CN111129081A - 柔性有机el显示器的制造方法 - Google Patents
柔性有机el显示器的制造方法 Download PDFInfo
- Publication number
- CN111129081A CN111129081A CN201911021955.4A CN201911021955A CN111129081A CN 111129081 A CN111129081 A CN 111129081A CN 201911021955 A CN201911021955 A CN 201911021955A CN 111129081 A CN111129081 A CN 111129081A
- Authority
- CN
- China
- Prior art keywords
- glass layer
- resin layer
- laminated substrate
- layer
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000011521 glass Substances 0.000 claims abstract description 239
- 239000011347 resin Substances 0.000 claims abstract description 213
- 229920005989 resin Polymers 0.000 claims abstract description 213
- 239000000758 substrate Substances 0.000 claims abstract description 182
- 238000005520 cutting process Methods 0.000 claims abstract description 83
- 239000010410 layer Substances 0.000 description 439
- 238000012545 processing Methods 0.000 description 61
- 239000010408 film Substances 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- 238000010030 laminating Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-204451 | 2018-10-30 | ||
JP2018204451A JP2020071968A (ja) | 2018-10-30 | 2018-10-30 | フレキシブル有機elディスプレイの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111129081A true CN111129081A (zh) | 2020-05-08 |
Family
ID=70496104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911021955.4A Withdrawn CN111129081A (zh) | 2018-10-30 | 2019-10-24 | 柔性有机el显示器的制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2020071968A (ko) |
KR (1) | KR102212175B1 (ko) |
CN (1) | CN111129081A (ko) |
TW (1) | TW202046824A (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008003388A (ja) * | 2006-06-23 | 2008-01-10 | Rohm Co Ltd | フラットパネルディスプレイおよびその製造方法 |
JP5227779B2 (ja) * | 2008-12-23 | 2013-07-03 | 三星ダイヤモンド工業株式会社 | 脆性材料基板に貫通孔を形成する方法 |
KR101723254B1 (ko) | 2009-09-08 | 2017-04-04 | 도요보 가부시키가이샤 | 유리/수지 적층체 및 그것을 사용한 전자 디바이스 |
JP5872182B2 (ja) * | 2011-04-05 | 2016-03-01 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
JP2015195106A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社ジャパンディスプレイ | 有機el表示装置及びその製造方法 |
-
2018
- 2018-10-30 JP JP2018204451A patent/JP2020071968A/ja active Pending
-
2019
- 2019-06-18 KR KR1020190072006A patent/KR102212175B1/ko active IP Right Grant
- 2019-09-04 TW TW108131803A patent/TW202046824A/zh unknown
- 2019-10-24 CN CN201911021955.4A patent/CN111129081A/zh not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW202046824A (zh) | 2020-12-16 |
JP2020071968A (ja) | 2020-05-07 |
KR20200049473A (ko) | 2020-05-08 |
KR102212175B1 (ko) | 2021-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5185412B2 (ja) | カッターホイールを用いた脆性材料基板のスクライブ方法および分断方法 | |
US8520182B2 (en) | Flat panel display and manufacturing method thereof | |
US20200353567A1 (en) | Method for dividing composite material | |
US10038170B2 (en) | Method for cutting display panel | |
JP6090325B2 (ja) | 複合シートの切断方法、ガラスシートの切断方法、複合シートの切断片 | |
KR20170055909A (ko) | SiC 기판의 분리 방법 | |
CN106001932B (zh) | 包含脆性层的多层结构的切割方法 | |
CN111279494A (zh) | 利用激光剥离的加工方法和平坦化夹具 | |
KR20140136868A (ko) | 커터 유닛, 절단 장치, 절단 방법 및 홀더 | |
TWI744488B (zh) | 靜電卡盤台的使用方法 | |
KR102136149B1 (ko) | 플렉시블 유기 el 디스플레이의 제조 방법 | |
CN111129081A (zh) | 柔性有机el显示器的制造方法 | |
CN111129357A (zh) | 柔性有机el显示器的制造方法 | |
KR102179151B1 (ko) | 플렉시블 유기 el 디스플레이의 제조 방법 | |
KR102204684B1 (ko) | 플렉시블 유기 el 디스플레이의 제조 방법 | |
JP2008132500A (ja) | レーザ加工装置、レーザ加工方法、基板の製造方法、及び電気光学装置の製造方法 | |
KR102204685B1 (ko) | 플렉시블 유기 el 디스플레이의 제조 방법 | |
JP2009248203A (ja) | 加工装置及び表示パネルの製造方法 | |
KR20200049476A (ko) | 플렉시블 유기 el 디스플레이의 제조 방법 | |
WO2023112612A1 (ja) | シート材の分断方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200508 |