CN111141207A - Three-dimensional current vortex sensor measuring head - Google Patents
Three-dimensional current vortex sensor measuring head Download PDFInfo
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- CN111141207A CN111141207A CN202010029662.7A CN202010029662A CN111141207A CN 111141207 A CN111141207 A CN 111141207A CN 202010029662 A CN202010029662 A CN 202010029662A CN 111141207 A CN111141207 A CN 111141207A
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- eddy current
- riser
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/24—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in magnetic properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
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- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to a three-dimensional eddy current sensor measuring head, which comprises a base, wherein three directions defining a space to be intersected vertically are respectively an X direction, a Y direction and a Z direction, a first PCB substrate, a second PCB substrate and a third PCB substrate which are mutually perpendicular are fixed on the base, a first eddy current coil with an axis extending along the X direction, a second eddy current coil with an axis extending along the Y direction and a third eddy current coil with an axis extending along the Z direction are respectively fixed on the inner sides of the three PCB substrates, the axes of the three eddy current coils are intersected vertically, and each PCB substrate is provided with two pad holes for welding and fixing coil heads of the corresponding eddy current coils. The invention solves the technical problem of overlarge axial size of the eddy current sensor in the prior art.
Description
Technical Field
The invention relates to a three-dimensional current vortex sensor measuring head in the technical field of displacement measuring sensors.
Background
At present, the mechanical equipment relied on by industrial production has higher and higher precision requirements, and the position change of the deep known micron level can cause serious problems for key parts. A typical example is a numerical control machine tool, and the numerical control machine tool is a primary important research object for the development strategy of the manufacturing strong country proposed by 'china manufacturing 2025'. For multi-degree-of-freedom flexible processing high-end numerical control machine tools produced by international large machine tool manufacturers, the requirement on the precision is usually within 10 micrometers. However, with thermal errors due to thermal deformations of the machine tool during operation, even up to 100 μm, the thermal errors must be studied by means of displacement sensors capable of measuring the multidimensional thermal errors.
The eddy current sensor is a displacement sensor commonly used in industrial fields due to the excellent characteristics of high sensitivity, strong anti-interference capability, non-contact measurement, high response speed and no influence of oil-water media. At present, the existing eddy current sensor is cylindrical in the packaging mode of an eddy current coil of a core sensitive element, a large amount of space can be occupied in the axial direction when the eddy current sensor is installed, and enough space must be reserved for installation when a plurality of eddy current sensors are needed to be installed for multi-dimensional displacement measurement. When a certain part in the machine tool needs to be subjected to thermal deformation measurement, enough space is not available for installing the existing eddy current sensor.
Disclosure of Invention
The invention aims to provide a three-dimensional eddy current sensor measuring head, which aims to solve the technical problem that the axial size of an eddy current sensor in the prior art is overlarge.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the utility model provides a three-dimensional current vortex sensor gauge head, which comprises a base, the three direction that the definition space is crossing perpendicularly is the X direction respectively, Y direction and Z direction, be fixed with mutually perpendicular's first PCB base plate each other on the base, second PCB base plate and third PCB base plate, the inboard of three PCB base plate is fixed with the first current vortex coil that the axis extends along the X direction respectively, the second current vortex coil that the axis extends along the Y direction and the third current vortex coil that the axis extends along the Z direction, the axis of three current vortex coil is crossing perpendicularly, all set up two supplies to correspond the pad hole that the coil head welded fastening of current vortex coil on each PCB base plate.
Each eddy current coil is fixed on the corresponding PCB substrate through an adhesive connection structure.
The base includes that thick bottom plate, the perpendicular fixation of being in the bottom plate of extending along the Z direction thick first riser that extends along the X direction and the perpendicular fixation of being in the thick second riser that extends along the Y direction of board on the bottom plate, and the fixed subsides of third PCB base plate are located on the bottom plate, on the first riser was located to the fixed subsides of first PCB base plate, on the second riser was located to the fixed subsides of second PCB base plate.
The bottom plate is provided with bottom plate threading holes corresponding to the pad holes in the third PCB substrate, the first riser is provided with first riser threading holes corresponding to the pad holes in the first PCB substrate, the second riser is provided with second riser threading holes corresponding to the pad holes in the second PCB substrate, and extension wires electrically connected with the corresponding pad holes penetrate through the threading holes.
The bottom plate, the first vertical plate and the second vertical plate are made of metal materials, a third through hole which is coaxial with the third eddy current coil and has a diameter not smaller than that of the third eddy current coil is formed in the bottom plate, a first through hole which is coaxial with the first eddy current coil and has a diameter not smaller than that of the first eddy current coil is formed in the first vertical plate, and a second through hole which is coaxial with the second eddy current coil and has a diameter not smaller than that of the second eddy current coil is formed in the second vertical plate.
The bottom of first riser, second riser is provided with thickness and connects along the riser of Z to extension, and the riser is connected along being fixed in on the bottom plate through the screw.
The lateral outer projection of the base plate is provided with a base plate connecting edge extending in the Z direction in thickness for connecting the base plate to the corresponding component.
The invention has the beneficial effects that: the invention carries out three-dimensional measurement on the deformation of the part to be measured by the eddy current coil with three vertical intersecting axes, the eddy current coil is directly fixed on the PCB substrate, the PCB substrate is used as a carrier of the eddy current coil, and the coil head of the eddy current coil is welded and fixed in the pad hole on the PCB substrate for electrifying, thereby omitting the cylindrical shell for packaging of the eddy current coil in the traditional technology, greatly shortening the axial dimension of the measuring device and being applicable to the environment with strict requirement on the axial dimension.
Drawings
FIG. 1 is a schematic block diagram of one embodiment of the present invention;
FIG. 2 is a schematic diagram of the bottom plate of FIG. 1 separated from the third PCB substrate and the second riser separated from the second PCB substrate;
fig. 3 is a state diagram of the use of fig. 1.
Detailed Description
An embodiment of a three-dimensional eddy current sensor probe is shown in fig. 1-3: including the base, the three direction that the definition space is crossing perpendicularly is X direction, Y direction and Z direction respectively, and the base includes bottom plate 6 that the rear end extends along the Z direction, and the thick first riser 11 that extends along the X direction of board on the vertical fixation bottom plate 6 and the thick second riser 9 that extends along the Y direction of board on the vertical fixation bottom plate, bottom plate 6, first riser 11 and second riser 9 are made by the metal material. The bottom of the first vertical plate 11 and the second vertical plate 9 is provided with a vertical plate connecting edge 15 with the thickness extending along the Z direction, and the vertical plate connecting edge 15 is fixed on the bottom plate 6 through screws. The lateral outside of the bottom plate 6 is convexly provided with a bottom plate connecting edge 1 which extends along the Z direction in thickness and is used for connecting the bottom plate to a corresponding part, and three bolt through holes 13 are formed in the bottom plate connecting edge.
The inboard face of bottom plate 6, first riser 11, second riser 9 has formed mutually perpendicular's reference plane each other, is equipped with third PCB base plate 5 through the fixed subsides of screw contact on the inboard face of bottom plate 6, is equipped with first PCB base plate 12 through the fixed subsides of screw on the inboard face of first riser 11, is equipped with second PCB base plate 8 through the fixed subsides of screw on the inboard face of second riser 9. A third eddy current coil 7 with an axis extending along the Z direction is fixed on the inner side board surface of the third PCB substrate 5 through gluing, a first eddy current coil 2 with an axis extending along the X direction is fixed on the inner side board surface of the first PCB substrate 12 through gluing, a second eddy current coil 10 with an axis extending along the Y direction is fixed on the inner side board surface of the second PCB substrate 8 through gluing, and the axes of the three eddy current coils are vertically intersected. The bottom plate 6 is provided with a third through hole 20 which is coaxial with the third eddy current coil and has a diameter not smaller than that of the third eddy current coil 7, the first vertical plate is provided with a first through hole which is coaxial with the first eddy current coil and has a diameter not smaller than that of the first eddy current coil, and the second vertical plate 9 is provided with a second through hole 21 which is coaxial with the second eddy current coil 10 and has a diameter not smaller than that of the second eddy current coil. The bottom plate, the first riser and the second riser of metal material have guaranteed the stability to PCB base plate support, and the setting of through-hole avoids the electric eddy current coil and corresponds the production vortex between the metal sheet, interference measurement.
And each PCB substrate is provided with two pad holes 3 for welding and fixing the coil heads of the corresponding eddy current coils, and each pad hole comprises annular pads on two surfaces of the PCB substrate and a middle electroplating through hole. The bottom plate is provided with a bottom plate threading hole 23 corresponding to the pad hole on the third PCB substrate, the first riser is provided with a first riser threading hole corresponding to the pad hole on the first PCB substrate, the second riser is provided with a second riser threading hole 22 corresponding to the pad hole on the second PCB substrate, and each threading hole is penetrated with an extension wire (not shown in the figure) electrically connected with the corresponding pad hole. The extension lead is connected with an external power supply, and current is led to the pad hole and the coil head of the eddy current coil through the extension lead.
The use of a three-dimensional eddy current sensor probe according to the invention is shown in fig. 3: the structural member 17 simulates a cantilever beam structure of a machine tool spindle, a heat source is arranged in the structural member 17, the heat generated by a motor during the operation of the machine tool is simulated, the structural member 17 is caused to generate thermal deformation, and then 3 mutually vertical surface thermal deformation displacements of the structural member 17 are measured by utilizing a three-dimensional eddy current sensor measuring head.
The structural member 17 is arranged on a standard workbench 18, m5 threaded holes which are arranged in a rectangular mode are formed in the standard workbench 18, the distance between every two adjacent holes is 25mm, and the structural member 17 is fixed through the threaded holes. Then, according to the position of the surface of the structural part 17 and the position of the threaded hole on the standard workbench 18, a suitable sensor clamp 19 is designed and processed to position and mount the three-dimensional eddy current sensor measuring head, so that the end faces of 3 mutually perpendicular eddy current coils of the three-dimensional eddy current sensor measuring head are respectively parallel to 3 mutually perpendicular surfaces of one corner of the structural part 17, and the distance between the end faces is within the linear range of the 3 eddy current coils.
High-frequency excitation voltage is applied to the eddy current coil 1, then, after the structural member 17 deforms, 3 surfaces of the structural member can move in space positions and the distance between the corresponding eddy current coils changes, the inductance value of the eddy current coils changes along with the change of the distance due to the eddy current effect, the change of the inductance value is converted into the amplitude value and the phase change of an alternating current signal through an alternating bridge, the amplitude value and the phase change are measured through measuring circuits such as amplitude discrimination circuits and phase discrimination circuits, and the corresponding displacement variation can be obtained according to the calibration result of the eddy current coils. The calibration method can refer to the national measurement technical specification of the linear displacement sensor calibration specification (JJF 1305-.
In the invention, in order to lead out signals of the eddy current coil, the coil head of the eddy current coil is welded in the corresponding pad hole of the corresponding PCB substrate, and meanwhile, an extension lead is also welded in each pad hole and is led out from the side of the PCB substrate, on which the eddy current coil is not fixed, and passes through the corresponding threading hole. According to the invention, the eddy current coil is fixed on the PCB substrate through reasonable design, and the fragile coil lead and the extension lead are fixed through a welding mode by skillfully utilizing the excellent conductive characteristic and the accommodation property of the PCB pad hole, so that the space occupation amount of the measuring head of the eddy current sensor is greatly reduced on the premise of ensuring the stability and the measuring function of the eddy current coil.
Claims (7)
1. A three-dimensional current vortex sensor measuring head is characterized in that: the PCB comprises a base, the three direction that the definition space is crossing perpendicularly is the X direction respectively, Y direction and Z direction, be fixed with mutually perpendicular's first PCB base plate each other on the base, second PCB base plate and third PCB base plate, the inboard of three PCB base plate is fixed with the first electric eddy current coil that the axis extends along the X direction respectively, the axis is along the second electric eddy current coil that the Y direction extends and the third electric eddy current coil that the axis extends along the Z direction, the axis of three electric eddy current coil is crossing perpendicularly, all set up two supplies on each PCB base plate to correspond electric eddy current coil's coil head welded fastening's pad hole.
2. The three-dimensional eddy current sensor probe according to claim 1, wherein: each eddy current coil is fixed on the corresponding PCB substrate through an adhesive connection structure.
3. The three-dimensional eddy current sensor probe according to claim 1 or 2, wherein: the base includes that thick bottom plate, the perpendicular fixation of being in the bottom plate of extending along the Z direction thick first riser that extends along the X direction and the perpendicular fixation of being in the thick second riser that extends along the Y direction of board on the bottom plate, and the fixed subsides of third PCB base plate are located on the bottom plate, on the first riser was located to the fixed subsides of first PCB base plate, on the second riser was located to the fixed subsides of second PCB base plate.
4. The three-dimensional eddy current sensor probe according to claim 3, wherein: the bottom plate is provided with bottom plate threading holes corresponding to the pad holes in the third PCB substrate, the first riser is provided with first riser threading holes corresponding to the pad holes in the first PCB substrate, the second riser is provided with second riser threading holes corresponding to the pad holes in the second PCB substrate, and extension wires electrically connected with the corresponding pad holes penetrate through the threading holes.
5. The three-dimensional eddy current sensor probe according to claim 3, wherein: the bottom plate, the first vertical plate and the second vertical plate are made of metal materials, a third through hole which is coaxial with the third eddy current coil and has a diameter not smaller than that of the third eddy current coil is formed in the bottom plate, a first through hole which is coaxial with the first eddy current coil and has a diameter not smaller than that of the first eddy current coil is formed in the first vertical plate, and a second through hole which is coaxial with the second eddy current coil and has a diameter not smaller than that of the second eddy current coil is formed in the second vertical plate.
6. The three-dimensional eddy current sensor probe according to claim 3, wherein: the bottom of first riser, second riser is provided with thickness and connects along the riser of Z to extension, and the riser is connected along being fixed in on the bottom plate through the screw.
7. The three-dimensional eddy current sensor probe according to claim 3, wherein: the lateral outer projection of the base plate is provided with a base plate connecting edge extending in the Z direction in thickness for connecting the base plate to the corresponding component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019111002179 | 2019-11-12 | ||
| CN201911100217 | 2019-11-12 |
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| Publication Number | Publication Date |
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| CN111141207A true CN111141207A (en) | 2020-05-12 |
| CN111141207B CN111141207B (en) | 2021-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010029662.7A Active CN111141207B (en) | 2019-11-12 | 2020-01-13 | Three-dimensional current vortex sensor measuring head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462310A (en) * | 2020-10-16 | 2021-03-09 | 电子科技大学 | Device and method for detecting and compensating gradient eddy current based on inductance coil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800773A (en) * | 2006-01-25 | 2006-07-12 | 北京航空航天大学 | Radial/axial six-position integrated electric eddy transducer |
| CN1987367A (en) * | 2006-12-14 | 2007-06-27 | 北京航空航天大学 | Integrated five freedom electric eddy sensor |
| US20160252339A1 (en) * | 2014-04-23 | 2016-09-01 | American Axle & Manufacturing, Inc. | Method For Determining The Position Of A Target Along A Movement Axis While Being Insensitive To Movement Of The Target Along Axes That Are Orthogonal To The Movement Axis |
| CN107421433A (en) * | 2017-08-01 | 2017-12-01 | 深圳麦格动力技术有限公司 | A kind of current vortex sensor and its processing technology |
-
2020
- 2020-01-13 CN CN202010029662.7A patent/CN111141207B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800773A (en) * | 2006-01-25 | 2006-07-12 | 北京航空航天大学 | Radial/axial six-position integrated electric eddy transducer |
| CN1987367A (en) * | 2006-12-14 | 2007-06-27 | 北京航空航天大学 | Integrated five freedom electric eddy sensor |
| US20160252339A1 (en) * | 2014-04-23 | 2016-09-01 | American Axle & Manufacturing, Inc. | Method For Determining The Position Of A Target Along A Movement Axis While Being Insensitive To Movement Of The Target Along Axes That Are Orthogonal To The Movement Axis |
| CN107421433A (en) * | 2017-08-01 | 2017-12-01 | 深圳麦格动力技术有限公司 | A kind of current vortex sensor and its processing technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462310A (en) * | 2020-10-16 | 2021-03-09 | 电子科技大学 | Device and method for detecting and compensating gradient eddy current based on inductance coil |
| CN112462310B (en) * | 2020-10-16 | 2021-09-24 | 电子科技大学 | Device and method for detecting and compensating gradient eddy current based on inductance coil |
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| Publication number | Publication date |
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| CN111141207B (en) | 2021-06-22 |
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Effective date of registration: 20221110 Address after: 710000 Room 027, F1902, 19/F, Building 4-A, Xixian Financial Port, Fengdong New City Energy Jinmao District, Xixian New District, Xi'an, Shaanxi Patentee after: Shaanxi Yinhui Jingchuang Technology Co.,Ltd. Address before: 710061 No. 563 South Changan Road, Shaanxi, Xi'an Patentee before: XI'AN University OF POSTS & TELECOMMUNICATIONS Patentee before: HEFEI HEGONG ANCHI INTELLIGENT TECHNOLOGY Co.,Ltd. |
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