CN111129245A - LED chip, display panel and display panel's equipment - Google Patents

LED chip, display panel and display panel's equipment Download PDF

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Publication number
CN111129245A
CN111129245A CN201811291809.9A CN201811291809A CN111129245A CN 111129245 A CN111129245 A CN 111129245A CN 201811291809 A CN201811291809 A CN 201811291809A CN 111129245 A CN111129245 A CN 111129245A
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China
Prior art keywords
led chip
face
groove
fluid
display panel
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Granted
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CN201811291809.9A
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Chinese (zh)
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CN111129245B (en
Inventor
米磊
郭恩卿
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Chengdu Vistar Optoelectronics Co Ltd
Original Assignee
Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
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Application filed by Kunshan New Flat Panel Display Technology Center Co Ltd, Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan New Flat Panel Display Technology Center Co Ltd
Priority to CN201811291809.9A priority Critical patent/CN111129245B/en
Priority to KR1020217016367A priority patent/KR102551554B1/en
Priority to PCT/CN2019/076363 priority patent/WO2020087817A1/en
Publication of CN111129245A publication Critical patent/CN111129245A/en
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Publication of CN111129245B publication Critical patent/CN111129245B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
    • H01L2224/95101—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses LED chip, display panel and display panel's equipment, the LED chip includes: the light emitting body comprises a first end face and a second end face which are oppositely arranged; and the magnetic electrode is arranged on the first end face, so that when the LED chip is placed in fluid and is subjected to the action of an external magnetic field, the first end face is arranged towards a preset direction. Through the mode, the success rate of LED chip transfer can be improved.

Description

LED chip, display panel and display panel's equipment
Technical Field
The application relates to the technical field of display, in particular to an LED chip, a display panel and display panel assembling equipment.
Background
The LED display panel has received more and more attention because of its advantages of high brightness, high response speed, low power consumption, long life, and the like.
Because the LED chips are difficult to directly grow on the array substrate at present, and often need to be transferred onto the array substrate by means of a mass transfer technology, the tiny size and the huge transfer number of the LED chips pose a great challenge to the mass transfer.
The inventor of the application finds that the massive transfer method adopted in the prior art has the problems of low success rate and the like in the long-term research process.
Disclosure of Invention
The technical problem that this application mainly solved provides an LED chip, display panel and display panel's equipment, can improve the success rate that the LED chip shifted.
In order to solve the technical problem, the application adopts a technical scheme that: provided is an LED chip including: the light emitting body comprises a first end face and a second end face which are oppositely arranged; and the magnetic electrode is arranged on the first end face, so that when the LED chip is placed in fluid and is subjected to the action of an external magnetic field, the first end face is arranged towards a preset direction.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a display panel including: the array substrate comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a plurality of grooves which are arranged in an array mode; the LED light source comprises a plurality of LED chips, wherein the LED chips are correspondingly arranged in the grooves respectively, each LED chip comprises a light-emitting main body and a magnetic electrode, the light-emitting main body comprises a first end face and a second end face which are oppositely arranged, and the magnetic electrode is arranged on the first end face and faces the bottom of the groove.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided an assembling apparatus of a display panel, the assembling apparatus including: the magnetic base station is used for bearing an array substrate, the array substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a plurality of grooves which are arranged in an array mode; the fluid chamber is arranged on the first surface and used for receiving fluid carrying LED chips, wherein each LED chip comprises a light-emitting body and a magnetic electrode, the light-emitting body comprises a first end face and a second end face which are oppositely arranged, and the magnetic electrode is arranged on the first end face; the magnetic electrode of the LED chip is acted by a magnetic field generated by the magnetic base station, and then falls into the groove in a mode that the first end face faces the bottom of the groove.
The beneficial effect of this application is: be different from prior art's condition, including the magnetic electrode in the LED chip that this application provided, the magnetic electrode is located the first terminal surface of the luminous main part of LED chip, when adopting fluid self-assembly method to shift the LED chip, the magnetic electrode is owing to receive external magnetic field's effect, under the effect of magnetic attraction, drives the first terminal surface of LED chip and sets up towards the predetermined direction, and then improves the success rate that the LED chip shifted, and further promotes the efficiency of fluid equipment.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of an LED chip according to the present application;
FIG. 2a is a schematic top view of one embodiment of the LED chip of FIG. 1;
FIG. 2b is a schematic top view of another embodiment of the LED chip of FIG. 1;
FIG. 3 is a schematic structural diagram of another embodiment of an LED chip according to the present application;
FIG. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of an embodiment of an assembling apparatus for a display panel according to the present application;
FIG. 6 is a schematic diagram illustrating a top view of one embodiment of the fluid chamber of FIG. 5;
FIG. 7 is a schematic top view of another embodiment of the fluid chamber of FIG. 5;
FIG. 8 is a flow chart illustrating an embodiment of an assembly process of a display panel according to the present application;
fig. 9 is a schematic structural diagram of an embodiment corresponding to steps S101 to S107 in fig. 8.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an LED chip according to the present application. The LED chip provided by the present application may be a common LED chip or a Micro-LED chip, and the LED chip 1 includes a light emitting body 10 and a magnetic electrode 12.
Specifically, the light emitting body 10 includes a first end face 100 and a second end face 102 disposed oppositely, and the structure of the light emitting body 10 may be any one of the prior art, for example, the light emitting body 10 includes a substrate, an epitaxial layer structure grown on the substrate, and the like, and the substrate may be a sapphire substrate and the like. The magnetic electrode 12 is disposed on the first end surface 100, so that when the LED chip 1 is placed in a fluid and is subjected to an external magnetic field, the first end surface 100 is disposed in a predetermined direction, and the material of the magnetic electrode 12 may be a metal, such as Cr, Al, Pt, or the like. When the fluid self-assembly method is used for transferring the LED chip 1, the magnetic electrode 12, under the action of the external magnetic field, drives the first end surface 100 of the LED chip 1 to face the predetermined direction under the action of the magnetic attraction force, so as to improve the success rate of transferring the LED chip 1 and further improve the efficiency of fluid assembly.
In one embodiment, the area of the first end surface 100 on the light emitting body 10 of the LED chip 1 is smaller than the area of the second end surface 102, which facilitates the arrangement of the first end surface 100 of the LED chip 1 toward a predetermined direction; preferably, the light emitting body 10 is disposed in an inverted trapezoid in a longitudinal section along a vertical direction of the first and second end faces 100 and 102. Referring to fig. 2a, fig. 2a is a schematic top view of an embodiment of the LED chip in fig. 1. The light emitting body 10 of the LED chip 1 in fig. 1 has an inverted trapezoidal longitudinal section along the direction a-a in fig. 2 a; of course, the longitudinal section of the light emitting body 10 of the LED chip 1 in fig. 1 along the direction B-B perpendicular to the direction a-a in fig. 2a can also be an inverted trapezoid; the design mode can enable the LED chip 1 to be more easily and accurately dropped to the preset position, so that the success rate of transferring the LED chip 1 is further improved, and the efficiency of fluid assembly is improved. In an application scenario, please refer to fig. 2a and fig. 2b, in which fig. 2a is a schematic top view of an embodiment of the LED chip in fig. 1, and fig. 2b is a schematic top view of another embodiment of the LED chip in fig. 1. The cross section of the light emitting body 10 of the LED chip 1 may be a circle (as shown in fig. 2 a), an ellipse, etc., and the cross section of the light emitting body 10' of the LED chip 1' may also be a polygon, such as a square (as shown in fig. 2 b), etc., i.e., the light emitting body 10 may be a circular truncated cone (as shown in fig. 2 a), and the light emitting body 10' may also be a prism (as shown in fig. 2 b), etc.
In another embodiment, the LED chip 1 provided herein may be a vertical structure or a lateral structure, the LED chip 1 generally includes an anode and a cathode, and the structure of the LED chip 1 and the corresponding growth manner determine whether the magnetic electrode 12 is the anode or the cathode of the LED chip 1.
As shown in fig. 1, the LED chip 1 in fig. 1 is a vertical structure, two electrodes of the LED chip 1 are respectively located at two opposite sides of the LED chip 1, and only anodes are schematically shown in fig. 1 because the LED chip 1 is assembled to the array substrate before the LED chip 1 is formed with only anodes, and cathodes of the LED chip 1 can be formed after the LED chip 1 is assembled to the array substrate. In this case, the magnetic electrode 12 may be an anode of the LED chip 1. Of course, in other embodiments, the anode and the cathode can be formed before the LED chip 1 is assembled on the array substrate, and the magnetic electrode 12 can be selected according to actual requirements.
As shown in fig. 3, fig. 3 is a schematic structural diagram of another embodiment of the LED chip of the present application. In fig. 3, the LED chip 1a is a horizontal structure, and two electrodes of the LED chip 1a are located on the same side of the LED chip 1 a. In fig. 3, the cathode 14a of the LED chip 1a is located at the periphery of the anode 16a, and both the anode 16a and the cathode 14a are formed on the LED chip 1a before the LED chip 1a is assembled on the array substrate, in which case the magnetic electrode may be the anode 16a or the cathode 14 a.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a display panel according to the present application. The display panel provided by the present application includes an array substrate 2 and a plurality of LED chips 1.
Specifically, the array substrate 2 includes a first surface 20 and a second surface 22 which are oppositely arranged, the first surface 20 is provided with a plurality of grooves 24 arranged in an array manner; the plurality of LED chips 1 are respectively and correspondingly disposed in the groove 24, each LED chip 1 includes a light-emitting body 10 and a magnetic electrode 12, the light-emitting body 10 includes a first end surface 100 and a second end surface 102 which are oppositely disposed, and the magnetic electrode 12 is disposed on the first end surface 100 and disposed toward the bottom (not identified) of the groove 24.
In the present embodiment, the structure of the LED chip 1 is the same as that in the above-described embodiment, and will not be described herein. The area of the first end surface 100 of the LED chip 1 is smaller than the area of the second end surface 102, and the cross section of the light emitting main body 10 along the vertical direction of the first end surface 100 and the second end surface 102 is in an inverted trapezoid shape, the shape of the groove 24 is matched with the shape of the LED chip 1, in this embodiment, the shape of the groove 24 may be slightly larger than the shape of the LED chip 1.
In one embodiment, the groove 24 is divided into a first groove section 240 and a second groove section 242 in a direction perpendicular to the first surface 20, wherein the first groove section 240 is matched in shape with the magnetic electrode 12 and is used for accommodating the magnetic electrode 12, for example, when a longitudinal section of the magnetic electrode 12 in a direction perpendicular to the first end surface 100 and the second end surface 102 is square, the longitudinal section may be a longitudinal section in a direction a-a in fig. 2a, or a longitudinal section in a direction B-B perpendicular to the direction a-a in fig. 2 a. Correspondingly, the longitudinal section of the first groove section 240 along the vertical direction of the first surface 20 and the second surface 22 may also be square. The second groove segment 242 is shaped to match the light emitting body 10 and is used for accommodating the light emitting body 10, and preferably, when the longitudinal section of the light emitting body 10 along the perpendicular direction of the first end face 100 and the second end face 102 is arranged in an inverted trapezoid, the longitudinal section may be a longitudinal section along the direction a-a in fig. 2A, or a longitudinal section along the direction B-B perpendicular to the direction a-a in fig. 2A. Correspondingly, the longitudinal section of the second groove section 242 along the vertical direction of the first surface 20 and the second surface 22 may also be in an inverted trapezoid shape. In this embodiment, the shape of the groove 24 formed by the combination of the second groove segment 242 and the first groove segment 241 is similar to a "Y" shape. This kind of design can make LED chip 1 more easily more accurately drop to preset position, promotes the stability behind LED chip 1 falls into recess 24 simultaneously, and then further improves the success rate that LED chip 1 shifted. Of course, in other embodiments, the shape of the groove 24 may be other.
To implement the design of the groove 24, please continue to refer to fig. 4, the array substrate 2 provided in the present application includes:
substrate 26, substrate 26 may be a rigid substrate (e.g., glass, silicon substrate, etc.) or a flexible substrate (e.g., polyimide, etc.).
A first film layer 28 located on one side of the substrate 26, the first film layer 28 being provided with a driving circuit (not identified) and a plurality of contact electrodes 280 connected to the driving circuit, the first film layer 28 being any thin film transistor layer in the prior art, and the contact electrodes 280 being also coated with a certain amount of solder, so as to enable the magnetic electrodes 12 of the subsequent LED chip 1 and the contact electrodes 280 to be better soldered together.
The second film layer 21 is located on a side of the first film layer 28 away from the substrate 26, the second film layer 21 is provided with a first groove section 240, the first groove section 240 exposes the corresponding contact electrode 280, the contact electrode 280 may be located in the first groove section 240 completely or partially, the second film layer 21 may be made of an insulating material, for example, photoresist, and the first groove section 240 may be formed by using a photolithography process.
The third film layer 23 is located on a side of the second film layer 21 away from the substrate 26, the third film layer 23 is provided with a second groove segment 242, the third film layer 23 may be made of an insulating material, for example, photoresist, and the second groove segment 242 may be formed by using a photolithography process. The second groove segment 242 also exposes the corresponding contact electrode 280.
Of course, in other embodiments, the second film layer 21 and the third film layer 23 may be combined into the same film layer; alternatively, the second film layer 21 and the third film layer 23 may be formed of a multilayer film, respectively, which is not limited in the present application. In addition, in this embodiment, the display panel provided by the present application may further include other structures, for example, an encapsulation layer 25, located on a side of the LED chip 1 away from the array substrate 2. The encapsulation layer 25 may be any encapsulation form known in the art, such as Frit glass encapsulation, film encapsulation, and the like.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of an assembly apparatus for a display panel according to the present application, the assembly apparatus including:
the magnetic base 3 is used for bearing the array substrate 2, the array substrate 2 comprises a first surface 20 and a second surface 22 which are oppositely arranged, and the first surface 20 is provided with a plurality of grooves 24 which are arranged in an array mode; the specific structure of the array substrate 2 can be seen from the above embodiments, and is not described herein again. The magnetic force of the magnetic base 3 can be provided by a magnet or the like, and the magnetic force generated by the magnetic base 3 is changed by selecting substances with different magnetic sizes; alternatively, the magnetic force of the magnetic base 3 is generated by an energized coil, and the magnetic force of the magnetic base 3 is changed by changing the current passing through the coil.
And a fluid chamber 4 disposed on the first surface 20 and configured to receive a fluid carrying the LED chips 1, wherein a solvent of the fluid may be alcohols, polyols, ketones, halogenated hydrocarbons, etc., wherein each LED chip 1 includes a light-emitting body 10 and a magnetic electrode 12, the light-emitting body 10 includes a first end face 100 and a second end face 102 disposed opposite to each other, and the magnetic electrode 12 is disposed on the first end face 100. The magnetic electrode 12 of the LED chip 1 is acted by the magnetic field generated by the magnetic base 3, and falls into the groove 24 with the first end face 100 facing the bottom of the groove 24. The specific structure of the LED chip 1 can be seen in the above embodiments, and is not described herein again.
In one embodiment, referring to fig. 6, fig. 6 is a schematic structural diagram of one embodiment of the fluid chamber of fig. 5. The fluid chamber 4 is provided with a plurality of flow channels 40 spaced from each other, wherein the flow channels 40 are arranged in a row direction or a column direction of the grooves 24 and cover at least one row or column of the grooves 24, and the fluid flows from the first end a to the second end B of the flow channels 40. As shown in fig. 5, when the flow channel 40 covers one row or one column of the grooves 24, the width d1 of the flow channel 40 is greater than the width d2 of the LED chip 1 by at least two times (e.g., two times, three times, four times, etc.), and the width d2 of the LED chip 1 may be the maximum width value of the LED chip 1. By this design, the number of LED chips 1 flowing through the flow channel 40 can be increased, thereby improving the fluid assembling efficiency.
In the fluid chamber 4 shown in fig. 6 described above, the fluid passages 40 penetrate through opposite sides of the fluid chamber 4. In another embodiment, please refer to fig. 7, fig. 7 is a schematic structural diagram of another embodiment of the fluid chamber in fig. 5. Fluid passages 40a in fluid chamber 4a may not extend through opposing sides of fluid chamber 4 a; at this time, a fluid inlet 42a and a fluid outlet 44a may be opened at corresponding positions in the fluid chamber 4a, the fluid inlet 42a is communicated with the first end a of each fluid channel 40a, the fluid outlet 44a is communicated with the second end of each fluid channel 40a, and the fluid mixed with the LED chip 1 flows to the fluid outlet 44a through the fluid channel 40a after passing through the fluid inlet 42 a.
In another embodiment, the assembly apparatus provided herein further comprises: and the pressure control assembly is positioned at the first end A and/or the second end B of the flow channel 40 and is used for providing pressure to the fluid so as to enable the fluid to flow at a constant speed. The pressure control assembly may be a pump or the like.
In yet another embodiment, referring again to fig. 5, the fluid chamber 4 provided herein is made of a transparent material, such as transparent plastic, transparent glass, etc.; the assembly equipment that this application provided still includes: an image pickup device 5 (e.g., a CCD camera or the like) located on a side of the fluid chamber 4 away from the array substrate 2 for obtaining images of the LED chip 1 and the array substrate 2; and the judging device 6 is used for receiving the image and judging whether the groove 24 of the array substrate 2 captures the LED chip 1 according to the image. In this embodiment, the determination device 6 may be a processor or the like, but in other embodiments, the determination device 6 may not be used, and the determination may be performed manually. Since the fluid chamber 4 provided by the present application is made of a transparent material, the image of the LED chip 1 and the array substrate 2 can be captured by the camera device 5 through the fluid chamber 4, and then whether to stop the fluid assembly can be determined according to the image.
Referring to fig. 8-9, fig. 8 is a flowchart illustrating an embodiment of an assembly process of a display panel according to the present application, and fig. 9 is a structural schematic diagram illustrating an embodiment corresponding to steps S101-S107 in fig. 8. The assembly process includes:
s101: providing a magnetic base table 3, and placing the array substrate 2 on the magnetic base table 3; specifically, as shown in fig. 9a, the second end face 22 of the array substrate 2 may be brought into contact with the magnetic base 3.
S102: providing a fluid chamber 4, wherein the side, provided with the flow channel 40, of the fluid chamber 4 faces the array substrate 2, and the flow channel 40 is arranged along the row direction or the column direction of the groove 24 and covers at least one row or column of the groove 24; in particular, as shown in fig. 9 b.
S103: the fluid containing the LED chip 1 flows from the first end to the second end of the flow channel 40; in particular, as shown in fig. 9 c. In step S103, the fluid containing the LED chip 1 can flow at a constant speed by adjusting the pressure provided by the pressure control assembly. In addition, the magnetic force provided by the magnetic base 3 can be further adjusted by controlling the speed of the fluid, so that the magnetic electrodes 12 of the LED chips 1 in the fluid face the array substrate 2. Preferably, the magnetic force provided by the magnetic base 3 is greater as the fluid velocity is greater. In addition, in the present embodiment, in order to realize colorization, only one of the blue LED chip, the red LED chip, or the green LED chip may be included in the fluid, and the groove 24 that is not required to be filled with the blue LED chip, the red LED chip, or the green LED chip on the array substrate 2 may be blocked by a mask-like tool in advance.
S104: the image pickup device 5 obtains images of the LED chip 1 and the array substrate 2 from the side, far away from the array substrate 2, of the fluid chamber 4, and the judgment device 6 receives the images and judges whether the groove 24 of the array substrate 2 captures the LED chip 1 or not according to the images; in particular, as shown in fig. 9 d.
S105: if all the grooves 24 on the array substrate 2 capture the LED chips 1, the fluid chamber 4 is removed, and the array substrate 2 is cleaned and dried. In particular, as shown in fig. 9 e. In step S105, the magnetic base 3 is not removed, and due to the action of the magnetic base 3, the LED chip 1 in the groove 24 is not disturbed by other processes and does not depart from the groove 24.
S106: the magnetic base 3 is removed and the contact electrode 280 of the array substrate 2 is soldered to the magnetic electrode 12 of the LED chip 1. Specifically, as shown in fig. 9f, when the array substrate 2 is formed, a layer of solder may be coated on the contact electrode 280 in advance, and the contact electrode 280 of the array substrate 2 and the LED chip 1 may be soldered by means of thermal reflow.
S107: and forming a plastic packaging layer 25 on the side of the LED chip 1 far away from the array substrate 2. Specifically, as shown in fig. 9g, the molding layer 25 can be formed by any method in the prior art, and will not be described in detail here.
In summary, different from the situation in the prior art, the LED chip provided in the present application includes a magnetic electrode, the magnetic electrode is located on the first end surface of the light-emitting main body of the LED chip, and when the fluid self-assembly method is used to transfer the LED chip, the magnetic electrode, under the action of the external magnetic field, drives the first end surface of the LED chip to face the predetermined direction, so as to improve the success rate of transferring the LED chip and further improve the efficiency of fluid assembly.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. An LED chip, comprising:
the light emitting body comprises a first end face and a second end face which are oppositely arranged;
and the magnetic electrode is arranged on the first end face, so that when the LED chip is placed in fluid and is subjected to the action of an external magnetic field, the first end face is arranged towards a preset direction.
2. The LED chip of claim 1, wherein said first end surface has an area smaller than an area of said second end surface.
3. The LED chip of claim 2, wherein the light emitting body has an inverted trapezoidal shape in a longitudinal section along a vertical direction of the first end surface and the second end surface.
4. A display panel, comprising:
the array substrate comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a plurality of grooves which are arranged in an array mode;
the LED light source comprises a plurality of LED chips, wherein the LED chips are correspondingly arranged in the grooves respectively, each LED chip comprises a light-emitting main body and a magnetic electrode, the light-emitting main body comprises a first end face and a second end face which are oppositely arranged, and the magnetic electrode is arranged on the first end face and faces the bottom of the groove.
5. The display panel according to claim 4, wherein the area of the first end surface is smaller than that of the second end surface, and the light emitting bodies are arranged in an inverted trapezoid shape in a vertical cross section along a direction perpendicular to the first end surface and the second end surface, and the shape of the groove matches the shape of the LED chip.
6. The display panel according to claim 5, wherein the groove is divided into a first groove segment and a second groove segment in a direction perpendicular to the first surface, wherein the first groove segment is shaped to match the magnetic electrode and to accommodate the magnetic electrode, and wherein the second groove segment is shaped to match the light emitting body and to accommodate the light emitting body.
7. The display panel according to claim 6, wherein the array substrate comprises:
a substrate;
the first film layer is positioned on one side of the substrate and is provided with a driving circuit and a plurality of contact electrodes connected with the driving circuit;
the second film layer is positioned on one side, far away from the substrate, of the first film layer, the second film layer is provided with the first groove section, and the first groove section exposes the corresponding contact electrode;
and the third film layer is positioned on one side, far away from the substrate, of the second film layer, and the third film layer is provided with the second groove section.
8. An assembling apparatus of a display panel, comprising:
the magnetic base station is used for bearing an array substrate, the array substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a plurality of grooves which are arranged in an array mode;
the fluid chamber is arranged on the first surface and used for receiving fluid carrying LED chips, wherein each LED chip comprises a light-emitting body and a magnetic electrode, the light-emitting body comprises a first end face and a second end face which are oppositely arranged, and the magnetic electrode is arranged on the first end face;
the magnetic electrode of the LED chip is acted by a magnetic field generated by the magnetic base station, and then falls into the groove in a mode that the first end face faces the bottom of the groove.
9. The assembly apparatus according to claim 8, wherein the fluid chamber is provided with a plurality of flow channels spaced from each other, wherein the flow channels are arranged in a row direction or a column direction of the grooves and cover at least one row or column of the grooves, the fluid flowing from a first end to a second end of the flow channels; preferably, the flow channel covers one row or column of the grooves, the width of the flow channel being greater than at least twice the width of the LED chip.
10. The assembly apparatus of claim 9,
the assembling apparatus further includes: the pressure control assembly is positioned at the first end and/or the second end of the flow channel and is used for providing pressure to the fluid so as to enable the fluid to flow at a constant speed; alternatively, the first and second electrodes may be,
the fluid chamber is made of transparent materials; the assembling apparatus further includes: the camera device is positioned on one side of the fluid cavity, which is far away from the array substrate, and is used for obtaining images of the LED chip and the array substrate; and the judging device is used for receiving the image and judging whether the groove of the array substrate captures the LED chip or not according to the image.
CN201811291809.9A 2018-10-31 2018-10-31 LED chip, display panel and display panel's equipment Active CN111129245B (en)

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