore, a kind of new technical scheme of necessary proposition is to solve the defect of prior art.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the invention provides the low inductance leads terminal of power model, it is by changing shape and the structure of existing power model lead terminal, and relative position, reduce the stray inductance of lead terminal, to realize the high switching speed of power model.
The technical solution adopted in the present invention is: the low inductance leads terminal of power model, comprise the first lead terminal and the second lead terminal that are connected with the positive and negative busbar of power model external power source, the first lead terminal comprises several the first lead end pin, the first support portion and first that connect successively and is solidly connected portion; Second lead terminal comprises several the second lead end pin, the second support portion and second that connect successively and is solidly connected portion; Wherein the first lead end pin of the first lead terminal and the second lead end pin of the second lead terminal are crisscross arranged.On the same line, to reduce terminal stray inductance, correspondingly, the Copper Foil on DBC is designed to staggered at the pin place of two terminals, to realize interconnection.Positive and negative terminals, by adopting level crossing structure, reduces power lead terminal loop area, substantially reduces the stray inductance of power terminal, and saves two lead terminals simultaneously take distance on power model.
Further improvement of the present invention is, be also provided with the first gap between every two first lead end pin of the first lead terminal, the width in each the first gap is greater than the width of setting the second lead end pin in the inner; Also be provided with the second gap between every two second lead end pin of the second lead terminal, the width in each the second gap is greater than the width of the first lead end pin established in the inner.
Further improvement of the present invention is, several the first lead end pin and several the second lead end pin of the first lead terminal and the second lead terminal form straight line side by side.
Further improvement of the present invention is, the first lead end pin and the second lead end pin are connected on power model respectively by ultra-sonic welded.
Further improvement of the present invention is, the first lead end pin and the second lead end pin entirety are in round and smooth arcuate structure.
Further improvement of the present invention is, the first lead end pin of the first lead terminal and the second lead end pin quantity of the second lead terminal are respectively three.
Further improvement of the present invention is, the first support portion and second support portion of the first lead terminal and the second lead terminal are arranged in parallel.
Further improvement of the present invention is, the material of the first lead terminal and the second lead terminal is copper, and its thickness is respectively 0.7 to 1.5mm; Lamination distance between first support portion and the second support portion is 0.5-2.5mm.
Further improvement of the present invention is, the first lead terminal is connected with power model respectively by Reflow Soldering with the edge of the second lead terminal, the bevelling, edge of the first lead terminal and the second lead terminal or rounding.。
Further improvement of the present invention is, the first lead end pin of the first lead terminal, the first support portion and first portion of being solidly connected are continuous bending structure, and first after its bending is connected the upper surface in portion and the upper surface of power model coplanar; Second lead end pin of the second lead terminal, the second support portion and second portion of being solidly connected are continuous bending structure, and second after its bending is connected the upper surface in portion and the upper surface of power model coplanar.
Compared with prior art, the invention has the beneficial effects as follows: power model lead terminal of the present invention is made up of the lead terminal of side by side pair of parallel+coplanar chi structure, comprise the first lead terminal and the second lead terminal, its relative space position, be injection molding into the profile after module housing, the part that two-terminal is injection molding into plastics shell have employed parallel side by side configuration, and terminal pins part have employed coplanar chi structure, and terminal pins is connected by ultra-sonic welded with the Copper Foil on DBC.Except the part of external DC bus, first power terminal and the second power terminal are owing to have employed parallel side by side configuration, and due to both areas, shape is similar, distance closely, according to electromagnetic theory, because the two-terminal sense of current is contrary, the space of magnetic flux density between terminal of generation is strengthened mutually, cancel out each other in space outside gap, under the prerequisite of versatility ensureing terminal insulative and installation, the gap between terminal is less, and the stray inductance of terminal is less; Similarly, the electric current of terminal pins part is divided into three strands, because the adjacent leads sense of current is contrary, although the magnetic flux density between adjacent two pins can be strengthened, but there is the direction of the magnetic flux density in two pairs of gaps just in time contrary, after cancelling out each other, only the magnetic flux in remaining a slice gap is effective, this reduces the stray inductance of power terminal.
The present invention adopts positive and negative electrode stack-design, and is embossed in module housing, and compared with conventional design, lead terminal inductance can reduce half; The connection of lead terminal and DBC, is designed to the alternating structure of dentation; Adopt the method for ultra-sonic welded, dentalation is accomplished to be electrically connected with the layers of copper on DBC surface; The part of dentalation and model calling, is designed to arcuation, to reduce the stress of lead terminal; The material of lead terminal is copper or copper alloy.
Due to above two kinds of mechanism, its stray inductance is reduced, greatly through Numerical Simulation Analysis, the stray inductance of power model lead terminal of the present invention is about 11.9nH, compare universal power module lead terminal, stray inductance reduces greatly, is only 1/2nd of universal power lead terminal.
Accompanying drawing explanation
Fig. 1 is the syndeton schematic diagram of an embodiment of the low inductance leads terminal of power model;
Fig. 2 is the structural representation of the first lead terminal of the embodiment of Fig. 1;
Fig. 3 is the structural representation of the second lead terminal of the embodiment of Fig. 1;
Fig. 4 is the structural representation that the lead terminal of the embodiment of Fig. 1 is connected on power model;
Fig. 5 is traditional power model direct current lead terminal design structure chart;
Fig. 6 is the improvement lead terminal structural representation on traditional power model direct current lead terminal basis;
Wherein:
1-first lead terminal, 11-first lead end pin, 12-first support portion, 13-first is solidly connected portion, 14-first gap; 2-second lead terminal, 21-second lead end pin, 22-second support portion, 23-second is solidly connected portion, 24-second gap; 3-connecting hole; 4-power model.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with drawings and Examples, the present invention is further described, and this embodiment, only for explaining the present invention, not forming protection scope of the present invention and limiting.
As shown in Figure 5, be power model direct current lead terminal design, be made up of pair of parallel coplanar power terminal 1 ' and 2 ', due to spacing comparatively large, comparatively greatly, its stray inductance is larger for area that two-terminal is enclosed, through Numerical Simulation Analysis, calculating its stray inductance is 24.2nH.
In order to reduce the stray inductance of lead terminal, common way be by terminal between distance reduce, make as shown in Figure 6, by pair of parallel coplanar, and spacing less power terminal 1 ' ' and 2 ' ' composition, but the limited use played like this, power terminal shown in Fig. 6, its stray inductance is about 16.7nH, 31% is reduced than the conventional design shown in Fig. 5, owing to having clearance for insulation requirement between power model negative leads terminal, its spacing can not infinitely reduce, therefore, need the stray inductance adopting new mentality of designing to reduce between positive and negative terminals further.
As shown in 1 and Fig. 4, the low inductance leads terminal of power model, comprise the first lead terminal 1 of being connected with the positive and negative busbar of power model 4 external power source and the second lead terminal 2, first lead terminal 1 to comprise several the first lead end pin 11, first support portions 12 and first connected successively and be solidly connected portion 13; Second lead terminal 1 comprises several the second lead end pin 21, second support portions 22 and second connected successively and is solidly connected portion 23; Wherein the first lead end pin 11 of the first lead terminal 1 and the second lead end pin 21 of the second lead terminal 2 are crisscross arranged.On the same line, to reduce terminal stray inductance, correspondingly, the Copper Foil on DBC plate is designed to staggered at the pin place of two terminals, to realize interconnection.Positive and negative terminals, by adopting level crossing structure, reduces power lead terminal loop area, substantially reduces the stray inductance of power terminal, and saves two lead terminals simultaneously take distance on power model.
Shown in Fig. 1, Fig. 2 and Fig. 3, be also provided with the first gap 14 between every two first lead end pin 11 of the first lead terminal 1, the width in each the first gap 14 is greater than the width of setting the second lead end pin 21 in the inner; Also be provided with the second gap 24 between every two second lead end pin 21 of the second lead terminal 2, the width in each the second gap 24 is greater than the width of the first lead end pin 11 established in the inner.And several the first lead end pin 11 of the first lead terminal 1 and the second lead terminal 2 and several the second lead end pin 21 form straight line side by side.First lead end pin 11 and the second lead end pin 21 entirety are in round and smooth arcuate structure.First lead end pin 11 of the first lead terminal 1 and the second lead end pin 21 quantity of the second lead terminal 2 are respectively three, and stray inductance is now minimum.
In the above-described embodiments, the first lead end pin 11 and the second lead end pin 21 are connected on power model respectively by ultra-sonic welded.
In the above-described embodiments, the first support portion 12 and second support portion 22 of the first lead terminal 1 and the second lead terminal 2 are arranged in parallel, the corresponding reduction of stray inductance.In order to make the first lead terminal 1 and the second lead terminal 2, there is more simple and direct structure, second lead end pin 21 of the second lead terminal 2 is provided with protuberance 221 to the side of its support portion 22, and protuberance 221 supports the second lead end pin 21 of outstanding second support portion 22.
In the above-described embodiments, the material of the first lead terminal 1 and the second lead terminal 2 is copper, and its thickness is respectively 0.7 to 1.5mm.Lamination distance between first support portion 12 and the second support portion 22 is 0.5-2.5mm.First lead terminal 1 and the second lead terminal 2 are respectively equipped with a connecting hole 3, for connecting external structure.
In addition, the first lead terminal 1 is connected with power model respectively by Reflow Soldering with the edge of the second lead terminal 2.First lead end pin 11, first support portion 12 of the first lead terminal 1 and first is solidly connected portion 13 for continuous bending structure, and first after its bending is connected the upper surface in portion 13 and the upper surface of power model coplanar; Second lead end pin 21, second support portion 22 of the second lead terminal 2 and second is solidly connected portion 23 for continuous bending structure, and second after its bending is connected the upper surface in portion 23 and the upper surface of power model coplanar.
In the above-described embodiments, the bevelling, edge of the first lead terminal 1 and the second lead terminal 2 or rounding.
Power model lead terminal of the present invention is made up of the lead terminal of side by side pair of parallel+coplanar chi structure, comprise the first lead terminal and the second lead terminal, its relative space position, be injection molding into the profile after module housing, the part that two-terminal is injection molding into plastics shell have employed parallel side by side configuration, terminal pins part have employed coplanar chi structure, and terminal pins is connected by ultra-sonic welded with the Copper Foil on DBC.Due to above two kinds of mechanism, its stray inductance is reduced greatly, through Numerical Simulation Analysis, the stray inductance of the power model lead terminal of the present invention shown in Fig. 3 is about 11.9nH, compare universal power module lead terminal, stray inductance reduces greatly, is only 1/2nd of universal power lead terminal.
What embodiments of the invention were announced is preferred embodiment, but is not limited thereto, those of ordinary skill in the art; very easily according to above-described embodiment, understand spirit of the present invention, and make different amplifications and change; but only otherwise depart from spirit of the present invention, all in protection scope of the present invention.
Claims (10)
1. the low inductance leads terminal of power model, comprise the first lead terminal (1) and the second lead terminal (2) that are connected with the positive and negative busbar of power model (4) external power source, described first lead terminal (1) comprises several the first lead end pin (11), the first support portion (12) and first that connect successively and is solidly connected portion (13); Described second lead terminal (1) comprises several the second lead end pin (21), the second support portion (22) and second that connect successively and is solidly connected portion (23); It is characterized in that: the first lead end pin (11) of wherein said first lead terminal (1) and the second lead end pin (21) of the second lead terminal (2) are crisscross arranged.
2. the low inductance leads terminal of power model according to claim 1, it is characterized in that: be also provided with the first gap (14) between every two first lead end pin (11) of described first lead terminal (1), the width of the first gap (14) described in each is greater than the width of setting the second lead end pin (21) in the inner; Also be provided with the second gap (24) between every two second lead end pin (21) of described second lead terminal (2), the width of the second gap (24) described in each is greater than the width of the first lead end pin (11) established in the inner.
3. the low inductance leads terminal of power model according to claim 2, is characterized in that: several the first lead end pin (11) and several the second lead end pin (21) of described first lead terminal (1) and the second lead terminal (2) form straight line side by side.
4. the low inductance leads terminal of power model according to claim 3, is characterized in that: described first lead end pin (11) and the second lead end pin (21) are connected on power model respectively by ultra-sonic welded.
5. the low inductance leads terminal of power model according to claim 4, is characterized in that: described first lead end pin (11) and the second lead end pin (21) entirety are in round and smooth arcuate structure.
6. the low inductance leads terminal of power model according to claim 5, is characterized in that: the first lead end pin (11) of described first lead terminal (1) and the second lead end pin (21) quantity of the second lead terminal (2) are respectively three.
7. the low inductance leads terminal of power model according to claim 6, is characterized in that: first support portion (12) of described first lead terminal (1) and the second lead terminal (2) is arranged in parallel with the second support portion (22).
8. the low inductance leads terminal of power model according to claim 7, is characterized in that: the material of described first lead terminal (1) and the second lead terminal (2) is copper, and its thickness is respectively 0.7 to 1.5mm; Lamination distance between described first support portion (12) and the second support portion (22) is 0.5-2.5mm.
9. according to the low inductance leads terminal of the power model in claim 1,2,3,6,7,8 described in any one, it is characterized in that: described first lead terminal (1) is connected with power model respectively by Reflow Soldering with the edge of the second lead terminal (2); The bevelling, edge of described first lead terminal (1) and the second lead terminal (2) or rounding.
10. the low inductance leads terminal of power model according to claim 1, it is characterized in that: the first lead end pin (11) of described first lead terminal (1), the first support portion (12) and first are solidly connected portion (13) for continuous bending structure, and first after its bending is connected the upper surface in portion (13) and the upper surface of power model coplanar;
Second lead end pin (21) of described second lead terminal (2), the second support portion (22) and second are solidly connected portion (23) for continuous bending structure, and second after its bending is connected the upper surface in portion (23) and the upper surface of power model coplanar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610062337.4A CN105514072A (en) | 2016-01-29 | 2016-01-29 | Power module low-inductance lead terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610062337.4A CN105514072A (en) | 2016-01-29 | 2016-01-29 | Power module low-inductance lead terminal |
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| CN105514072A true CN105514072A (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610062337.4A Pending CN105514072A (en) | 2016-01-29 | 2016-01-29 | Power module low-inductance lead terminal |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789192A (en) * | 2016-05-03 | 2016-07-20 | 扬州国扬电子有限公司 | Power module with large electrode arm |
| CN105810653A (en) * | 2016-05-03 | 2016-07-27 | 扬州国扬电子有限公司 | Power module with shareable electrode large arms |
| CN107644857A (en) * | 2016-07-20 | 2018-01-30 | 福特全球技术公司 | The signal pins layout of more device power modules |
| CN107731771A (en) * | 2017-10-31 | 2018-02-23 | 臻驱科技（上海）有限公司 | Power semiconductor modular terminal with low spurious inductance |
| CN108418063A (en) * | 2018-05-18 | 2018-08-17 | 臻驱科技（上海）有限公司 | A kind of power semiconductor modular power terminal |
| US10347608B2 (en) | 2016-05-27 | 2019-07-09 | General Electric Company | Power module |
| CN111048475A (en) * | 2019-11-29 | 2020-04-21 | 广东芯聚能半导体有限公司 | Insulated gate bipolar transistor packaging module |
| CN112750803A (en) * | 2019-10-31 | 2021-05-04 | 株洲中车时代电气股份有限公司 | Busbar terminal and IGBT power module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117276A (en) * | 2011-09-30 | 2013-05-22 | 英飞凌科技股份有限公司 | Low-inductive semiconductor module |
| CN103545282A (en) * | 2013-11-05 | 2014-01-29 | 株洲南车时代电气股份有限公司 | Insulated gate bipolar thyristor module and electrode power terminal |
| CN104521126A (en) * | 2012-08-31 | 2015-04-15 | 日立汽车系统株式会社 | Power semiconductor module |
| CN104617071A (en) * | 2015-01-19 | 2015-05-13 | 株洲南车时代电气股份有限公司 | Power terminal group and power electronic module |
| CN205376505U (en) * | 2016-01-29 | 2016-07-06 | 南京银茂微电子制造有限公司 | Inductance lead terminal is hanged down to power module |
-
2016
- 2016-01-29 CN CN201610062337.4A patent/CN105514072A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117276A (en) * | 2011-09-30 | 2013-05-22 | 英飞凌科技股份有限公司 | Low-inductive semiconductor module |
| CN104521126A (en) * | 2012-08-31 | 2015-04-15 | 日立汽车系统株式会社 | Power semiconductor module |
| CN103545282A (en) * | 2013-11-05 | 2014-01-29 | 株洲南车时代电气股份有限公司 | Insulated gate bipolar thyristor module and electrode power terminal |
| CN104617071A (en) * | 2015-01-19 | 2015-05-13 | 株洲南车时代电气股份有限公司 | Power terminal group and power electronic module |
| CN205376505U (en) * | 2016-01-29 | 2016-07-06 | 南京银茂微电子制造有限公司 | Inductance lead terminal is hanged down to power module |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810653A (en) * | 2016-05-03 | 2016-07-27 | 扬州国扬电子有限公司 | Power module with shareable electrode large arms |
| CN105789192A (en) * | 2016-05-03 | 2016-07-20 | 扬州国扬电子有限公司 | Power module with large electrode arm |
| CN105810653B (en) * | 2016-05-03 | 2018-09-28 | 扬州国扬电子有限公司 | It is a kind of be equipped with can common electrode large arm power module |
| CN105789192B (en) * | 2016-05-03 | 2018-11-30 | 扬州国扬电子有限公司 | A kind of power module equipped with electrode large arm |
| US10559553B2 (en) | 2016-05-27 | 2020-02-11 | General Electric Company | Power module |
| US10347608B2 (en) | 2016-05-27 | 2019-07-09 | General Electric Company | Power module |
| CN107644857A (en) * | 2016-07-20 | 2018-01-30 | 福特全球技术公司 | The signal pins layout of more device power modules |
| CN107644857B (en) * | 2016-07-20 | 2023-05-12 | 福特全球技术公司 | Signal pin layout of multi-device power module |
| CN107731771A (en) * | 2017-10-31 | 2018-02-23 | 臻驱科技（上海）有限公司 | Power semiconductor modular terminal with low spurious inductance |
| CN108418063A (en) * | 2018-05-18 | 2018-08-17 | 臻驱科技（上海）有限公司 | A kind of power semiconductor modular power terminal |
| CN108418063B (en) * | 2018-05-18 | 2023-10-17 | 臻驱科技（上海）有限公司 | Power semiconductor module power terminal |
| CN112750803A (en) * | 2019-10-31 | 2021-05-04 | 株洲中车时代电气股份有限公司 | Busbar terminal and IGBT power module |
| CN111048475A (en) * | 2019-11-29 | 2020-04-21 | 广东芯聚能半导体有限公司 | Insulated gate bipolar transistor packaging module |
| CN111048475B (en) * | 2019-11-29 | 2021-09-21 | 广东芯聚能半导体有限公司 | Insulated gate bipolar transistor packaging module |
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