CN111128916A - Packaging structure - Google Patents

Packaging structure Download PDF

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Publication number
CN111128916A
CN111128916A CN201911374656.9A CN201911374656A CN111128916A CN 111128916 A CN111128916 A CN 111128916A CN 201911374656 A CN201911374656 A CN 201911374656A CN 111128916 A CN111128916 A CN 111128916A
Authority
CN
China
Prior art keywords
temperature
housing
package structure
substrate
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911374656.9A
Other languages
Chinese (zh)
Inventor
王留宝
殷志珍
吴涵
丁朋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Original Assignee
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Institute of Nano Tech and Nano Bionics of CAS filed Critical Suzhou Institute of Nano Tech and Nano Bionics of CAS
Priority to CN201911374656.9A priority Critical patent/CN111128916A/en
Publication of CN111128916A publication Critical patent/CN111128916A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Abstract

The invention discloses a packaging structure, which comprises a substrate and a shell hermetically connected with the substrate, wherein the shell comprises a temperature adjusting device and a temperature controller used for controlling the temperature adjusting device, and the packaging structure also comprises a first heat insulation layer arranged on the outer side of the shell. The packaging structure can reduce the influence of the external environment on the internal temperature of the packaging structure, and can adjust the internal temperature by the packaging structure, so that electronic devices which are arranged in the packaging structure and are sensitive to temperature change can keep a normal working state.

Description

Packaging structure
Technical Field
The invention relates to the field of semiconductor devices, in particular to a packaging structure.
Background
The current chip and other electronic components are sensitive to the temperature of the working environment, and the normal working state of the chip and other electronic components cannot be guaranteed at too low or too high temperature. For example, in chaotic synchronous communication, when it is required to keep the multi-path related components and chips in the same working state, the working environment needs to be controlled to keep the temperature of the working environment consistent.
However, the existing constant temperature packaging technology is not adequate in heat preservation of the circuit board, and when the device with the packaging structure is in a low temperature environment, the design of the packaging structure does not take into account the heat conduction effect of the circuit board itself, so the heat preservation effect of the packaging structure is not ideal. When the device with the package structure is in a high-temperature environment, the heat dissipation effect of the heat dissipation device of the package structure is limited, so that an ideal constant temperature state inside the package structure cannot be realized. As can be seen, the temperature inside the conventional package structure is easily affected by the external environment, and thus the constant temperature state inside cannot be maintained in different environments (low-temperature or high-temperature environments).
Disclosure of Invention
In view of the defects in the prior art, the invention provides a packaging structure, which comprises a substrate and a shell hermetically connected with the substrate, wherein the shell comprises a temperature regulating device and a temperature controller used for controlling the temperature regulating device, and the packaging structure further comprises a first thermal insulation layer arranged outside the shell.
Preferably, the temperature adjusting device is arranged on the inner side surface of the shell, and a second thermal insulation layer is further arranged on the inner side of the shell.
Preferably, the temperature adjusting device is arranged on the outer side surface of the shell, and a heat radiating device is arranged on one side of the temperature adjusting device, which is back to the shell.
Preferably, the heat dissipation device includes a heat dissipation plate attached to the temperature adjustment device and a fan disposed on the heat dissipation plate, a plurality of heat dissipation fins are disposed on a side of the heat dissipation plate facing away from the temperature adjustment device, and the fan is configured to provide airflow to the heat dissipation fins.
Preferably, the temperature adjusting device is a semiconductor cooling/heating plate, the temperature controller includes a control unit for controlling a cooling or heating state of the temperature adjusting device and a temperature sensor for detecting a temperature inside the casing, and the control unit and the temperature sensor are disposed inside the casing.
Preferably, the inside of the case is filled with a heat conductive substance or an adiabatic substance.
Preferably, a third thermal insulation layer is arranged on a side of the substrate opposite to the housing, wherein the size of the third thermal insulation layer is greater than or equal to the size of a projection area formed by the housing on the substrate.
Preferably, a protective shell is arranged on one side of the first temperature insulation layer, which faces away from the shell.
Preferably, the substrate includes a mounting region for mounting the housing, and a plurality of through holes are provided around the mounting region.
Preferably, the material of the shell is one or more of silver, copper, gold and aluminum.
Compared with the prior art, the packaging structure can reduce the influence of the external environment on the internal temperature of the packaging structure, and can adjust the internal temperature to a certain degree, so that electronic devices which are arranged in the packaging structure and sensitive to temperature change can keep a normal working state.
Drawings
Fig. 1 is a schematic diagram of a package structure according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram of a package structure according to embodiment 2 of the present invention;
fig. 3 is a schematic diagram of a package structure according to embodiment 3 of the present invention;
fig. 4 is a schematic diagram of a package structure according to embodiment 4 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.
The invention provides a packaging structure which can reduce the influence of the external environment on the internal temperature of the packaging structure, and can adjust the internal temperature by itself so as to keep the internal temperature to a certain degree.
In order to achieve the above object, the package structure of the present invention includes a substrate 1 (e.g., PCB, FPCB, glass substrate, etc.) and a case 2 hermetically connected to the substrate 1, wherein the sealed state means that no air flows between an inner space of the case 2 and the outside after the substrate 1 and the case 2 are connected.
The housing 2 comprises a temperature adjustment device 3 and a temperature controller for controlling the temperature adjustment device 3. It should be noted that the case 2 including the temperature adjustment device 3 and the temperature controller means that the temperature adjustment device 3 and the temperature controller may be disposed on the surface of the case 2 (including the inner surface and the outer surface of the case), or embedded inside the case 2 itself, or the temperature adjustment device 3 is disposed on the outer side of the case 2 and the temperature controller is disposed on the inner side of the case 2. The temperature controller includes a control unit for controlling a cooling or heating state of the thermostat 3 and a temperature sensor for detecting a temperature inside the housing 2, wherein the temperature sensor is preferably disposed inside the housing 2 for detecting a more precise temperature, and a specific layout of the temperature sensor and the control unit may take an appropriate form according to various embodiments, which are not specifically exemplified herein.
In order to enable the packaging structure to have a certain heat insulation effect, a first heat insulation layer 4 is further arranged on the outer side of the shell 2, and the first heat insulation layer 4 is used for isolating heat exchange between the shell 2 and the outside, so that the external environment has a low influence on the temperature inside the packaging structure. The first thermal insulation layer 4 may have a single-layer structure or a stacked-layer structure.
Preferably, the housing 2 is made of a material with high thermal conductivity, such as: one or more of silver, copper, gold and aluminum. The temperature adjusting device 3 can cool or heat under the control of the temperature controller, thereby adjusting the temperature inside the casing 2. The packaging structure provided by the invention can enable the external environment to have a low influence on the internal temperature of the packaging structure, and the internal temperature of the packaging structure is controlled by the temperature regulating structure of the packaging structure, so that the packaging structure can keep a good constant temperature state even if exposed to environments with different temperatures.
The package structure of the present invention is further explained with reference to the following embodiments.
Example 1
As shown in fig. 1, in the present embodiment, the temperature adjustment device 3 and the temperature controller (not shown) are both disposed on the inner surface of the housing 2, and the first thermal insulation layer 4 is disposed on the outer side of the housing 2. The first thermal insulation layer 4 may be closely attached to the outer surface of the housing 2, or may have a certain distance from the housing 2. When there is a space between the first thermal insulation layer 4 and the housing 2, the space may be in a vacuum state, thereby reducing heat exchange by gas and further improving thermal insulation effect. In addition, the inner side of the casing 2 is further provided with a second thermal insulation layer 5, the second thermal insulation layer 5 is attached to the inner side surface of the casing 2, wherein the second thermal insulation layer 5 is attached to the inner side surface of the casing 2 except for the temperature adjusting device 3 and the temperature controller, so that the thermal insulation effect of the packaging structure is further improved.
In this embodiment, the temperature adjustment device 3 is a semiconductor cooling/heating board, and when the semiconductor cooling/heating board is adopted, the shape of the housing 2 can be appropriately adjusted, so that the package structure can be applied to smaller electronic products, such as a notebook computer or a thin host computer. In order to improve the stability of the packaging structure, a protective shell a may be further disposed on a side of the first thermal insulation layer 4 facing away from the housing 2.
Example 2
As shown in fig. 2, different from embodiment 1, in order to further improve the thermal insulation effect of the package structure, a third thermal insulation layer 8 is further disposed on a side of the substrate 1 opposite to the housing 2, and the third thermal insulation layer 8 may be disposed in close contact with the surface of the substrate 1, or may have a certain interval with the substrate 1. When the third thermal insulation layer 8 has a space with the substrate 1, the space may be in a vacuum state, thereby reducing heat exchange by gas and further improving the thermal insulation effect. Wherein, the size of the third thermal insulation layer 8 is larger than or equal to the size of the projection area formed by the shell 2 on the substrate 1. In addition, the shape of the third thermal insulation layer 8 may be the same as the shape of the projection area of the housing 2 formed on the substrate 1.
Further, in order to reduce the heat conduction effect of the substrate 1 in the present embodiment, a mounting area for mounting the housing 2 is provided on the substrate 1, and a plurality of through holes 1a are provided around the mounting area, so as to reduce the heat conduction between the substrate 1 portion and the other substrate 1 portions of the package structure, thereby further improving the thermal insulation effect of the package structure.
Example 3
As shown in fig. 3, unlike embodiment 1, the temperature adjustment device 3 of the present embodiment is provided on the outer side surface of the housing 2, and the first thermal insulation layer 4 is attached to the outer side surface of the housing 2 except for the temperature adjustment device 3 and the temperature controller. Wherein, a heat sink is arranged on one side of the temperature adjusting device 3 facing away from the housing 2. The heat dissipating device includes: the cooling plate 6 is attached to the temperature adjusting device 3, and the fan 7 is arranged on the cooling plate 6, wherein a plurality of cooling fins 7a are arranged on one side of the cooling plate 6 facing away from the temperature adjusting device 3, and the fan 7 is used for providing air flow for the cooling fins 7 a. This embodiment enhances the cooling effect of the package structure, thereby enabling the package structure to maintain a constant temperature inside, particularly in hotter environments.
In this embodiment, the inside of the casing 2 may further be filled with a heat conducting substance (e.g., silicone grease) or a thermal insulating substance (e.g., cotton), so as to enhance the thermal insulation or heat dissipation of the package structure.
Example 4
As shown in fig. 4, as a further improvement of embodiment 3, the package structure further includes a second heat dissipation device, the second heat dissipation device is disposed on a side surface of the substrate 1 facing away from the housing 2, the second heat dissipation device may also include a heat dissipation plate 6 and a fan 7, and the heat dissipation plate 6 may also include heat dissipation fins 7 a. Further, the package structure of the present embodiment may further include an additional temperature adjustment device 3, where the temperature adjustment device 3 is disposed on a side surface of the substrate 1 facing away from the housing 2, and the second heat dissipation device is disposed on the additional temperature adjustment device 3.
The package structure provided by the present invention can be applied not only to a circuit substrate provided with a chip, but also to any electronic device or equipment that needs to provide a constant temperature working environment.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The packaging structure is characterized by comprising a substrate and a shell which is hermetically connected with the substrate, wherein the shell comprises a temperature adjusting device and a temperature controller which is used for controlling the temperature adjusting device, and the packaging structure further comprises a first heat insulation layer which is arranged on the outer side of the shell.
2. The package structure of claim 1, wherein the temperature adjustment device is disposed on an inner surface of the housing, and a second thermal insulation layer is disposed inside the housing.
3. The package structure of claim 1, wherein the temperature adjustment device is disposed on an outer surface of the housing, and a side of the temperature adjustment device facing away from the housing is provided with a heat dissipation device.
4. The package structure of claim 3, wherein the heat sink comprises a heat sink attached to the temperature adjustment device and a fan disposed on the heat sink, wherein a plurality of heat dissipation fins are disposed on a side of the heat sink facing away from the temperature adjustment device, and the fan is configured to provide airflow to the heat dissipation fins.
5. The package structure according to any one of claims 1 to 4, wherein the temperature adjustment device is a semiconductor cooling/heating board, the temperature controller includes a control unit for controlling a cooling or heating state of the temperature adjustment device and a temperature sensor for detecting a temperature inside the casing, and the control unit and the temperature sensor are provided inside the casing.
6. The package structure of claim 5, wherein the inside of the case is filled with a heat conductive substance or an insulating substance.
7. The package structure according to claim 5, wherein a side of the substrate facing away from the housing is provided with a third thermal insulation layer, wherein a size of the third thermal insulation layer is greater than or equal to a size of a projection area formed by the housing on the substrate.
8. The package structure according to claim 7, wherein a protective shell is disposed on a side of the first thermal insulation layer facing away from the housing.
9. The package structure of claim 5, wherein the substrate comprises a mounting area for mounting the housing, the mounting area having a plurality of through holes disposed therearound.
10. The package structure of claim 5, wherein the housing is made of one or more of silver, copper, gold, and aluminum.
CN201911374656.9A 2019-12-27 2019-12-27 Packaging structure Pending CN111128916A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911374656.9A CN111128916A (en) 2019-12-27 2019-12-27 Packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911374656.9A CN111128916A (en) 2019-12-27 2019-12-27 Packaging structure

Publications (1)

Publication Number Publication Date
CN111128916A true CN111128916A (en) 2020-05-08

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ID=70503839

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911374656.9A Pending CN111128916A (en) 2019-12-27 2019-12-27 Packaging structure

Country Status (1)

Country Link
CN (1) CN111128916A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10205223A1 (en) * 2002-02-08 2003-08-28 Audi Ag Vehicle unit, e.g. gearbox unit, has cooling device with at least one Peltier element associated with temperature-critical electronic components in electronic controller
DE10233836A1 (en) * 2002-07-25 2004-02-05 Robert Bosch Gmbh Housing for electronic control unit and electronically controlled gear has peltier element to hold system below a maximum operating temperature
US20090147481A1 (en) * 2005-08-03 2009-06-11 Matsushita Electric Industrial Co., Ltd. Electronic device
CN103151318A (en) * 2013-03-07 2013-06-12 北京中石伟业科技股份有限公司 Heat dissipation managing system and method between heating chip and shell in electronic equipment
CN209027137U (en) * 2018-10-31 2019-06-25 李诗宇 A kind of constant temperature structure of electronic chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10205223A1 (en) * 2002-02-08 2003-08-28 Audi Ag Vehicle unit, e.g. gearbox unit, has cooling device with at least one Peltier element associated with temperature-critical electronic components in electronic controller
DE10233836A1 (en) * 2002-07-25 2004-02-05 Robert Bosch Gmbh Housing for electronic control unit and electronically controlled gear has peltier element to hold system below a maximum operating temperature
US20090147481A1 (en) * 2005-08-03 2009-06-11 Matsushita Electric Industrial Co., Ltd. Electronic device
CN103151318A (en) * 2013-03-07 2013-06-12 北京中石伟业科技股份有限公司 Heat dissipation managing system and method between heating chip and shell in electronic equipment
CN209027137U (en) * 2018-10-31 2019-06-25 李诗宇 A kind of constant temperature structure of electronic chip

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Application publication date: 20200508

RJ01 Rejection of invention patent application after publication