CN111141754A - Device and method for wafer detection based on AI vision - Google Patents
Device and method for wafer detection based on AI vision Download PDFInfo
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- CN111141754A CN111141754A CN201911394264.9A CN201911394264A CN111141754A CN 111141754 A CN111141754 A CN 111141754A CN 201911394264 A CN201911394264 A CN 201911394264A CN 111141754 A CN111141754 A CN 111141754A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a device and a method for detecting a wafer based on AI vision, which comprises an AI vision recognition host and a horizontal table, wherein the top of the horizontal table is fixed with symmetrically distributed supporting blocks, annular light source equipment is arranged at the top of the supporting blocks, the inner sides of the two supporting blocks are positioned at the top of the horizontal table and are provided with the wafer to be detected, the top of the horizontal table is positioned at the rear side of the supporting blocks and is fixed with a fixed rod, and the fixed rod is provided with a high-resolution industrial camera and a fastening mechanism; the invention also discloses a detection method for the wafer detection device based on AI vision; the invention has the beneficial effects that: the annular light source equipment is fixed and stable through the designed fastening mechanism, so that the stability of the annular light source equipment is improved; the designed adjusting and stabilizing mechanism is beneficial to adjusting the height of the high-resolution industrial camera and stabilizing the adjusted high-resolution industrial camera; the application of artificial intelligence promotes the accuracy of detection.
Description
Technical Field
The invention belongs to the technical field of wafer detection, and particularly relates to a device for wafer detection based on AI vision and a detection method for the wafer detection device based on AI vision.
Background
The wafer is one of the main raw materials of the LED, and is the light emitting component of the LED, and the quality of the wafer directly determines the performance of the LED.
When detecting the wafer, shooting a high-definition picture of the wafer by using a high-resolution industrial camera; preloading a deep learning neural network model Gtnet by an AI visual recognition host; transmitting a picture shot by a high-resolution industrial camera into an AI visual recognition host for defect recognition; and displaying the identification result through a display device.
The existing device for wafer detection based on AI vision has the following defects when in use:
1. when the annular light source equipment is placed, a fastening mechanism is lacked, so that the stability of placing the annular light source is not increased;
2. when the high-resolution industrial camera is installed, the realization of the height adjustment of the high-resolution industrial camera is time-consuming and labor-consuming.
Disclosure of Invention
The invention aims to provide a device and a method for detecting a wafer based on AI vision, which aims to solve the problems that when annular light source equipment provided by the background technology is placed, a fastening mechanism is lacked, and the stability of placing an annular light source is not favorable to increase; when the high-resolution industrial camera is installed, the problem that the realization of the height adjustment of the high-resolution industrial camera is time-consuming and labor-consuming is solved.
In order to achieve the purpose, the invention provides the following technical scheme: the device and the method for detecting the wafers based on the AI vision comprise an AI vision recognition host and a horizontal table, wherein the top of the horizontal table is fixedly provided with symmetrically distributed supporting blocks, annular light source equipment is placed at the top of each supporting block, the inner sides of the two supporting blocks are positioned at the top of the horizontal table and provided with the wafers to be detected, the top of the horizontal table is positioned at the rear side of each supporting block and is fixedly provided with a fixed rod, a high-resolution industrial camera is mounted on the fixed rod, the device further comprises a fastening mechanism, the fastening mechanism comprises a threaded rod, an upright rod, a bearing, a nut and a supporting plate, the top of each supporting block is fixedly provided with the upright rod, the surface of the upright rod is provided with a through hole, the inside of the through hole is fixedly provided with the nut screwed with the threaded rod, the supporting plate is fixed at.
As a preferred technical solution of the present invention, the abutting plate is of an annular structure, and an annular rubber pad is fixed to an end of the abutting plate.
As a preferable technical scheme of the invention, a hand wheel is fixed at the other end of the threaded rod, and a handle is arranged on the hand wheel.
As a preferred embodiment of the present invention, the high-resolution industrial camera and the AI visual recognition host are connected by wireless transmission.
As a preferred technical solution of the present invention, the high-resolution industrial camera and the fixing rod are provided with an adjusting and fixing mechanism, the adjusting and fixing mechanism includes a first fixing ring, a second fixing lug, a second fixing ring and a first fixing lug, the first fixing ring is fixed on the high-resolution industrial camera, the end of the first fixing ring is fixed with the first fixing lugs which are symmetrically distributed, the end of the second fixing ring is fixed with the second fixing lugs which are symmetrically distributed, and the second fixing lug and the first fixing lug are fixed by a bolt.
In a preferred embodiment of the present invention, the second fixing lug and the first fixing lug have bolt holes formed on their surfaces, and the bolt holes are communicated with each other.
The invention also discloses a detection method for the wafer detection device based on AI vision, which comprises the following steps:
the method comprises the following steps: placing a wafer to be detected, operating a high-resolution industrial camera, shooting a high-resolution picture of the wafer by the high-resolution industrial camera, and transmitting the shot picture into an AI visual identification host for defect identification;
step two: and the AI visual identification host displays the identification result through the display equipment.
Compared with the prior art, the invention has the beneficial effects that:
(1) the annular light source equipment is fixed and stable through the designed fastening mechanism, so that the stability of the annular light source equipment is improved;
(2) the designed adjusting and stabilizing mechanism is beneficial to adjusting the height of the high-resolution industrial camera and stabilizing the adjusted high-resolution industrial camera;
(3) the application of artificial intelligence promotes the accuracy of detection.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the region H in FIG. 1 according to the present invention;
FIG. 3 is a side view of the high resolution industrial camera of the present invention;
in the figure: 1. an AI visual identification host; 2. a wafer; 3. a support block; 4. a horizontal table; 5. a hand wheel; 6. a threaded rod; 7. a high resolution industrial camera; 8. fixing the rod; 9. erecting a rod; 10. an annular light source device; 11. a rubber pad; 12. a bearing; 13. a nut; 14. a resisting plate; 15. a first retaining ring; 16. a second fixing lug; 17. a second retaining ring; 18. a first fixing lug.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a device and a method for detecting a wafer based on AI vision comprise an AI vision recognition host 1 and a horizontal table 4, wherein the top of the horizontal table 4 is fixed with symmetrically distributed supporting blocks 3, the top of the supporting block 3 is provided with an annular light source device 10, the inner sides of the two supporting blocks 3 are positioned at the top of the horizontal table 4 and are provided with a wafer 2 to be detected, the top of the horizontal table 4 is positioned at the rear side of the supporting block 3 and is fixed with a fixed rod 8, the fixed rod 8 is provided with a high-resolution industrial camera 7, the device also comprises a fastening mechanism, the fastening mechanism comprises a threaded rod 6, an upright rod 9, a bearing 12, a nut 13 and a butt plate 14, the top of the supporting block 3 is fixed with the upright rod 9, the surface of the upright rod 9 is provided with a through hole, the nut 13 screwed with the threaded rod 6 is fixed inside the through hole, one end of the threaded rod 6 is fixed with the butt, the abutting plate 14 is of an annular structure, and an annular rubber pad 11 is fixed at the end of the abutting plate 14, so that the annular light source equipment 10 can be protected by the rubber pad 11 when being fastened; a hand wheel 5 is fixed at the other end of the threaded rod 6, and a handle is arranged on the hand wheel 5, so that the hand wheel 5 can rotate the threaded rod 6 more easily; annular light source equipment 10 is placed at the top of supporting shoe 3, rotates hand wheel 5, and hand wheel 5 drives threaded rod 6 and rotates, and threaded rod 6 drives to support the board 14 and impels, supports rubber pad 11 on board 14 and supports annular light source equipment 10 tightly for annular light source equipment 10 is fixed firm, has increased the steadiness that annular light source equipment 10 placed.
In this embodiment, preferably, the high-resolution industrial camera 7 is connected to the AI visual recognition host 1 by wireless transmission, so that the data of the wafer 2 collected by the high-resolution industrial camera 7 can be conveniently transmitted to the AI visual recognition host 1.
In this embodiment, it is preferable that the high-resolution industrial camera 7 and the fixing rod 8 are provided with an adjusting and fixing mechanism, the adjusting and fixing mechanism includes a first fixing ring 15, a second fixing lug 16, a second fixing ring 17 and a first fixing lug 18, the first fixing ring 15 is fixed on the high-resolution industrial camera 7, the end of the first fixing ring 15 is fixed with first fixing lugs 18 which are symmetrically distributed, the end of the second fixing ring 17 is fixed with second fixing lugs 16 which are symmetrically distributed, the second fixing lug 16 and the first fixing lug 18 are fixed by bolts, bolt holes are respectively formed on the surfaces of the second fixing lug 16 and the first fixing lug 18, the bolt holes are communicated with each other, when the high-resolution industrial camera 7 needs to be adjusted, the bolts are loosened to adjust the height of the high-resolution industrial camera 7, and when the required height is adjusted, the first fixing ring 15 is tightly attached to the fixing rod 8, the second fixing ring 17 is lifted up, so that the second fixing ring 17 is matched with the first fixing ring 15, the fixing rod 8 is covered, and the second fixing lug 16 and the first fixing lug 18 are stabilized by passing bolts through bolt holes on the surfaces of the second fixing lug 16 and the first fixing lug 18, so that the high-resolution industrial camera 7 is stabilized.
It should be added that:
an annular light source device 10 for providing an annular light source to enable the wafer 2 to clearly exhibit the defect image characteristics;
a high-resolution industrial camera 7 that generates a high-resolution image of 4K (4096 × 2160) or more using 1000 ten thousand or more pixels;
the AI vision identification host 1 is used for storing the acquired image and identifying the defect content of the wafer 2 in the image, and uses a high-performance video card.
The optimal distance from the lens of the high resolution industrial camera 7 to the wafer 2 to be inspected is 60 mm.
The optimum distance from the light source of the annular light source device 10 to the wafer 2 to be inspected is 74 mm.
A detection method for a wafer detection device based on AI vision is as follows:
the method comprises the following steps: placing a wafer 2 to be detected, operating a high-resolution industrial camera 7, shooting a high-resolution picture of the wafer 2 by the high-resolution industrial camera 7, and transmitting the shot picture into an AI visual recognition host 1 for defect recognition;
step two: the AI visual recognition host 1 displays the recognition result through a display device.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a device for wafer detection based on AI vision, includes AI vision identification host computer (1), horizontal stand (4), the top of horizontal stand (4) is fixed with symmetric distribution's supporting shoe (3), and annular light source equipment (10) have been placed at the top of this supporting shoe (3), two the inboard top that is located horizontal stand (4) of supporting shoe (3) has placed wafer (2) of waiting to detect, the rear side that the top of horizontal stand (4) is located supporting shoe (3) is fixed with dead lever (8), installs high resolution industry camera (7) on this dead lever (8), its characterized in that: the supporting device is characterized by further comprising a fastening mechanism, the fastening mechanism comprises a threaded rod (6), an upright rod (9), a bearing (12), a nut (13) and a supporting plate (14), the upright rod (9) is fixed to the top of the supporting block (3), a through hole is formed in the surface of the upright rod (9), the nut (13) screwed with the threaded rod (6) is fixed inside the through hole, the supporting plate (14) is fixed to one end of the threaded rod (6), and the bearing (12) is arranged at the joint of the supporting plate (14) and the threaded rod (6).
2. The AI vision-based wafer inspection apparatus of claim 1, wherein: the resisting plate (14) is of an annular structure, and an annular rubber pad (11) is fixed at the end part of the resisting plate (14).
3. The AI vision-based wafer inspection apparatus of claim 1, wherein: the other end of the threaded rod (6) is fixed with a hand wheel (5), and a handle is arranged on the hand wheel (5).
4. The AI vision-based wafer inspection apparatus of claim 1, wherein: the high-resolution industrial camera (7) is connected with the AI visual recognition host (1) through wireless transmission.
5. The AI vision-based wafer inspection apparatus of claim 1, wherein: be provided with on high resolution industry camera (7) and dead lever (8) and adjust firm mechanism, should adjust firm mechanism and include first solid fixed ring (15), the fixed ear of second (16), the fixed ear of second (17) and first fixed ear (18), on first solid fixed ring (15) were fixed in high resolution industry camera (7), the end fixing of this first solid fixed ring (15) had first fixed ear (18) of symmetric distribution, the end fixing of the fixed ring of second (17) has the fixed ear of symmetric distribution's second (16), and the fixed ear of second (16) and first fixed ear (18) pass through the bolt fastening.
6. The AI vision based apparatus for wafer inspection as in claim 5, wherein: bolt holes are formed in the surfaces of the second fixing lug (16) and the first fixing lug (18), and the bolt holes are communicated with each other.
7. An inspection method for an AI vision based wafer inspection apparatus according to any one of claims 1 to 6, wherein: the detection method comprises the following steps:
the method comprises the following steps: placing a wafer (2) to be detected, operating by using a high-resolution industrial camera (7), shooting a high-definition picture of the wafer (2) by using the high-resolution industrial camera (7), and transmitting the shot picture into an AI visual identification host (1) for defect identification;
step two: the AI visual recognition host (1) displays the recognition result through the display equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911394264.9A CN111141754A (en) | 2019-12-30 | 2019-12-30 | Device and method for wafer detection based on AI vision |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911394264.9A CN111141754A (en) | 2019-12-30 | 2019-12-30 | Device and method for wafer detection based on AI vision |
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| CN111141754A true CN111141754A (en) | 2020-05-12 |
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| CN201911394264.9A Pending CN111141754A (en) | 2019-12-30 | 2019-12-30 | Device and method for wafer detection based on AI vision |
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Application publication date: 20200512 |
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